纯铜双层辉光离子渗钛及渗铝工艺和性能的研究
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摘要
纯铜具有高导电、导热性和一定的力学性能，使其成为工业上应用广泛的一种有色金属，但是纯铜又存在着强度低、硬度低、抗氧化性差等不足之处，使纯铜产品寿命短，不能满足某些工况条件下的需求。本文就是针对纯铜这些不足之处利用双层辉光离子渗金属技术在纯铜表面进行离子渗钛；同时为了和纯铜渗铝的抗高温氧化性能做对比，在纯铜表面进行了粉末渗铝。对纯铜表面双层辉光离子渗钛工艺过程、渗层的组织特征、渗层形成的机理等方面进行里详细的研究；对纯铜表面粉末渗铝的工艺，渗层组织特征，渗层形成的机理也进行了研究；对离子渗钛试样和纯铜、纯钛对比试样分别在0.5mol/LH_2SO_4、1mol/LH_2SO_4、1mol/LHCl、10％HNO_3和5％NaCl溶液中进行电化学腐蚀性能的研究；对离子渗钛试样和粉末渗铝试样以及纯铜试样在400℃和700℃高温循环氧化100小时的抗高温氧化性能进行了研究；对离子渗钛试样和纯铜试样在300N、500N和750N不同载荷下的摩擦磨损性能进行了研究；其中渗层的成分分布、显微特征、结构形貌采用了先进的XRD、SEM、BSE，EDS等手段进行了检测分析。
研究结果表明：利用双层辉光离子渗金属技术可以在纯铜表面形成厚度在20—90um之间变化，表面合金含量在30—90％(wt)之间变化的扩散层，是一种新型的梯度材料；用粉末法在纯铜表面也能形成含铝量不同的合金渗层。通过分析发现离子渗钛层中钛是以含钛的固溶体和铜钛金属间化合物Cu_4Ti等的形式存在，弥散分布的Cu_4Ti对铜基体起到强化作用，粉末渗铝的组织以α固溶体和共析体(α+γ_2)
太原理工大学硕士论文
组成。对离子渗钦试样和纯铜、纯钦对比试样分别在0.smo比HZSO4、
lmol/LHZSo4、lmo比HCI、10%HNO3和so/6NaCI中进行电化学腐蚀性
能研究，实验结果表明:离子渗钦层在0.smol/L HZSO;的腐蚀速度几
乎与纯钦的相当，仅是纯铜的0.01倍;在lmol/L HZSO;是纯铜的0.1
倍，是纯钦的3.2倍;在lmol/L HCI中离子渗钦层的腐蚀速度相对较
大，但后期发生了钝化，而纯铜和纯钦发生了较为严重的孔蚀;在
10%HNO3中离子渗钦层的腐蚀速度是纯铜的0.66倍，是纯钦的10倍;
在5%NaCI中离子渗钦层的腐蚀速度是纯铜的2倍，但几乎与纯钦的
相当:由于纯铜和纯钦均具有较好的耐蚀性，所以说明离子渗钦层在
不同的介质中也均具有较高的耐蚀性。对离子渗钦试样和粉末渗铝试
样以及纯铜试样在400℃和700OC高温循环氧化100小时的抗高温氧化
性能进行了研究，分别给出了它们的氧化动力学曲线，并氧化机理进
行了探讨，结果显示:纯铜离子渗钦后也可以大大提高纯铜的抗高温
氧化性能，铜的氧化速率K。值在400‘C和700℃时均比离子渗钦和渗
铝试样的几乎大一个数量级;在400℃时离子渗钦层生成的氧化膜致
密，氧化速度慢，不容易剥落，比渗铝试样的抗氧化性能有绝对的优
势;在700℃离子渗钦层在氧化80小时后才有剥落现象，而渗铝试样
在氧化40小时就开始剥落，而且离子渗钦试样的速率常数K，值也比
渗铝的小，说明在700℃离子渗钦试样的抗氧化性能要比渗铝的还要
好。对离子渗钦试样和纯铜试样在300N、500N和75ON不同载荷下的
摩擦磨损性能进行了研究，并对磨损机理进行了分析，结果显示:由
于渗钦后表面硬度的提高大大降低了磨损次表面的塑性变形，阻止了
磨损裂纹的形成与扩展，从而减小了磨损量，在300N纯铜试样的质
量磨损量是离子渗钦试样的5倍多，在500N时约为11倍，在750N
太原理工大学硕_1_沦文
时不考虑时间因素是17倍。
Pure copper is extensively used as high electrical and thermal conductors. But pure copper is relatively soft and possesses a poor strength and hardness and high temperature oxidation resistance , which is not able to meet the need of industry. In order to improve the mechanical strength of copper, in this paper double glow discharge plasma titanizing surface alloying have been carried out on copper substrate. At the same time for contrast of high temperature oxidation resistance powder aluminizing was carried out. The processes of double glow discharge plasma titanizing , surface alloying layer micro-structure and diffusion mechanism were investigated in details also. The processes of powder aluminizing, surface alloying layer micro-structure and diffusion mechanism were also investigated in details. The corrosion resistance of plasma titanizing alloying layer has been investigated by electrochemical method in 0.5mol/LH2SO4, lmol/LH2SO4, Imol/LHCK 10%HNO3 and 5%NaCl solution respectively. The high temperatu
re oxidation resistance of plasma titanizing alloying layer and aluminium alloying layer at 400℃ and 700℃ after oxidation 100 hours were investigated. The friction wear properties and wear mechanism of plasma titanizing alloying layer were studied. The compositions and microstructure of surface alloying layer were
investigated by the advanced means of XRD,SEM,BES,EDS.
