TFT-LCD模组段生产良率及效率的研究
摘要
TFT-LCD作为一个新兴的高科技行业,具有全面取代目前CRT显示器的趋势。目前面临的问题是大量生产中生产良率和效率较低。对于这两个问题,本文通过改善压合件和改善线平衡提升良率和产能,降低生产成本提高产品市场竞争力。
分析了目前大规模生产及其良率的现状,找出生产中影响良率及产能的因素,确定了提高良率和改善线平衡的方案。
在实装段生产中,主要不良现象是压合异物和压痕不良。对于压合异物,分析原因是压合区的清洁效果不佳,采用新的清洁方式,利用无尘布对固体颗粒进行清洁,Plasma对有机物进行清洁;同时选择性价比高的无尘布及优化清洁时间降低成本,最终达到了改善清洁的效果。压痕不良,分析了不同现象的产生原因,针对压痕偏淡,通过改变压强及提高机构精度解决这个问题;针对Bump压塌,分析原因是压合异物造成,通过导入Plasma清洁改善;对于导电粒子捕捉不足,通过理论分析为ACF设计问题,提出增加导电粒子密度及变更ACF结构,从理论上彻底解决了导电粒子捕捉不足的问题。在以上研究过程中,采用了鱼骨图和DOE等品质管理分析方法,在分析问题过程中节省了时间及成本,并通过实际生产证明了改善效果的有效性。通过以上改善,压合不良率从0.34%降低为0.14%。
在组装段生产过程中,作业员主要工作是组装和检测,影响生产效率主要是人均工作量分配不均造成的人员等待,通过改善线平衡来打破瓶颈提高产能。提高人员检验速度,采用分享检验人员优秀工作经验,推广形成作业人员标准动作,改善后人均功能检测时间缩短35%,外观检测站缩短18.5%;改善检验方式,根据产线不良调整检测画面顺序,提前发现不良现象,每片可节省100秒的时间;优化重组检验项目,平均分配各作业员的工作量,调整后的工作时间差异缩短为2.75秒,基本上达到了线平衡。以上改善,借助于工业工程方法,根据生产实际情况进行调整,达到了改善线平衡和提升产能的目的。
本文还分析了资源管理对生产的辅助作用。作业人员培训后缩短上岗时间两个月,对于良率及效率的提升有重要的作用,借助于ERP系统提高生产管理效率,有效组织企业资源提高产量。
生产过程中影响良率和效率的因素较多,本论文所研究良率和效率的改善方法,对于企业降低成本具有较好的借鉴意义,对于进一步解决生产中工艺改良、工作量分配等复杂问题提供了指导思路和参考价值。
TFT-LCD display is a new photoelectric industrial with advanced technology. In short time it will replace CRT display thoroughly. Now it is facing two problems of low yield and low efficiency during mass production. In the thesis it focuses on improving bonding conditions and line balance to achieve the goals and with lower cost to enhance the competitive power in the market.
In this thesis, it introduces present status of TFT-LCD mass production. We set up a plan that optimazes bonding conditions and get better line balance during manufacturing process to get higher yield and better efficiency.
In JI process there are two defect phenomena of bonding particle and bonding defect. The reason of bonding particle is the bad cleaning result in bonding area. We will introduce a new way with cleaning cloth wiping off solide particle and Plasma cleaning the liquid organic. We select higher performance-price ratio cleaning cloth and optimize cleaning time to saving the running cost and achieve the cleaning result. Bonding defects have different factors and action. Solution of bonding lightly is increasing pressure and modifying transmission accuracy. About conductive particle broken solution is taking Plasma cleaning to wipe off micro particle. About insufficient quantity of conductive particle in bonding area, the solution is re-designing a new kind of ACF with higher density of conductive particle and new structure to solv this issue. In the course of studying quality controlling tools are taken into pratice such as DOE and fishbone diagram to save time and cost. Generally the defect ratio descent from 0.34% to 0.14%.
