高密度MCM-L的散热及热机械可靠性研究
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摘要
本文结合国内下一代超级计算机中央处理器(CPU)高速度、高密度、高性能封装形式的需要，以某超级计算机CPU拟采用的积层多层有机基板多芯片模块(MCM-L)为研究对象，从散热和热机械可靠性两方面对其进行了较为深入的研究。
所设计的多芯片模块中有七个芯片，每个芯片都通过1268个面阵排列的PbSn共晶凸点倒装焊接在具有叠层通孔的聚酰亚胺积层多层基板上，芯片下填充底充胶，模块的总功耗为90W，芯片的最大热流密度为30W／cm~2。
在散热方面，本文拟设计采用双流道铝质水冷板作为该多芯片模块的间接液体冷却手段。为了研究这种水冷板的冷却能力，首先用功率管模拟芯片发热贴装在水冷板上，做了一系列的热测试试验，并采用计算流体力学(CFD)软件对试验过程进行了相应的模拟，对冷板中水的流动、冷板和功率管的温度分布以及系统的热平衡进行了详细的分析。试验和模拟结果的对比一方面验证了CFD模拟的准确性，另一方面推导出了试验中热接触材料的接触热阻(或接触热导)值。然后，通过CFD模拟对多芯片模块在这种水冷板的冷却下的温度分布和热平衡进行了分析，其结果表明水冷板可以使多芯片模块的最高温度达到58.1℃，满足热设计的要求。最后，研究了热接触材料的导热系数和接触热阻、芯片下凸点分布、BGA焊球分布、芯片厚度、芯片之间的间隔和芯片布局以及流体入口的流速和温度等参数对多芯片模块温度的影响。
在热机械可靠性方面，由于含七个芯片的多芯片模块具有结构对称性，为了节约成本，本文以单个具有多端子的倒装芯片焊接在积层多层有机基板上的FCOB封装形式来研究整个多芯片模块的可靠性。首先设计了采用不同芯片尺寸、底充胶材料和基板类型组合的六种单芯片多端子FCOB样品进行热循环、热冲击试验和失效分析，并将各样品的寿命和失效模式进行了比较分析，以研究芯片尺寸、底充胶材料和基板类型对这种单芯片多端子FCOB封装可靠性的影响，然后采用“整体—局部”有限元模拟对热循环条件下，各组样品焊点的位移、等效应力、等效应变以及应变能密度的变化历程进行了详细的研究，模拟结果较好的解释了热循环过程中出现的相关失效现象。最后，结合热循环测试结果和模拟结果拟合了基于焊点应变能密度的Darveaux总体寿命预测模型中的系数，并采用试验设计和响应面方法分析了各结构参数和材料属性的综合影响，对多端子FCOB的热机械可靠性进行了综合优化。
In order to meet the high speed, high density and high performance requirement of the package of CPU of domestic next generation supercomputer, the thermal dissipation and thermal-mechanical reliability of a kind of build-up laminated Multi-Chip Module (MCM-L) which will be applied in a certain supercomputer was investigated comprehensively in this paper. The module consisted of seven chips with 1268 eutectic solder bumps under each chip, which are mounted on a 224ayer laminated polyimide substrate with build-up layers and stacked vias. Underfill was filled in between the chips and substrate. The total power of the module was 90W and the maximum heat flux was 30W/cm~2.
In the aspect of thermal dissipation, an aluminum cold plate with inner double flow path was designed as the indirect liquid cooling equipment for the module. In order to determine the cooling ability of the cold plate, a series of similar experiments were conducted firstly: two power devices which could imitate power dissipation of chips were mounted on the top of the cold plate with thermal interface materials, and CFD simulations corresponding to the experiments were performed to get the fluid flow, temperature distribution and heat balance of the cold plate and power devices. The comparisons of the experimental results and simulation results not only evaluated the validity of CFD simulation method but also determined the interfacial thermal resistance of thermal interface materials iteratively. And then CFD simulation was used to investigate the heat transfer and fluid flow of the multi-chip module, the results turned out that the maximum temperature of the module was about 58.1℃, which indicted the cold plate could meet the requirement of thermal design. Based on the CFD simulation, the effects of factors such as thermal conductivity and interfacial thermal resistance of the thermal interface materials, solder bump patterns, solder ball patterns, thickness of the chips, space between chips, flow velocity and liquid inlet temperature on the thermal performance of the module were studied.
