X波段一体化接收前端设计
摘要
接收机前端是雷达系统中的关键部件之一,它的主要功能是对雷达天线接收到的微弱信号进行处理,同时抑制来自外部的干扰和机内的噪声,使信号保持尽可能多的目标信息,因此其性能直接影响到雷达系统的整体性能。
本课题旨在应用LTCC多层基板与封装一体化技术,实现X波段一体化接收前端的小型化技术研究,满足某型号工程的应用需求。
论文首先对最近几年逐渐成熟的低温共烧陶瓷(LTCC)技术和应用进行了介绍。提出了基于一体化基板(LTCC)／外壳技术的X波段接收前端的小型化设计方案。然后对接收机的原理及几种常见的接收机的形式进行了描述,对微波有源电路如低噪声放大器、混频器、限幅器的原理进行了介绍；文中详细介绍了实现接收前端的几种关键技术,如对宽带金丝键合匹配结构、微波信号穿墙结构、微带-带状线-共面波导的转换等进行分析和仿真；X波段接收前端电路的封装采用一体化基板／外壳(ISP,Integral Substrate／Package)技术,将LTCC基板作为封装的载体,在LTCC基板上直接引出封装的I／O端子,并装连封装体的其他部分,使基板与外壳成为一个封装整体。
最后将接收前端电路样品装配到X波段接收机系统中进行测试,测试结果表明,设计加工的一体化接收机前端电路满足了整机系统的设计指标要求,该X接收前端且具有可靠性高、体积小、重量轻、一体化封装、噪声低等优点。
The receiver front module is one of important parts of Radar system. It could processs the feebleness signal received by the antenna, and also could restrain the outside interference & noises from inner part of the radar system, thus the system could help the signal holding more useful information. Its performance directly affects the Radar system's work.
The subject aims to apply the LTCC&Integral Substrate/Package (SIP) technology to achieve Miniaturization Research result of a X-Wave Band Integral Substrate/Package Front-end Receiver, thus to meet the practical demands of some engineering part.
Firstly the paper introduced the characteristics and application of LTCC technology, which had become well-developed in recent years. A Miniaturization scheme of a LTCC substrate X wave band front end receiver design technology of ISP is presented. Then the paper talked about seveval typical receivers types and their working principles. Also, it described the working principles of several microwave active circuits, namely LNA、Mixer Limitr. The paper described in details several key technologies of front-end receivers:the anlysis & simulation technology of gold ribbon bonding adapted structure, microwave signal penetration structure, microstrip-stripline-CPW/coplanar wave guide switch. The X Wave band receiver adopt the Integral Substrate/Package (ISP) technology method, it take the LTCC substrate as the carrier of its package, with the I/O ports of the LTCC substrate directly led out,while assembling the other Parts of the package, in achiving a comprehensive package structure of the substrate and the package.
Finally we assembled the front-end receiver into the X-band receiver system to measure. The measurement result showed that the front-end receiver module being able to reach the desired target value, and satisfying customer requirements. The module boasts of many virtues, such as high in reliability, small in volume, light in weight, low in noise, and integrated package.
本课题旨在应用LTCC多层基板与封装一体化技术,实现X波段一体化接收前端的小型化技术研究,满足某型号工程的应用需求。
论文首先对最近几年逐渐成熟的低温共烧陶瓷(LTCC)技术和应用进行了介绍。提出了基于一体化基板(LTCC)／外壳技术的X波段接收前端的小型化设计方案。然后对接收机的原理及几种常见的接收机的形式进行了描述,对微波有源电路如低噪声放大器、混频器、限幅器的原理进行了介绍；文中详细介绍了实现接收前端的几种关键技术,如对宽带金丝键合匹配结构、微波信号穿墙结构、微带-带状线-共面波导的转换等进行分析和仿真；X波段接收前端电路的封装采用一体化基板／外壳(ISP,Integral Substrate／Package)技术,将LTCC基板作为封装的载体,在LTCC基板上直接引出封装的I／O端子,并装连封装体的其他部分,使基板与外壳成为一个封装整体。
最后将接收前端电路样品装配到X波段接收机系统中进行测试,测试结果表明,设计加工的一体化接收机前端电路满足了整机系统的设计指标要求,该X接收前端且具有可靠性高、体积小、重量轻、一体化封装、噪声低等优点。
The receiver front module is one of important parts of Radar system. It could processs the feebleness signal received by the antenna, and also could restrain the outside interference & noises from inner part of the radar system, thus the system could help the signal holding more useful information. Its performance directly affects the Radar system's work.