In MA process the job of operator is assying and inspection. The key factor of line output is the workload unbalance. To raise the capacity we make workload balance to break the bottle neck of the line. To increase the inspection speed, we share the good experience of oprators and standardized the operation. Thus function inspection time descent by 35% and visual inspection time descent by 18.5%. According to the defect ratio change the order of test pattern and defect will be detected eralier which can save 100 seconds per piece. Optimizing the inspection pattern which make the variation of workload descent from 10.75 seconds to 2.75 seconds and basically achieving line balance. The capacity is raised with IE tools with which be put into action to the line balance improvement. The tools provide a standard way to solve problem duing process which be wildly used in manufacturing.
Resource management is helpful during mass production. The operator with training could be fit the position 2 months eralier and improv the yield. With ERP manufacturing management becomes more efficiency.
During mass producrion there are quite a few factors.The solution in this thesis can be benefit in cost down of manufacturing process and will advance the ability of developing and manufacturing.
分析了目前大规模生产及其良率的现状,找出生产中影响良率及产能的因素,确定了提高良率和改善线平衡的方案。
在实装段生产中,主要不良现象是压合异物和压痕不良。对于压合异物,分析原因是压合区的清洁效果不佳,采用新的清洁方式,利用无尘布对固体颗粒进行清洁,Plasma对有机物进行清洁;同时选择性价比高的无尘布及优化清洁时间降低成本,最终达到了改善清洁的效果。压痕不良,分析了不同现象的产生原因,针对压痕偏淡,通过改变压强及提高机构精度解决这个问题;针对Bump压塌,分析原因是压合异物造成,通过导入Plasma清洁改善;对于导电粒子捕捉不足,通过理论分析为ACF设计问题,提出增加导电粒子密度及变更ACF结构,从理论上彻底解决了导电粒子捕捉不足的问题。在以上研究过程中,采用了鱼骨图和DOE等品质管理分析方法,在分析问题过程中节省了时间及成本,并通过实际生产证明了改善效果的有效性。通过以上改善,压合不良率从0.34%降低为0.14%。
在组装段生产过程中,作业员主要工作是组装和检测,影响生产效率主要是人均工作量分配不均造成的人员等待,通过改善线平衡来打破瓶颈提高产能。提高人员检验速度,采用分享检验人员优秀工作经验,推广形成作业人员标准动作,改善后人均功能检测时间缩短35%,外观检测站缩短18.5%;改善检验方式,根据产线不良调整检测画面顺序,提前发现不良现象,每片可节省100秒的时间;优化重组检验项目,平均分配各作业员的工作量,调整后的工作时间差异缩短为2.75秒,基本上达到了线平衡。以上改善,借助于工业工程方法,根据生产实际情况进行调整,达到了改善线平衡和提升产能的目的。
本文还分析了资源管理对生产的辅助作用。作业人员培训后缩短上岗时间两个月,对于良率及效率的提升有重要的作用,借助于ERP系统提高生产管理效率,有效组织企业资源提高产量。
生产过程中影响良率和效率的因素较多,本论文所研究良率和效率的改善方法,对于企业降低成本具有较好的借鉴意义,对于进一步解决生产中工艺改良、工作量分配等复杂问题提供了指导思路和参考价值。
TFT-LCD display is a new photoelectric industrial with advanced technology. In short time it will replace CRT display thoroughly. Now it is facing two problems of low yield and low efficiency during mass production. In the thesis it focuses on improving bonding conditions and line balance to achieve the goals and with lower cost to enhance the competitive power in the market.
In this thesis, it introduces present status of TFT-LCD mass production. We set up a plan that optimazes bonding conditions and get better line balance during manufacturing process to get higher yield and better efficiency.
In JI process there are two defect phenomena of bonding particle and bonding defect. The reason of bonding particle is the bad cleaning result in bonding area. We will introduce a new way with cleaning cloth wiping off solide particle and Plasma cleaning the liquid organic. We select higher performance-price ratio cleaning cloth and optimize cleaning time to saving the running cost and achieve the cleaning result. Bonding defects have different factors and action. Solution of bonding lightly is increasing pressure and modifying transmission accuracy. About conductive particle broken solution is taking Plasma cleaning to wipe off micro particle. About insufficient quantity of conductive particle in bonding area, the solution is re-designing a new kind of ACF with higher density of conductive particle and new structure to solv this issue. In the course of studying quality controlling tools are taken into pratice such as DOE and fishbone diagram to save time and cost. Generally the defect ratio descent from 0.34% to 0.14%.
