典型电子封装结构的热动力学分析与寿命预测
摘要
随着电子封装技术向着高密度、高性能、小型化和低成本的方向发展,振动与热引起的可靠性问题日益成为人们研究的重点。本文以二级陶瓷柱状阵列封装组件为研究对象,研究了典型电子封装结构在振动与热循环载荷作用下的可靠性问题。
主要工作包括:1)建立了振动与热传导的三维有限元模型,分析了结构在正弦激励与热循环载荷作用下的应力应变分布情况;2)根据高周疲劳损伤原理,结合本文正弦激励得到的模拟结果,拟合得到基于应力的寿命预测方程;3)基于累积损伤理论,预测了扫频振动载荷作用下的疲劳寿命,并同时验证了上述方程具有可行性与适用性;4)根据Coffin-Manson疲劳损伤原理和裂纹扩展理论,结合本文热循环载荷得到的模拟结果,拟合得到了基于应变能密度的疲劳寿命预测方程,并通过与诸多试验结果比较,证实了该热疲劳寿命预测模型的有效性。
研究结果表明,电子封装结构中最危险的部位始终位于离电路板中心最远的焊点上;振动载荷作用时,最薄弱的环节位于危险焊点上离电路板较近的体积平均层上,且焊点内的应力与电路板的边界约束条件有关,靠近约束边界的焊点应力明显偏大,电路板的弯曲挠度与焊点内的应力存在一定的同步性质;在热循环载荷作用时,裂纹最早产生于危险焊点上离基板较近的体积平均层上;与电路板的厚度相比,基板的厚度及盖板的存在情况对焊点的热疲劳寿命影响较大。
本文所得结论可为电子封装结构的设计工作提供重要理论参考。
With the more density, higher performance, downsizing and lower cost of the electronic packaging, the reliabilities of electronic packages induced by vibration and thermal conditions become the focus of people. This dissertation takes the board level packages of ceramic column grid array as study object and investigates the reliabilities of typical electronic packages under vibration and thermal cycle conditions.
The work in the subject mainly include: 1) Built three dimensional finite element models of vibration and thermal cycle conditions, and analyzed the stress as well as strain distribution of structures under harmonic excitation and thermal cycle conditions individually; 2) Combined with the modeling results, the fatigue life prediction equation was developed by the principle of high cycle damage; 3) On the basis of accumulative damage theory, the fatigue life prediction of sweep frequency loading was predicted, which meanwhile validated the fatigue life equation fitted before; 4) Based the Coffin-Manson fatigue damage principle and crack growing theory, using the modeling results of the thermal cycle conditions, the thermal fatigue life prediction model was also predicted, and it was validated by comparing with several test data.
The results show that the most dangerous location is always on the furthest solder joint from the center of the printed circuit board; When analyzing the vibration conditions, the weakest link is on the volume averaged layer beside the printed circuit board, and the stress in the solder is related to the boundary constraint conditions; The stresses in the solders near the constraint boundary are significantly larger and synchronous with the bending deflection; While dealing with the case of the thermal conditions, the weakest link tends into the volume averaged layer on the substrate side, which is differently from the conclusion from the vibration analysis; Besides, compared with the thickness of the printed circuit board, the thickness of the substrate and the presence of lid have more influence on the thermodynamics distribution, which then seriously affect on the thermal cycle fatigue life. The results from the finite element simulation have been validated to be applicable and reliable by comparing with the test data.
The conclusions obtained may provide theoretical guidance for the designation of electronic packages.
