电子设备硬振设计的模态测试与分析
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摘要
电子设备小型化已成发展趋势，现有的电子设备抗振性不能满足要求。由于机电系统小型化和轻量化以及其愈来愈严酷的应用环境条件，振动和冲击对机电系统的影响已变得非常突出，因此机电系统的结构的设计必须重视结构的动态特性分析。如果不能比较准确地把握电子设备本身性能，就无法形成一套完整的电子设备的抗振动设计方法，更难以主动的、有针对的提出改进和保证设备动态性能的方案。因此在实现电子设备硬装过程中，必须掌握电子设备结构的动态性能，才能有针对性地进行结构设计，实现电子设备硬装。于是，对设备进行模态分析，了解其固有频率等性质就显得非常必要。
模态分析是一种研究结构动力特性的方法，是系统辩识方法在工程振动领域中的应用，是结构动态设计及设备故障诊断的重要理论基础；结构动力修改则研究系统结构做出某种修改后动力学特性的变化或为获得某种动力学特性应如何对系统进行修改等问题。
本论文正是针对上述问题，对组件和整机系统进行实验模态测试与分析，总结出一套对电子设备模态测试以及分析的方法。通过研究实验数据，了解参数估计的原理及方法，从频域方面进行模态的参数辨识。从而辨识出被测对象的模态参数，并总结出结构参数对它的影响。测得的模态数据可以为有限元模型提供匹配依据，使其数值计算结果能与实验测试相匹配，这样的有限元模型可为电子设备硬装设计或改进提供有力的设计指导。
在得到模态参数之后，对组件以及整机系统进行谱分析。通过响应谱分析来了解对象的振动特性。冲击谱分析检测电子设备整机或关键元器件，部件的抗震，抗冲特性。随机谱分析的主要目的是研究与正弦扫频信号相比对模态参数提取的影响等。本文提出了一些对冲击以及随机响应谱进行分析的方法。
在模态分析的基础上对设备进行结构动力学修改。通过实验得到组件的动力学特性对整机的动态性能频率等方面的影响，并通过改变结构来优化设计，得到所需要的动态特性。
再根据组件和整机系统在模态分析之后得到的机械性能指标，开发出有效方法来控制组件和整机振动的方法，本文主要讨论了组件阻尼器的设计以及动态设计两种方法，得到了一定的减振效果。
Miniaturization has become the trend in the development of electronic equipment, so that vibration resistance of electronic equipment can not meet the existing requirements. Because the small and lightweight application of mechanical and electrical systems, and the increasingly harsh environmental conditions. Vibration and shock's effect of the electrical and mechanical systems have become very prominent. Therefore the design of the mechanical and electrical systems must attach importance to the dynamic characteristics of the structure analysis. If we can not accurately grasp the properties of electronic equipment, it is impossible to establish a complete set of anti-vibration design methods of electronic equipment, and also having less initiative. It is necessary to improve the dynamic performance of the equipment and guarantee programs. During the install process of electronic equipment, we must master the dynamic performance of electronic equipment. So that we can be targeted to the structural design and electronic equipment install. Therefore, the modal analysis of equipment, which using to understand their nature such as natural frequencies, is very necessary.
Modal analysis is a method to study the effects of structural dynamic characteristics, applying the system identification in the field of vibration engineering. Dynamic design equipment and fault diagnosis are basis for the important theoretical. Dynamic changes to the structure research that system make some changes in the revised dynamics. It is also research that how to obtain some dynamic characteristics by the system changes and other issues.
This paper will address these issues. It contains experimental modal testing and analysis of components and the whole system, and summed up a set method of electronic equipment modal testing and analysis. Based on the experimental data, realize the principles and methods of parameter estimation, and understand the modal parameter estimation from frequency domain. Determine the modal parameters of the measured object, and summed up the impact of structural parameters of modal parameters. It can provide numerical results to match the finite element model. This finite element model can provide effective guidance for the design or improve electronic equipment.
Understand the vibration characteristics of testing equipment by responding spectrum analysis. The impact spectral analysis is to study the anti-vibration and the impact characteristics of components or critical parts. Random spectral analysis is the main purpose of the study the influence of modal parameters compared with the sin-swept signal extraction and the random signal. This paper presents some method of the shock and random response spectrum analysis.
