芯片键合高速精密定位系统设计与控制
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摘要
高速精密定位系统是芯片引线键合设备的关键部件之一,其结构设计与控制方法研究具有重要学术和应用价值。本文以提高芯片键合效率和质量为目的,系统地研究了两自由度高速精密定位平台、超声换能器和键合头的结构动态设计理论,运动控制策略和样机建造技术,取得了如下创造性成果:
     提出了基于机电联合仿真技术的高速精密定位系统动态设计方法。通过在ANSYS、MSC.ADAMS和MATLAB/SIMULINK软件环境下构建定位系统的刚柔耦合机械实体模型和控制系统模型,实现了对XY定位平台的机械与控制系统的性能仿真。考察了预紧弹簧对定位平台性能的影响,得到了预紧弹簧刚度与预载力的匹配规律,最终确定了弹簧刚度与预载力的数值。
     考虑到音圈电机直驱的特点,提出了两自由度高速精密定位平台控制系统方案。首先通过系统辨识的方法建立了X、Y向定位平台控制系统开环模型。在此基础上,针对X向定位平台,设计了PID控制器、带摩擦和前馈补偿的PID控制器、比例切换滑模变结构控制器和基于指数趋近律的滑模变结构控制器。机电联合仿真和实验测试结果表明:基于指数趋近律的滑模变结构控制器能够有效减小运动超调,缩短稳定时间,并具有很强的抗干扰鲁棒性,非常适合于该类定位平台的运动控制;实验和仿真结果的一致性证实了基于机电联合仿真技术的高速精密定位系统动态设计方法是有效和可行的。
     基于机电等效电路原理、有限元分析和模块化设计思想,发展了芯片引线键合用高频超声换能器结构设计方法。该方法可有效解决换能器高频域模态密集问题,避免了反复的建模和计算过程。研制了工作频率为100 kHz的超声换能器,探讨了换能器超声能量在空间域、时域和频域的传递规律。阻抗分析仪和多普勒测振仪测试结果表明换能器具有良好的谐振特性,且实验与有限元仿真分析结果具有很好的一致性。
     提出了旋转音圈电机直驱的新型键合头结构方案,并研制了样机。充分考虑到该键合头的动力学特性,设计了带摩擦补偿和陷波滤波器的三闭环PID控制器,搭建了键合头运动控制系统。实验结果表明键合头的运动特性能够很好地满足芯片引线键合的要求。
     上述研究成果丰富了芯片引线键合定位系统设计理论,对促进微电子封装装备技术进步具有重要意义。
The high-speed and high-precision positioning system is one of the key components of integrated chip(IC) wire bonder, and the research on its structure design and control methodology has important academic and application values. To improve the efficiency and quality of IC bonding, this dissertation studies on the structure dynamic design theory, the motion control strategies and prototype manufacturing technology for 2-DOF high-speed and high-precision positioning table, ultrasonic transducer and bond head. The following contributions have been made:
     The dynamic design methodology of high-speed and high-precision positioning system is proposed based on electromechanical co-simulation method. By use of ANSYS, MSC.ADAMS and MATLAB/SIMULINK software, the rigid-flexible coupled mechanical solid model and the controller model of the positioning system are established, and the characteristics of the mechanical and control system of the XY positioning table are simulated. The influences of the preloaded spring to the characteristics of the positioning system are investigated, and the matching law of the spring stiffness and preload is achieved. Finally, the spring stiffness and preload are determined.
     Considering the characteristics of the direct drive by voice coil motor(VCM), the control strategy of the 2-DOF high-speed and high-precision positioning table is presented. Firstly, the open-loop models of the control system for X-axis and Y-axis tables are obtained through system identification method. On this basis, Proportion Integration Differentiation(PID) controller, PID controller with friction and feedforward compensators, proportional switching sliding mode controller(SMC), and SMC based on exponential reaching law are designed to control the X-axis table, respectively. Electromechanical co-simulation and experiment results show that the motion overshoot and settling time are reduced using the SMC based on exponential reaching law, and this controller shows strong robustness in the face of disturbances. Thus it is very suitable for the motion control of such kinds of positioning table. The experiment results and simulation results are in good agreement, which confirms the validity and feasibility of the dynamic design methodology for high-speed and high-precision positioning system based on electromechanical co-simulation method.
     The structure design method for high-frequency ultrasonic transducer used in IC wire bonding is developed on the basis of the electromechanical equivalent theory, finite element analysis(FEA) and modular design concept. With the aid of this method, the modal concentration problems of high-frequency transducers can be solved, meanwhile avoiding the process of repeated modelings and calculations. A 100 kHz ultrasonic transducer has been designed, and the law of ultrasonic energy transmission in spatial domain, time domain, and frequency domain are discussed, respectively. The experiment results by impedance analyzer and laser Doppler vibrometer measurements show that the transducer has good vibration characteristics. The experiment results prove remarkable resemblance with simulation analysis results through FEA.
     A novel rotary VCM direct-drive bond head mechanism is presented and manufactured. Considering the dynamic characteristics of the bond head, a three closed-loop PID controller with friction compensator and notch filter is designed, and the motion control system is established. The experiment results show that the motion characteristics of the bond head can satisfy the requirements of IC wire bonding.
     The above research achievements enrich the design theory of precision positioning system used in IC wire bonding, and they have great significances on promoting the development of microelectronics packaging equipments.
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