标签用热熔压敏胶的研制及性能影响因素探讨
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摘要
热熔压敏胶(HMPSA)在标签应用中会出现质量不稳定、渗油等问题,使得标签产生起皱、翘边、脱落等现象,因此其产品质量保障尤为突出。
     本文进行了最佳增粘树脂的选择及热熔压敏胶性能影响因素分析,并获得标签热熔压敏胶的最佳配方。结果表明:标签用HMPSA的最佳增粘树脂为软化点在100℃左右的萜烯树脂和松香季戊四醇酯;环烷油对标签HMPSA的初粘力和渗油性影响最大;获得正交最优配方为SIS-A:环烷油4010:增粘树脂= 30:25:50(质量比)。
     本文还研究了苯乙烯系热塑性弹性体(SIS)结构变量对HMPSA性能影响。研究表明:苯乙烯含量由14%上升至30%,软化点由75℃上升至89℃,180°剥离强度由5.6 N·cm-1升高至8.4 N·cm-1,初粘力由2.2 cm降低至5.4 cm;双嵌段SI含量由7%升高至38%,180°剥离强度由4.2 N·cm-1上升至10.1 N·cm-1;熔融流动指数(MI)由8 g/10min升高至25 g/10min,175℃熔融黏度由9200 mPa·s下降至2200 mPa·s。
     本文最后利用差式扫描量热分析法(DSC)研究各种增粘树脂与弹性体相容性。研究发现:弹性体的DSC曲线充分体现其典型的微观两相分离结构;不同类型增粘树脂软化点与其Tg间线性关系不同;融入SIS不同相的增粘树脂对其两相Tg影响不同。
Hot melt pressure sensitive adhesive (HMPSA) used in label had many quality problems such as unstable quality or permeability in applications, to cause the label wrinkling, sticking out or falling off. So the quality guarantee of HMPSA has been particularly outstanding.
     The selection of optimum tackifying resin and the analysis of influencing factors of HMPSA were firstly researched in this paper. And the optimum formula of label HMPSA was obtained. The results indicate that the optimum tackifying resin for label HMPSA was rosin pentaerythritol ester or terpene resin with softening point of 100℃. The existence of naphthenic oil has affected the initial adhesion and oil penetration of label HMPSA the most. The optimum formula of label HMPSA was SIS-A: naphthenic oil 4010: tackifier resins = 30:25:50(mass ratio).
     Influences of the structure variable of styrene series thermoplastic elastomer on the properties of HMPSA were also studied. The research demonstrates that when the styrene content was increased from 14% to 30%, the softening point of HMPSA was increased from 75℃to 89℃,and 180opeel strength was increased from 5.6 N·cm-1 to 8.4 N·cm-1,and the initial adhesion was decreased from 2.2 cm to 5.4 cm; when the diblock copolymer content was increased from 7% to 38%,180opeel strength was increased from 4.2 N·cm-1 to 10.1 N·cm-1; when the melt flow index was decreased from 8 g/10min to 25 g/10min, melt viscosity of 175℃was decreased from 9200 mPa·s to 2200 mPa·s.
     At last, differential scanning calorimetry (DSC) analysis was used to research the compatibility of various kinds of tackifying resin and styrene series thermoplastic elastomer. Through the study we found that the DSC curve of styrene type-thermoplastic elastomer presented typical micro-structure of two-phase separation.The quantitative relationship between Tg and the softening point of different tackifier resins was diverse. The tackifying resins which were dissolved in different phases of SIS had different effects on the two phases′Tg.
引文
[1].向明,蓝方,陈宁.热熔胶粘剂[M].北京:化学工业出版社,2002.
    [2].石军,李建颖.热熔胶粘剂实用手册[M].北京:化学工业出版社,2004.
    [3].华向阳.热熔压敏胶的研究与开发[J].中国胶粘剂,2000,9(3):1~4.
    [4].王德充.SIS国内外现状和发展趋势[J].石化技术,2001,3(1):1~4.
    [5].Aadams R D,Gibbs M.Manufacture of adhesive joints and bulk specimens with high-temperature adhesives[J].International Journal of Adhesion and Adhesives.2004,24(1):69~83.
    [6].杨玉昆.压敏胶粘剂[M].北京:科学出版社,1991.
    [7].邸明伟,王勃.防腐卷材用热熔压敏胶的研制[J].粘接,2003,24(l):12~14.