The subject aims to apply the LTCC&Integral Substrate/Package (SIP) technology to achieve Miniaturization Research result of a X-Wave Band Integral Substrate/Package Front-end Receiver, thus to meet the practical demands of some engineering part.
Firstly the paper introduced the characteristics and application of LTCC technology, which had become well-developed in recent years. A Miniaturization scheme of a LTCC substrate X wave band front end receiver design technology of ISP is presented. Then the paper talked about seveval typical receivers types and their working principles. Also, it described the working principles of several microwave active circuits, namely LNA、Mixer Limitr. The paper described in details several key technologies of front-end receivers:the anlysis & simulation technology of gold ribbon bonding adapted structure, microwave signal penetration structure, microstrip-stripline-CPW/coplanar wave guide switch. The X Wave band receiver adopt the Integral Substrate/Package (ISP) technology method, it take the LTCC substrate as the carrier of its package, with the I/O ports of the LTCC substrate directly led out,while assembling the other Parts of the package, in achiving a comprehensive package structure of the substrate and the package.
Finally we assembled the front-end receiver into the X-band receiver system to measure. The measurement result showed that the front-end receiver module being able to reach the desired target value, and satisfying customer requirements. The module boasts of many virtues, such as high in reliability, small in volume, light in weight, low in noise, and integrated package.
引文
1. Rofougaran, A., et al., "A Single-chip 900-MHz Spread-Spectrum Wireless Transceiver in 1-μ m CMOS—Part Ⅰ & Ⅱ, " IEEE J. Sol id-State Circ., vol.33, no.4, pp.515-547, April 1998
2. Jussila J. A 22-mA 3.0-dB NF direct conversion receiver for 3G WCDMA [J].IEEE J Sol Sta Circ,2001;36(12):2025-2029
3.程明生,陈该青,陈奇海,蒋健乾.X波段T／R组件高密度组装技术[J].电子机械工程.2006(04)：43—46
4.丁鹭飞,耿富路.雷达原理(第三版).西安：西安电子科技大学出版社,2003
5.顾其诤.微波集成电路.第一版.北京：人民邮电出版社,1978.
6.杨邦朝,张经国.多芯片组件(MCM)技术及其应用.电子科技大学出版社,2001
7.杨邦朝,蒋明,胡以达.LTCC组件及未来发展趋势.混合微电子技术,2002
8.何中伟,MCM-C及HIC基本术语. 中国兵器第214研究所MCM-C工艺制造技术研究学术论文集.20059.何中伟、王守政.LTCC基板与封装的一体化制造. 中国兵器第214研究所MCM-C工艺制造技术研究学术论文集,2005
10.何中伟、杜松、李寿胜.MCM-C组装封装基本工艺流程研究.中国兵器第214研究所MCM-C工艺制造技术研究学术论文集.2005
11. Hossein Hashemi, Student Member, Concurrent Multiband Low-Noise Amplifiers—Theory, Design, and Applications. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL.50, NO.1, JANUARY 2002.
12. Tapan K. Gupta. Handbook of Thick-and Thin-Film Hybrid Microelectronics. John Wiley &Sons, Inc.2004
13.华东光电集成器件研究所,LTCC设计规则
14.顾继慧编著.微波技术.第一版.北京：科学出版社,2004
15.清华大学《微带电路》编写组.第1版.微带电路.北京：人民邮电出版社,1979.
