RFID标签封装设备热压模块的设计与实现
摘要
目前RFID(射频识别)的应用领域越来越广,标签需求量也越来越大,因此RFID标签封装设备的研制有着极其重大的科研意义。Strap封装作为RFID标签封装的一种方式,其封装效率远大于传统封装,可有效降低封装成本,代表着未来RFID标签制作的一个趋势。故本文设计了基于各向异性导电胶封装工艺的Strap标签封装设备热压模块,着重对热压模块关键部件热压头进行方案设计并验证,最终实现了整个热压模块的机构设计。
首先,根据整台封装设备的设计指标,对热压模块提出设计要求,根据Strap基板上的天线焊盘排布方式,对热压固化过程作出时序规划,并对热压模块关键部件热压头提出设计指标,最终按照设备功能要求提出热压模块初方案。
其次,依据设计指标与实际工况需求对热压头控制方案进行设计,包括温度控制方案与压力控制方案。根据该温控系统设计指标对关键零部件选型,获得一种最优配置,并对设计的温控系统进行实验验证以确定其控制效果。对压力控制方案的设计提出两种设计方案,并对气缸压力控制方案进行实验验证,通过分析比较后最终选定采用气缸压力控制方案。
然后根据设计需求建立热压头结构初模型,进行有限元分析,依据分析结果对热压头结构进行优化设计,最终确定热压头部件结构。为验证有限元分析结果正确性对成品热压头部件进行温度均衡性、隔热性实验验证,并通过实际封装实验验证热压头部件对芯片的封装效果,该效果已达到本文所提出的设计要求。
最后依据热压模块的运动规划和热压头的确定参数,对整个热压模块进行传动方案设计和关键部件机构设计,最终完成整个热压模块的机构设计。
At present the application of the radio frequency identification technology is used widely, and the demand of RFID tags is growing rapidly, therefore, it is very significant to do the research and development of RFID tag-package equipments. As an especial package-way of RFID, Strap-package has many advantages and represents a development tendency. This paper mainly states how to design the hot-pressing module of Strap-package equipment which is based on ACA packaging technology, focusing on design of the hot-pressing bonder which is the key components of hot-pressing module.
Firstly, the design requirement of hot-pressing module is created according to the design figure of the equipment, and the time and route of hot-pressing module are planned according to antenna distribution of Strap substrate. Then an initial plan of hot-pressing module is created.
Secondly, the control scheme of the hot-pressing bonder is designed according to the requirement of thermal and pressure precise control, and they are verified through the experiment.
Thirdly, the finite element model of the thermo-compression bonder is created, and the structure of hot-pressing bonder is optimized according to the analysis result. An excellent hot-pressing bonder is created after a series of improvements. The results of the finite element analysis are verified by the thermal experiment. Through the actual package experiment, the designed bonder has reached the design requirements which are proposed in this paper.
Finally, hot-pressing module is designed according to the design requirement, and the autochart of hot-pressing process is achieved.
首先,根据整台封装设备的设计指标,对热压模块提出设计要求,根据Strap基板上的天线焊盘排布方式,对热压固化过程作出时序规划,并对热压模块关键部件热压头提出设计指标,最终按照设备功能要求提出热压模块初方案。
其次,依据设计指标与实际工况需求对热压头控制方案进行设计,包括温度控制方案与压力控制方案。根据该温控系统设计指标对关键零部件选型,获得一种最优配置,并对设计的温控系统进行实验验证以确定其控制效果。对压力控制方案的设计提出两种设计方案,并对气缸压力控制方案进行实验验证,通过分析比较后最终选定采用气缸压力控制方案。
然后根据设计需求建立热压头结构初模型,进行有限元分析,依据分析结果对热压头结构进行优化设计,最终确定热压头部件结构。为验证有限元分析结果正确性对成品热压头部件进行温度均衡性、隔热性实验验证,并通过实际封装实验验证热压头部件对芯片的封装效果,该效果已达到本文所提出的设计要求。
最后依据热压模块的运动规划和热压头的确定参数,对整个热压模块进行传动方案设计和关键部件机构设计,最终完成整个热压模块的机构设计。
At present the application of the radio frequency identification technology is used widely, and the demand of RFID tags is growing rapidly, therefore, it is very significant to do the research and development of RFID tag-package equipments. As an especial package-way of RFID, Strap-package has many advantages and represents a development tendency. This paper mainly states how to design the hot-pressing module of Strap-package equipment which is based on ACA packaging technology, focusing on design of the hot-pressing bonder which is the key components of hot-pressing module.
