无胶双面挠性覆铜板的制备及其性能研究
详细信息 查看官网全文
- 论文作者：胡启彬 ; 梁立 ; 茹敬宏 ; 伍宏奎
- 年：2016
- 作者机构：广东生益科技股份有限公司国家电子电路基材工程技术研究中心;
- 论文关键词：挠性覆铜板 ; 热塑性聚酰亚胺 ; 低成本
- 英文论文关键词：Two-layer FCCL ; TPI ; Low-cost
- 会议召开时间：2016-10-13
- 会议录名称：第十七届中国覆铜板技术·市场研讨会论文集
- 语种：中文
- 分类号：TN41
- 学会代码：FTBC
- 会议名称：第十七届中国覆铜板技术·市场研讨会
- 会议地点：中国陕西西安
- 主办单位：中国印制电路行业协会基板材料分会、中国电子材料行业协会覆铜板材料分会
- 学会名称：中国电子材料行业协会覆铜板材料分会
- 页数：5
- 文件大小：170k
- 原文格式：D
- 会议级别：全国
摘要
通过在铜箔上先后涂布热固性聚酰亚胺前驱体和热塑性聚酰亚胺前驱体,经过高温亚胺化得到无胶单面挠性覆铜板,再与铜箔进行高温辊压制得无胶双面板。通过测试板材的剥离强度和PI复合膜的玻璃化转变温度、机械性能,热膨胀系数评价其应用于无胶双面挠性覆铜板的可行性。结果表明:15%TPI含量的无胶双面挠性覆铜板具有较好的综合性能以及较低的成本,可用于挠性覆铜板领域。
The thermosetting polyimide precursor and the thermal plastic polyimide precursor were coated on the copper foils layer by layer in the order of Cu/PI/TPI/Cu.It was imidized with high temperature and then laminated with another copper foil to make a two-layer flexible copper clad laminate(FCCL).The peeling strength of FCCL and the glass transition temperature(Tg),the thermal expansion coefficient and mechanical properties of the PI composite film were tested to evaluate the feasibility of its application in FCCL.The results show that the 15% TPI content of FCCL has good comprehensive properties and low cost, and can be used in the field of FCCL.
The thermosetting polyimide precursor and the thermal plastic polyimide precursor were coated on the copper foils layer by layer in the order of Cu/PI/TPI/Cu.It was imidized with high temperature and then laminated with another copper foil to make a two-layer flexible copper clad laminate(FCCL).The peeling strength of FCCL and the glass transition temperature(Tg),the thermal expansion coefficient and mechanical properties of the PI composite film were tested to evaluate the feasibility of its application in FCCL.The results show that the 15% TPI content of FCCL has good comprehensive properties and low cost, and can be used in the field of FCCL.
引文
[1]张翔宇.二层法双面挠性覆铜板的研制[J].绝缘材料.2009 42(6):9-11.
[2]欧家忠.挠性印制电路市场面面观[J].印制电路信息.2000(9):29-32.
[3]刘生鹏.浅述二层挠性覆铜板的进展及市场分布[J].印制电路信息.2007(5):42-44.
[4]谢飞.浅析无胶单面挠性覆铜板的卷曲性[J].覆铜板资讯.2011(4):16-19.
[5]丁孟贤.聚酰亚胺—化学、结构与性能的关系及材料[M].北京:科学出版社,2006.
[6]丁孟贤.聚酰亚胺—单体合成、聚合方法及材料制备[M].北京:科学出版社,2011.
[2]欧家忠.挠性印制电路市场面面观[J].印制电路信息.2000(9):29-32.
[3]刘生鹏.浅述二层挠性覆铜板的进展及市场分布[J].印制电路信息.2007(5):42-44.
[4]谢飞.浅析无胶单面挠性覆铜板的卷曲性[J].覆铜板资讯.2011(4):16-19.
[5]丁孟贤.聚酰亚胺—化学、结构与性能的关系及材料[M].北京:科学出版社,2006.
[6]丁孟贤.聚酰亚胺—单体合成、聚合方法及材料制备[M].北京:科学出版社,2011.