蓝宝石晶片研磨用碳化硼微粉的表征
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摘要
蓝宝石晶片需求量的猛增促使碳化硼作为其研磨材料的用量也逐渐增加。而电弧炉碳热还原法制备碳化硼时,由于炉内温区不均一和保温时间的不同,导致所合成的碳化硼品质差别较大,仅有高品质的碳化硼微粉才可用于蓝宝石晶片的研磨。本文采用了化学分析、XRD、SEM等检测方法,从纯度、硼碳比、晶型、物相结构、表观形貌、硬度等方面对两种不同品质的碳化硼微粉进行了一系列的对比分析,并进行了蓝宝石晶片的研磨试验。实验结果表明:蓝宝石研磨用一级品碳化硼微粉具有纯度高(98.35%)、硼碳比接近理论硼碳比4.0、结晶好、致密度高和硬度高(4987.20 kg/mm2)的等特性。一级品碳化硼在用于蓝宝石研磨时具有研磨速率高、研磨时间短、使用寿命长和研磨效果好等优点。
The demand of boron carbide,which is used as the abrasive material of sapphire wafer,is dramatically increasing with the development of sapphire wafer. Commercially,the boron carbide was prepared by arc furnace carbothermic reduction. The quality of boron carbide was heterogeneous due to the temperature and holding time variation in the submerged electronic arc furnace. Only boron carbide powder of high quality could be used in the grinding process of sapphire wafer. In this paper,the influence factors the quality of boron carbide,such as the purity,molar B/C ratio,phase composition,morphology and hardness,were characterized and compared to determine their hardness by chemical analysis,XRD and SEM,respectively. Besides,the grinding experiments of sapphire with different qualities of boron carbide were also proceeded. It was found that only the boron carbide with high purity(98.35%),stoichiometric molar B/C ratio(4/0),high crystallinity and high densification,was qualified as the abrasive material for sapphire wafer. Besides,the high quality of boron carbide resulted in the higher grinding rate,shorter grinding time,longer usage life and better grinding effect in the sapphire grinding experiment.
引文
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