一种新型聚合酸酐在高性能无卤覆铜板上的应用
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- 论文作者：密亚男 ; 粟俊华
- 年：2016
- 作者机构：上海南亚覆铜箔板有限公司;
- 论文关键词：聚合酸酐 ; 无卤 ; 高性能 ; 覆铜板
- 英文论文关键词：polymeric anhydride ; halogen-free ; high performance ; copper clad laminate
- 会议召开时间：2016-10-13
- 会议录名称：第十七届中国覆铜板技术·市场研讨会论文集
- 语种：中文
- 分类号：TN41
- 学会代码：FTBC
- 会议名称：第十七届中国覆铜板技术·市场研讨会
- 会议地点：中国陕西西安
- 主办单位：中国印制电路行业协会基板材料分会、中国电子材料行业协会覆铜板材料分会
- 学会名称：中国电子材料行业协会覆铜板材料分会
- 页数：6
- 文件大小：246k
- 原文格式：D
- 会议级别：全国
摘要
本文论述了一种新型聚合酸酐在高性能无卤覆铜板上的应用,主要采用了一种特殊结构的环氧树脂为主体树脂,选用氰酸酯和一种聚合酸酐为固化剂来改善材料的介电性能和耐热性能,选用高耐热含磷类阻燃剂以实现无卤阻燃。制备的高性能无卤覆铜板主要性能指标为:Tg(DMA)≥208℃,Z轴CTE≤2.6%;耐热性:TD≥370℃,T288>180min;电性能(55%RC,10GHz):Dk≤4.06,Df≤0.007;阻燃达到UL94 V-0级,可满足高频高速PCB领域应用无卤化的需求。
This paper introduces a new polymeric anhydride which can be used in high performance halogen-free copper clad Laminate. This high performance halogen free laminating matrix resin based on epoxy resin with special structure and curing agent such as cyanate and a polymeric anhydride, the high performance flame retardant such as polyphosphazene used to balance the flammability. By this way, we prepared a high performance halogen-free copper clad Laminate. Its key characters are: Tg(DMA)≥208℃; Z axis CTE≤2.7%; Heat resistance: TD≥370℃, T288>180min; Electrical properties(50% RC, 10GHz): Dk≤4.06, Df ≤0.007. Furthermore, the copper clad laminate also has good flame retardant to UL94 V-0 level, which is fully meeting the high-frequency field of high-speed PCB and multilayer production of halogen-free process demand.
This paper introduces a new polymeric anhydride which can be used in high performance halogen-free copper clad Laminate. This high performance halogen free laminating matrix resin based on epoxy resin with special structure and curing agent such as cyanate and a polymeric anhydride, the high performance flame retardant such as polyphosphazene used to balance the flammability. By this way, we prepared a high performance halogen-free copper clad Laminate. Its key characters are: Tg(DMA)≥208℃; Z axis CTE≤2.7%; Heat resistance: TD≥370℃, T288>180min; Electrical properties(50% RC, 10GHz): Dk≤4.06, Df ≤0.007. Furthermore, the copper clad laminate also has good flame retardant to UL94 V-0 level, which is fully meeting the high-frequency field of high-speed PCB and multilayer production of halogen-free process demand.
引文
[1]马丽丽,Bhanu sood,Michael Pecht,包生祥.无卤阻燃剂在印制电路板中的应用进展.材料导报,2010,24(12):50-54.
[2]李芝华,谢科予,任冬燕.电路板用无卤阻燃环氧树脂材料研究进展.中国塑料,2005,19(12):1-6.
[3]David Bedner.New Halogen-free Materials:Their Time Has Finally Arrived[J].Circui Tree,2008,21(9):26-29.
[4]Edward N,Scott M Fisher,郭桦等.多官能团聚苯醚低聚物在覆铜板中的应用及无卤阻燃性能的研究[C].第十一届中国覆铜板技术·市场研讨会论文集,上海,2010:153-161.
[5]江璐霞,孙云,汪映寒.新型无卤阻燃环氧树脂及固化剂的研究进展[J].绝缘材料,2005,38(4):39-45.
[6]刘潜发,苏民社.无卤阻燃对覆铜板性能的影响及开发新动向[J].绝缘材料,绝缘材料2012,45(5).
[7]张楷亮,王立新,任丽,酸酐固化环氧树脂/蒙脱石纳米复合材料的合成及固化动力学的研究,化学与粘合,2004,l(3).
[8]Ji Li-Na,Gong Yi;Yang Zhen-Guo.Failure investigation on copper-plated blind vias in PCB.Microelectronics Reliability,2010,50(8):1163-1170.
[9]祝大同.高速基板材料技术发展现况与分析,覆铜板资讯,2015,(5):9-30
[10]杨中强,刘东亮,王江华.苯乙烯-马来酸酐树脂在覆铜箔板中的应用,热固性树脂.2002,5(17):20-22
[11]祝大同.PCB基板材料用新型环氧树脂发展综述.印制电路信息,2009,(4)..
[12]张家亮.低传输损失无卤PCB基板材料的发展(1)[J].覆铜板资讯,2009(1):16.
[13]Medesti M,Lorenzetti A,Simioni F.Influence of different flame retardants on fire behaviour of modified PIR/PUB polymers[J].Polym Degrad Stab,2001,72:475.
[2]李芝华,谢科予,任冬燕.电路板用无卤阻燃环氧树脂材料研究进展.中国塑料,2005,19(12):1-6.
[3]David Bedner.New Halogen-free Materials:Their Time Has Finally Arrived[J].Circui Tree,2008,21(9):26-29.
[4]Edward N,Scott M Fisher,郭桦等.多官能团聚苯醚低聚物在覆铜板中的应用及无卤阻燃性能的研究[C].第十一届中国覆铜板技术·市场研讨会论文集,上海,2010:153-161.
[5]江璐霞,孙云,汪映寒.新型无卤阻燃环氧树脂及固化剂的研究进展[J].绝缘材料,2005,38(4):39-45.
[6]刘潜发,苏民社.无卤阻燃对覆铜板性能的影响及开发新动向[J].绝缘材料,绝缘材料2012,45(5).
[7]张楷亮,王立新,任丽,酸酐固化环氧树脂/蒙脱石纳米复合材料的合成及固化动力学的研究,化学与粘合,2004,l(3).
[8]Ji Li-Na,Gong Yi;Yang Zhen-Guo.Failure investigation on copper-plated blind vias in PCB.Microelectronics Reliability,2010,50(8):1163-1170.
[9]祝大同.高速基板材料技术发展现况与分析,覆铜板资讯,2015,(5):9-30
[10]杨中强,刘东亮,王江华.苯乙烯-马来酸酐树脂在覆铜箔板中的应用,热固性树脂.2002,5(17):20-22
[11]祝大同.PCB基板材料用新型环氧树脂发展综述.印制电路信息,2009,(4)..
[12]张家亮.低传输损失无卤PCB基板材料的发展(1)[J].覆铜板资讯,2009(1):16.
[13]Medesti M,Lorenzetti A,Simioni F.Influence of different flame retardants on fire behaviour of modified PIR/PUB polymers[J].Polym Degrad Stab,2001,72:475.