新一代IGBT模块用高可靠氮化硅陶瓷覆铜基板研究进展
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摘要
电动汽车是靠电能驱动的最理想的"清洁车辆",是解决能源环境问题的有效途径。作为电动汽车驱动系统的核心IGBT模块,对封装材料的可靠性提出了越来越高的要求。从目前国际最新的实用化IGBT模块的发展出发,介绍了一种新型的IGBT模块封装用氮化硅陶瓷覆铜基板,综述了国内外的研究现状,介绍了氮化硅陶瓷覆铜基板制备技术。
Electric vehicle is the most ideal "clean vehicle"driven by electric power,and it is an effective way to solve the problem of energy and environment. IGBT module is the core component of electric vehicle drive system. The high reliability of packaging material is demanded by IGBT module.In this paper,the latest practical IGBT module in the world is introduced. A new type of silicon nitride ceramic bonding copper substrate for electric vehicle is reviewed. The present research situation and preparation technology of silicon nitride ceramic bonding copper substrate is summarized.
Electric vehicle is the most ideal "clean vehicle"driven by electric power,and it is an effective way to solve the problem of energy and environment. IGBT module is the core component of electric vehicle drive system. The high reliability of packaging material is demanded by IGBT module.In this paper,the latest practical IGBT module in the world is introduced. A new type of silicon nitride ceramic bonding copper substrate for electric vehicle is reviewed. The present research situation and preparation technology of silicon nitride ceramic bonding copper substrate is summarized.
引文
[1]陈清泉.现代电动汽车技术[M].北京:北京理工大学出版社,2002.
[2]余群明.电动汽车电控系统发展现状及趋势[J].汽车零部件,2011,(04):18-19.
[3]Hareesh Chandrasekar.The IGBT and its creator[J].Resonance,2013,18(6):63-580.
[4]Kang,Zhipo Ji,Chun Yang,et al.Performance Comparison of Battery Chargers Based on Si C-MOSFET and Si-IGBT for Railway Vehicles[C].International Conference on Electrical and Information Technologies for Rail Transportation,2017,351-358.
[5]Jinlong Xu,Joyce Zhang,Ken Kuang.Influence of Firing Temperature and Atmospheric Conditions on Processing of Direct Bond Copper(DBC)[C].Conveyor Belt Furnace Thermal Processing,2018,133-139.
[6]Kuan Hong Lin,Zi Hao Xu,Shun Tian Lin.A Study on Microstructure and Dielectric Performances of Alumina/Copper Composites by Plasma Spray Coating[J].Journal of Materials Engineering and Performance,2011,20(2):231-237.
[7]Cherng-Yuh Su,C.T.Pan,Min-Sheng Lo.Microstructure and Mechanical Properties of Al N/Cu Brazed Joints[J].Journal of Materials Engineering and Performance,2014,23(9):3299-3304.
[8]Jurgen Schulz-Harder.Advantages and new development of direct bonded copper substrates[J].Microelectronics Reliability,2003,(43):359-365.
[9]Shinji Fukuda,Kazuhiko Shimada,Noriya Izu,et al.Crack generation in electroless nickel plating layers on copper-metallized silicon nitride substrates during thermal cycling[J].Journal of Materials Sci ence:Materials in Electronics,2017,28(11):8278-8285.
[10]Shinji Fukuda,Kazuhiko Shimada,Noriya Izu,et al.Thermal-cycling-induced surface roughening and structural change of a metal layer bonded to silicon nitride by active metal brazing[J].Journal of Materials Science:Materials in Electronics,2017,28(16):12168-12175.
[11]祝昌军,蒋俊,高玲,等.氮化硅陶瓷的制备及进展[J].江苏陶瓷,2001,34(3):10-12.
[12]Yongfeng Xia,Yu-Ping Zeng,and Dongliang Jiang.Microstructure and mechanical properties of porous Si3N4ceramics prepared by freeze-casting[J].Materials and Design,2012,(33):98-103.
[13]Shinya Matsuda.Fracture characteristics of silicon nitride ceramic ball subjected to thermal shock[J].Journal of Materials Science,2016,51(11):5502-5513.
[14]Haggerty J S,Light foot A.Opportunities for enhancing the thermal conductivities of Si C and Si3N4ceramics through improved processing ceram[J].Eng.Sci.Proc.,1995,(16):475-487.
[15]Lee SW,ChaeH B,Park D S,et al.Thermal conductivity of unidirection ally oriented Si3N4W/Si3N4composites[J].J.Mater.Sci.,2000,(35):4487-4493.
[16]Barinova,T.V.and Borovinskaya,I.P.Combustion of silicon powders containing organic additives in nitrogen gas under pressure:1.Effect of dopants on combustion phenomenology,Int.J.Self-Propag.High-Temp[J].Synth.,2009,(18):25-29.