主要工作包括:1)建立了振动与热传导的三维有限元模型,分析了结构在正弦激励与热循环载荷作用下的应力应变分布情况;2)根据高周疲劳损伤原理,结合本文正弦激励得到的模拟结果,拟合得到基于应力的寿命预测方程;3)基于累积损伤理论,预测了扫频振动载荷作用下的疲劳寿命,并同时验证了上述方程具有可行性与适用性;4)根据Coffin-Manson疲劳损伤原理和裂纹扩展理论,结合本文热循环载荷得到的模拟结果,拟合得到了基于应变能密度的疲劳寿命预测方程,并通过与诸多试验结果比较,证实了该热疲劳寿命预测模型的有效性。
研究结果表明,电子封装结构中最危险的部位始终位于离电路板中心最远的焊点上;振动载荷作用时,最薄弱的环节位于危险焊点上离电路板较近的体积平均层上,且焊点内的应力与电路板的边界约束条件有关,靠近约束边界的焊点应力明显偏大,电路板的弯曲挠度与焊点内的应力存在一定的同步性质;在热循环载荷作用时,裂纹最早产生于危险焊点上离基板较近的体积平均层上;与电路板的厚度相比,基板的厚度及盖板的存在情况对焊点的热疲劳寿命影响较大。
本文所得结论可为电子封装结构的设计工作提供重要理论参考。
With the more density, higher performance, downsizing and lower cost of the electronic packaging, the reliabilities of electronic packages induced by vibration and thermal conditions become the focus of people. This dissertation takes the board level packages of ceramic column grid array as study object and investigates the reliabilities of typical electronic packages under vibration and thermal cycle conditions.
The work in the subject mainly include: 1) Built three dimensional finite element models of vibration and thermal cycle conditions, and analyzed the stress as well as strain distribution of structures under harmonic excitation and thermal cycle conditions individually; 2) Combined with the modeling results, the fatigue life prediction equation was developed by the principle of high cycle damage; 3) On the basis of accumulative damage theory, the fatigue life prediction of sweep frequency loading was predicted, which meanwhile validated the fatigue life equation fitted before; 4) Based the Coffin-Manson fatigue damage principle and crack growing theory, using the modeling results of the thermal cycle conditions, the thermal fatigue life prediction model was also predicted, and it was validated by comparing with several test data.
The results show that the most dangerous location is always on the furthest solder joint from the center of the printed circuit board; When analyzing the vibration conditions, the weakest link is on the volume averaged layer beside the printed circuit board, and the stress in the solder is related to the boundary constraint conditions; The stresses in the solders near the constraint boundary are significantly larger and synchronous with the bending deflection; While dealing with the case of the thermal conditions, the weakest link tends into the volume averaged layer on the substrate side, which is differently from the conclusion from the vibration analysis; Besides, compared with the thickness of the printed circuit board, the thickness of the substrate and the presence of lid have more influence on the thermodynamics distribution, which then seriously affect on the thermal cycle fatigue life. The results from the finite element simulation have been validated to be applicable and reliable by comparing with the test data.
The conclusions obtained may provide theoretical guidance for the designation of electronic packages.
引文
[1]袁国政.无铅焊点对电子封装芯片动态可靠性影响的研究: [硕士学位论文],太原:太原理工大学,2007.5
[2]杨邦朝,张经国.多芯片组件(MCM)技术及其应用[M].电子科技大学出版社,2000: 16-17
[3]戴丽娜.子模型法预测BGA封装中焊点的热疲劳寿命: [硕士学位论文],浙江:浙江工业大学,2007.6
[4]张杰.冲击载荷下BGA封装焊点的力学特性研究:[硕士学位论文],江苏:江苏大学,2006.10
[5]李磊.三维叠层CSP/BGA封装的热分析与焊点可靠性分析: [硕士学位论文],成都:电子科技大学,2006.2
[6]周俊.微电子封装中无铅焊料的损伤模型和失效机理研究:[博士学位论文].浙江:浙江工业大学,2007.6
[7]闫青亮. PBGA无铅焊点可靠性的有限元模拟与寿命预测: [硕士学位论文],天津:天津大学材料科学与工程学院,2007.1
[8]钱乙余,马寨.吉田综仔.表面组装焊点内部应力-应变场的数值模拟(Ⅱ)-焊点失效的主控力学因素[J].中国有色金属学报,2000,10(3):411-415
[9]樊强.材料选择对BGA焊点热可靠性影响的有限元仿真研究: [硕士学位论文].天津:天津大学材料科学与工程学院,2005: 9-10
[10] Sauber J. Prediction thermal fatigue lifetimes for SMT solder joints [J]. ASME Journal of Electronic Packaging, 1992, 114(2):470– 472
[11]Yang Q J. Lim G H. et al. Experimental modal analysis of PBGA printed circuit board assemblies.1997 IEEE EPTC, pp: 290-296.
