“Cut-and-paste” method for the rapid prototyping of soft electronics
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摘要
Unlike wafer-based rigid electronics, soft electronics have many unique advantages including thinness, flexibility, stretchability,conformability, lightweight, large area, as well as low cost. As a result, they have demonstrated many emerging capabilities in healthcare devices, soft robotics, and human-machine interface. Instead of conventional microfabrication, there is an evergrowing interest in the freeform or digital manufacture of soft electronics. This review provides a survey for a cost-and timeeffective subtractive manufacturing process called the "cut-and-paste" method. It employs a mechanical cutter plotter to form patterns on various electronically functional membranes such as sheets of metals, functional polymers, and even two-dimensional(2D) materials, supported by a temporary tape. The patterned membranes can then be pasted on soft substrates such as medical tapes or even human skin. This process is completely dry and desktop. It does not involve any rigid wafers and is hence capable of making large-area electronics. The process can be repeated to integrate multiple materials on a single substrate.Integrated circuits(ICs) and rigid components can be added through a "cut-solder-paste" process. Multilayer devices can also be fabricated through lamination. We therefore advocate that the "cut-and-paste" method is a very versatile approach for the rapid prototyping of soft electronics for various applications.
Unlike wafer-based rigid electronics, soft electronics have many unique advantages including thinness, flexibility, stretchability,conformability, lightweight, large area, as well as low cost. As a result, they have demonstrated many emerging capabilities in healthcare devices, soft robotics, and human-machine interface. Instead of conventional microfabrication, there is an evergrowing interest in the freeform or digital manufacture of soft electronics. This review provides a survey for a cost-and timeeffective subtractive manufacturing process called the "cut-and-paste" method. It employs a mechanical cutter plotter to form patterns on various electronically functional membranes such as sheets of metals, functional polymers, and even two-dimensional(2D) materials, supported by a temporary tape. The patterned membranes can then be pasted on soft substrates such as medical tapes or even human skin. This process is completely dry and desktop. It does not involve any rigid wafers and is hence capable of making large-area electronics. The process can be repeated to integrate multiple materials on a single substrate.Integrated circuits(ICs) and rigid components can be added through a "cut-solder-paste" process. Multilayer devices can also be fabricated through lamination. We therefore advocate that the "cut-and-paste" method is a very versatile approach for the rapid prototyping of soft electronics for various applications.
Unlike wafer-based rigid electronics, soft electronics have many unique advantages including thinness, flexibility, stretchability,conformability, lightweight, large area, as well as low cost. As a result, they have demonstrated many emerging capabilities in healthcare devices, soft robotics, and human-machine interface. Instead of conventional microfabrication, there is an evergrowing interest in the freeform or digital manufacture of soft electronics. This review provides a survey for a cost-and timeeffective subtractive manufacturing process called the "cut-and-paste" method. It employs a mechanical cutter plotter to form patterns on various electronically functional membranes such as sheets of metals, functional polymers, and even two-dimensional(2D) materials, supported by a temporary tape. The patterned membranes can then be pasted on soft substrates such as medical tapes or even human skin. This process is completely dry and desktop. It does not involve any rigid wafers and is hence capable of making large-area electronics. The process can be repeated to integrate multiple materials on a single substrate.Integrated circuits(ICs) and rigid components can be added through a "cut-solder-paste" process. Multilayer devices can also be fabricated through lamination. We therefore advocate that the "cut-and-paste" method is a very versatile approach for the rapid prototyping of soft electronics for various applications.
引文
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3 Rogers J A,Someya T,Huang Y.Materials and mechanics for stretchable electronics.Science,2010,327:1603-1607
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6 Wang S,Xu J,Wang W,et al.Skin electronics from scalable fabrication of an intrinsically stretchable transistor array.Nature,2018,555:83-88
7 Someya T,Sekitani T,Iba S,et al.A large-area,flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications.Proc Natl Acad Sci USA,2004,101:9966-9970
8 Huang J,Zhu H,Chen Y,et al.Highly transparent and flexible nanopaper transistors.ACS Nano,2013,7:2106-2113
9 Lee G H,Yu Y J,Cui X,et al.Flexible and transparent MoS2fieldeffect transistors on hexagonal boron nitride-graphene heterostructures.ACS Nano,2013,7:7931-7936
10 Schwartz G,Tee B C K,Mei J,et al.Flexible polymer transistors with high pressure sensitivity for application in electronic skin and health monitoring.Nat Commun,2013,4:1859
11 Ko H C,Stoykovich M P,Song J,et al.A hemispherical electronic eye camera based on compressible silicon optoelectronics.Nature,2008,454:748-753