[17]T.V.Barinova,I.P.Borovinskaya.Effect of metal compounds onα-Si3N4formation during silicon combustionin nitrogen in the presence of organic additives[J].Inorganic Materials,2017,(53):381-385.
[18]徐鹏,杨建,丘泰.输出窗材料的研究进展[J].硅酸盐通报,2007,(26):1158-1164.
[19]Sang-Hoon Rhee,Jae Do Lee,and Doh-Yeon Kim.Effect ofα-Si3N4initial powder size on the microstructural evolution and phase transformation during sintering of Si3N4ceramics[J].J.Eur.Cer.Soc.,2000,(20):1787-1794.
[20]L.A.ChevykalovaI.Yu.Kelina et al.Ceramic Material Based on Domestic Silicon Nitride Powder Prepared by an SHS Method[J].Refractories and Industrial Ceramics January,2015,(55):403-408.
[21]Okamoto Y,HirosakiN,Ando M,et al.Effect of sintering additive composition on the thermal conductivity of silicon nitride[J].J.Mater.Res.,1998,(13):3473-3177.
[22]K.Furuya,F.Munakata,K.Matsuo,et al.Microstructural control ofβ-silicon nitride ceramics to improve thermal conductivity[J].Journal of Thermal Analysis and Calorimetry,2002,69(3):873-879.
[23]Dai Jian-Qing,Huang Yong,Ma Jing-Tao.Surface characteristics and aqueous dispersibility of commercial silicon nitride powders:Effects of acid leaching,surface hydrolysis,and thermal oxidation[J].Ceramics International,2008,34(8):1835-1842.
[24]Yang J.F.,Ohji T.,Niihara K..The influence of Y2O3-Al2O3content on sintering process and microstructure of siliconnitride ceramics[J].Journal of the American Ceramic Society,2000,83(8):2094-2096.
[25]V.V.Krasil'nikov,V.V.Sirota,A.S.Ivanov etal.Investigation of the Structure of Si3N4-Based Ceramic with Al2O3and Y2O3Additives[J].Glass and Ceramics,2014,71(1-2):15-17.
[26]Sung R J,Lee S W,Nakayama T,etal.Mechanical and thermal properties of hot-pressed Si3N4with added Al N[J].Mater.Sci.Forum,2003,(439):119-124.
[27]Kitayama M,Hirao K,Toriyama M,etal.Thermal conductivity ofβ-Si3N4effects of various microstructure factors[J].J.Am.Ceram.Soc.,1999,(82):3105-3110.
[28]Yang J.F.,Ohji T.,Niihara K..The influence of Y2O3-Al2O3content on sintering process and microstructure of silicon nitride ceramics[J].Journal of the American Ceramic Society,2000,83,(8):2094-2096.
[29]Yang L,Li J B,Yang X Z,et al.Effect of heat treatment on properties of silicon nitride with rare earth oxide addition[J].Chinese Journal of Rare Metals,2004,4(28):609-612.
[30]KitayamaM,Hirao K,Toryama M,et al.Control of Si3N4crystal morphology and Its mechanism(Part2):effect of lanthanide additives[J].J.Ceram.Soc.Jpn,1999,(107):995-1000.
[2]余群明.电动汽车电控系统发展现状及趋势[J].汽车零部件,2011,(04):18-19.
[3]Hareesh Chandrasekar.The IGBT and its creator[J].Resonance,2013,18(6):63-580.
[4]Kang,Zhipo Ji,Chun Yang,et al.Performance Comparison of Battery Chargers Based on Si C-MOSFET and Si-IGBT for Railway Vehicles[C].International Conference on Electrical and Information Technologies for Rail Transportation,2017,351-358.
[5]Jinlong Xu,Joyce Zhang,Ken Kuang.Influence of Firing Temperature and Atmospheric Conditions on Processing of Direct Bond Copper(DBC)[C].Conveyor Belt Furnace Thermal Processing,2018,133-139.
[6]Kuan Hong Lin,Zi Hao Xu,Shun Tian Lin.A Study on Microstructure and Dielectric Performances of Alumina/Copper Composites by Plasma Spray Coating[J].Journal of Materials Engineering and Performance,2011,20(2):231-237.
[7]Cherng-Yuh Su,C.T.Pan,Min-Sheng Lo.Microstructure and Mechanical Properties of Al N/Cu Brazed Joints[J].Journal of Materials Engineering and Performance,2014,23(9):3299-3304.
[8]Jurgen Schulz-Harder.Advantages and new development of direct bonded copper substrates[J].Microelectronics Reliability,2003,(43):359-365.
[9]Shinji Fukuda,Kazuhiko Shimada,Noriya Izu,et al.Crack generation in electroless nickel plating layers on copper-metallized silicon nitride substrates during thermal cycling[J].Journal of Materials Sci ence:Materials in Electronics,2017,28(11):8278-8285.