Firstly, the design requirement of hot-pressing module is created according to the design figure of the equipment, and the time and route of hot-pressing module are planned according to antenna distribution of Strap substrate. Then an initial plan of hot-pressing module is created.
Secondly, the control scheme of the hot-pressing bonder is designed according to the requirement of thermal and pressure precise control, and they are verified through the experiment.
Thirdly, the finite element model of the thermo-compression bonder is created, and the structure of hot-pressing bonder is optimized according to the analysis result. An excellent hot-pressing bonder is created after a series of improvements. The results of the finite element analysis are verified by the thermal experiment. Through the actual package experiment, the designed bonder has reached the design requirements which are proposed in this paper.
Finally, hot-pressing module is designed according to the design requirement, and the autochart of hot-pressing process is achieved.
引文
[1]赵军辉.射频识别技术与应用[M].北京:机械工业出版社,2008.
[2]戴清杰,宋军奇,高燕.射频识别技术及应用[J].通信与信息技术,2010年第5期:65~67.
[3]陶玉芬. RFID技术应用展望[J].电脑应用技术,2006总第68期:6~8.
[4]柳维长. RFID与物联网[J].信息与电脑,2010年第10期:32~34.
[5]张智文.射频识别技术理论与实践[M].北京:中国科学技术出版社,2008
[6]徐济仁,陈家松,牛纪海.射频识别技术及应用展望[J].数据通信,2009年第1期:21~26
[7] Sung-Lin Chen,Ken-Huang Lin,Raj Mittra. A Low Profile RFID Tag Designed for Metallic Objects[C]. Microwave Conference,2009,APMC 2009,Asia Pacific,2009:226~228
[8]傅岳鹏,谭凯,田民波.电子封装技术的最新进展[J].半导体技术,第34卷第2期2009年2月:113~118.
[9]佚名.让中国制造的电子标签瞄准世界先进水平[R].中国电子商情(RFID技术与应用),2009年第1期:12~14.
[10] Inlay,Tag production machinery. http://www.hallys.co.jp/en/html/rfid.html
[11] A lien technology. http://www.alientechnology.com/
[12]张辉,范炎章.物联网-我们感知世界的另一扇窗[J].时代经贸,2010年第1期:33~36
[13]邹茉莲.焊接理论及工艺基础[M].北京:北京航空航天大学出版社,1994.
[14]郭以嵩,俞宏坤.TAB封装技术[J].集成电路应用,2003年第4期:17
[15]吴懿平,丁汉.电子制造技术基础[M].北京:机械工业出版社,2005
[16] F. Kriebel,Th. Seidowski. Smart labels-High volume applications using adhesive flip-chip-technologies[C]. Polymers and Adhesives in Microelectronics and Photonics. First International IEEE Conference on Digital Object Identifier,2001: 304 ~308
[17] U. Srinivasan,R. T. Howe,D. Liepmann. Microstructure to Substrate Self-Assembly Using Capillary Forces[J]. ASME/IEEE Journal of Microelectromechanical Systems,2001,10(1):17-24
[18] Johan Liu,Conductive Adhesives for Electronics Packaging[M],electrochemical publications Ltd,1999
[19] Kotthous S,Günther B H,Hang R,et al. Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles [J]. IEEE Transactions on Components and Packaging Technologies,1997,20(1):15-20
[20] Rasul. Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications[J]. Microelectronics Reliability,Vol.44,2004
[21] Joachim Pajonk.New Flip Chip Technology Utilizing Non-Conductive Adhesive Adapted for High Volume Chip Card Module Production[J].IEEE/SEMI Int’l Electronics Manufacturing Technology Symposium,2004:165~170
[22] Sung K Kan,Purushothaman S. Development of conducting adhesive materials for microelectronic applications [J].Journal of Electronic Materials,1999,28(11):1314~1318
[23] Chan Y C,Luk D Y. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly ii.different bonding pressure[J] . Microelectronic Reliability , 2002 , 42 :1195~1204
[24] Chen X.,Zhang J.,Jiao C.L,et al. Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection[J]. Microelectronics Reliability,2006,46
[25]张洪武,关振群,李云鹏等.有限元分析与CAE技术基础[M].北京:清华大学出版社,2004
[26]陶永华.新型PID控制及其应用[M].北京:机械工业出版社.2002
[27]朱盈权. PTC热敏电阻的现状与发展趋势[J].电子元件与材料,2002年第6期:26~27
[28]苏方宁,吴崇隽,赵营刚.氧化铝陶瓷电热元件的节能研究[J].佛山陶瓷,2010年第9期:17~25
[29]唐黎明.浅谈陶瓷电加热元件及其控制电路[J].电子制作,2007年第12期:68~69
[30]卞正岗.传感器技术和市场发展趋势[J].软件,2008年第2期:42~44
[31] Dale Cigoy. How to select the right temperature sensor[R]. June 2007.
