中频非平衡磁控溅射TiAlN薄膜的结构与性能
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摘要
采用中频非平衡磁控溅射离子镀设备在YG10硬质合金表面制备(Ti_(1-x)Al_x)N薄膜,运用X线衍射仪、扫描电子显微镜、显微硬度计和材料表面性能测试仪等对薄膜进行表征,分析氮气分压、直流偏压和Al含量对薄膜的力学性能、薄膜成分和组织结构的影响。结果表明:薄膜呈柱状多晶组织,主要组成相为(Ti,Al)N相;随着氮气分压增大,膜层中氮原子增多,而铝、钛原子含量减少,膜层中rAl/(Al+Ti)与r(Al+Ti)/N均下降,薄膜(111)晶面取向减弱,(220)和(200)晶面取向增强。力学性能测试表明,随着膜层中的Al含量和直流偏压升高,薄膜硬度、膜厚和膜-基结合力均呈现先升高后降低的趋势,薄膜显微硬度最高2 915 HV,膜-基结合力最高达73 N。
(Ti_(1-x)Al_x) N films were prepared on YG10-cemented tungsten carbide surface by using mid-frequency non-equilibrium magnetron sputtering. The films 'properties were characterized by X-ray diffraction( XRD),scanning electron microscopy( SEM),and microhardness and surface property testing. Effects of nitrogen partial pressure,DC bias voltage,and Al content on the mechanical properties,composition,and microstructure of the films were investigated. The films were composed of( Ti,Al) N columnar crystals. The concentration of nitrogen in the film increased with the increasing of nitrogen partial pressure,while the concentrations of Al and Ti,the atom ratios rAl/( Al + Ti)and r( Al + Ti)/Nwere decreased. The( 111) crystal orientation became less prominent,and the( 220) and( 200) orientations became predominant. Mechanical testing show that,with the increasing of Al concentration and DC bias voltage,the film hardness and thickness,along with the binding force between the film and substrate,all initially increase and then decrease. The maximum microhardness of the films is 2915 HV,and the maximum binding force between the film and substrate is 73 N.
(Ti_(1-x)Al_x) N films were prepared on YG10-cemented tungsten carbide surface by using mid-frequency non-equilibrium magnetron sputtering. The films 'properties were characterized by X-ray diffraction( XRD),scanning electron microscopy( SEM),and microhardness and surface property testing. Effects of nitrogen partial pressure,DC bias voltage,and Al content on the mechanical properties,composition,and microstructure of the films were investigated. The films were composed of( Ti,Al) N columnar crystals. The concentration of nitrogen in the film increased with the increasing of nitrogen partial pressure,while the concentrations of Al and Ti,the atom ratios rAl/( Al + Ti)and r( Al + Ti)/Nwere decreased. The( 111) crystal orientation became less prominent,and the( 220) and( 200) orientations became predominant. Mechanical testing show that,with the increasing of Al concentration and DC bias voltage,the film hardness and thickness,along with the binding force between the film and substrate,all initially increase and then decrease. The maximum microhardness of the films is 2915 HV,and the maximum binding force between the film and substrate is 73 N.
引文
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[28]张以忱,于大洋,马胜歌,等.Al含量对非平衡磁控溅射制备Ti1-xAlxN膜性能的影响[J].真空,2007,44(3):1.
[2]BARSHILIA H C.Structure,hardness and thermal stability of Ti Al N and nanolayered Ti Al N/Cr N multilayer films[J].Vacaum,2005,77:169.
[3]ARNDT M,KACSICH T.Performance of new Ti Al N coatings in dry speed cutting[J].Surface and Coatings Technology,2003,674:163.
[4]KAWATE M.Oxidation resistance of Cr1-xAlxN and Ti1-xAlxN film[J].Surface and Coatings Technology,2003,165:163.
[5]蒋钊,陈学康.膜的应力控制技术研究现状[J].真空科学与技术学报,2008,5(28):17.
[6]王永康,夏立芳,雷廷权,等.Ti Al N/Ti多元复合涂层的截面透射电镜研究[J].兵器材料科学与工程,2000,23(6):12.
