单晶锗纳米切削温度场分布及各向异性对切削温度的影响研究（英文）
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摘要
为深入理解单晶锗纳米切削特性,提高纳米锗器件光学表面质量,首次采用三维分子动力学(MD)的方法研究了单晶锗纳米切削过程中工件原子的温度分布情况,研究了晶体的各向异性(100),(110),(111)晶面对切削温度的影响及切削温度对切削力的影响。结果表明,在切削过程中最高切削温度分布在切屑当中,达到了460 K。刀具的后刀面与已加工表面之间的区域也有较高的温度,在400 K以上。在3个不同的晶面中,(111)晶面的切削温度最高,(111)晶面的原子密度最大,即为单晶锗的密排面,释放出的能量最多。切削温度对切削力也有影响,切削温度越高,工件中原子受到的切削力越小。
In order to understand the nano-cutting properties of single crystal germanium and improve the optical surface quality of nano-germanium devices, the three-dimensional molecular dynamics(MD) method was firstly applied to investigate the temperature distribution of the material atoms during the nano-cutting process of single crystal germanium. The anisotropy effect of Ge(100),(110) and(111) on the cutting temperature and the influence of cutting temperature on cutting force were investigated. The results show that the highest cutting temperature during the cutting process is distributed among the chips, reaching 460 K. There is also a high temperature region in the friction zone of the tool back face, and the highest temperature is above 400 K. Among the three different crystal planes, the highest cutting temperature exists on the surface of Ge(111) crystal. Atomic arrangement is the most intensive in Ge(111), namely, Ge(111) is the densely packed surface of the single crystal germanium, which releases the most energy. What's more, cutting temperature has also made an impact on the cutting force. As the cutting temperature increases, the cutting force of the material atoms is reduced.
In order to understand the nano-cutting properties of single crystal germanium and improve the optical surface quality of nano-germanium devices, the three-dimensional molecular dynamics(MD) method was firstly applied to investigate the temperature distribution of the material atoms during the nano-cutting process of single crystal germanium. The anisotropy effect of Ge(100),(110) and(111) on the cutting temperature and the influence of cutting temperature on cutting force were investigated. The results show that the highest cutting temperature during the cutting process is distributed among the chips, reaching 460 K. There is also a high temperature region in the friction zone of the tool back face, and the highest temperature is above 400 K. Among the three different crystal planes, the highest cutting temperature exists on the surface of Ge(111) crystal. Atomic arrangement is the most intensive in Ge(111), namely, Ge(111) is the densely packed surface of the single crystal germanium, which releases the most energy. What's more, cutting temperature has also made an impact on the cutting force. As the cutting temperature increases, the cutting force of the material atoms is reduced.
引文
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3 Zhu Pengzhe,Hu Yuanzhong,Ma Tianbao et al.Tribol Lett[J],2011,41(1):41
4 Wu Chengda,Jiang Wenxiang.Journal of Molecular Modeling[J],2018,24:253
5 Redkov A V,Osipov A V,Kukushkin S A.Technical Physics Letters[J],2016,42(6):639
6 Sharma A,Datta D,Balasubramaniam R.Computational Materials Science[J],2018,145:208
7 Xu Feifei,Fang Fengzhou,Zhang Xiaodong.Computational Materials Science[J],2018,143:133
8 Xu Feifei,Fang Fengzhou,Zhang Xiaodong.Applied Surface Science[J],2017,425:1020
9 Chavoshi S Z,Goel S,Luo X C.Journal of Manufacturing Processes[J],2016,23:201
10 Chavoshi S Z,Luo X C.Computational Materials Science[J],2016,113:1
11 Chavoshi S Z,Luo X C.Materials Science&Engineering A[J],2016,654:400
12 Wang Quanlong,Bai Qingshun,Chen Jiaxuan et al.Nanoscale Research Letters[J],2015,10:396
13 Wang Quanlong,Bai Qingshun,Chen Jiaxuan et al.Applied Surface Science[J],2015,344:38
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15 Chen Jiaxuan,Wang Quanlong,Liang Yingchun et al.Procedia Engineering[J],2012,29:3478
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17 Zhu P Z,Fang F Z.Appl Phys A[J],2012,108(2):415
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20 Yang Xiaojing,Liu Yanrong,Yang Xiaojiang et al.Transactions of the Chinese Society for Agricultural Machinery[J],2014,5:322