Characterization and Failure Analysis Techniques for Ball Grid Array Solder Joints
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- 英文论文题名：Characterization and Failure Analysis Techniques for Ball Grid Array Solder Joints
- 论文作者：Adam W.Mortensen ; Maria C.Lee ; Roger M.Devaney
- 英文论文作者：Adam W.Mortensen ; Maria C.Lee ; Roger M.Devaney
- 年：2016
- 会议召开时间：2016-11-10
- 会议录名称：2016中国高端SMT学术会议论文集
- 语种：英文
- 分类号：TN405
- 学会代码：SMTS
- 会议名称：2016中国高端SMT学术会议
- 会议地点：中国福建厦门
- 主办单位：四川省电子学会SMT专委会、广东省电子学会SMT专委会、厦门市技师协会SMT专委会、陕西省电子学会SMT专委会、山东省电子制造技术专委会、上海市电子学会SMT专委会、安徽省电子学会SMT专委会、南京市电子学会SMT专委会、清华大学伟创力SMT实验室、SMTA China、英国环球SMT与封装、EM Asia、电子工艺技术杂志社、广东技术师范学院SMT实训中心
- 学会名称：四川省电子学会SMT专业委员会
- 页数：16
- 文件大小：3005k
- 原文格式：D
- 会议级别：全国
摘要
The necessity for smaller complex assemblies in Printed Circuit Board(PCB)manufacturing has given rise to the use of Ball Grid Array(BGA)devices,primarily due to their density of solder connections over a small area.Other devices,such as pin grid arrays and surface mount integrated circuits,have become difficult to use because of potential electrical shorting from limited spacing between the solder connections.While the number of solder connections on BGA’s is an advantage regarding space and size,the devices do have potential issues.Reduced mechanical strength of the solder connection due to the small surface area of each joint can result in fracture.Coefficient of Thermal Expansion(CTE)mismatch during reflow or thermal cycling can cause flexure between the component and board,putting additional stress on the solder joints.The transition to lead(Pb)free solder driven by Ro HS has created additional problems(e.g.Head-in-Pillow{Hi P},black pad defect,pad cratering,etc.).Characterization of BGA solder joints is critical in determining the quality of an assembly and when identifying the cause of a failure.This paper will describe techniques used for BGA solder joint characterization and failure analysis.Non-destructive techniques,such as visual examination and radiography,are typically the first tests performed and are used to identify such things as misshaped solder joints and voiding,but are limited in their ability to locate failures and defects.Further testing with destructive techniques,including Dye&Pry analysis,cross sectional evaluation,and subsequent examination in a Scanning Electron Microscope(SEM)with analysis by Energy Dispersive Spectroscopy(EDS),is typically used for interfacial analysis and can identify the majority of failures in BGA solder joints.While most of these techniques are common,the success of an analysis is based on the implementation and interpretation of each test.
The necessity for smaller complex assemblies in Printed Circuit Board(PCB) manufacturing has given rise to the use of Ball Grid Array(BGA) devices, primarily due to their density of solder connections over a small area. Other devices, such as pin grid arrays and surface mount integrated circuits, have become difficult to use because of potential electrical shorting from limited spacing between the solder connections. While the number of solder connections on BGA's is an advantage regarding space and size, the devices do have potential issues. Reduced mechanical strength of the solder connection due to the small surface area of each joint can result in fracture. Coefficient of Thermal Expansion(CTE) mismatch during reflow or thermal cycling can cause flexure between the component and board, putting additional stress on the solder joints. The transition to lead(Pb) free solder driven by Ro HS has created additional problems(e.g. Head-in-Pillow {Hi P}, black pad defect, pad cratering, etc.). Characterization of BGA solder joints is critical in determining the quality of an assembly and when identifying the cause of a failure. This paper will describe techniques used for BGA solder joint characterization and failure analysis. Non-destructive techniques, such as visual examination and radiography, are typically the first tests performed and are used to identify such things as misshaped solder joints and voiding, but are limited in their ability to locate failures and defects. Further testing with destructive techniques, including Dye & Pry analysis, cross sectional evaluation, and subsequent examination in a Scanning Electron Microscope(SEM) with analysis by Energy Dispersive Spectroscopy(EDS), is typically used for interfacial analysis and can identify the majority of failures in BGA solder joints. While most of these techniques are common, the success of an analysis is based on the implementation and interpretation of each test.
The necessity for smaller complex assemblies in Printed Circuit Board(PCB) manufacturing has given rise to the use of Ball Grid Array(BGA) devices, primarily due to their density of solder connections over a small area. Other devices, such as pin grid arrays and surface mount integrated circuits, have become difficult to use because of potential electrical shorting from limited spacing between the solder connections. While the number of solder connections on BGA's is an advantage regarding space and size, the devices do have potential issues. Reduced mechanical strength of the solder connection due to the small surface area of each joint can result in fracture. Coefficient of Thermal Expansion(CTE) mismatch during reflow or thermal cycling can cause flexure between the component and board, putting additional stress on the solder joints. The transition to lead(Pb) free solder driven by Ro HS has created additional problems(e.g. Head-in-Pillow {Hi P}, black pad defect, pad cratering, etc.). Characterization of BGA solder joints is critical in determining the quality of an assembly and when identifying the cause of a failure. This paper will describe techniques used for BGA solder joint characterization and failure analysis. Non-destructive techniques, such as visual examination and radiography, are typically the first tests performed and are used to identify such things as misshaped solder joints and voiding, but are limited in their ability to locate failures and defects. Further testing with destructive techniques, including Dye & Pry analysis, cross sectional evaluation, and subsequent examination in a Scanning Electron Microscope(SEM) with analysis by Energy Dispersive Spectroscopy(EDS), is typically used for interfacial analysis and can identify the majority of failures in BGA solder joints. While most of these techniques are common, the success of an analysis is based on the implementation and interpretation of each test.
引文
1 IPC-7095C:Design and Assembly Process Implementation for BGAs,2013-January
2 Xie,Dongji;Shangguan,Dongkai and Kroener,Helmut“Pad Cratering Evaluation of PCB”.IPC APEX EXPO Conference Proceedings
3 Wells,Oliver.Scanning Electron Microscopy.New York,Mc Graw-Hill,Inc.,1974
2 Xie,Dongji;Shangguan,Dongkai and Kroener,Helmut“Pad Cratering Evaluation of PCB”.IPC APEX EXPO Conference Proceedings
3 Wells,Oliver.Scanning Electron Microscopy.New York,Mc Graw-Hill,Inc.,1974