热循环载荷下LTCC基板焊接组件结构仿真分析与试验对比研究
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摘要
低温共烧陶瓷(Low Temperature Co-fired Ceramic,简称LTCC)技术是实现电子设备小型化、集成化的主流技术。在LTCC封装时,由于封装金属与LTCC的热膨胀系数很难匹配,导致组件在焊接以及交变温度载荷下产生位移,进而产生热应力,严重时甚至导致LTCC基板产生裂纹,丧失其工作性能。在高、低温环境下,通过对LTCC基板焊接组件表面位移进行试验测量与软件仿真,并将二者进行对比,验证了仿真结果的合理性与准确性。本文工作为今后提升LTCC基板焊接组件的力学性能提供了一种便捷、经济、可靠的有限元软件仿真分析技术手段。
The low temperature co-fired ceramic (LTCC) is a mainstream technology for miniaturization and integration ofthe electronic devices. During the packaging of LTCC,the thermal expansion coefficient of the encapsulated metal is difficult to match with that of LTCC,resulting in the displacements and stresses of the component under welding and alternating temperature load,leading to cracks in LTCC substrate and loss of the performance. In both high and low temperature conditions, the surface displacements of the welding component of LTCC substrate were measured and simulated. And the rationality and accuracy of the simulation was verified. This work provides a convenient,economical and reliable method of finite element simulation analysis to improve the mechanical properties of LTCC substrate welding components for the future.
The low temperature co-fired ceramic (LTCC) is a mainstream technology for miniaturization and integration ofthe electronic devices. During the packaging of LTCC,the thermal expansion coefficient of the encapsulated metal is difficult to match with that of LTCC,resulting in the displacements and stresses of the component under welding and alternating temperature load,leading to cracks in LTCC substrate and loss of the performance. In both high and low temperature conditions, the surface displacements of the welding component of LTCC substrate were measured and simulated. And the rationality and accuracy of the simulation was verified. This work provides a convenient,economical and reliable method of finite element simulation analysis to improve the mechanical properties of LTCC substrate welding components for the future.
引文
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[2]Ma M S,Liu Z F,Li Y X.Multilayer metallized ceramic composites:LTCC processing and thermal simulation[J].Ferroelectrics,2013,450(1):107-112.
[3]周育保.LTCC基板的振动分析及其封装可靠性研究[D].西安:西安电子科技大学,2009.
[4]钟慧,张怀武.低温共烧结陶瓷(LTCC):特点、应用及问题[J].磁性材料及器件,2003(4):33-35.
[5]Chen C,Hou F Z,Liu F M,et al.Thermo-mechanical reliability analysis of a RF Si P module based on LTCCsubstrate[J].M icroelectronics Reliability,2017,79:38-47.
[6]岳帅旗,刘志辉,张刚,等.LTCC基板腔底平整度研究[J].电子元件与材料,2014,33(5):80-83.
[7]谭继勇,张强,刘兵.LTCC电路片焊接裂纹分析与优化[J].电子工艺技术,2016,37(1):11-16.
[8]黄元昊,杨连乔,张建华.LED热学性能测试方法的研究综述[J].半导体技术,2012,37(5):329-334.
[9]吕强,尤明懿,郭细平,等.工业级FPGA空间应用器件封装可靠性分析[J].电子元件与材料,2015,34(2):69-73.
[10]宝剑光,秦强,柴葳,等.基于非接触法的1200℃高温应变测试技术研究[J].科学技术与工程,2017,17(6):117-121.
[11]潘兵,吴大方,高镇同.基于数字图像相关方法的非接触高温热变形测量系统[J].航空学报,2010,31(10):1960-1967.
[12]高建新.变形测量的数字图像相关分析法[J].同济大学学报(自然科学版),1997(1):98-103.
[13]潘兵,谢惠民,杨林华.三维数字图像相关方法在卫星天线表面测量上的应用[C]//中国力学学会成立50周年暨中国力学学会学术大会2007论文摘要集(下).北京:中国力学学会,2007:769.
[14]Gencturk B,Hossain K,Kapadia A,et al.Use of digital image correlation technique in full-scale testing of prestressed concrete structures[J].M easurement,2014,47(1):505-515.
[15]王天石,时生淦,马洪波,等.基于LTCC基板温度载荷条件下失效的仿真分析[J].装备制造技术,2018(3):204-208.