C波段双层MEMS滤波器的设计
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摘要
微波滤波器作为通信、雷达等系统中重要的选频元件,其性能好坏将直接影响整个通信系统的性能[1]。滤波器的高性能、小型化是目前主要的研制目标。本文介绍了C波段双层微机械(Micro-Electro-Mechanical System,MEMS)滤波器,采用抽头交指结构,采用电感耦合等离子(Inductively Coupled Plasma,ICP)深硅刻蚀和金-金键合工艺实现封闭谐振腔,大大减少了体积和辐射损耗。滤波器中心频率为4.1GHz,,相对带宽15%,驻波小于1.5,3.2GHz&5GH处抑制大于45 d B。芯片尺寸为7 mm×7.8 mm×0.8 mm。本文给出了该滤波器的具体制作流程。实物测试结果表明,获得的MEMS滤波器的测试结果与仿真结果基本一致。
Microwave filter is an important element in communications, radar and other systems, its performance will directly affect the performance of the entire communication system [1].Highperformance and miniaturization of filter are the main development objectives. This article describes a C-band double layer MEMS(Micro-Electro-Mechanical System) filter, which usingthe tap interdigitated structure, and inductively coupled plasma(Inductively Coupled Plasma, ICP) deep silicon etching and gold- gold bonding process to achieve closure resonator, in this way, it greatly reducing the volume and radiation loss. Filter center frequency is 4.1GHz, relative bandwidth is 15%, VSWR less than 1.5, inhibition at 3.2GHz & 5GH is both greater than 45 d B. The filter Chip size is 7 mm × 7.8 mm × 0.8 mm. In this paper, we also describethe specific production process of the filter. It shows that the test results and our simulation results arealmost the same.
引文
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