导电游丝激光锡膏微焊接
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摘要
导电游丝人工焊接存在效率低一致性差的问题。为了实现其自动化焊接,设计了一套能够进行锡膏微量分液、焊点视觉定位、激光加热、红外测温的焊接平台。首先,进行了红外测温仪的发射率标定与精度测量,激光能量中心与相机视野中心的同轴度的补偿。然后,在镀金的焊盘上进行微小焊点焊接试验。最后,测量了30μm游丝焊点的导电性。试验结果表明激光锡膏微焊接中存在虚焊假焊、多锡珠产生、焊点与基底接触面积的多态性以及助焊剂残留的问题,通过优化激光加热功率曲线与焊接工艺过程,得到了直径为0. 2 mm左右的导电性良好的焊点。导电游丝激光锡膏微焊接自动化设计具备可行性。
There are some problems of low efficiency and poor consistency in manual welding of flex lead. In order to realize automatic soldering,an experimental platform with micro-dispensing solder paste,visual location of soldered joints,laser heating and infrared temperature measurement was designed. Firstly,the emissivity calibration and accuracy measurement of infrared thermometer was performed,the coaxiality compensation between laser energy center and camera vision center was made. The micro-spot welding experiment was carried out on the goldplated pad. Finally,the conductivity of the soldered joints of the 30 μm flex lead was measured. The experimental results show that there are some problems in laser micro-welding with solder paste such as pseudo solder joints,multi-tin beads generation,variability of contact area of soldered joints and flux residue. By optimizing the laser heating power curve and the process,a soldered joint with good conductivity about 0.2 mm in diameter has been obtained. The automatic design of laser and solder paste micro-welding of flex lead is feasible.
There are some problems of low efficiency and poor consistency in manual welding of flex lead. In order to realize automatic soldering,an experimental platform with micro-dispensing solder paste,visual location of soldered joints,laser heating and infrared temperature measurement was designed. Firstly,the emissivity calibration and accuracy measurement of infrared thermometer was performed,the coaxiality compensation between laser energy center and camera vision center was made. The micro-spot welding experiment was carried out on the goldplated pad. Finally,the conductivity of the soldered joints of the 30 μm flex lead was measured. The experimental results show that there are some problems in laser micro-welding with solder paste such as pseudo solder joints,multi-tin beads generation,variability of contact area of soldered joints and flux residue. By optimizing the laser heating power curve and the process,a soldered joint with good conductivity about 0.2 mm in diameter has been obtained. The automatic design of laser and solder paste micro-welding of flex lead is feasible.
引文
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[3]邹俊,丁劲锋,雷威.半导体激光自动锡焊系统的研制[J].仪表技术与传感器,2017(6):88-90.
[4]Kay R,Desmulliez M.A review of stencil printing for microelectronic packaging[J].Soldering&Surface Mount Technology,2012,24(1):38-50.
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[6]Suenaga N,Nakazono M,Tsuchiya H.Laser soldering[J].Welding International,1988,2(3):269-276.
[7]Alessandro A,Alessandro F,Giacomo G,et al.Long pulse laser micro welding of commercially pure titanium thin sheets[J].Procedia Engineering,2017,184:274-283.
[8]Joanna K,Ning C L.Assessment of solder paste technology limitation at miniaturization for SIP and SMT application[C].2017 18th International Conference on Electronic Packaging Technology,Harbin,China,2017.
[9]唐彦琴,顾国华,钱惟贤,等.四象限探测器基于高斯分布的激光光斑中心定位算法[J].红外与激光工程,2017,46(2):64-70.
[10]杨雪霞,张宇,树学峰.回流焊接温度曲线对焊点形状影响的实验研究[J].电子元件与材料,2016,35(2):70-72.
[11]陈群,李英,黄艳,等.无铅无卤焊接用活性物质的研究[J].焊接技术,2011,40(3):38-41.
[12]Rathinavelu U,Jellesen M S,Ambat R.Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies[J].Corrosion Engineering Science and Technology,2013,48(6):436-444.
[2]王迪.激光熔融喷射焊接系统的设计及实验研究[D].长春:吉林大学硕士学位论文,2017.
[3]邹俊,丁劲锋,雷威.半导体激光自动锡焊系统的研制[J].仪表技术与传感器,2017(6):88-90.
[4]Kay R,Desmulliez M.A review of stencil printing for microelectronic packaging[J].Soldering&Surface Mount Technology,2012,24(1):38-50.
[5]赵兴科,邢德胜,刘大勇.激光微连接技术研究与应用进展[J].航空制造技术,2017(12):28-34.
[6]Suenaga N,Nakazono M,Tsuchiya H.Laser soldering[J].Welding International,1988,2(3):269-276.
[7]Alessandro A,Alessandro F,Giacomo G,et al.Long pulse laser micro welding of commercially pure titanium thin sheets[J].Procedia Engineering,2017,184:274-283.
[8]Joanna K,Ning C L.Assessment of solder paste technology limitation at miniaturization for SIP and SMT application[C].2017 18th International Conference on Electronic Packaging Technology,Harbin,China,2017.
[9]唐彦琴,顾国华,钱惟贤,等.四象限探测器基于高斯分布的激光光斑中心定位算法[J].红外与激光工程,2017,46(2):64-70.
[10]杨雪霞,张宇,树学峰.回流焊接温度曲线对焊点形状影响的实验研究[J].电子元件与材料,2016,35(2):70-72.
[11]陈群,李英,黄艳,等.无铅无卤焊接用活性物质的研究[J].焊接技术,2011,40(3):38-41.
[12]Rathinavelu U,Jellesen M S,Ambat R.Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies[J].Corrosion Engineering Science and Technology,2013,48(6):436-444.