Founded on the experimental analysis, it can know the dynamic characteristics of components and the whole system. It focuses on how the dynamic characteristics of components affect the dynamic performance of a whole system. It also study that how to optimize the structure to gain the dynamic characteristics which are required.
Based on systems and components performance from the modal analysis, develop effective ways to control parts and components vibration. It main include designing internal components damper to reduce vibration and dynamic designing. And the result of the experiment show that this design obtains better reduces vibration effective.
模态分析是一种研究结构动力特性的方法，是系统辩识方法在工程振动领域中的应用，是结构动态设计及设备故障诊断的重要理论基础；结构动力修改则研究系统结构做出某种修改后动力学特性的变化或为获得某种动力学特性应如何对系统进行修改等问题。
本论文正是针对上述问题，对组件和整机系统进行实验模态测试与分析，总结出一套对电子设备模态测试以及分析的方法。通过研究实验数据，了解参数估计的原理及方法，从频域方面进行模态的参数辨识。从而辨识出被测对象的模态参数，并总结出结构参数对它的影响。测得的模态数据可以为有限元模型提供匹配依据，使其数值计算结果能与实验测试相匹配，这样的有限元模型可为电子设备硬装设计或改进提供有力的设计指导。
在得到模态参数之后，对组件以及整机系统进行谱分析。通过响应谱分析来了解对象的振动特性。冲击谱分析检测电子设备整机或关键元器件，部件的抗震，抗冲特性。随机谱分析的主要目的是研究与正弦扫频信号相比对模态参数提取的影响等。本文提出了一些对冲击以及随机响应谱进行分析的方法。
在模态分析的基础上对设备进行结构动力学修改。通过实验得到组件的动力学特性对整机的动态性能频率等方面的影响，并通过改变结构来优化设计，得到所需要的动态特性。
再根据组件和整机系统在模态分析之后得到的机械性能指标，开发出有效方法来控制组件和整机振动的方法，本文主要讨论了组件阻尼器的设计以及动态设计两种方法，得到了一定的减振效果。
Miniaturization has become the trend in the development of electronic equipment, so that vibration resistance of electronic equipment can not meet the existing requirements. Because the small and lightweight application of mechanical and electrical systems, and the increasingly harsh environmental conditions. Vibration and shock's effect of the electrical and mechanical systems have become very prominent. Therefore the design of the mechanical and electrical systems must attach importance to the dynamic characteristics of the structure analysis. If we can not accurately grasp the properties of electronic equipment, it is impossible to establish a complete set of anti-vibration design methods of electronic equipment, and also having less initiative. It is necessary to improve the dynamic performance of the equipment and guarantee programs. During the install process of electronic equipment, we must master the dynamic performance of electronic equipment. So that we can be targeted to the structural design and electronic equipment install. Therefore, the modal analysis of equipment, which using to understand their nature such as natural frequencies, is very necessary.
Modal analysis is a method to study the effects of structural dynamic characteristics, applying the system identification in the field of vibration engineering. Dynamic design equipment and fault diagnosis are basis for the important theoretical. Dynamic changes to the structure research that system make some changes in the revised dynamics. It is also research that how to obtain some dynamic characteristics by the system changes and other issues.
This paper will address these issues. It contains experimental modal testing and analysis of components and the whole system, and summed up a set method of electronic equipment modal testing and analysis. Based on the experimental data, realize the principles and methods of parameter estimation, and understand the modal parameter estimation from frequency domain. Determine the modal parameters of the measured object, and summed up the impact of structural parameters of modal parameters. It can provide numerical results to match the finite element model. This finite element model can provide effective guidance for the design or improve electronic equipment.
Understand the vibration characteristics of testing equipment by responding spectrum analysis. The impact spectral analysis is to study the anti-vibration and the impact characteristics of components or critical parts. Random spectral analysis is the main purpose of the study the influence of modal parameters compared with the sin-swept signal extraction and the random signal. This paper presents some method of the shock and random response spectrum analysis.
Founded on the experimental analysis, it can know the dynamic characteristics of components and the whole system. It focuses on how the dynamic characteristics of components affect the dynamic performance of a whole system. It also study that how to optimize the structure to gain the dynamic characteristics which are required.
Based on systems and components performance from the modal analysis, develop effective ways to control parts and components vibration. It main include designing internal components damper to reduce vibration and dynamic designing. And the result of the experiment show that this design obtains better reduces vibration effective.