In MA process the job of operator is assying and inspection. The key factor of line output is the workload unbalance. To raise the capacity we make workload balance to break the bottle neck of the line. To increase the inspection speed, we share the good experience of oprators and standardized the operation. Thus function inspection time descent by 35% and visual inspection time descent by 18.5%. According to the defect ratio change the order of test pattern and defect will be detected eralier which can save 100 seconds per piece. Optimizing the inspection pattern which make the variation of workload descent from 10.75 seconds to 2.75 seconds and basically achieving line balance. The capacity is raised with IE tools with which be put into action to the line balance improvement. The tools provide a standard way to solve problem duing process which be wildly used in manufacturing.
Resource management is helpful during mass production. The operator with training could be fit the position 2 months eralier and improv the yield. With ERP manufacturing management becomes more efficiency.
During mass producrion there are quite a few factors.The solution in this thesis can be benefit in cost down of manufacturing process and will advance the ability of developing and manufacturing.
引文
[1] 谷至华. 薄膜晶体管阵列制造技术. 上海:复旦大学出版社,2007.45-48
[2] 工研院产业经济与资讯服务中心. 从长鞭效应探讨 TFTLCD 面板厂之供应链策略.台湾:工研院产业经济与咨询服务中心.2007. 15-20
[3] 上海科学技术情报研究所.光电显示器发展现状与趋势[J].上海:上海图书馆,2006.10(3)
[4] 赵中兴.显示原理与技术. 台湾: 全华科技图书股份有限公司.2002
[5] 蓝益政.TFT-LCD 制程原理.台湾:工研院产业经济与咨询服务中心 2007
[6] 高鸿锦. 液晶显示材料产业现状及其展望[J]. 现代显示,2007,15(3)
[7] 谷 千束.先进显示器技术. 北京: 科学出版社,2002.40-42
[8] 美国国家标准协会.ANSI-209D.美国联邦标准洁净室规格.美国国家标准协会.1988
[9] Toray Engineering Co.,Ltd. Elecronics Division. COG Bonder line-Type (Model No. CL2000) Instrument’s Manual rev.0. Japan. 2002.
[10] 李佳阳,FPC 制程及材料介绍.台湾.公司内部资料.2003
[11] Y.Gotoh Display Material Div. Goshomiya Works. Hitachi Chemical Co.,Ltd. Dilivery Specification for Hitachi Anisotropic Conductive Film AnisolmAC-8623Z-23. 2002.
[12] 李广福,刘玉岭,李薇薇.LCD 残留液晶的清洗[J]。清洗世界,2006(22):24-28
[13] 李新贝.COG 制程中的紫外清洗工艺研究[J]。现代显示,2007(5):20-23
[14]谭满清,茅冬生.InP 衬底表面的 H2/N2 等离子清洁技术,半导体学报.1999.20(10)
[15] 土肥 俊郎 ,半导体平坦化 CMP 技术.台湾.全华科技有限公司.2000
[16] Gopal K. Kanji&Mike Asher.全面品质管理 100 种方法.广州:广东经济出版社.2003
[17] 詹昭雄,QC 七大手法与 New QC 七大手法.台湾:世曜国际品质专业顾问公司.2002