    [8].张在新.热熔压敏胶粘剂的市场和技术动向[J].中国胶粘剂,2002,11(5):50~52.
    [9].李红强,曾辛荣,吴伟卿,等.热熔压敏胶的应用现状及发展[J].化学与黏合,2006,28(5):338~341.
    [10].亢海刚,张巧莲,陈贤军. SIS热熔压敏胶粘剂的研制[J].粘接,2005,26(3):27~29.
    [11].陈薇,钟玉林,陈鹏宇,等.SIS热熔压敏胶的研制[J].广西工学院学报,2001,12(4):58~62.
    [12].刘志娟,吕鸿,王少明,等.卫生用品用环保型热熔压敏胶的研制[J].中国胶粘剂,2004,13(4):14~16.
    [13].任嘉祥,杜奕,李江屏,等.丙烯酸系热熔压敏胶粘剂的研究[J].高分子材料科学与工程, 2000,16(4): 139~142.
    [14].Ulman K L, Sweet R P, Durfee L D. Hot - melt silicone pressure sensitive adhesive with siloxylated polyether waxes as additives[P].US5607721,1997-03-04.
    [15].Cifuentes M E,Brady W P,Schmidt R G,et al. Moisture-curable hot melt silicone pressure sensitive adhesives[P].US5905123,1999-05-18.
    [16].Wang B Y,Zhang C Y. Hot melt adhesive composition based on ablend of amorphous poly-alpha-olefin and syndiotactic polypropylene[P].WO2003/033612,2003-04-24.
    [17].哈维尔M G,里斯威克M,马丁K E.低应用温度弹性胶粘剂[P].CN1918255A,2007-02-21.
    [18].何Q,哈维尔M G,黄J M.含离聚物的热熔胶粘剂[P].CN1918257,2007-02-21.
    [19].吴永升.一种可以低温涂布的热熔胶[P].CN1687282A,2005-10-26.
    [20].Fabienne A,Christophe M F.Low application temperature hot melt adhesive[P].US20070088116, 2007-04-19.
    [21].Frank A B.Hot melt pressure sensitive composition and applications[P].US5360854,1994-11-01
    [22].Czec H Z. Development of solvent - free pressure - sensitive adhesive acrylic[J].International Journal of Adhesion and Adhesives,2004,24(2):119~125.
    [23].Park M C,Lee M C. Effects of polymeric emulsifiers on the properties of acrylic emulsion pressure sensitive adhesives[J].Journal of Applied Polymer Science,2004,94(4):1456~1460.
    [24].Yang Y K,Li H,Wang F. Studies on the water resistance of acrylic emulsion pressure sensitive adhesives(PSAs)[J].Journal of Adhesion Science and Technology,2003,17(13):1741~1750.
    [25].黄汉生.日本热塑性弹性体开发与应用动向[J].现代化工,1999,19(12):42~46.
    [26].陈居铨.制约热熔压敏胶发展因素探讨[J].福建化工,2004,9(4):47~48,56.
    [27].李红强.曾幸荣.吴伟卿,等.热熔压敏胶的应用现状及发展[J].化学与黏合.2006,28(5):338~341.
    [28].李红强,曾辛荣,吴伟卿,等.热塑性弹性体热熔压敏胶的研究进展[J].中国胶粘剂,2006,15(6):47~50.
    [29].石磊,葛学贵,杨中洲,等.我国胶粘剂技术现状、发展趋势和应用前景[J].中国胶粘剂,2005,14(8): 44~47,51.
    [30].龚辈凡.我国大陆胶粘剂市场现状及发展预测[J].粘接,2008,29(1):1~5.
    [31].龚辈凡.我国胶粘剂市场现状及发展态势[J].粘接,2007,28(1):1~4.
    [32].钱伯章,朱建芳.苯乙烯类热塑性弹性体的发展现状和市场分析(一)[J].橡胶科技市场,2007,(3):15~17
    [33].吴艳芬.不干胶标签材料及应用[J].中国包装工业,2005,24(12):53~55.
    [34].李勃昕,陈建华,姚克检.不干胶标签用胶黏剂分析[J].印刷技术,2009,16(2):3~5.
    [35].翟大昌.标签用丙烯酸醋乳液压敏胶粘剂性能的研究[J].中国胶粘剂,2005,14(3):1~4.