引文
[1] W.Heylen, S.Lammens, P.Sas. Modal Analysis Theory and Testing. KULeuven, ISBN 9073802-61-Ⅹ.1998,25(2):115-116
[2] Brian J.Schwarz, Mark H.Richardson. Experimental Modal Analysis. CSI Reliability Week. October,1999,36(3):30-32
[3] J．H．金斯伯格．白化同，李俊宝译．机械与结构振动—理论与应用．北京：中国宇航出版社，2005：101—104
[4] 傅志方．振动模态分析与参数辨识．北京：机械工业出版社，1990：2—3
[5] Wayne Tustin. Curing resonances in electronic equipment. Evaluation Enginering.1998,4:80
[6] Barker DB, Chen YS. Modeling the vibration restraints of wedge lock card guides. J Electron.Packag 1993,115:189-94
[7] Claudie Hutin, Modal Analysis Using Appropriated Excitation Techniques, Sound and Vibration, 2000,(2):50-54
[8] 李玉盛，严学书．车床结构试验模态分析及可靠性．渝州大学学报，1995，11(3)：47—48
[9] 李金泉，丁洪生，付铁，庞思勤，谢殿煌．BKX—Ⅰ型并联机床的实验模态分析．制造技术与机床，2004(5)：35-38
[10] Steinberg DS. Vibration analysis for electronic equipment. New York: Wiley. 1988,45(3):20-22
[11] 邹进和．振动系统的模态分析实验设计．物理实验，2004，111(6)：65-70
[12] Pitarrsi J M,Di Edwardo A V. A Design Approach for the Systematic Improvement of Support Lcations for Vibrating Circuit Cards. ASME J. Electron. Package.,1993,115(1):118-123
[13] A.O.Cifuentes, A.Kalbag. Optimum placement of supports for printed wiring boards. Submitted for publication. 1993,108(5):30-32
[14] 曹树谦，张文德，萧龙翔．振动结构模态分析-理论、实验与应用．天津：天津大学出版社，2001：2-3，55-59
[15] 张维衡，谭林森．振动测试技术．武汉：华中理工大学出版社，1993：11—13
[16] James Mark Pitarresi. Modeling of Printed Circuit Cards Subjected to Vibration. Proc. IEEE. Papar CH2868-8/8/90/0000-2104,1990,36(7):2104-2107
[17] 李威，张宗杰，张维衡．柴油机机体实验模态分析和减振降噪研究．华中理工大学学 报，2000，20(2)：13-14
[18] 许本文，焦群英．机械振动与模态分析基础．北京：机械工业出版社，1998：80—88
[19] 周传荣，赵淳生．机械振动参数识别及其应用．江苏：科学出版社，1989：40-43
[20] D．J．EWINS．模态试验理论与实践(赵淳生，周传荣译)．江苏：东南大学出版社，1991：58
[21] 张思．振动测试与分析技术．北京：清华大学出版社，1992：30—36
[22] 张令弥．振动测试与动态分析．北京：航空工业出版社，1992：144—146
[23] Signalcalc 730软件使用说明文档
[24] Peter Avitabile. Experimental Modal Analysis—A simple Non-Mathematical Presentation. Sound and Vibration. 2001,102(2):70-72
[25] Singal R K, Gorman D J. A General Analytical Solution for Free Vibration of RectangularPlates Resting on Fixed Supports and with Attached Masses. ASME J. Electron. Packag. 1992:114;239-245
[26] 唐水源，张建民等．机器人机电一体化设计方法与应用研究．北京理工大学学报，1994，17(3)：45—47
[27] Pitarresi J M, Primavera A A. Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards. ASME J, Electron. package. 1992,114(4):378-383
[28] Barker DB, Chen YS, Dasgupta A. Estimating the vibration fatigue life of quad leaded surface mount components. J Electron Packag 1993,115:195-200.
[30] 沃德．海伦，斯帝芬，波尔著，白化同等泽．模态分析理论与试验．北京：北京理工大学出版社．2006：55-75
[31] McMurray KE, Mitchell LD. Characterization of boundary condition for wedge-lock-mounted printed circuit boards. Adv Electron Package. 1997,10(2): 121-127.