[7]KONTER O,MUNZ W D.Industrial deposition of binary,ternary and quaternary nitrides of titanrum,zorconium and aluminuium[J].Vac Sci Technol,1987,A5(4):2173.
[8]王永康,熊仁章,雷廷权,等.Ti1-xAlxN涂层的组织结构及Al元素的作用机理[J].宁波大学学报(理工版),2001,14(4):48.
[9]WAHLSTROM U,HULTMAN L,SUNDGREN J E.Crystal growth and microstructure of polycryotallme Ti1-xAlxN alloy films deposited by ultra-high-vacuum dual-target magnetron sputtering[J].Thin Soild Films,1993,2(35):62.
[10]熊仁章,夏立芳,雷廷权,等.工艺因素对Ti Al N多元涂层成分的影响[J].兵器材料科学与工程,2000,23(5):55.
[11]李丽,吴卫,金永中,等.磁控溅射钛膜的沉积过程及表面形貌研究[J].西华大学学报(自然科学版),2009,28(2):93.
[12]MATTOXD M.Partide bombardment effects on thin-film deposition:A review[J].Journal of Vacuum Science and Technology A,1989(7):1105.
[13]MESSIER R,GIRI A P,ROY R A.Revised structure zone model for thin film physical structure[J].Vac Sci Technol A,1984,2(2):500.
[14]卢龙,蒋涛,严铿,等.基体负偏压对Ti Al N/Ti N膜层组织成分及硬度的影响[J].材料热处理技术,2009,38(24):79.
[15]倪茂林.非平衡磁控溅射Ti Al N薄膜的组织结构与性能研究[D].杭州:浙江工业大学,2011:35-40.
[16]刘志远,冯广杰,潘金喜,等.非平衡磁控溅射Ti Al N薄膜的组织结构与性能分析[J].热加工工艺,2013,42:158.
[17]孙伟,宫秀敏,叶卫平,等.多弧离子镀Ti N涂层结合力的影响因素[J].材料保护,2000,33(8):31.
[18]张皓扬,周兰英,田建朝,等.基体偏压对Ti Al N涂层性能的影响[J].表面技术,2006,35(6):15.
[19]乔保卫,刘正堂,李阳平,等.工艺参数对磁控反应溅射Al N薄膜沉积速率的影响[J].西北工业大学学报,2004,22(2):260.
[20]曹晓英,赵广彬,陈甥怡,等.热阴极离子镀技术制备特种硬质薄膜及性能研究[J].西华大学学报(自然科学版),2009,28(6):110.
[21]赵立新,郑立允,牛兰芹,等.Ti Al N镀层硬质合金结构及性能研究[J].金属热处理学报,2008,33(7):18.
[22]张靖华,金杰,倪茂林,等.磁控溅射Ti Al N薄膜的制备及性能研究[J].轻工机械,2013,31(1):64.
[23]ROOS J R,CELIS J P,VANCOILLE E,etal.Interrelationship between processing,coating properties and functional properties of steered are physically vapour deposited(Ti,Al)N and(Ti,Nb)N coatings[J].Thin Soild Films,1990,547:193.
[24]KOMG U.Deposition and properties of multicomponent hard coatings[J].Surf Coat Technol,1987,33:91.
[25]李佳,夏长清,刘昌斌,等.Al含量对(Ti,Al)N涂层结构性能的影响[J].材料导报,2003,17(12):29.
[26]王海东,童洪辉,沈丽如,等.Al含量对电弧离子镀共沉积Ti1-xAlxN涂层性能的影响[J].热加工工艺,2006,35(8):4.
[27]廖凤娟,赵广彬,谭刚,等.铝靶电流对Ti Al N薄膜组织结构与性能的影响[J].西华大学学报(自然科学版),2014,33(6):66.
[28]张以忱,于大洋,马胜歌,等.Al含量对非平衡磁控溅射制备Ti1-xAlxN膜性能的影响[J].真空,2007,44(3):1.