16.李嗣范.《微波元件原理与设计》.第一版.北京：人民邮电出版社,1982
17.范博.射频电路原理与实用电路设计.第一版.北京：机械工业出版社,2006
18.黄家栋.X波段微波低噪声混合集成接收前端[J].舰船电子对抗.1997(01)：30一33
19.程焰平.一种X波段小型化高频接收机的设计[J].现代电子.2001(01)：30-37
20.王强,吴景峰.X波段微波接收前端研究[c].2004年全国第十届微波集成电路与移动通信学术年会：369-371
21. Robert V. Garver.Broad-Band Diode Phase Shifters. IEEE Trans. on Microwave Theory and Techniques,Vol. MTT-20, No.5, June 1972,pp.314-323
22.微波固态电路设计.南京：电子第14所译：551-560
23.林为干.微波网络.第1版.北京：国防工业出版社,1978.
24.张玉兴.射频模拟电路.第1版.北京：电子工业出版社,2002
25.张玉兴.非线性电路与系统.第1版.成都：电子科技大学出版社,2003.
26.刘学观,郭辉萍.微波技术与天线.第1版.西安：西安电子科技大学出版社,2001
27. Andrei Grebennikov著,张玉兴,赵宏飞译.射频与微波功率放大器设计.第1版.北京：电子工业出版社,2006.4：128-134
28. Cotter W. Sayre著,张之超,黄世亮,吴海云等译.无线通信设备与系统设计大全.第1版.北京：人民邮电出版社,2004
29. Matthew M Radmanesh. Radio Frequency and Microwave Electronics Illustrated.第1版.北京：电子工业出版社,2002
30.吴远斌.多波段可重构雷达接收机技术的研究.第1版.现代雷达.2006
31.胡小文.混频器的设计及其应用.计算机与网络,pp57-58,No.21,2003
32. D. G. Swanson, "Grounding microstrip lines with via holes, " IEEE Trans., MTT-40, August 1992:1719-1721.33. WJ Communications Inc. Receiver Dynamic Range:Part 1&2 Tech-note,2001
34. Ulrich L. Rohde David P. NewKirk. RF Microwave Circuit Design For Wireless Applications,2000
35. J. K. Kong. Electronmagnetic Wave Theory 2nd ed John Wiley&Sons New York,1996
36. Cornell Drentea. Radio Communications Receivers TAB Books,1982
37.顾墨琳,林守远.有源相控阵接收系统的噪声测试[J].现代雷达.2004(03)：54-57
38.戴永胜.X和Ku波段GaAs MMIC低噪声放大器的测量及其研究[J].半导体情报.1994(04)： 22-25
39.王磊,陈名松.低噪声、高线性射频前端的设计[c].2005年无线科技学术会议：188-191
40.夏顺冬.雷达接收机的动态范围[J].现代雷达.1996(4)：76—82
41. R. Collin. Foundation of Microwave Engineering McGraw-Hill New York,1996
42.黄香馥.微波固体电路.第1版.国防科技大学出版社,1985年
43.吴万春.集成固体微波电路.第1版.北京：国防工业出版社,1981.
2. Jussila J. A 22-mA 3.0-dB NF direct conversion receiver for 3G WCDMA [J].IEEE J Sol Sta Circ,2001;36(12):2025-2029
3.程明生,陈该青,陈奇海,蒋健乾.X波段T／R组件高密度组装技术[J].电子机械工程.2006(04)：43—46
4.丁鹭飞,耿富路.雷达原理(第三版).西安：西安电子科技大学出版社,2003
5.顾其诤.微波集成电路.第一版.北京：人民邮电出版社,1978.
