CBGA热力耦合失效的实验研究和有限元分析
摘要
本文首先简要地介绍了微电子封装技术及其可靠性研究的现状和进展，之后对CBGA／PCB组件的热力耦合失效进行了实验研究和有限元模拟。
本文在系统介绍云纹干涉和全息干涉的同时，通过设计一套联合光路，建立实验过程和数据自动和半自动化处理系统。既节省时间，又提高了精度。通过实验测试，得出了室温环境、高温环境和低温环境下组件表观变形的特点和规律。
在实验条件的基础上，又利用有限元软件ANSYS5.3，通过2-D PLANE42和3-D SOLID模型分别计算了CBGA、PCB和焊球的变形、应变、应力场分布，得出了最大应力的位置和数值。
本文通过实验测试和有限元模拟，实现了对CBGA／PCB组件热力耦合失效的全面分析，对微电子组件的设计提供了可靠的数据，有重要的参考价值。
Above all, the electronic packages and the current research state on its reliability were briefly introduced in this dissertation. Then, the thermal and mechanical failures of the solder joints in the EGA were researched by the experimental method and Finite Element Method (FEM).
In this paper, the theory of the Moire Interferometry (MI) and Holographic Interferometry (HI) was systemically explained. Here, an integrative light path was put forward to full use of both methods, and a system was set up to deal with the experiment and its data automatically or half-automatically, which not only can save time but also has higher accuracy. By the experiments, we obtained the trait and regulation of specimen's deformation in room, high and low temperature environment.
Based on data of experiments, the ANSYS5.3 software was used to simulate and compute the deformations of CBGA/PCB by 2-D PLANE42 model and 3-D SOLID model. By finite element simulation, the stresses and strains on the CBGA, PCB and solder joints were obtained, and the location and the value of the most stress were known.
By the experiments and finite element simulation, the thermal and mechanical reliabilities of the solder joints in the BGA were fully analyzed in this paper. It provided credible dada for the design of the electronic packages, which was significant.
本文在系统介绍云纹干涉和全息干涉的同时，通过设计一套联合光路，建立实验过程和数据自动和半自动化处理系统。既节省时间，又提高了精度。通过实验测试，得出了室温环境、高温环境和低温环境下组件表观变形的特点和规律。
在实验条件的基础上，又利用有限元软件ANSYS5.3，通过2-D PLANE42和3-D SOLID模型分别计算了CBGA、PCB和焊球的变形、应变、应力场分布，得出了最大应力的位置和数值。
本文通过实验测试和有限元模拟，实现了对CBGA／PCB组件热力耦合失效的全面分析，对微电子组件的设计提供了可靠的数据，有重要的参考价值。
Above all, the electronic packages and the current research state on its reliability were briefly introduced in this dissertation. Then, the thermal and mechanical failures of the solder joints in the EGA were researched by the experimental method and Finite Element Method (FEM).
In this paper, the theory of the Moire Interferometry (MI) and Holographic Interferometry (HI) was systemically explained. Here, an integrative light path was put forward to full use of both methods, and a system was set up to deal with the experiment and its data automatically or half-automatically, which not only can save time but also has higher accuracy. By the experiments, we obtained the trait and regulation of specimen's deformation in room, high and low temperature environment.
Based on data of experiments, the ANSYS5.3 software was used to simulate and compute the deformations of CBGA/PCB by 2-D PLANE42 model and 3-D SOLID model. By finite element simulation, the stresses and strains on the CBGA, PCB and solder joints were obtained, and the location and the value of the most stress were known.
By the experiments and finite element simulation, the thermal and mechanical reliabilities of the solder joints in the BGA were fully analyzed in this paper. It provided credible dada for the design of the electronic packages, which was significant.