[12] Man-Lung Sham,Jang-Kyo Kim,Joo-Hyuk Park,“Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions”,Computational Materials Science 43 (2008) 460-480
[13] Wu J., Song G. S. et al, Drop/impact simulation and test validation of telecommunication products. Inter Society Conference on Thermal Phenomena 1998, pp: 330-336.
[14] Tee T. Y., Hun S. N, et al, Impact life prediction modeling of TFBGA packages under board level drop test. Microelectronics Reliability. 2004(44): 1131-1142
[15] Cemal Basaran. Juan Gomez. Minghui Lin al. Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading On Electronic Packaging,SCSC2007
[16]徐步陆.称姚年.电子封装可靠性研究: [博士学位论文].上海:中国科学院上海微系统与信息技术研究所, 2002:78-92
[17] H D Solomon. Energy approach to the fatigue of 60/40 solder: PartⅡ: influence of hold time and asymmetric loading[J].ASME Journal of Electronic Packaging,1996,118(2):67-71
[18] Engelmajer W. Fatigue life of leadless chip carrier solder joints during power cycling [J]. IEEE Components, hybrids and manufacturing teehnology.1983. 6(3):232-237
[19] Akay H, Zhang H, Paydar N. Experimental correlations of an energy-based fatigue life prediction method for solder joints, advance in electronic packaging[C]. Proc. Of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference.1997, 2: 567-574
[20] Darveaux R, Bane J K, Mawer A, Dody G. Reliability of plastic ball grid array assembly [M]. Ball Grid Array Technology, J. Lau. Ed. New York: McGrdw-Hill, Inc, 1995:379-442
[21] Darveaux R. Effect of simulation methodology on solder joint crack growth correlations[C]. Proceedings of 5th Electronic components & technology, 2000:1048-1058
[22] Knechts S, Fox L. Integrated matrix creep Application to accelerated testing and lifetime prediction [A]. Solder joint reliability theory and applications van no strand rein hold[C], New York:1991.508-544
[23] Syed A. Reliability of leadfree solder connections of area array packages [EB]. www.amkor com/products/notes_papers/Reliability of lead free solder connections Whitepater pdf, 2001
[24] Pao Y H.A Fracture Mechanics Approach to Thermal Fatigue Life Prediction of Solder Joints[J].IEEECHMT,1992,15(4):559-570.
[25] Andrew Eugene Perkins. Investigation and prediction of solder joint reliability for ceramic area array packages under thermal cycling, power cycling, and vibration environments, Doctor of Philosophy, School of G. W. Woodruff School of Mechanical Engineering, May 2007
[26] Ju, S. H., Kuskowski, S., Sandor, B.I., et al. Creep-fatigue damage analysis of solder joints [J]. Fatigue of Electronic Materials, 1994, 1153: 1-21
[27] Nose, H., et al., Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders. ASME Journal of Electronic Packaging, 2003. 125: p. 59-6.
[28] Anand,L., Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures[J].Journal of Engineering Materials and Technology,1982,104(l):12-17
[29]王国忠,程兆年. SnPb钎料合金的粘塑性Anand本构方程[J].应用力学学报,2000,17(3):133-139
[30]王秋旺.传热学重点难点及典型题精解[M].西安交通大学出版社,2001.10
[31]李维特,黄保海,毕仲波.热应力理论分析及应用[M].中国电力出版社,2004: 69-88
[32]马孝松.微电子封装高聚物热、湿-机械特性及其封装可靠性研究.: [博士学位论文].西安:西安电子科技大学,2006.6
[33]胡海岩,孙久厚.陈怀海.机械振动与冲击(修订版)[M].航空工业出版社,2002: 29-34
[34]朱颂春,况延香.新型微电子封装技术-BGA[J].电子工艺技术,1998.3: 19(2)
[35] IPC-SM-785.Guidelines for Accelerated Reliability Testing of Surface Mount Technology [S].Institute for Interconnection and Packaging Electronic Circuits,Lincolnwood,L.
