微系统技术及其在电子战接收机中的应用
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- 英文论文题名：Micro System Technology and Its Application in EW Receiver
- 论文作者：卢胜军 ; 林逸群 ; 范童修 ; 邓庆文
- 英文论文作者：LU Sheng-jun ; LIN Yi-qun ; FAN Tong-xiu ; DEND Qing-wen ; No.36 Research Institute of CETC
- 年：2016
- 作者机构：中国电子科技集团公司第三十六研究所;
- 论文关键词：电子战 ; 微系统 ; 接收机
- 英文论文关键词：Electronic warfare(EW) ; Micro system ; Receiver
- 会议召开时间：2016-08-17
- 会议录名称：2016年全国军事微波、太赫兹、电磁兼容技术学术会议论文集
- 语种：中文
- 分类号：TN851
- 学会代码：WBXB
- 会议名称：2016年全国军事微波、太赫兹、电磁兼容技术学术会议
- 会议地点：中国陕西西安
- 主办单位：中国电子学会微波分会、天线与微波技术重点实验室
- 学会名称：《微波学报》编辑部
- 页数：5
- 文件大小：655k
- 原文格式：D
- 会议级别：全国
摘要
传统的电子战接收机存在着集成密度低、互联尺度长等缺点,无法满足电子战装备微系统化的强烈需求,功能模块的高度集成是解决这一需求的关键技术途径,本文首先阐述了微系统的两种主要技术途径:多功能芯片和多功能基板;随后针对一个实际应用的电子战接收机架构展开分析,并给出了各功能模块的集成化解决方案及部分测试结果。
Due to the limitations in integration density, interconnect distance and heat dissipation capacities, the traditional microwave module cannot meet the demands of EW micro systems. High density integration technology is regarded as the key solution for this problem. Firstly, this dissertation describe two technique approaches in micro-system: multi-functional chip and multi-functional substrate; Subsequently, this paper analyze a receiver's architecture which has been used in a EW system. And also, a integration scheme and some testing results for the microwave modules are described.
Due to the limitations in integration density, interconnect distance and heat dissipation capacities, the traditional microwave module cannot meet the demands of EW micro systems. High density integration technology is regarded as the key solution for this problem. Firstly, this dissertation describe two technique approaches in micro-system: multi-functional chip and multi-functional substrate; Subsequently, this paper analyze a receiver's architecture which has been used in a EW system. And also, a integration scheme and some testing results for the microwave modules are described.
引文
[1]刘志辉,吴明远,微系统功能模块集成工艺发展趋势及挑战[J],电子工艺技术,2015,04:195-198
[2]毛军发,周亮,系统级封装的基础研究[R],上海交通大学,2013.10
[3]Hao Wu,Hooman Darabi,David Murphy,and M.-C.Frank Chang,A Highly Linear Inductorless Wideband Receiver with Phase and Thermal Noise Cancellation[C],2015 IEEE ISSCC pp:30-31.
[4]Hongmei Li,Jagannathan B.,Jing Wang.et al.Technology Scaling and Device Design for 350 GHz RF Performance in a 45nm Bulk CMOS Process[C].2007 IEEE Symposium on VLSI Technology,2007,pp:56-57.
[5]Hooijtnans Pieter.射频集成的技术选择[J].电子产品世界.2004,18:89-91.
[6]Simon W,Kassner J,Litschke O,et al.Highly Integrated Ka-band TX Front-end Module with an8×8 Antenna Array[R].Kamp-Lintfort,Germany:IMST Gmb H,2011.
[2]毛军发,周亮,系统级封装的基础研究[R],上海交通大学,2013.10
[3]Hao Wu,Hooman Darabi,David Murphy,and M.-C.Frank Chang,A Highly Linear Inductorless Wideband Receiver with Phase and Thermal Noise Cancellation[C],2015 IEEE ISSCC pp:30-31.
[4]Hongmei Li,Jagannathan B.,Jing Wang.et al.Technology Scaling and Device Design for 350 GHz RF Performance in a 45nm Bulk CMOS Process[C].2007 IEEE Symposium on VLSI Technology,2007,pp:56-57.
[5]Hooijtnans Pieter.射频集成的技术选择[J].电子产品世界.2004,18:89-91.
[6]Simon W,Kassner J,Litschke O,et al.Highly Integrated Ka-band TX Front-end Module with an8×8 Antenna Array[R].Kamp-Lintfort,Germany:IMST Gmb H,2011.