[18] 刘 萍.ACF 在 LCD 中的应用与发展[J]。电子工艺技术,2002(6)
[19] 王仁宫. 实验设计与分析.北京:中国统计出版社.1998
[20] 何舢,陈建华.流水线生产作业管理精要.北京:中国经济出版社,2006
[21] 陈坤. 生产管理 80 计.台湾:中卫发展中心.2004. 30-32
[22] Jeffrey K. Liker. The Toyota Way. America:McGraw-Hil: 2004(11)
[23] (英)泰勒,布拉特.生产运营与供应链管理--精益方法.北京:清华大学出版社.2004(03)
[24] (日)五十岚,杨平吉(译).多种少量生产之新管理模式.东京:日刊工业新闻社.2004(02)
[25] 王恩亮.工业工程手册. 北京:机械工程手册. 2006(01)108
[26] 丁邦敏. 5S 管理体系与 ISO 标准管理体系.北京:中国计量出版社.2003
[27] 周可.目视管理 72 变.台湾:中卫发展中心.2000(10)
[28] 高辛阳.短暂停机零的挑战.台湾:中卫发展中心.1998(03)
[29] 刘季旋.生产绩效管理. 台北:中卫发展中心.1999
[30] 田俊国. ERP 项目实施全攻掠. 北京:北大出版社. 2002(04)
[31] 戴维·L·奥尔森. ERP 系统的管理问题.北京:东方出版社.2006
[32] 陈青.工厂物流管理实务. 台北:中卫发展中心.2002
[33] 大野耐一.丰田生产方式. 北京:中国铁道出版社.2006
[2] 工研院产业经济与资讯服务中心. 从长鞭效应探讨 TFTLCD 面板厂之供应链策略.台湾:工研院产业经济与咨询服务中心.2007. 15-20
[3] 上海科学技术情报研究所.光电显示器发展现状与趋势[J].上海:上海图书馆,2006.10(3)
[4] 赵中兴.显示原理与技术. 台湾: 全华科技图书股份有限公司.2002
[5] 蓝益政.TFT-LCD 制程原理.台湾:工研院产业经济与咨询服务中心 2007
[6] 高鸿锦. 液晶显示材料产业现状及其展望[J]. 现代显示,2007,15(3)
[7] 谷 千束.先进显示器技术. 北京: 科学出版社,2002.40-42
[8] 美国国家标准协会.ANSI-209D.美国联邦标准洁净室规格.美国国家标准协会.1988
[9] Toray Engineering Co.,Ltd. Elecronics Division. COG Bonder line-Type (Model No. CL2000) Instrument’s Manual rev.0. Japan. 2002.
[10] 李佳阳,FPC 制程及材料介绍.台湾.公司内部资料.2003
[11] Y.Gotoh Display Material Div. Goshomiya Works. Hitachi Chemical Co.,Ltd. Dilivery Specification for Hitachi Anisotropic Conductive Film AnisolmAC-8623Z-23. 2002.
[12] 李广福,刘玉岭,李薇薇.LCD 残留液晶的清洗[J]。清洗世界,2006(22):24-28
[13] 李新贝.COG 制程中的紫外清洗工艺研究[J]。现代显示,2007(5):20-23
[14]谭满清,茅冬生.InP 衬底表面的 H2/N2 等离子清洁技术,半导体学报.1999.20(10)
[15] 土肥 俊郎 ,半导体平坦化 CMP 技术.台湾.全华科技有限公司.2000
[16] Gopal K. Kanji&Mike Asher.全面品质管理 100 种方法.广州:广东经济出版社.2003
[17] 詹昭雄,QC 七大手法与 New QC 七大手法.台湾:世曜国际品质专业顾问公司.2002
[18] 刘 萍.ACF 在 LCD 中的应用与发展[J]。电子工艺技术,2002(6)
[19] 王仁宫. 实验设计与分析.北京:中国统计出版社.1998
[20] 何舢,陈建华.流水线生产作业管理精要.北京:中国经济出版社,2006
[21] 陈坤. 生产管理 80 计.台湾:中卫发展中心.2004. 30-32
[22] Jeffrey K. Liker. The Toyota Way. America:McGraw-Hil: 2004(11)
[23] (英)泰勒,布拉特.生产运营与供应链管理--精益方法.北京:清华大学出版社.2004(03)
[24] (日)五十岚,杨平吉(译).多种少量生产之新管理模式.东京:日刊工业新闻社.2004(02)
[25] 王恩亮.工业工程手册. 北京:机械工程手册. 2006(01)108
[26] 丁邦敏. 5S 管理体系与 ISO 标准管理体系.北京:中国计量出版社.2003
[27] 周可.目视管理 72 变.台湾:中卫发展中心.2000(10)
[28] 高辛阳.短暂停机零的挑战.台湾:中卫发展中心.1998(03)
[29] 刘季旋.生产绩效管理. 台北:中卫发展中心.1999
[30] 田俊国. ERP 项目实施全攻掠. 北京:北大出版社. 2002(04)
[31] 戴维·L·奥尔森. ERP 系统的管理问题.北京:东方出版社.2006
[32] 陈青.工厂物流管理实务. 台北:中卫发展中心.2002
[33] 大野耐一.丰田生产方式. 北京:中国铁道出版社.2006