6.杨邦朝,张经国.多芯片组件(MCM)技术及其应用.电子科技大学出版社,2001
7.杨邦朝,蒋明,胡以达.LTCC组件及未来发展趋势.混合微电子技术,2002
8.何中伟,MCM-C及HIC基本术语. 中国兵器第214研究所MCM-C工艺制造技术研究学术论文集.20059.何中伟、王守政.LTCC基板与封装的一体化制造. 中国兵器第214研究所MCM-C工艺制造技术研究学术论文集,2005
10.何中伟、杜松、李寿胜.MCM-C组装封装基本工艺流程研究.中国兵器第214研究所MCM-C工艺制造技术研究学术论文集.2005
11. Hossein Hashemi, Student Member, Concurrent Multiband Low-Noise Amplifiers—Theory, Design, and Applications. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL.50, NO.1, JANUARY 2002.
12. Tapan K. Gupta. Handbook of Thick-and Thin-Film Hybrid Microelectronics. John Wiley &Sons, Inc.2004
13.华东光电集成器件研究所,LTCC设计规则
14.顾继慧编著.微波技术.第一版.北京：科学出版社,2004
15.清华大学《微带电路》编写组.第1版.微带电路.北京：人民邮电出版社,1979.
16.李嗣范.《微波元件原理与设计》.第一版.北京：人民邮电出版社,1982
17.范博.射频电路原理与实用电路设计.第一版.北京：机械工业出版社,2006
18.黄家栋.X波段微波低噪声混合集成接收前端[J].舰船电子对抗.1997(01)：30一33
19.程焰平.一种X波段小型化高频接收机的设计[J].现代电子.2001(01)：30-37
20.王强,吴景峰.X波段微波接收前端研究[c].2004年全国第十届微波集成电路与移动通信学术年会：369-371
21. Robert V. Garver.Broad-Band Diode Phase Shifters. IEEE Trans. on Microwave Theory and Techniques,Vol. MTT-20, No.5, June 1972,pp.314-323
22.微波固态电路设计.南京：电子第14所译：551-560
23.林为干.微波网络.第1版.北京：国防工业出版社,1978.
24.张玉兴.射频模拟电路.第1版.北京：电子工业出版社,2002
25.张玉兴.非线性电路与系统.第1版.成都：电子科技大学出版社,2003.
26.刘学观,郭辉萍.微波技术与天线.第1版.西安：西安电子科技大学出版社,2001
27. Andrei Grebennikov著,张玉兴,赵宏飞译.射频与微波功率放大器设计.第1版.北京：电子工业出版社,2006.4：128-134
28. Cotter W. Sayre著,张之超,黄世亮,吴海云等译.无线通信设备与系统设计大全.第1版.北京：人民邮电出版社,2004
29. Matthew M Radmanesh. Radio Frequency and Microwave Electronics Illustrated.第1版.北京：电子工业出版社,2002
30.吴远斌.多波段可重构雷达接收机技术的研究.第1版.现代雷达.2006
31.胡小文.混频器的设计及其应用.计算机与网络,pp57-58,No.21,2003
32. D. G. Swanson, "Grounding microstrip lines with via holes, " IEEE Trans., MTT-40, August 1992:1719-1721.33. WJ Communications Inc. Receiver Dynamic Range:Part 1&2 Tech-note,2001
34. Ulrich L. Rohde David P. NewKirk. RF Microwave Circuit Design For Wireless Applications,2000
35. J. K. Kong. Electronmagnetic Wave Theory 2nd ed John Wiley&Sons New York,1996
36. Cornell Drentea. Radio Communications Receivers TAB Books,1982
37.顾墨琳,林守远.有源相控阵接收系统的噪声测试[J].现代雷达.2004(03)：54-57
38.戴永胜.X和Ku波段GaAs MMIC低噪声放大器的测量及其研究[J].半导体情报.1994(04)： 22-25
39.王磊,陈名松.低噪声、高线性射频前端的设计[c].2005年无线科技学术会议：188-191
40.夏顺冬.雷达接收机的动态范围[J].现代雷达.1996(4)：76—82
41. R. Collin. Foundation of Microwave Engineering McGraw-Hill New York,1996
42.黄香馥.微波固体电路.第1版.国防科技大学出版社,1985年
43.吴万春.集成固体微波电路.第1版.北京：国防工业出版社,1981.