[32] 傅志方，华宏星．模态分析理论与应用．上海：上海交通大学出版社,2000：58-66
[33] 李朝旭．电子设备的抗振动设计．电子机械工程，2002,18(1)：223—228
[34] 陆超．信号变换装置结构动态设计与分析：[硕士学位论文]．成都：四川大学，2003
[35] 张劲松．电子机柜振动实验方法及夹具设计研究：[硕士学位论文]．成都：电子科技大学，2003
[36] 李方泽，刘馥清，王正．工程振动测试与分析．北京：高教出版社，1992：46
[37] 曾峰．印刷电路板(PCB)设计与制作．成都：电子工业出版社，2002：76-79
[38] 夏宏，郑鹏洲．电子元器件失效分析及应用．北京：国防工业出版社，1998：187
[39] 林循泓．振动模态参数识别及其应用．南京：东南大学出版社，1990：16-39
[40] ME'Scope软件使用帮助文档
[41] 张翔，臧其昌．模态分析及测试技术在空空导弹中的应用．航空兵器报，2002，21(1)：57—62
[42] 张向东，王志华，结构损伤检测的实验模态分析，北京石油化工学院学报，2004，16(1)：280—286
[43] Pitarresi JM. Modeling of printed circuit boards subject to vibration. IEEE Int Symp Circuits Sys. 1990,3:2104-2107
[44] 胡海昌．多自由度结构固有振动理论．北京：科学出版社，1987：97—98
[45] Pitarresi JM, Akanda A. Random vibration reponse of a surface mount lead/soder joint. Adv Electron Packag 1993,4(1):207-15
[46] 张亚峰．车载电子设备的抗振设计．电子机械工程，2003，19(2)：6—12
[47] Joseph K.Hammond, Timothy P.Waters. Signal Processing for Experimental Modal Analysis, The Royal Society. 2001,5:41-59
[48] P.Verboven, E.Parloo, B.Cauberghe, Improved Modal Parameter Estimation for Lowly Damped Systems Using Mon-parametric Exponential Windowing Techniques. Mechanical Systems and Signal Processing. 2004, 86(19): 675-699
[49] Samit Basu, Yoram Bresler. The Stability of Nonlinear Least Squares Problems and The Cramer-Rao Bound. IEEE Transactions on Signal Processing,2000,6(12): 3426-3436
[2] Brian J.Schwarz, Mark H.Richardson. Experimental Modal Analysis. CSI Reliability Week. October,1999,36(3):30-32
[3] J．H．金斯伯格．白化同，李俊宝译．机械与结构振动—理论与应用．北京：中国宇航出版社，2005：101—104
[4] 傅志方．振动模态分析与参数辨识．北京：机械工业出版社，1990：2—3
[5] Wayne Tustin. Curing resonances in electronic equipment. Evaluation Enginering.1998,4:80
[6] Barker DB, Chen YS. Modeling the vibration restraints of wedge lock card guides. J Electron.Packag 1993,115:189-94
[7] Claudie Hutin, Modal Analysis Using Appropriated Excitation Techniques, Sound and Vibration, 2000,(2):50-54
[8] 李玉盛，严学书．车床结构试验模态分析及可靠性．渝州大学学报，1995，11(3)：47—48
[9] 李金泉，丁洪生，付铁，庞思勤，谢殿煌．BKX—Ⅰ型并联机床的实验模态分析．制造技术与机床，2004(5)：35-38
[10] Steinberg DS. Vibration analysis for electronic equipment. New York: Wiley. 1988,45(3):20-22
[11] 邹进和．振动系统的模态分析实验设计．物理实验，2004，111(6)：65-70
[12] Pitarrsi J M,Di Edwardo A V. A Design Approach for the Systematic Improvement of Support Lcations for Vibrating Circuit Cards. ASME J. Electron. Package.,1993,115(1):118-123
[13] A.O.Cifuentes, A.Kalbag. Optimum placement of supports for printed wiring boards. Submitted for publication. 1993,108(5):30-32
[14] 曹树谦，张文德，萧龙翔．振动结构模态分析-理论、实验与应用．天津：天津大学出版社，2001：2-3，55-59
[15] 张维衡，谭林森．振动测试技术．武汉：华中理工大学出版社，1993：11—13