The experimental results show that copper surface can form titanium alloying layer with double glow discharge plasma surface alloying. The thickness of diffusion layer is between 20um and 90um and the surface titanium concentration is between 30% and 90%(wt). Aluminium diffusion layer is also able to form by use of powder aluminizing. In the plasma titanizing alloying layer titanium solute in copper and form the precipitation Cu4Ti. Copper is strengthened by the dispersion of Cu4Ti. The aluminium alloying layer is made of solid solution and precipitate. The corrosion resistance experiment indicated that corrosion rate of plasma titanizing alloying layer was equal to that of titanium,0.01 times that of copper in 0.5mol/LH2SO4 solution, and was 0.1 times that of copper and was 3.2 times of titanium in 0.5mol/LH2SO4 solution.The corrosion rate of plasma titanizing alloying layer was faster than that of copper and titanium in Imol/LHCl solution , but plasma titanizing alloying layer became of passivation at the
later stage ,while copper and titanium surface occurred seriously aperture corrosion. The corrosion rate of plasma titanizing alloying layer is 0.66 times that of copper and 10 times that of titanium in 10%HNO3 solution. The corrosion rate of plasma titanizing alloying layer was almost equal to that of titanium and 2 times that of copper in5%NaCl solution. The oxidation kinetics curve is worked out and the oxidation resistance mechanism is studied. The results show that plasma titanizing on copper surface can improve greatly the high temperature oxidation resistance of copper. The oxidation rate of copper is almost 10 times that of plasma titanizing sample and powder aluminizing sample. At 400 ℃ the
oxidation film of plasma titanizing sample is very dense and was not easily exfoliated. The oxidation resistance of plasma titanizing sample is much belter than of powder aluminizing sample. At 700℃ the oxidation film of plasma titanizing sample is exfoliated after oxidation 80 hours, but oxidation film of powder aluminizing sample is exfoliated after oxidation 40 hours. The oxidation rate of plasma titanizing sample is less than that of powder aluminizing sample. It is indicated the oxidation resistance of plasma titanizing sample is better than that of powder aluminizing sample. The friction wear properties and wear mechanism of plasma titanizing sample at 300N,500N and 750N are studied. The results show wear quantity of plasma titanizing sample is less .It is due to improve the surface hardness of plasma titanizing sample. The wear quantity of copper is 5 times that of plasma titanizing sample at 300N, 11 times at 500N, 17 ti