所设计的多芯片模块中有七个芯片，每个芯片都通过1268个面阵排列的PbSn共晶凸点倒装焊接在具有叠层通孔的聚酰亚胺积层多层基板上，芯片下填充底充胶，模块的总功耗为90W，芯片的最大热流密度为30W／cm~2。
在散热方面，本文拟设计采用双流道铝质水冷板作为该多芯片模块的间接液体冷却手段。为了研究这种水冷板的冷却能力，首先用功率管模拟芯片发热贴装在水冷板上，做了一系列的热测试试验，并采用计算流体力学(CFD)软件对试验过程进行了相应的模拟，对冷板中水的流动、冷板和功率管的温度分布以及系统的热平衡进行了详细的分析。试验和模拟结果的对比一方面验证了CFD模拟的准确性，另一方面推导出了试验中热接触材料的接触热阻(或接触热导)值。然后，通过CFD模拟对多芯片模块在这种水冷板的冷却下的温度分布和热平衡进行了分析，其结果表明水冷板可以使多芯片模块的最高温度达到58.1℃，满足热设计的要求。最后，研究了热接触材料的导热系数和接触热阻、芯片下凸点分布、BGA焊球分布、芯片厚度、芯片之间的间隔和芯片布局以及流体入口的流速和温度等参数对多芯片模块温度的影响。
在热机械可靠性方面，由于含七个芯片的多芯片模块具有结构对称性，为了节约成本，本文以单个具有多端子的倒装芯片焊接在积层多层有机基板上的FCOB封装形式来研究整个多芯片模块的可靠性。首先设计了采用不同芯片尺寸、底充胶材料和基板类型组合的六种单芯片多端子FCOB样品进行热循环、热冲击试验和失效分析，并将各样品的寿命和失效模式进行了比较分析，以研究芯片尺寸、底充胶材料和基板类型对这种单芯片多端子FCOB封装可靠性的影响，然后采用“整体—局部”有限元模拟对热循环条件下，各组样品焊点的位移、等效应力、等效应变以及应变能密度的变化历程进行了详细的研究，模拟结果较好的解释了热循环过程中出现的相关失效现象。最后，结合热循环测试结果和模拟结果拟合了基于焊点应变能密度的Darveaux总体寿命预测模型中的系数，并采用试验设计和响应面方法分析了各结构参数和材料属性的综合影响，对多端子FCOB的热机械可靠性进行了综合优化。
In order to meet the high speed, high density and high performance requirement of the package of CPU of domestic next generation supercomputer, the thermal dissipation and thermal-mechanical reliability of a kind of build-up laminated Multi-Chip Module (MCM-L) which will be applied in a certain supercomputer was investigated comprehensively in this paper. The module consisted of seven chips with 1268 eutectic solder bumps under each chip, which are mounted on a 224ayer laminated polyimide substrate with build-up layers and stacked vias. Underfill was filled in between the chips and substrate. The total power of the module was 90W and the maximum heat flux was 30W/cm~2.
In the aspect of thermal dissipation, an aluminum cold plate with inner double flow path was designed as the indirect liquid cooling equipment for the module. In order to determine the cooling ability of the cold plate, a series of similar experiments were conducted firstly: two power devices which could imitate power dissipation of chips were mounted on the top of the cold plate with thermal interface materials, and CFD simulations corresponding to the experiments were performed to get the fluid flow, temperature distribution and heat balance of the cold plate and power devices. The comparisons of the experimental results and simulation results not only evaluated the validity of CFD simulation method but also determined the interfacial thermal resistance of thermal interface materials iteratively. And then CFD simulation was used to investigate the heat transfer and fluid flow of the multi-chip module, the results turned out that the maximum temperature of the module was about 58.1℃, which indicted the cold plate could meet the requirement of thermal design. Based on the CFD simulation, the effects of factors such as thermal conductivity and interfacial thermal resistance of the thermal interface materials, solder bump patterns, solder ball patterns, thickness of the chips, space between chips, flow velocity and liquid inlet temperature on the thermal performance of the module were studied.
引文
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