激光选区熔化成形纯铜的工艺及其性能研究
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  • 英文篇名:Process and Properties of Pure Copper Fabricated by Selective Laser Melting
  • 作者:周燕 ; 陈柯宇 ; 文世峰 ; 段隆臣 ; 魏青松
  • 英文作者:Zhou Yan;Chen Keyu;Wen Shifeng;Duan Longchen;Wei Qingsong;Faculty of Engineering,China University of Geosciences;State Key Laboratory of Material Processing and Die and Mould Technology,Huazhong University of Science and Technology;
  • 关键词:激光选区熔化 ; ; 微观组织 ; 机械性能
  • 英文关键词:selective laser melting;;copper;;microstructure;;mechanical properties
  • 中文刊名:YYJG
  • 英文刊名:Applied Laser
  • 机构:中国地质大学(武汉)工程学院;华中科技大学材料成形与模具技术国家重点实验室;
  • 出版日期:2019-06-15
  • 出版单位:应用激光
  • 年:2019
  • 期:v.39
  • 基金:国家自然科学基金资助项目(项目编号:51605176);; 国家高技术研究发展计划(863计划)资助项目(项目编号:2015AA042501);; 广东省重大科技专项资助项目(项目编号:2017B090911007);; 佛山市重大科技资助项目(项目编号:2016AG101253);; 材料成形与模具技术国家重点实验室开放基金资助项目(项目编号:P2019-006)
  • 语种:中文;
  • 页:YYJG201903005
  • 页数:7
  • CN:03
  • ISSN:31-1375/T
  • 分类号:27-33
摘要
铜及其合金因具有优良的导热性能而被应用于模具制造业,而激光选区熔化(Selective Laser Melting,SLM)技术能够有效成形高性能复杂结构模具。目前采用SLM成形铜及其合金的研究较少,系统地研究了SLM成形纯铜的工艺参数,获得了最优工艺窗口下成形的纯铜块体的显微形貌、物相及其机械性能等。在激光功率360 W、扫描速度600 mm/s的最佳参数组合下,得到了致密度接近88%的纯铜试样,其表面和侧面的维氏硬度分别为42.9±6.8、32.8±4.5 HV,试样的平均抗拉强度和延伸率分别为95.0±24.2 MPa、8.9±3.8%。该研究为SLM成形纯铜应用于工业尤其是模具制造业提供了理论与工艺借鉴。
        Copper and its alloys are applied to the mold manufacturing industry due to its excellent thermal conductivity,and selective laser melting(SLM)technology can effectively form high-performance complex structure molds. At present, there are few researches on SLM forming copper and its alloys. The process parameters of SLM forming pure copper are systematically studied, and the microstructure, phase and mechanical properties of the pure copper blocks formed under the optimum process window are obtained. Under the optimal combination of laser power of 360 W and scanning speed of 600 mm/s, a pure copper sample with a density close to 88% was obtained. The Vickers hardness of the surface and side views were 42.9±6.8 and 32.8±4.5 HV, respectively. The average tensile strength and elongation of the samples were 95.0 ± 24.2 MPa and 8.9 ± 3.8%, respectively. This study provides theoretical and technological reference for the application of SLM formed pure copper to industry, especially mold manufacturing.
引文
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