研究结果表明：利用双层辉光离子渗金属技术可以在纯铜表面形成厚度在20—90um之间变化，表面合金含量在30—90％(wt)之间变化的扩散层，是一种新型的梯度材料；用粉末法在纯铜表面也能形成含铝量不同的合金渗层。通过分析发现离子渗钛层中钛是以含钛的固溶体和铜钛金属间化合物Cu_4Ti等的形式存在，弥散分布的Cu_4Ti对铜基体起到强化作用，粉末渗铝的组织以α固溶体和共析体(α+γ_2)
太原理工大学硕士论文
组成。对离子渗钦试样和纯铜、纯钦对比试样分别在0.smo比HZSO4、
lmol/LHZSo4、lmo比HCI、10%HNO3和so/6NaCI中进行电化学腐蚀性
能研究，实验结果表明:离子渗钦层在0.smol/L HZSO;的腐蚀速度几
乎与纯钦的相当，仅是纯铜的0.01倍;在lmol/L HZSO;是纯铜的0.1
倍，是纯钦的3.2倍;在lmol/L HCI中离子渗钦层的腐蚀速度相对较
大，但后期发生了钝化，而纯铜和纯钦发生了较为严重的孔蚀;在
10%HNO3中离子渗钦层的腐蚀速度是纯铜的0.66倍，是纯钦的10倍;
在5%NaCI中离子渗钦层的腐蚀速度是纯铜的2倍，但几乎与纯钦的
相当:由于纯铜和纯钦均具有较好的耐蚀性，所以说明离子渗钦层在
不同的介质中也均具有较高的耐蚀性。对离子渗钦试样和粉末渗铝试
样以及纯铜试样在400℃和700OC高温循环氧化100小时的抗高温氧化
性能进行了研究，分别给出了它们的氧化动力学曲线，并氧化机理进
行了探讨，结果显示:纯铜离子渗钦后也可以大大提高纯铜的抗高温
氧化性能，铜的氧化速率K。值在400‘C和700℃时均比离子渗钦和渗
铝试样的几乎大一个数量级;在400℃时离子渗钦层生成的氧化膜致
密，氧化速度慢，不容易剥落，比渗铝试样的抗氧化性能有绝对的优
势;在700℃离子渗钦层在氧化80小时后才有剥落现象，而渗铝试样
在氧化40小时就开始剥落，而且离子渗钦试样的速率常数K，值也比
渗铝的小，说明在700℃离子渗钦试样的抗氧化性能要比渗铝的还要
好。对离子渗钦试样和纯铜试样在300N、500N和75ON不同载荷下的
摩擦磨损性能进行了研究，并对磨损机理进行了分析，结果显示:由
于渗钦后表面硬度的提高大大降低了磨损次表面的塑性变形，阻止了
磨损裂纹的形成与扩展，从而减小了磨损量，在300N纯铜试样的质
量磨损量是离子渗钦试样的5倍多，在500N时约为11倍，在750N
太原理工大学硕_1_沦文
时不考虑时间因素是17倍。
Pure copper is extensively used as high electrical and thermal conductors. But pure copper is relatively soft and possesses a poor strength and hardness and high temperature oxidation resistance , which is not able to meet the need of industry. In order to improve the mechanical strength of copper, in this paper double glow discharge plasma titanizing surface alloying have been carried out on copper substrate. At the same time for contrast of high temperature oxidation resistance powder aluminizing was carried out. The processes of double glow discharge plasma titanizing , surface alloying layer micro-structure and diffusion mechanism were investigated in details also. The processes of powder aluminizing, surface alloying layer micro-structure and diffusion mechanism were also investigated in details. The corrosion resistance of plasma titanizing alloying layer has been investigated by electrochemical method in 0.5mol/LH2SO4, lmol/LH2SO4, Imol/LHCK 10%HNO3 and 5%NaCl solution respectively. The high temperatu
re oxidation resistance of plasma titanizing alloying layer and aluminium alloying layer at 400℃ and 700℃ after oxidation 100 hours were investigated. The friction wear properties and wear mechanism of plasma titanizing alloying layer were studied. The compositions and microstructure of surface alloying layer were
investigated by the advanced means of XRD,SEM,BES,EDS.