[16] James Mark Pitarresi. Modeling of Printed Circuit Cards Subjected to Vibration. Proc. IEEE. Papar CH2868-8/8/90/0000-2104,1990,36(7):2104-2107
[17] 李威，张宗杰，张维衡．柴油机机体实验模态分析和减振降噪研究．华中理工大学学 报，2000，20(2)：13-14
[18] 许本文，焦群英．机械振动与模态分析基础．北京：机械工业出版社，1998：80—88
[19] 周传荣，赵淳生．机械振动参数识别及其应用．江苏：科学出版社，1989：40-43
[20] D．J．EWINS．模态试验理论与实践(赵淳生，周传荣译)．江苏：东南大学出版社，1991：58
[21] 张思．振动测试与分析技术．北京：清华大学出版社，1992：30—36
[22] 张令弥．振动测试与动态分析．北京：航空工业出版社，1992：144—146
[23] Signalcalc 730软件使用说明文档
[24] Peter Avitabile. Experimental Modal Analysis—A simple Non-Mathematical Presentation. Sound and Vibration. 2001,102(2):70-72
[25] Singal R K, Gorman D J. A General Analytical Solution for Free Vibration of RectangularPlates Resting on Fixed Supports and with Attached Masses. ASME J. Electron. Packag. 1992:114;239-245
[26] 唐水源，张建民等．机器人机电一体化设计方法与应用研究．北京理工大学学报，1994，17(3)：45—47
[27] Pitarresi J M, Primavera A A. Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards. ASME J, Electron. package. 1992,114(4):378-383
[28] Barker DB, Chen YS, Dasgupta A. Estimating the vibration fatigue life of quad leaded surface mount components. J Electron Packag 1993,115:195-200.
[30] 沃德．海伦，斯帝芬，波尔著，白化同等泽．模态分析理论与试验．北京：北京理工大学出版社．2006：55-75
[31] McMurray KE, Mitchell LD. Characterization of boundary condition for wedge-lock-mounted printed circuit boards. Adv Electron Package. 1997,10(2): 121-127.
[32] 傅志方，华宏星．模态分析理论与应用．上海：上海交通大学出版社,2000：58-66
[33] 李朝旭．电子设备的抗振动设计．电子机械工程，2002,18(1)：223—228
[34] 陆超．信号变换装置结构动态设计与分析：[硕士学位论文]．成都：四川大学，2003
[35] 张劲松．电子机柜振动实验方法及夹具设计研究：[硕士学位论文]．成都：电子科技大学，2003
[36] 李方泽，刘馥清，王正．工程振动测试与分析．北京：高教出版社，1992：46
[37] 曾峰．印刷电路板(PCB)设计与制作．成都：电子工业出版社，2002：76-79
[38] 夏宏，郑鹏洲．电子元器件失效分析及应用．北京：国防工业出版社，1998：187
[39] 林循泓．振动模态参数识别及其应用．南京：东南大学出版社，1990：16-39
[40] ME'Scope软件使用帮助文档
[41] 张翔，臧其昌．模态分析及测试技术在空空导弹中的应用．航空兵器报，2002，21(1)：57—62
[42] 张向东，王志华，结构损伤检测的实验模态分析，北京石油化工学院学报，2004，16(1)：280—286
[43] Pitarresi JM. Modeling of printed circuit boards subject to vibration. IEEE Int Symp Circuits Sys. 1990,3:2104-2107
[44] 胡海昌．多自由度结构固有振动理论．北京：科学出版社，1987：97—98
[45] Pitarresi JM, Akanda A. Random vibration reponse of a surface mount lead/soder joint. Adv Electron Packag 1993,4(1):207-15
[46] 张亚峰．车载电子设备的抗振设计．电子机械工程，2003，19(2)：6—12
[47] Joseph K.Hammond, Timothy P.Waters. Signal Processing for Experimental Modal Analysis, The Royal Society. 2001,5:41-59
[48] P.Verboven, E.Parloo, B.Cauberghe, Improved Modal Parameter Estimation for Lowly Damped Systems Using Mon-parametric Exponential Windowing Techniques. Mechanical Systems and Signal Processing. 2004, 86(19): 675-699
[49] Samit Basu, Yoram Bresler. The Stability of Nonlinear Least Squares Problems and The Cramer-Rao Bound. IEEE Transactions on Signal Processing,2000,6(12): 3426-3436