引文
[1] Gil Olacbea, VisionCast, "Evolution of IC Packaging" Electronic Packaging and Production Vol.38 No.8 1998(6) p58～63
[2] 李枚“微电子封装技术的发展与展望” 半导体杂志Vol．25，No．22000(6)32～36
[3] 高尚通“跨世纪的微电子封装”半导体情报Vol 3 No．62000(12)pp1～7
[4] 况延香，马莒生“迈向新世纪的微电子封装技术”电子工艺技术Vol．21，No．1 2000(1)1～6
[5] 朱颂春，况延香“新型微电子封装技术—BGA'’电子工艺技术Vol．19 No．2 1998(3)47～53
[6] Marrs, R.C., Freman,, B., Martin, J., "High Density BGA Technology", Proceedings of the 2nd International Conference and Exhibition on Multichip Modules, April 1993,pp326～329
[7] 李秀清，葛新霞“BGA封装技术研究”半导体情报Vol．37，No．4 2000(8)18～26
[8] BGA装封类型简单介绍 半导体杂志Vol．22 No．4 1997(12) 40～41
[9] 朱颂春“球形触点阵列与四边扁平封装的比较” 电子元件与材料1996．2 12～15
[10] 李玉珍“未来电子系统封装可靠性面临的困难”电子产品性与预测试验1999(6)pp42～44
[11] 肖汉武“IC设计中的封装问题”微电子技术Vol．27No．6 1999(12)pp6～11
[12] 李民 焊点的质量与可靠性 电子工艺技术Vol．21，No．2 2000(3)70～73
[13] 王谦，Shi-Wei Picky LEE，汪刚强，耿志挺，黄乐，唐祥云，马莒生“电子封装中的焊点及其可靠性”电子元件与材料2000(4)24～26
[14] Y. Guo, S.Liu "Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications" Journal of Electronic Packaging Vol. 120 1998(6) 186～193
[15] J.C.Suhing and S.T. Lin "Applications of Optical Methods to Electronic Packaging"Applications of Experimental Mechanics to Electronic Packaging ASEM 1995 39～45
[16] Hall, P.M., Dudderar, T.D. and Argyle, J.F., "Thermal Deformations Observered in Leadless Ceramic Chip Carders Surface Mounted to Printed Wiring Boards," IEEE Transactions on Components, Hybrids and Manufactureing Technology, Vol.6(4),pp544～552 1983
[17] Y F Guo "Characterizations of thermal deformation and effective CTE of PBGA modules" Proc of the 2nd International Symposium on Electronic Packaging Technology, Shanghai 1996 125～130
[18] B.Han, Y. Guo and H. C. Choi," Out-of-plane Displacement Measurement of Printed Circuit Board by Shadow Moir(e) with Variable Sensitivity," Proceedings of the 1993 ASEM International Electronics Packaging Conference, Binghamton. NY September
1993
[19] Y. Guo, "Applications of Shadow Moir(e) Method in Determination of Thermal Deformations in Eletronic Packaging," Proceedings of 1995 SEM Spring Conference,Grand Rapids, MI, 1995
[20] C P Yeh "Experimental and analytical investigation of thermally inducedwarpage for PWBs" proc IEEE, 41st Electronic Component technology conference Oakland, CA,1991
[21] B.Han, "Higher Sensitivity Moir(e) Intefferometry for Micromechanics Studies," Optical Engineering, Vol.31 No.7, 1992 pp. 1517～1526
[22] B.Han and D.Post, "Immersion Interferometer for Microscopic Moir(r) Interferometry",Experimental Mechanics, Vol.32,No. 1, 1992 pp3～41,