The experimental results show that copper surface can form titanium alloying layer with double glow discharge plasma surface alloying. The thickness of diffusion layer is between 20um and 90um and the surface titanium concentration is between 30% and 90%(wt). Aluminium diffusion layer is also able to form by use of powder aluminizing. In the plasma titanizing alloying layer titanium solute in copper and form the precipitation Cu4Ti. Copper is strengthened by the dispersion of Cu4Ti. The aluminium alloying layer is made of solid solution and precipitate. The corrosion resistance experiment indicated that corrosion rate of plasma titanizing alloying layer was equal to that of titanium,0.01 times that of copper in 0.5mol/LH2SO4 solution, and was 0.1 times that of copper and was 3.2 times of titanium in 0.5mol/LH2SO4 solution.The corrosion rate of plasma titanizing alloying layer was faster than that of copper and titanium in Imol/LHCl solution , but plasma titanizing alloying layer became of passivation at the
later stage ,while copper and titanium surface occurred seriously aperture corrosion. The corrosion rate of plasma titanizing alloying layer is 0.66 times that of copper and 10 times that of titanium in 10%HNO3 solution. The corrosion rate of plasma titanizing alloying layer was almost equal to that of titanium and 2 times that of copper in5%NaCl solution. The oxidation kinetics curve is worked out and the oxidation resistance mechanism is studied. The results show that plasma titanizing on copper surface can improve greatly the high temperature oxidation resistance of copper. The oxidation rate of copper is almost 10 times that of plasma titanizing sample and powder aluminizing sample. At 400 ℃ the
oxidation film of plasma titanizing sample is very dense and was not easily exfoliated. The oxidation resistance of plasma titanizing sample is much belter than of powder aluminizing sample. At 700℃ the oxidation film of plasma titanizing sample is exfoliated after oxidation 80 hours, but oxidation film of powder aluminizing sample is exfoliated after oxidation 40 hours. The oxidation rate of plasma titanizing sample is less than that of powder aluminizing sample. It is indicated the oxidation resistance of plasma titanizing sample is better than that of powder aluminizing sample. The friction wear properties and wear mechanism of plasma titanizing sample at 300N,500N and 750N are studied. The results show wear quantity of plasma titanizing sample is less .It is due to improve the surface hardness of plasma titanizing sample. The wear quantity of copper is 5 times that of plasma titanizing sample at 300N, 11 times at 500N, 17 ti
引文
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49 徐重 苏永安 高原 贺志勇 刘小萍 徐在峰 双层辉光离子渗金属技术的现状和展望 第七次全国热处理大会专辑
50 徐重 王振民 古风英 范本惠 双层辉光离子渗金属技术 金属热处理学报 1982(6)：71-83
51 徐重 王振民 范本惠 孙梅琴 离子氮化装置中的双层辉光放电现象及其放电特性的研究 太原工学院学报 1981(1)：76-89
52 Zhong Xu A Novel Plasma Surface Metallurgy: Xu--Tec Process Metallurgical cootings and Thin Films 1990 (2)
