下填充封装过程的宏介观多尺度建模与计算
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摘要
下填充过程对倒装芯片封装过程至关重要，它直接影响了封装的结构和热可靠性。采用数值模拟的方法预测并分析下填充封装过程，对于优化成型过程，提高封装的可靠性都具有重要的意义。现有的下填充成型过程模拟以二维模型为主，三维模型尚不完善，而且关于下填充成型过程中毛细驱动力作用机理的认识也不够清楚。另一方面，对下填充过程中多相流以及悬浮固体颗粒再分布等介观问题，传统方法难以准确描述多相界面作用，不能真正反映颗粒与熔体之间的相互作用关系，无法准确考虑多形态颗粒的分布形式，有必要采用更有效的方法分析下填充封装中的介观过程。
以下填充封装过程为研究对象，本文从宏、介观两个层次研究了芯片塑封下填充成型过程模拟的理论与方法。在宏观过程模拟方面，主要工作有：
(1)研究了塑封下填充工艺中的毛细作用机理，提出了“互激励”毛细作用模型，认为壁面非平衡黏附力和自由界面表面张力都是毛细作用不可或缺的组成部分，这两种力在毛细作用过程中互相协同、彼此竞争，构成了毛细作用对立统一的两个方面。基于此模型采用分层计算方法实现了静态毛细界面计算的数值方法和动态毛细流动计算的数值方法，并通过平行平板和毛细管毛细实验对所提出的模型和方法进行了验证。
(2)基于提出的“互激励”毛细模型，采用三维N-S方程，结合Kamal固化反应模型和广义Cox-Merz黏度模型，建立了塑封下填充成型的宏观物理模型。采用SUPG/PSPG计算格式建立了稳定的有限元求解过程，实现塑封成型中非牛顿流动、固化反应以及包含固化放热的成型温度变化的物理过程；
在介观过程计算方面，主要的工作有：
(3)基于扩展的格子波尔兹曼(LBM)伪势模型建立了下填充介观多相流充填模拟过程，研究了封胶熔体的表面张力，及其与硅芯片、基板以及焊点壁面润湿性能对下填充过程的影响，考察了焊点间距以及边界通道对充填过程一致性的影响，并分析了布胶方式对边界绕流作用的影响；
(4)基于Ladd壁面模型建立了下填充颗粒悬浮介观模型，一方面研究了成型过程中不同剪切速率以及固体颗粒形状等因素对剪切迁移影响，另一方面研究了固体颗粒密度，颗粒形状以及封胶基体黏度对颗粒沉淀行为的影响。
Underfill is an important process in flip-chip encapsulation because of its great impacton the reliability of electronic packagings. Numerical prediction of underfill is beneficialto optimize the encapsulation process and improve the quality of packagings. Existingunderfill molding is mainly two dimensional, and the three dimensional is not satisfied.The mechanism of capillary action in underfill is not well understood. Furthermore, themultiphase phenomenon and particle filler redistribution in underfill could not be analyzedexactly, as the force of complex interface is poorly characterized, the interaction betweenparticles and fluid is not modeled synchronously, and polydispersity of particles could beconsidered. Therefore, it is necessary to employ new methods to describe and analyzethese mesoscale phenomena.
In this thesis, we simulate the macroscale and mesoscale process of the underfillencapsulation respectively. In macroscale process simulation, we have done:
(1) The driven mechanism of the capillary action in underfill is analyzed bypresenting an inter-motivation model, in which the capillary action is modeled as twodifferent forces, i.e., the unbalanced adhesive force close to the wall and the surfacetension force on the free surface. Those two forces compete and also cooperate with eachother during the capillary flow process, and they are the unity of opposites of the capillaryaction. Based on this model, a layer numerical method for equilibrium state and dynamiccapillary process is established respectively. Parallel-plate experiments and capillary tubeexperiments are conducted to verified our model.
(2) Based on the presented inter-motivation capillary model, three dimensional N-Sequation and the Kamal curing reaction equation coupled with generalized Cox-Merzconstitutive model are used to established a macroscale underfill simulation system. ThePSPG (Pressure Stabilizing Petro Galerkin) and SUPG (Streamline Upwind PetrovGalerkin) finite element method is used to solve the equations in our system. In oursimulation, the non-Newton behavior of the melt, curing reaction and thermal responsecould be characterized comprehensively.
In mesoscale process simulation, we have done:
(3) The modified interparticle-potential LBM (Lattice Boltzmann method) model isused to simulate the mesoscale underfill multiphase flow. The surface tension coefficientof the melt, and its wettability with the surface of die, substrate and solder bumps areanalyzed in the simulation. The effects of the bump bitch, edge channel and encapsulantdispensing are investigated.