[10]Shinji Fukuda,Kazuhiko Shimada,Noriya Izu,et al.Thermal-cycling-induced surface roughening and structural change of a metal layer bonded to silicon nitride by active metal brazing[J].Journal of Materials Science:Materials in Electronics,2017,28(16):12168-12175.
[11]祝昌军,蒋俊,高玲,等.氮化硅陶瓷的制备及进展[J].江苏陶瓷,2001,34(3):10-12.
[12]Yongfeng Xia,Yu-Ping Zeng,and Dongliang Jiang.Microstructure and mechanical properties of porous Si3N4ceramics prepared by freeze-casting[J].Materials and Design,2012,(33):98-103.
[13]Shinya Matsuda.Fracture characteristics of silicon nitride ceramic ball subjected to thermal shock[J].Journal of Materials Science,2016,51(11):5502-5513.
[14]Haggerty J S,Light foot A.Opportunities for enhancing the thermal conductivities of Si C and Si3N4ceramics through improved processing ceram[J].Eng.Sci.Proc.,1995,(16):475-487.
[15]Lee SW,ChaeH B,Park D S,et al.Thermal conductivity of unidirection ally oriented Si3N4W/Si3N4composites[J].J.Mater.Sci.,2000,(35):4487-4493.
[16]Barinova,T.V.and Borovinskaya,I.P.Combustion of silicon powders containing organic additives in nitrogen gas under pressure:1.Effect of dopants on combustion phenomenology,Int.J.Self-Propag.High-Temp[J].Synth.,2009,(18):25-29.
[17]T.V.Barinova,I.P.Borovinskaya.Effect of metal compounds onα-Si3N4formation during silicon combustionin nitrogen in the presence of organic additives[J].Inorganic Materials,2017,(53):381-385.
[18]徐鹏,杨建,丘泰.输出窗材料的研究进展[J].硅酸盐通报,2007,(26):1158-1164.
[19]Sang-Hoon Rhee,Jae Do Lee,and Doh-Yeon Kim.Effect ofα-Si3N4initial powder size on the microstructural evolution and phase transformation during sintering of Si3N4ceramics[J].J.Eur.Cer.Soc.,2000,(20):1787-1794.
[20]L.A.ChevykalovaI.Yu.Kelina et al.Ceramic Material Based on Domestic Silicon Nitride Powder Prepared by an SHS Method[J].Refractories and Industrial Ceramics January,2015,(55):403-408.
[21]Okamoto Y,HirosakiN,Ando M,et al.Effect of sintering additive composition on the thermal conductivity of silicon nitride[J].J.Mater.Res.,1998,(13):3473-3177.
[22]K.Furuya,F.Munakata,K.Matsuo,et al.Microstructural control ofβ-silicon nitride ceramics to improve thermal conductivity[J].Journal of Thermal Analysis and Calorimetry,2002,69(3):873-879.
[23]Dai Jian-Qing,Huang Yong,Ma Jing-Tao.Surface characteristics and aqueous dispersibility of commercial silicon nitride powders:Effects of acid leaching,surface hydrolysis,and thermal oxidation[J].Ceramics International,2008,34(8):1835-1842.
[24]Yang J.F.,Ohji T.,Niihara K..The influence of Y2O3-Al2O3content on sintering process and microstructure of siliconnitride ceramics[J].Journal of the American Ceramic Society,2000,83(8):2094-2096.
[25]V.V.Krasil'nikov,V.V.Sirota,A.S.Ivanov etal.Investigation of the Structure of Si3N4-Based Ceramic with Al2O3and Y2O3Additives[J].Glass and Ceramics,2014,71(1-2):15-17.
[26]Sung R J,Lee S W,Nakayama T,etal.Mechanical and thermal properties of hot-pressed Si3N4with added Al N[J].Mater.Sci.Forum,2003,(439):119-124.
[27]Kitayama M,Hirao K,Toriyama M,etal.Thermal conductivity ofβ-Si3N4effects of various microstructure factors[J].J.Am.Ceram.Soc.,1999,(82):3105-3110.
[28]Yang J.F.,Ohji T.,Niihara K..The influence of Y2O3-Al2O3content on sintering process and microstructure of silicon nitride ceramics[J].Journal of the American Ceramic Society,2000,83,(8):2094-2096.
[29]Yang L,Li J B,Yang X Z,et al.Effect of heat treatment on properties of silicon nitride with rare earth oxide addition[J].Chinese Journal of Rare Metals,2004,4(28):609-612.
[30]KitayamaM,Hirao K,Toryama M,et al.Control of Si3N4crystal morphology and Its mechanism(Part2):effect of lanthanide additives[J].J.Ceram.Soc.Jpn,1999,(107):995-1000.