53 ZhongXu Gu. FY New Development in Ion Surface Alloying Proceedings 1986 (3)
54 Z. Xu etc. Plasma Surface Alloying Surface Engineering 1986,
2(2)
55 Zhong Xu etc. U.S.Patent No.4,525,268
56 Zhong Xu etc. U.S.Patent No.4,5731,539
57 Zhong Xu etc. U.K.Patent No.2,150,602
58 Zhong Xu etc. Canada Patent No.1,212,486
59 Zhong Xu etc. Australia Patent No.580,734
60 Zhong Xu etc. Sweden Patent No.8,500,364-8
61 徐重等，中国专利：871043580
62 徐重等，中国专利：87104626．1
63 李忠厚 刘小平 徐重 在双层辉光离子渗金属中空位浓度梯度对扩散的影响 应用科学学报 2000(2)：183-185
64 李成明 贺志勇 徐重 离子钨钼共渗的扩散机制 中国有色金属学报 2000(2)：185-188
65 潘俊德等 加弧辉光离子渗镀技术的现状与发展[J] 太原理工大学学报 2000，31(增刊)：69-71
66 潘俊德等 加弧辉光离子渗镀技术[P] CN Patent，90103841．5
67 Nagarjuna, S.; Sarma, D.S. On the variation of lattice parameter of Cu solid solution with solute content in Cu-Ti alloys Scripta Materialia 1999, 41 (4): p2929-2942
68 Nagarjuna, S.; Srinivas, M.; Balasubramanian, K.; Sarma, D.S. On the variation of mechanical properties with solute content in Cu-Ti alloys Materials Science & Engineering 1999, A259(1): p34-42
69 Mangan, M.A.; Shiflet, G.J. Three dimensional investigation of Cu-Ti discontinuous precipitation Scripta Materialia 15 1997, 37 (4): p517-522
70 Wei, Yinghui; Hu, Lanqing; Huang, Yuan; Wang, Xiaotian Characteristics of spinodal decomposition in Cu-Ti alloy Transactions of Metal Heat Treatment 1997, 18 (2): p9-13
71 徐重 范本惠 潘俊德 郑维能 双层辉光离子渗钛 金属热处理 1986(5)：13-20
72 潘俊德 范本惠 加弧辉光离子渗钛的研究[J] 兵工学报 1993(3)：60-66
73 Uzunov, Tzanko Dimitrov; Stojanov, Stojan Petrov; Lambov, Sashko Ivanov Thin films of intermetallic Cu/Ti compounds and their possible uses Vacuum 1999, 52(3): p321-325
74 王从曾 苏永安等 双层辉光离子渗金属主要工艺参数的研究 热加工工艺 1995(4)：7-9
75 贺志勇等 双层辉光离子镍铬共渗最佳工艺参数的研究 金属热处理学报 1990(3)：64-73
76 王从曾 唐宾 苏永安 徐重 不等电位空心阴极离子渗金属工艺特性及其应用 金属热处理学报 1991(3)：43-50
77 中国机械工程学会热处理学会 表面沉积技术 机械工业出版社 1989
78 卢燕平 金属表面防蚀处理 冶金工业出版社 1995，6
79 郑传林 北京科技大学博士论文 TiAl双层辉光等离子表面合金化及其高温氧化行为研究 2001
80 张旭 北京科技大学博士论文 双层辉光离子渗优质镍基耐蚀合金及身材成分控制的研究 1999
81 中国腐蚀与防护学会 金属腐蚀手册 上海科学技术出版社 1984
82 孙秋霞 材料腐蚀与防护 冶金工业出版社 2001
83 刘永辉 电化学测试技术 北京航空学院 1987
84 翟金坤 金属高温腐蚀 北京航天航空大学出版社 1994
85 李建明 磨损金属学 冶金工业出版社 1990
2 麻向军 王伟民 导电铜合金强化的研究现状 机械研究与应用 1998(1)：48-49
3 洛阳铜加工中心编 铜及铜合金金相图谱 冶金工业出版社 1983
4 Nagarjuna, S.; Srinivas, M.; Balasubramanian, K.; Sarma, D.S. On the variation of mechanical properties with solute content in Cu-Ti alloys Materials Science & Engineering 1999, A259(1): 34-42
5 王深强 陈志强等 高强度高导电铜合金的研究概述 材料工程 1995(7)：3-6
6 方正春 耐热和导电铜合金发展现状 材料开发与应用 1997(4)：27-31
7 张玉平 李联英 王灵卉 孙钢 新型黄铜摩擦磨损特性的试验研究 特种铸造及有色金 1999(3)：28-30
8 孙扬善 黄海波 两种耐磨黄铜的组织和性能 机械工程材料 1991 (1)：21-24
9 胡大禄 曹建春 周兆 张世琼 新型高强耐磨青铜的组织与性能研究 有色金属 1998(3)：99-103
10 李元元 夏伟 张文 罗宗强 高强度耐磨铝青铜合金及其摩擦学特性 中国有色金属学报 1996(3)：76-80
11 清华大学博士论文 耐蚀、耐磨铜合金的研制及其机理研究 1998
12 刘平 顾海澄 曹兴国 铜基集成电路引线框架材料的发展概况 材料开发与应用 1998(3)：37-41
13 Choi, H.I., Lee, K.Y.; Kwun, S.I. Fabrication of high strength and high conductivity copper alloys by rod milling. Journal of Materials Science Letters, 1997,16(1): 1600～1602