[36] Che. F.X. et al. Vibration Fatigue Test and Analysis for Flip Chip Solder Joints. Electronic Packaging Technology Conference 5th. 2003. Singapore: IEEE.
[37]隋允康,杜家政,彭细荣. MSC. Nastran有限元动力分析与优化设计实用教程[M].科学出版社,2004: 89-120
[38]张永昌. MSC.Nastran有限元分析理论基础与应用[M].科学出版社,2004:389-399
[39]刘兵山,黄聪. Patran从入门到精通[M].中国水利水电出版社,2002:359-369
[40] K. Darbha, A. Dasgupta. A Nested Finite Element Methodology for Stress Analysis of Electronic Products. ASME Transactions in Electronic Packaging, 1997,114(6): 152~160
[41]杜兵.功率载荷下叠层芯片尺寸封装热应力分析: [硕士学位论文].哈尔滨:哈尔滨理工大学,2007.3
[42]嘉木工作室. ANSYS5.7有限元实例分析教程[M].北京:机械工业出版社,2003
[43]元鑫.多芯片组件_MCM_焊点可靠性的有限元模拟与寿命的预测. [硕士学位论文],天津:天津大学材料科学与工程学院,2006.1
[44] Cole, M.S., et al, CCGA design variables and their effects on reliability. Circuits Assembly, 2002 13(1):p.66
[2]杨邦朝,张经国.多芯片组件(MCM)技术及其应用[M].电子科技大学出版社,2000: 16-17
[3]戴丽娜.子模型法预测BGA封装中焊点的热疲劳寿命: [硕士学位论文],浙江:浙江工业大学,2007.6
[4]张杰.冲击载荷下BGA封装焊点的力学特性研究:[硕士学位论文],江苏:江苏大学,2006.10
[5]李磊.三维叠层CSP/BGA封装的热分析与焊点可靠性分析: [硕士学位论文],成都:电子科技大学,2006.2
[6]周俊.微电子封装中无铅焊料的损伤模型和失效机理研究:[博士学位论文].浙江:浙江工业大学,2007.6
[7]闫青亮. PBGA无铅焊点可靠性的有限元模拟与寿命预测: [硕士学位论文],天津:天津大学材料科学与工程学院,2007.1
[8]钱乙余,马寨.吉田综仔.表面组装焊点内部应力-应变场的数值模拟(Ⅱ)-焊点失效的主控力学因素[J].中国有色金属学报,2000,10(3):411-415
[9]樊强.材料选择对BGA焊点热可靠性影响的有限元仿真研究: [硕士学位论文].天津:天津大学材料科学与工程学院,2005: 9-10
[10] Sauber J. Prediction thermal fatigue lifetimes for SMT solder joints [J]. ASME Journal of Electronic Packaging, 1992, 114(2):470– 472
[11]Yang Q J. Lim G H. et al. Experimental modal analysis of PBGA printed circuit board assemblies.1997 IEEE EPTC, pp: 290-296.
[12] Man-Lung Sham,Jang-Kyo Kim,Joo-Hyuk Park,“Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions”,Computational Materials Science 43 (2008) 460-480
[13] Wu J., Song G. S. et al, Drop/impact simulation and test validation of telecommunication products. Inter Society Conference on Thermal Phenomena 1998, pp: 330-336.