[23] 刘宝琛，史训清，“云纹干涉反转倍增法及其在微电子组件变形场测量中的应用”第八届全国实验力学会议文集1995．8，598～601
[24] W.N.Wang, K.M.Leung, "Reliability testing of Solder Joints in Surface Mounted Assembly Using Real-Time Holographic Interferometry", 45th Electronic Components and Technology Conference, U.S.A 1995 835～840,
[25] 王卫宁，石玲等，“表面安装技术(SMT)组件在功率循环作用下的三维位移形变场的光测力学实验研究”，第八届全国实验力学会议文集——实验力学进展哈尔滨工业大学出版社1995 586～589
[26] 王卫宁，石玲，戴福隆，“表面封装技术组件焊点热变形的云纹干涉法研究” 光学技术1996，2期，2～4
[27] 王卫宁、梁镜明，“表面安装技术(SMT)可靠性问题研究的实验测试方法及其研究现状和进展”首都师范大学学报Vol．18，1997
[28] W.N.Wang, L.Ai and K.M.Leung "Laser-interferometry Tolls Applied in Surface Mount Technology", Proceedings of the 3th Electronic Package Symposium Beifing Tsinghua University Pross, 1998, 364～369
[29] 王卫宁，梁镜明，“功率循环中表面安装器件(SMD)热变形的实时全息干涉测量研究”，半导体学报1998(8)，609～614
[30] 王卫宁，张存林等，“电子封装器件BGA的实时全息干涉实验研究”，激光杂志Vol．20,No．3 1999 46～48
[31] 王卫宁，张存林等，“全息干涉法在表面安装组件可靠性分析和产品质量检测中的应用”，激光技术，2000．1 15～20
[32] Zhang Lefu, Wang Weining, Wu Yiping, "Study of Thermal Deformation In BGA Assemblies Using FEM" International Conference and Exhibition in Micro Material Conference-Micro Mat 2000 Berlin, 2000
[33] N.J.Nigro, "Solder Reliability Theory and Applications" New York: Vab Nortrand Reinhold 1991:568
[34] J.Lau, D.Rice, and S. Erasmus "Thermal Fatigue Life of 256-pin, 0.4mm Pitch Plastic
Quad Flat Pack (QFP) Solder Joints," Advances in Electronic Packaging, ASME, San Jose, 1992
[35]Zhu,J., Ojala, K., and Tuominen, A., 1997, "The App;ication of Global/Local Techniue Infinite Element Simulation of BGA Assemblies," Presented at the ASEM International Mechanical Engineering Congress & Exposition, Dalas, Texas, Nov, 16～21
[36]D.Post, "Moir(?) Interferometry in White Light" Appl. ,Vol. 18, NO.124 (Dec 15 1979),4163～4167
[37]D.Post, B.Han, P. Ifju, "High Sensitivity Moir(?) Interferometry: Experimental Analysis for Mechanics and Materials," Springer-Verlag, NY, 1994
[38]戴福隆，方萃长等 《现代光测力学》 科学出版社 1990
[39]张如一，陆耀桢 《实验应力分析》 机械工业出版社 1980
[40]Guo,Y.,and Woychik, C.G., "Thermal Strain Measurements of Solder Joints in second Level Interconnections Using Moire Interferometry", ASEM Journal of Electronic Packaging 1992(3)
[41]D.Gabor, Nature, 161(1948),777
[42]E.Leith and J.Upatnieks, J.Opt., soc. Am52(1962), 1123
[43]Powell and K. Stetson, J.Opt., soc. Am 55(1965), 1593
[44]赵清澄 《光测力学》 上海科学技术出版社 1982
[45]于美文 《光全息学及其应用》 北京理工出版社 1994
[46]赵清澄，石沅，《实验应力分析》 科学出版社，1987
[47]王朝阳 朝阳软件之日积月累 1997
[48]Origin 5.0 之 readme
[49]弘道工作室 编著 《融会贯通——Photoshop 5.0中文版》人民交通出版社 1999．2
[50]ANSYS 用户使用手册 ANSYS in USA
[51]蓝宇，张连杰 “大型有限元分析软件ANSYS”应用科技 Vol.27，No.6 Jun．2000