14 Biselli, C.; Morris, D. G. High strength high conductivity fibre-reinforced copper alloys. Journal De Physique, 1993, 3(7):1737～1740
15 Dadras, M.M.; Morris, D.G. Examination of some high-strength, high-conductivity copper alloys for high-temperature applications. Scripta Materialia, 1997, 38(2): 199～205
16 Lopez, F.; Reyes, J.; Campillo, B. Rapid solidification of copper alloys with high strength and high conductivity. Journal of Materials Engineering and Performance, 1997,6(5):611～614
17 Foltz, John V.; Blackmon, Charles M. Metal Matrix Composites. Advanced Materials & Processes, 1998,154(6): 19～23
18 Tomioka, Yasuo; Miyake, Junji. OXIDE ADHESION CHARACTERISTIC OF LEAD FRAME COPPER ALLOYS. Proceedings - Electronic Components and Technology Conference Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) Jun 1～Jun 4:714～720
19 石子源等．Al_2O_3／Cu 基复合材料的制备 机械工程材料 1996，20(6)：46～47
20 王武孝等．Al_2O_3／Cu 复合材料的研究进展 特种铸造及有色合金 1998，(5)：50～52
21 梁淑华等．改善连铸结晶器材质的新途径．材料导报 1997，11(4)：15～18
22 赵昌正．碳纤维增强铜复合材料．机械工程材料 1993，14(2)：14～17
23 王军等．金属基复合材料的发展和未来 上海有色金属 1999，20(4)：188～192
24 万怡灶等．Al_2O_3／铜复合材料的磨损特性研究．材料工程，1997，(11)，6～11
25 梁淑华等．超细Al_2O_3增强铜基复合材料的显微结构．铸造，1998(1)：8～10
26 Sobolev, V.V.; Guilemany, J M.; Calero, J.A. Development of coating structure and adhesion during high velocity oxygen-fuel spraying of WC-Co powder on a copper substrate Journal of Thermal Spray Technology 2000, 9(1): 100-106
27 Sobolev, V.V.; Guilemany, J.M.; Calero, J.A. Heat transfer during the formation of an HVOF sprayed WC-Co coating on a copper substrate Journal of Materials Processing Technology 1999, 1 (1-3): 1-8
28 Sobolev, V.V.; Guilemany, J.M.; Calero, J.A. Thermal processes in HVOF sprayed WC-Co coating on a copper substrate Journal of Thermal Spray Technology. 1998, 7(2): 191-192
29 Yih, P.; Chung, D.D.L. Titanium diboride copper-matrix composites Journal of Materials Science 1997, 32(7): 1703-1709
30 Agarwal. A.; Dahotre, N.B.; Sudarshan, T.S. Evolution of interface in pulsed electrode deposited titanium diboride on copper and steel Surface Engineering 1999, 15(1): 27-32
31 沈复处 叶必光 郦剑 毛志远 甘正浩等 铜在含硅气氛中表面改
性的化学热处理研究 金属热处理学报 1996(4)：42-46
32 沈复初 毛志远 郦剑 叶必光 甘正浩 晋圣发 铜表面气体渗硅后的滑动摩擦磨损研究 浙江大学学报(工学版)1997(3)：287-291
33 华南理工大学硕士论文 铜合金渗Si、Al、Re 等元素后渗层的组织及抗氧化性能的研究
34 周辉全等 纯铜渗铝工艺及渗剂 金属热处理，1995(2)：36～37
35 何红媛，张远明 纯铜深层渗铝工艺的研究 上海有色金属 1998(3)：99-101
36 石子源，张铭陆，高宏 纯铜渗铝及其复合材料热 加工工艺 1997(1)：35-37
37 邵德军，张林，刘军，靳巍，张德生 纯铜多元合金共渗及渗Al层的研究 山东冶金 1998(2)：33-35
38 王春明，庞兆夫，王书惠 多元共渗金属铜表面强化机制的研究 鞍钢技术 1998(8)：16-21
39 大连铁道学院硕士论文 纯铜表面弥散强化的研究
40 华南理工大学硕士论文渗入Al、Si、Zr、Re等后铜合金的高温抗氧化性能，机理
41 吉林工业大学硕士论文H68黄铜粉末包渗铝，铝钛共渗工艺、组织及性能的研究
42 中南工业大学硕士论文 铜渣口热渗镀层的形成和作用研究
43 Jimenez-Morales, A.; Galvan, J.C.; Rodriguez, R.; De Damborenea, J.J. Electrochemical study of the corrosion behaviour of copper surfaces modified by nitrogen ion implantation Journal of Applied Electrochemistry 1997, 27(5): 550-557
44 Kellock, A.J.; Tabacniks, M.H.; Baglin, J.E.E Mechanism for ion beam
passivation of copper surfaces Nuclear Instruments & Methods in Physics Research 1997, 127-128 (2) p742-746