[14] Tee T. Y., Hun S. N, et al, Impact life prediction modeling of TFBGA packages under board level drop test. Microelectronics Reliability. 2004(44): 1131-1142
[15] Cemal Basaran. Juan Gomez. Minghui Lin al. Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading On Electronic Packaging,SCSC2007
[16]徐步陆.称姚年.电子封装可靠性研究: [博士学位论文].上海:中国科学院上海微系统与信息技术研究所, 2002:78-92
[17] H D Solomon. Energy approach to the fatigue of 60/40 solder: PartⅡ: influence of hold time and asymmetric loading[J].ASME Journal of Electronic Packaging,1996,118(2):67-71
[18] Engelmajer W. Fatigue life of leadless chip carrier solder joints during power cycling [J]. IEEE Components, hybrids and manufacturing teehnology.1983. 6(3):232-237
[19] Akay H, Zhang H, Paydar N. Experimental correlations of an energy-based fatigue life prediction method for solder joints, advance in electronic packaging[C]. Proc. Of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference.1997, 2: 567-574
[20] Darveaux R, Bane J K, Mawer A, Dody G. Reliability of plastic ball grid array assembly [M]. Ball Grid Array Technology, J. Lau. Ed. New York: McGrdw-Hill, Inc, 1995:379-442
[21] Darveaux R. Effect of simulation methodology on solder joint crack growth correlations[C]. Proceedings of 5th Electronic components & technology, 2000:1048-1058
[22] Knechts S, Fox L. Integrated matrix creep Application to accelerated testing and lifetime prediction [A]. Solder joint reliability theory and applications van no strand rein hold[C], New York:1991.508-544
[23] Syed A. Reliability of leadfree solder connections of area array packages [EB]. www.amkor com/products/notes_papers/Reliability of lead free solder connections Whitepater pdf, 2001
[24] Pao Y H.A Fracture Mechanics Approach to Thermal Fatigue Life Prediction of Solder Joints[J].IEEECHMT,1992,15(4):559-570.
[25] Andrew Eugene Perkins. Investigation and prediction of solder joint reliability for ceramic area array packages under thermal cycling, power cycling, and vibration environments, Doctor of Philosophy, School of G. W. Woodruff School of Mechanical Engineering, May 2007
[26] Ju, S. H., Kuskowski, S., Sandor, B.I., et al. Creep-fatigue damage analysis of solder joints [J]. Fatigue of Electronic Materials, 1994, 1153: 1-21
[27] Nose, H., et al., Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders. ASME Journal of Electronic Packaging, 2003. 125: p. 59-6.
[28] Anand,L., Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures[J].Journal of Engineering Materials and Technology,1982,104(l):12-17
[29]王国忠,程兆年. SnPb钎料合金的粘塑性Anand本构方程[J].应用力学学报,2000,17(3):133-139
[30]王秋旺.传热学重点难点及典型题精解[M].西安交通大学出版社,2001.10
[31]李维特,黄保海,毕仲波.热应力理论分析及应用[M].中国电力出版社,2004: 69-88
[32]马孝松.微电子封装高聚物热、湿-机械特性及其封装可靠性研究.: [博士学位论文].西安:西安电子科技大学,2006.6
[33]胡海岩,孙久厚.陈怀海.机械振动与冲击(修订版)[M].航空工业出版社,2002: 29-34
[34]朱颂春,况延香.新型微电子封装技术-BGA[J].电子工艺技术,1998.3: 19(2)
[35] IPC-SM-785.Guidelines for Accelerated Reliability Testing of Surface Mount Technology [S].Institute for Interconnection and Packaging Electronic Circuits,Lincolnwood,L.
[36] Che. F.X. et al. Vibration Fatigue Test and Analysis for Flip Chip Solder Joints. Electronic Packaging Technology Conference 5th. 2003. Singapore: IEEE.
[37]隋允康,杜家政,彭细荣. MSC. Nastran有限元动力分析与优化设计实用教程[M].科学出版社,2004: 89-120
[38]张永昌. MSC.Nastran有限元分析理论基础与应用[M].科学出版社,2004:389-399
[39]刘兵山,黄聪. Patran从入门到精通[M].中国水利水电出版社,2002:359-369
[40] K. Darbha, A. Dasgupta. A Nested Finite Element Methodology for Stress Analysis of Electronic Products. ASME Transactions in Electronic Packaging, 1997,114(6): 152~160
[41]杜兵.功率载荷下叠层芯片尺寸封装热应力分析: [硕士学位论文].哈尔滨:哈尔滨理工大学,2007.3
[42]嘉木工作室. ANSYS5.7有限元实例分析教程[M].北京:机械工业出版社,2003
[43]元鑫.多芯片组件_MCM_焊点可靠性的有限元模拟与寿命的预测. [硕士学位论文],天津:天津大学材料科学与工程学院,2006.1
[44] Cole, M.S., et al, CCGA design variables and their effects on reliability. Circuits Assembly, 2002 13(1):p.66