(4) The Ladd's LBM model about suspension particles is used to study the distributionof particle filler in underfill process, including the shear-induced migration and the settling.For shear-induced particle migration, the effects of shear rate and particle size areanalyzed. For the particle settling, the particle density, size and viscosity of the melt isinvestigated respectively.
以下填充封装过程为研究对象，本文从宏、介观两个层次研究了芯片塑封下填充成型过程模拟的理论与方法。在宏观过程模拟方面，主要工作有：
(1)研究了塑封下填充工艺中的毛细作用机理，提出了“互激励”毛细作用模型，认为壁面非平衡黏附力和自由界面表面张力都是毛细作用不可或缺的组成部分，这两种力在毛细作用过程中互相协同、彼此竞争，构成了毛细作用对立统一的两个方面。基于此模型采用分层计算方法实现了静态毛细界面计算的数值方法和动态毛细流动计算的数值方法，并通过平行平板和毛细管毛细实验对所提出的模型和方法进行了验证。
(2)基于提出的“互激励”毛细模型，采用三维N-S方程，结合Kamal固化反应模型和广义Cox-Merz黏度模型，建立了塑封下填充成型的宏观物理模型。采用SUPG/PSPG计算格式建立了稳定的有限元求解过程，实现塑封成型中非牛顿流动、固化反应以及包含固化放热的成型温度变化的物理过程；
在介观过程计算方面，主要的工作有：
(3)基于扩展的格子波尔兹曼(LBM)伪势模型建立了下填充介观多相流充填模拟过程，研究了封胶熔体的表面张力，及其与硅芯片、基板以及焊点壁面润湿性能对下填充过程的影响，考察了焊点间距以及边界通道对充填过程一致性的影响，并分析了布胶方式对边界绕流作用的影响；
(4)基于Ladd壁面模型建立了下填充颗粒悬浮介观模型，一方面研究了成型过程中不同剪切速率以及固体颗粒形状等因素对剪切迁移影响，另一方面研究了固体颗粒密度，颗粒形状以及封胶基体黏度对颗粒沉淀行为的影响。
Underfill is an important process in flip-chip encapsulation because of its great impacton the reliability of electronic packagings. Numerical prediction of underfill is beneficialto optimize the encapsulation process and improve the quality of packagings. Existingunderfill molding is mainly two dimensional, and the three dimensional is not satisfied.The mechanism of capillary action in underfill is not well understood. Furthermore, themultiphase phenomenon and particle filler redistribution in underfill could not be analyzedexactly, as the force of complex interface is poorly characterized, the interaction betweenparticles and fluid is not modeled synchronously, and polydispersity of particles could beconsidered. Therefore, it is necessary to employ new methods to describe and analyzethese mesoscale phenomena.
In this thesis, we simulate the macroscale and mesoscale process of the underfillencapsulation respectively. In macroscale process simulation, we have done:
(1) The driven mechanism of the capillary action in underfill is analyzed bypresenting an inter-motivation model, in which the capillary action is modeled as twodifferent forces, i.e., the unbalanced adhesive force close to the wall and the surfacetension force on the free surface. Those two forces compete and also cooperate with eachother during the capillary flow process, and they are the unity of opposites of the capillaryaction. Based on this model, a layer numerical method for equilibrium state and dynamiccapillary process is established respectively. Parallel-plate experiments and capillary tubeexperiments are conducted to verified our model.
(2) Based on the presented inter-motivation capillary model, three dimensional N-Sequation and the Kamal curing reaction equation coupled with generalized Cox-Merzconstitutive model are used to established a macroscale underfill simulation system. ThePSPG (Pressure Stabilizing Petro Galerkin) and SUPG (Streamline Upwind PetrovGalerkin) finite element method is used to solve the equations in our system. In oursimulation, the non-Newton behavior of the melt, curing reaction and thermal responsecould be characterized comprehensively.
In mesoscale process simulation, we have done:
(3) The modified interparticle-potential LBM (Lattice Boltzmann method) model isused to simulate the mesoscale underfill multiphase flow. The surface tension coefficientof the melt, and its wettability with the surface of die, substrate and solder bumps areanalyzed in the simulation. The effects of the bump bitch, edge channel and encapsulantdispensing are investigated.
(4) The Ladd's LBM model about suspension particles is used to study the distributionof particle filler in underfill process, including the shear-induced migration and the settling.For shear-induced particle migration, the effects of shear rate and particle size areanalyzed. For the particle settling, the particle density, size and viscosity of the melt isinvestigated respectively.
引文
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