45 Lu, Fu-Hsing; Chen, Hong-Ying Characterization of titanium nitride films deposited by cathodic arc plasma technique on copper substrates Surface and Coatings Technology 2000, 130(2): 290-296
46 Majumdar, J. Dutta; Manna, I. Laser surface alloying of copper with chromium. I. Microstructural evolution Materials Science and Engineering 1999, A268 (1): 227-235
47 Majumdar, J. Dutta; Manna, Ⅰ. Laser surface alloying of copper with chromium. Ⅱ. Improvement in mechanical properties Materials Science and Engineering 1999, A268(1): 216-226
48 李成明 徐重 谢锡善 离子渗金属技术现状 太原理工大学学报 1997(1)：1-7
49 徐重 苏永安 高原 贺志勇 刘小萍 徐在峰 双层辉光离子渗金属技术的现状和展望 第七次全国热处理大会专辑
50 徐重 王振民 古风英 范本惠 双层辉光离子渗金属技术 金属热处理学报 1982(6)：71-83
51 徐重 王振民 范本惠 孙梅琴 离子氮化装置中的双层辉光放电现象及其放电特性的研究 太原工学院学报 1981(1)：76-89
52 Zhong Xu A Novel Plasma Surface Metallurgy: Xu--Tec Process Metallurgical cootings and Thin Films 1990 (2)
53 ZhongXu Gu. FY New Development in Ion Surface Alloying Proceedings 1986 (3)
54 Z. Xu etc. Plasma Surface Alloying Surface Engineering 1986,
2(2)
55 Zhong Xu etc. U.S.Patent No.4,525,268
56 Zhong Xu etc. U.S.Patent No.4,5731,539
57 Zhong Xu etc. U.K.Patent No.2,150,602
58 Zhong Xu etc. Canada Patent No.1,212,486
59 Zhong Xu etc. Australia Patent No.580,734
60 Zhong Xu etc. Sweden Patent No.8,500,364-8
61 徐重等，中国专利：871043580
62 徐重等，中国专利：87104626．1
63 李忠厚 刘小平 徐重 在双层辉光离子渗金属中空位浓度梯度对扩散的影响 应用科学学报 2000(2)：183-185
64 李成明 贺志勇 徐重 离子钨钼共渗的扩散机制 中国有色金属学报 2000(2)：185-188
65 潘俊德等 加弧辉光离子渗镀技术的现状与发展[J] 太原理工大学学报 2000，31(增刊)：69-71
66 潘俊德等 加弧辉光离子渗镀技术[P] CN Patent，90103841．5
67 Nagarjuna, S.; Sarma, D.S. On the variation of lattice parameter of Cu solid solution with solute content in Cu-Ti alloys Scripta Materialia 1999, 41 (4): p2929-2942
68 Nagarjuna, S.; Srinivas, M.; Balasubramanian, K.; Sarma, D.S. On the variation of mechanical properties with solute content in Cu-Ti alloys Materials Science & Engineering 1999, A259(1): p34-42
69 Mangan, M.A.; Shiflet, G.J. Three dimensional investigation of Cu-Ti discontinuous precipitation Scripta Materialia 15 1997, 37 (4): p517-522
70 Wei, Yinghui; Hu, Lanqing; Huang, Yuan; Wang, Xiaotian Characteristics of spinodal decomposition in Cu-Ti alloy Transactions of Metal Heat Treatment 1997, 18 (2): p9-13
71 徐重 范本惠 潘俊德 郑维能 双层辉光离子渗钛 金属热处理 1986(5)：13-20
72 潘俊德 范本惠 加弧辉光离子渗钛的研究[J] 兵工学报 1993(3)：60-66
73 Uzunov, Tzanko Dimitrov; Stojanov, Stojan Petrov; Lambov, Sashko Ivanov Thin films of intermetallic Cu/Ti compounds and their possible uses Vacuum 1999, 52(3): p321-325
74 王从曾 苏永安等 双层辉光离子渗金属主要工艺参数的研究 热加工工艺 1995(4)：7-9
75 贺志勇等 双层辉光离子镍铬共渗最佳工艺参数的研究 金属热处理学报 1990(3)：64-73
76 王从曾 唐宾 苏永安 徐重 不等电位空心阴极离子渗金属工艺特性及其应用 金属热处理学报 1991(3)：43-50
77 中国机械工程学会热处理学会 表面沉积技术 机械工业出版社 1989
78 卢燕平 金属表面防蚀处理 冶金工业出版社 1995，6
79 郑传林 北京科技大学博士论文 TiAl双层辉光等离子表面合金化及其高温氧化行为研究 2001
80 张旭 北京科技大学博士论文 双层辉光离子渗优质镍基耐蚀合金及身材成分控制的研究 1999
81 中国腐蚀与防护学会 金属腐蚀手册 上海科学技术出版社 1984
82 孙秋霞 材料腐蚀与防护 冶金工业出版社 2001
83 刘永辉 电化学测试技术 北京航空学院 1987
84 翟金坤 金属高温腐蚀 北京航天航空大学出版社 1994
85 李建明 磨损金属学 冶金工业出版社 1990