[32]张洁天,贾宏博,任磊.铂电阻温度传感器的自热效应[J].传感器技术,2002年第12期:13~17
[33]李楠楠. RFID封装中热压模块温度控制系统的设计与实现[硕士学位论文].武汉:华中科技大学,2007.5
[34] Lei Guo,Hong Wang.PID controller design for output PDFs of stochastic systems using linear matrix inequalities[J]. Systems,Man and Cybernetics,Part B,IEEE Transactionson,2005.35(1):65-71.
[35]罗强. RFID标签热压工艺平台设计与性能验证[硕士学位论文].武汉:华中科技大学,2009.5
[36] T. H. Pian, D. P. chen, etc. A new formulation of hybrid mixed finite elements[J]. Computers&Structures. 1983, 16:81-87
[37]郑堃，吴金波，尹周平等.一种应用与ACA固化的热压装置设计[J].机械与电子,2006,(7):26-29.
[38]李芳,凌道盛.工程结构优化设计发展综述[J].工程设计学报,2002年第2期:229-235
[39]黄国权.有限元基础及ANSYS应用[M].北京:机械工业出版社,2004
[40]许国良.工程传热学[M].北京:中国电力出版社,2005
[41]李兵,何正嘉,陈雪峰. ANSYS Workbench设计、仿真与优化[M].北京:清华大学出版社,2008.
[42]徐广为,沈连婠.直线加速器同轴负载的热分析与优化设计[J].机械与电子,2006,(9):12-14.
[43]吴亚明,陈仲恒,王佳民.惯性平台热分析与热变形试验研究[J].机械与电子,2006,(12):16-19.
[44]李亮,宋健,李勇等.制动器热分析的快速有限元仿真模型研究[J].系统仿真学报.2005,(12):2869-2872
[2]戴清杰,宋军奇,高燕.射频识别技术及应用[J].通信与信息技术,2010年第5期:65~67.
[3]陶玉芬. RFID技术应用展望[J].电脑应用技术,2006总第68期:6~8.
[4]柳维长. RFID与物联网[J].信息与电脑,2010年第10期:32~34.
[5]张智文.射频识别技术理论与实践[M].北京:中国科学技术出版社,2008
[6]徐济仁,陈家松,牛纪海.射频识别技术及应用展望[J].数据通信,2009年第1期:21~26
[7] Sung-Lin Chen,Ken-Huang Lin,Raj Mittra. A Low Profile RFID Tag Designed for Metallic Objects[C]. Microwave Conference,2009,APMC 2009,Asia Pacific,2009:226~228
[8]傅岳鹏,谭凯,田民波.电子封装技术的最新进展[J].半导体技术,第34卷第2期2009年2月:113~118.
[9]佚名.让中国制造的电子标签瞄准世界先进水平[R].中国电子商情(RFID技术与应用),2009年第1期:12~14.
[10] Inlay,Tag production machinery. http://www.hallys.co.jp/en/html/rfid.html
[11] A lien technology. http://www.alientechnology.com/
[12]张辉,范炎章.物联网-我们感知世界的另一扇窗[J].时代经贸,2010年第1期:33~36
[13]邹茉莲.焊接理论及工艺基础[M].北京:北京航空航天大学出版社,1994.