    [36].翟大昌.标签用热塑性弹性体SDS热熔压敏胶性能的探讨[J].化学与黏合,2006,28(2):82~84.
    [37].刘志娟,裘理仁,吕鸿,等.便贴纸用热熔压敏胶的研制[J].中国胶粘剂,2003,12(1):41~43.
    [38].山西省化工研究所编著.聚氨酯弹性体[M].北京:化学工业出版社,1985.
    [39].钱伯章.世界热塑性弹性体的现状和发展趋势[J].世界橡胶工业,2005,32(5):40~46.
    [40].卜雅萍.热塑性弹性体发展现状[J].广东塑料,2005,8(133):18~21.
    [41].Arendt W D.Dibenzoate modifier finds niche uses in specialty hot melts[J].Adhesives Age,1996,39(9): 37~38.
    [42].Osterberger L D,Arendt W D.High melt point additives improve product assembley HMs[J]. Adhesives Age,1991,34(12):22~27.
    [43].殷锦捷,马海云.热熔压敏胶的开发应用[J].中国胶粘剂,2003,12(5):61~63.
    [44].Class J B,Chu S G.The viscoelastic properties of rubber-res blends.I.The effect of resin structure[J].Journal of Applied Polymer Sclence,1985,30(1):805~814.
    [45].Class J B,Chu S G.The viscoelastic properties of rubber-resin blends.Ⅱ.The effect of resin molecular weight[J].Journal of Applied Polymer Science,1985,30(1):815~824.
    [46].Class J B,Chu S G.The viscoelastic propertiesof rubber-resin blends.Ⅲ.The effect of resin concentration [J].Journal of Applied Polymer Science,1985,30(2):825~842.
    [47].Kumooka Y.Analysis of rosin and modified rosin ester in adhesives by matrix-assisted laser desorptionionization time of flight mass spectrometry(MALDI-TOF-MS)[J].Forensic Science International, 2008,176(2):111~120.
    [48].薛小栋.环烷基油—一种理想的橡胶增塑剂[J].世界橡胶工业,2007,34(3):14~16.
    [49].高红,马书杰,刘妍,等.橡胶油的种类和性能及应用[J].橡胶工业,2003,50(12):75~759.
    [50].李立权.白油及白油生产技术[J].润滑油,2003,18(4):1~6.
    [51].王鉴,张凤军,王东军.当今抗氧剂的主要类型及发展趋势[J].炼油与化工,2008,19(2):7~10.
    [52].亢海刚,张巧莲,陈贤军. SIS热熔压敏胶粘剂的研制[J].粘接,2005,26(3):27~29.
    [53].李红英,金关泰.苯乙烯类热塑性弹性体热熔压敏胶的研究进展[J].石化技术与应用,2001,19(3): 183~186.
    [54].杨玉昆,吕凤亭.压敏胶制品技术手册[M].北京:化学工业出版社,2004.
    [55].易严德.热塑性弹性体SIS结构与性能的关系[J].中国胶粘剂,2004,14(2):8~11.
    [56]Webster I. Recent developments in pressure-sensitive adhesives for medical applications[J ]. International Journal of Adhesion and Adhesives,1997,17(1):69~73.
    [57].クラレ株式会社,hydrogenated butadiene block copolymer[P].EP0779350,1997-06-25
    [58].易华,扬帆,王霞.SEBS热熔型压敏胶的研究[J].上海应用技术学院学报,2002,2(2):102~105.
    [59].Noel R M,Stoner C A.Hot melt pressure sentitive positioning adhesive[P].US6465557,2002-10-15
    [60].陈勇,谢洪泉.SBS和SBS环氧化与顺酐化研究[J].弹性体,2005,15(2):67~72.
    [61].邸明伟,王勃.环氧化SIS热熔压敏胶的研究[J].粘接,2004,24(5):5~7.
    [62].向福如,马明兴,丁明双,等.环氧化苯乙烯-丁二烯嵌段共聚物的性能研究[J].橡胶工业, 1998,45(6):339~342.
    [63].熊开生,徐溢,张云怀.紫外光改性SIS热熔压敏胶研究[J].中国胶粘剂,2003,12(1):38~40.
    [64].Dong H L,Hyun S D,Hyun J K,Preparation of SIS/SBS based UV-cross-linkable pressure-sensitive adhesive using the thiol-ene reaction[J].Journal of Adhesion Science and Technology,2007,21(7):589~603.