[52]陈精一、蔡国忠 电脑辅助工程分析——ANSYS 使用指南 中国铁道出版社2001年 北京
[2] 李枚“微电子封装技术的发展与展望” 半导体杂志Vol．25，No．22000(6)32～36
[3] 高尚通“跨世纪的微电子封装”半导体情报Vol 3 No．62000(12)pp1～7
[4] 况延香，马莒生“迈向新世纪的微电子封装技术”电子工艺技术Vol．21，No．1 2000(1)1～6
[5] 朱颂春，况延香“新型微电子封装技术—BGA'’电子工艺技术Vol．19 No．2 1998(3)47～53
[6] Marrs, R.C., Freman,, B., Martin, J., "High Density BGA Technology", Proceedings of the 2nd International Conference and Exhibition on Multichip Modules, April 1993,pp326～329
[7] 李秀清，葛新霞“BGA封装技术研究”半导体情报Vol．37，No．4 2000(8)18～26
[8] BGA装封类型简单介绍 半导体杂志Vol．22 No．4 1997(12) 40～41
[9] 朱颂春“球形触点阵列与四边扁平封装的比较” 电子元件与材料1996．2 12～15
[10] 李玉珍“未来电子系统封装可靠性面临的困难”电子产品性与预测试验1999(6)pp42～44
[11] 肖汉武“IC设计中的封装问题”微电子技术Vol．27No．6 1999(12)pp6～11
[12] 李民 焊点的质量与可靠性 电子工艺技术Vol．21，No．2 2000(3)70～73
[13] 王谦，Shi-Wei Picky LEE，汪刚强，耿志挺，黄乐，唐祥云，马莒生“电子封装中的焊点及其可靠性”电子元件与材料2000(4)24～26
[14] Y. Guo, S.Liu "Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications" Journal of Electronic Packaging Vol. 120 1998(6) 186～193
[15] J.C.Suhing and S.T. Lin "Applications of Optical Methods to Electronic Packaging"Applications of Experimental Mechanics to Electronic Packaging ASEM 1995 39～45
[16] Hall, P.M., Dudderar, T.D. and Argyle, J.F., "Thermal Deformations Observered in Leadless Ceramic Chip Carders Surface Mounted to Printed Wiring Boards," IEEE Transactions on Components, Hybrids and Manufactureing Technology, Vol.6(4),pp544～552 1983
[17] Y F Guo "Characterizations of thermal deformation and effective CTE of PBGA modules" Proc of the 2nd International Symposium on Electronic Packaging Technology, Shanghai 1996 125～130
[18] B.Han, Y. Guo and H. C. Choi," Out-of-plane Displacement Measurement of Printed Circuit Board by Shadow Moir(e) with Variable Sensitivity," Proceedings of the 1993 ASEM International Electronics Packaging Conference, Binghamton. NY September
1993
[19] Y. Guo, "Applications of Shadow Moir(e) Method in Determination of Thermal Deformations in Eletronic Packaging," Proceedings of 1995 SEM Spring Conference,Grand Rapids, MI, 1995
[20] C P Yeh "Experimental and analytical investigation of thermally inducedwarpage for PWBs" proc IEEE, 41st Electronic Component technology conference Oakland, CA,1991
[21] B.Han, "Higher Sensitivity Moir(e) Intefferometry for Micromechanics Studies," Optical Engineering, Vol.31 No.7, 1992 pp. 1517～1526
[22] B.Han and D.Post, "Immersion Interferometer for Microscopic Moir(r) Interferometry",Experimental Mechanics, Vol.32,No. 1, 1992 pp3～41,
[23] 刘宝琛，史训清，“云纹干涉反转倍增法及其在微电子组件变形场测量中的应用”第八届全国实验力学会议文集1995．8，598～601