12 Jung I,Xiao J,Malyarchuk V,et al.Dynamically tunable hemispherical electronic eye camera system with adjustable zoom capability.Proc Natl Acad Sci USA,2011,108:1788-1793
13 Kim D H,Lu N,Ma R,et al.Epidermal electronics.Science,2011,333:838-843
14 Kim D H,Ghaffari R,Lu N,et al.Flexible and stretchable electronics for biointegrated devices.Annu Rev Biomed Eng,2012,14:113-128
15 Park S I,Brenner D S,Shin G,et al.Soft,stretchable,fully implantable miniaturized optoelectronic systems for wireless optogenetics.Nat Biotechnol,2015,33:1280-1286
16 Minev I R,Musienko P,Hirsch A,et al.Electronic dura mater for long-term multimodal neural interfaces.Science,2015,347:159-163
17 Miyamoto A,Lee S,Cooray N F,et al.Inflammation-free,gaspermeable,lightweight,stretchable on-skin electronics with nanomeshes.Nat Nanotech,2017,12:907-913
18 Jeong J W,Yeo W H,Akhtar A,et al.Materials and optimized designs for human-machine interfaces via epidermal electronics.Adv Mater,2013,25:6839-6846
19 Lim S,Son D,Kim J,et al.Transparent and stretchable interactive human machine interface based on patterned graphene heterostructures.Adv Funct Mater,2015,25:375-383
20 Ameri S K,Kim M,Kuang I A,et al.Imperceptible electrooculography graphene sensor system for human-robot interface.npj2D Mater Appl,2018,2:19
21 Lu N,Kim D H.Flexible and stretchable electronics paving the way for soft robotics.Soft Robotics,2014,1:53-62
22 Yoon J,Jo S,Chun I S,et al.GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies.Nature,2010,465:329-333
23 Xu S,Zhang Y,Cho J,et al.Stretchable batteries with self-similar serpentine interconnects and integrated wireless recharging systems.Nat Commun,2013,4:1543
24 Fan F R,Tang W,Wang Z L.Flexible nanogenerators for energy harvesting and self-powered electronics.Adv Mater,2016,28:4283-4305
25 Rogers J A,Bao Z,Baldwin K,et al.Paper-like electronic displays:Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks.Proc Natl Acad Sci USA,2001,98:4835-4840
26 Yokota T,Zalar P,Kaltenbrunner M,et al.Ultraflexible organic photonic skin.Sci Adv,2016,2:e1501856
27 Koo J H,Kim D C,Shim H J,et al.Flexible and stretchable smart display:Materials,fabrication,device design,and system integration.Adv Funct Mater,2018,28:1801834
28 Yan Z,Pan T,Yao G,et al.Highly stretchable and shape-controllable three-dimensional antenna fabricated by“Cut-Transfer-Release”method.Sci Rep,2017,7:42227
29 Inui T,Koga H,Nogi M,et al.A miniaturized flexible antenna printed on a high dielectric constant nanopaper composite.Adv Mater,2015,27:1112-1116
30 Khaleel H R,Al-Rizzo H M,Rucker D G,et al.A compact polyimide-based UWB antenna for flexible electronics.Antennas Wirel Propag Lett,2012,11:564-567
31 Cibin C,Leuchtmann P,Gimersky M,et al.A flexible wearable antenna.APS IEEE,2004,4:3589-3592
32 Wu Z,Jobs M,Rydberg A,et al.Hemispherical coil electrically small antenna made by stretchable conductors printing and plastic thermoforming.J Micromech Microeng,2015,25:027004
33 Lu N,Yang S.Mechanics for stretchable sensors.Curr Opin Solid State Mater Sci,2015,19:149-159
34 Kim D H,Lu N,Huang Y,et al.Materials for stretchable electronics in bioinspired and biointegrated devices.MRS Bull,2012,37:226-235
35 Suo Z.Mechanics of stretchable electronics and soft machines.MRSBull,2012,37:218-225
36 Someya T,Bauer S,Kaltenbrunner M.Imperceptible organic electronics.MRS Bull,2017,42:124-130
37 Lipomi D J,Bao Z.Stretchable and ultraflexible organic electronics.MRS Bull,2017,42:93-97
38 Meitl M A,Zhu Z T,Kumar V,et al.Transfer printing by kinetic control of adhesion to an elastomeric stamp.Nat Mater,2006,5:33-38
39 Carlson A,Bowen A M,Huang Y,et al.Transfer printing techniques for materials assembly and micro/nanodevice fabrication.Adv Mater,2012,24:5284-5318
40 Kim J,Salvatore G A,Araki H,et al.Battery-free,stretchable optoelectronic systems for wireless optical characterization of the skin.Sci Adv,2016,2:e1600418
41 Choi M K,Park I,Kim D C,et al.Thermally controlled,patterned graphene transfer printing for transparent and wearable electronic/optoelectronic system.Adv Funct Mater,2015,25:7109-7118
42 Lee Y K,Kim J,Kim Y,et al.Room temperature electrochemical sintering of Zn microparticles and its use in printable conducting inks for bioresorbable electronics.Adv Mater,2017,29:1702665
43 Lee C H,Kim D R,Zheng X.Fabrication of nanowire electronics on nonconventional substrates by water-assisted transfer printing method.Nano Lett,2011,11:3435-3439
44 Kim T,Carson A,Ahn J,et al.Kinetically controlled,adhesiveless transfer printing using microstructured stamps.Appl Phys Lett,2009,94:113502
45 Hines D R,Ballarotto V W,Williams E D,et al.Transfer printing methods for the fabrication of flexible organic electronics.J Appl Phys,2007,101:024503
46 Wünscher S,Abbel R,Perelaer J,et al.Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices.J Mater Chem C,2014,2:10232-10261
47 Kim J,Kumar R,Bandodkar A J,et al.Advanced materials for printed wearable electrochemical devices:A review.Adv Electron Mater,2017,3:1600260
48 Liu X,Yuk H,Lin S,et al.3D printing of living responsive materials and devices.Adv Mater,2018,30:1704821
49 Valentine A D,Busbee T A,Boley J W,et al.Hybrid 3D printing of soft electronics.Adv Mater,2017,29:1703817
50 Pan C,Kumar K,Li J,et al.Visually imperceptible liquid-metal circuits for transparent,stretchable electronics with direct laser writing.Adv Mater,2018,30:1706937
51 Rahimi R,Shams Es-Haghi S,Chittiboyina S,et al.Laser-enabled processing of stretchable electronics on a hydrolytically degradable hydrogel.Adv Healthcare Mater,2018,7:1800231
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