    [65].Dupont M,Masse M.Proceedings of the 2000 TAPPI hot melt symposium,Bal Harbour 2000[C]. Atlanta:TAPPI press,2000.
    [66].王士才,李宝霞,张晓东.丙烯酸接枝SBS胶粘剂的研制[J].粘接,1998,19(2):1~3.
    [67].Wilhelm H M,Felisberti M I.Modification of styrene-butadiane-styrene triblock copolymer with maleic anhydride[J].Journal of Applied Polymer Science, 2000,83(13):2953~2960.
    [68].Passaglia E.Grafting of maleate and maleic anhydride onto styrene-b-(ethylene-co-1-butene)- b-styrene triblock copolymer(SEBE)[J].Polymer,2000,41(2):4389~4400.
    [69].殷锦捷,刘静.环保型EVA/SBS胶粘剂的研究[J].中国胶粘剂,2006,15(2):18~20.
    [70].刘静,殷锦捷.溶液法改性SBS胶粘剂的研究[J].中国胶粘剂,2007,16(9):18~21.
    [71].周卫平,庄萍.嵌段共聚物的改性研究及其在胶黏剂中的应用[J].化学与粘合,2006,28(2):102~106.
    [72].Xinya L T,Ingrid C S.Hot melt pressure sensitive adhesives based on compatibilized blends of elastomers[P].US6162859,2000-12-19.
    [73].李广宇,付丽华,何红波,等.SDS型热熔压敏胶的研制[J].粘接,1999,20(3):13~16.
    [74].扬性坤,宋世林.用SIS及SBS制备热熔压敏胶的工艺研究[J].化学与粘合,2001,7(3):107~109.
    [75].Lutz E L,Eddy S.Hot melt pressure sensitive adhesive composition[P].US6384138, 2002-05-07.
    [76].鲁俊,张军.SIS改性EVA热熔胶的研制[J].粘接,2006,27(4):12~13.
    [77].朱晶心,谢理,陈芳,等.SBS与CPE熔融共混的研究[J].太原工业大学学报,1996,27(1):24~29.
    [78].李健丰,徐亚娟.测试方法对聚合物玻璃化温度的影响[J].塑料科技,2009,37(2):64~67.
    [79].周平华,许乾慰.热分析在高分子材料中的应用[J].上海塑料,2004,125(1):36~40.
    [80].张斌,张志谦,王超,等.SBS与不用增粘树脂相容性的研究[J].中国胶粘剂,1998,8(3):40~43.
    [81].徐种德,黄妙玲,卜路嘉,等.差示扫描量热法(DSC)研究聚苯乙烯-聚异戊二烯二嵌段共聚物的微相分离行为[J].功能高分子学报,1989,2(4):254~260.
    [82].杜淼,郁秋明,王万杰,等.线形苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)的粘弹弛豫与相形态[J].高等学校化学学报,2006,27(4):753~757.
    [83].邸明伟,陈鹏,阮光锋,等.极性化SBS/增粘树脂共混物的相容性研究[J].粘接,2009,16(8):32~35.
    [84].谭亮红,周淑华,王进,等.差示扫描量热仪在橡胶配方研究中的应用[J].特种橡胶制品,2002,23(2): 52~55.
    [85].张红星,周晓山.苯乙烯-异戊二烯嵌段聚合物热熔压敏胶性能影响因素探讨[J].精细化工中间体, 2007,37(4):48~49,58.
    [86].袁煜艳. SIS、SEBS产品及其在热熔胶中的应用[J].粘接,2007,28(5):49~52.
    [87].张红星,周晓山.苯乙烯-异戍二烯两嵌段对线型三嵌段聚合物性能的影响[J].弹性体,2008,18(3): 45~47.
    [88].李金林.胶粘剂技术与应用手册[M].北京:宇航出版社,1991.
    [89].夏文干,韩养军.热熔压敏胶研究[J].粘接,1991,9(5):1.
    [90].张红墨,周晓山.苯乙烯-异戊二烯嵌段聚合物热熔压敏胶性能影响因素探讨[J].精细化工中间体, 2007,37(4):48~49.
    [91].Man Jun H,Wei Xiao C,Xi Xia D,et al.Polymer Physics[M].Shanghai:Fudan Press,1990:248~250.
    [92].卢言成,童盺,孙向东.石油树脂对热熔压敏胶粘结性能的影响[J].化工生产与技术,2007,14(6):51~54.

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