[24] W.N.Wang, K.M.Leung, "Reliability testing of Solder Joints in Surface Mounted Assembly Using Real-Time Holographic Interferometry", 45th Electronic Components and Technology Conference, U.S.A 1995 835～840,
[25] 王卫宁，石玲等，“表面安装技术(SMT)组件在功率循环作用下的三维位移形变场的光测力学实验研究”，第八届全国实验力学会议文集——实验力学进展哈尔滨工业大学出版社1995 586～589
[26] 王卫宁，石玲，戴福隆，“表面封装技术组件焊点热变形的云纹干涉法研究” 光学技术1996，2期，2～4
[27] 王卫宁、梁镜明，“表面安装技术(SMT)可靠性问题研究的实验测试方法及其研究现状和进展”首都师范大学学报Vol．18，1997
[28] W.N.Wang, L.Ai and K.M.Leung "Laser-interferometry Tolls Applied in Surface Mount Technology", Proceedings of the 3th Electronic Package Symposium Beifing Tsinghua University Pross, 1998, 364～369
[29] 王卫宁，梁镜明，“功率循环中表面安装器件(SMD)热变形的实时全息干涉测量研究”，半导体学报1998(8)，609～614
[30] 王卫宁，张存林等，“电子封装器件BGA的实时全息干涉实验研究”，激光杂志Vol．20,No．3 1999 46～48
[31] 王卫宁，张存林等，“全息干涉法在表面安装组件可靠性分析和产品质量检测中的应用”，激光技术，2000．1 15～20
[32] Zhang Lefu, Wang Weining, Wu Yiping, "Study of Thermal Deformation In BGA Assemblies Using FEM" International Conference and Exhibition in Micro Material Conference-Micro Mat 2000 Berlin, 2000
[33] N.J.Nigro, "Solder Reliability Theory and Applications" New York: Vab Nortrand Reinhold 1991:568
[34] J.Lau, D.Rice, and S. Erasmus "Thermal Fatigue Life of 256-pin, 0.4mm Pitch Plastic
Quad Flat Pack (QFP) Solder Joints," Advances in Electronic Packaging, ASME, San Jose, 1992
[35]Zhu,J., Ojala, K., and Tuominen, A., 1997, "The App;ication of Global/Local Techniue Infinite Element Simulation of BGA Assemblies," Presented at the ASEM International Mechanical Engineering Congress & Exposition, Dalas, Texas, Nov, 16～21
[36]D.Post, "Moir(?) Interferometry in White Light" Appl. ,Vol. 18, NO.124 (Dec 15 1979),4163～4167
[37]D.Post, B.Han, P. Ifju, "High Sensitivity Moir(?) Interferometry: Experimental Analysis for Mechanics and Materials," Springer-Verlag, NY, 1994
[38]戴福隆，方萃长等 《现代光测力学》 科学出版社 1990
[39]张如一，陆耀桢 《实验应力分析》 机械工业出版社 1980
[40]Guo,Y.,and Woychik, C.G., "Thermal Strain Measurements of Solder Joints in second Level Interconnections Using Moire Interferometry", ASEM Journal of Electronic Packaging 1992(3)
[41]D.Gabor, Nature, 161(1948),777
[42]E.Leith and J.Upatnieks, J.Opt., soc. Am52(1962), 1123
[43]Powell and K. Stetson, J.Opt., soc. Am 55(1965), 1593
[44]赵清澄 《光测力学》 上海科学技术出版社 1982
[45]于美文 《光全息学及其应用》 北京理工出版社 1994
[46]赵清澄，石沅，《实验应力分析》 科学出版社，1987
[47]王朝阳 朝阳软件之日积月累 1997
[48]Origin 5.0 之 readme
[49]弘道工作室 编著 《融会贯通——Photoshop 5.0中文版》人民交通出版社 1999．2
[50]ANSYS 用户使用手册 ANSYS in USA
[51]蓝宇，张连杰 “大型有限元分析软件ANSYS”应用科技 Vol.27，No.6 Jun．2000
[52]陈精一、蔡国忠 电脑辅助工程分析——ANSYS 使用指南 中国铁道出版社2001年 北京