[14]郭以嵩,俞宏坤.TAB封装技术[J].集成电路应用,2003年第4期:17
[15]吴懿平,丁汉.电子制造技术基础[M].北京:机械工业出版社,2005
[16] F. Kriebel,Th. Seidowski. Smart labels-High volume applications using adhesive flip-chip-technologies[C]. Polymers and Adhesives in Microelectronics and Photonics. First International IEEE Conference on Digital Object Identifier,2001: 304 ~308
[17] U. Srinivasan,R. T. Howe,D. Liepmann. Microstructure to Substrate Self-Assembly Using Capillary Forces[J]. ASME/IEEE Journal of Microelectromechanical Systems,2001,10(1):17-24
[18] Johan Liu,Conductive Adhesives for Electronics Packaging[M],electrochemical publications Ltd,1999
[19] Kotthous S,Günther B H,Hang R,et al. Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles [J]. IEEE Transactions on Components and Packaging Technologies,1997,20(1):15-20
[20] Rasul. Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications[J]. Microelectronics Reliability,Vol.44,2004
[21] Joachim Pajonk.New Flip Chip Technology Utilizing Non-Conductive Adhesive Adapted for High Volume Chip Card Module Production[J].IEEE/SEMI Int’l Electronics Manufacturing Technology Symposium,2004:165~170
[22] Sung K Kan,Purushothaman S. Development of conducting adhesive materials for microelectronic applications [J].Journal of Electronic Materials,1999,28(11):1314~1318
[23] Chan Y C,Luk D Y. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly ii.different bonding pressure[J] . Microelectronic Reliability , 2002 , 42 :1195~1204
[24] Chen X.,Zhang J.,Jiao C.L,et al. Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection[J]. Microelectronics Reliability,2006,46
[25]张洪武,关振群,李云鹏等.有限元分析与CAE技术基础[M].北京:清华大学出版社,2004
[26]陶永华.新型PID控制及其应用[M].北京:机械工业出版社.2002
[27]朱盈权. PTC热敏电阻的现状与发展趋势[J].电子元件与材料,2002年第6期:26~27
[28]苏方宁,吴崇隽,赵营刚.氧化铝陶瓷电热元件的节能研究[J].佛山陶瓷,2010年第9期:17~25
[29]唐黎明.浅谈陶瓷电加热元件及其控制电路[J].电子制作,2007年第12期:68~69
[30]卞正岗.传感器技术和市场发展趋势[J].软件,2008年第2期:42~44
[31] Dale Cigoy. How to select the right temperature sensor[R]. June 2007.
[32]张洁天,贾宏博,任磊.铂电阻温度传感器的自热效应[J].传感器技术,2002年第12期:13~17
[33]李楠楠. RFID封装中热压模块温度控制系统的设计与实现[硕士学位论文].武汉:华中科技大学,2007.5
[34] Lei Guo,Hong Wang.PID controller design for output PDFs of stochastic systems using linear matrix inequalities[J]. Systems,Man and Cybernetics,Part B,IEEE Transactionson,2005.35(1):65-71.
[35]罗强. RFID标签热压工艺平台设计与性能验证[硕士学位论文].武汉:华中科技大学,2009.5
[36] T. H. Pian, D. P. chen, etc. A new formulation of hybrid mixed finite elements[J]. Computers&Structures. 1983, 16:81-87
[37]郑堃，吴金波，尹周平等.一种应用与ACA固化的热压装置设计[J].机械与电子,2006,(7):26-29.
[38]李芳,凌道盛.工程结构优化设计发展综述[J].工程设计学报,2002年第2期:229-235
[39]黄国权.有限元基础及ANSYS应用[M].北京:机械工业出版社,2004
[40]许国良.工程传热学[M].北京:中国电力出版社,2005
[41]李兵,何正嘉,陈雪峰. ANSYS Workbench设计、仿真与优化[M].北京:清华大学出版社,2008.
[42]徐广为,沈连婠.直线加速器同轴负载的热分析与优化设计[J].机械与电子,2006,(9):12-14.
[43]吴亚明,陈仲恒,王佳民.惯性平台热分析与热变形试验研究[J].机械与电子,2006,(12):16-19.
[44]李亮,宋健,李勇等.制动器热分析的快速有限元仿真模型研究[J].系统仿真学报.2005,(12):2869-2872