板级与封装级电路系统电磁完整性研究
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摘要
随着板级与封装级电子系统向低电压、高功耗、高密度以及高速度的发展趋势，信号完整性、电源完整性和电磁兼容性已成为高速电路设计与系统级封装中的研究热点。一方面，电源需给状态切换时的芯片提供大量瞬时电流，会在供电网络上产生相应的电压波动，电压波动在电源分配网络上传播形成噪声或电磁干扰信号。另一方面，电磁干扰将通过电源分配网络耦合到相关的信号线上，从而引起眼图闭合、信号畸变等信号完整性问题。因此，高速电路中的信号完整性、电源完整性及其相互作用问题已经成为目前板级设计和封装级设计中热点与瓶颈。随着系统速率的提高，信号完整性与电源完整性之间的互相影响和制约关系表现得更加突出，有必要对其综合研究，在实际应用中协同考虑以提高系统性能。本文在国内外现有研究成果的基础上，系统地分析了板级与封装级电路中电磁完整性问题，研究了信号完整性与电源完整性的相互作用机理、信号完整性及电源完整性的分析方法、返回路径不连续对信号完整性的影响、通过改变电源分布网络实现滤波及转换结构的方法以及基于硅通孔的三维封装中信号完整性与电磁干扰问题等，取得了一定的研究成果。相关成果归纳如下：
1.对应用于高速电路中的平面电磁带隙结构进行了研究。提出了一种新的可抑制超宽带同步切换噪声的电磁带隙结构，讨论了电磁带隙结构上方有电源或地平面覆盖时电源分布网络中噪声传播问题。针对相应问题，给出了具体的工程解决方案。
2.深入研究了返回路径不连续对信号完整性的影响。对过孔和返回平面上开槽等两种不连续结构所引起的信号完整性问题进行了分析。使用微波网络分析方法结合实际三维结构，提出了基于模式分解的高速互连电路中串扰机制的快速求解方法。使用跨接于开槽两端的短路线来旁路槽线模式电磁场，从而改善传输特性，抑制串扰。针对具体的工程应用，研究了开槽下方有完整平面时，信号传输特性和串扰受电源分布网络谐振效应的影响情况及解决方案。
3.通过改变信号返回路径的形状和特性，实现不同的滤波与转换结构。提出了一种适用于超宽带通信的基于过孔的微带垂直转换结构。通过在过孔附近的电源层上蚀刻平面电磁带隙单元来抑制电源分配网络谐振，降低其在过孔处的自阻抗，以改善垂直互连结构传输性能。将蘑菇型电磁带隙结构引入到差分电路中，用以滤除共模干扰，该方法具有占用面积小、带内抑制大、设计简单等优点。
4.分析了基于硅通孔的三维集成电路中的相关问题。主要分析了硅通孔的电特性和RLGC参数提取方案，讨论了MOS效应对硅通孔寄生电容的影响。在基本硅通孔的电特性研究基础上分析了三维集成电路中的串扰问题，讨论了硅通孔结构和放置方法对串扰的影响，得出了一些可直接用于三维集成电路设计的方法和结论。
The trend in the electronic system to the high speed, high power, high density, lowvoltage and high current, high-speed interconnect effects such as signal integrity, powerintegrity, and electromagnetic compatibility become the dominant factor limiting overallperformance of high speed circuits and system on package. On the one hand, at the timeof the switching state the chip needs to draw a large number of transient current, whichresulting in fluctuations in the power supply, and the rail voltage fluctuations in thepower distribution network could form a distributed power supply noise. Meanwhile,power supply noise could be coupled through the power distribution network to thesignal line, causing signal distortion, eye closure and other signal integrity issues.Electromagnetic integrity has become one of the major issues in printed circuit boardand integrated circuit design. As the increasing of the data rate of the system, the restrictrelationship between signal integrity and power integrity has become more prominent.To improve the system performance in high-speed circuit, it is necessary to analysis thesignal integrity and power integrity simultaneously. Base on existing research results, asystematic analysis of the circuit board level and package level electromagneticintegrity were conducted in this dissertation. The interaction mechanism of signalintegrity and power integrity, the analysis method of signal integrity and power integrity,the effects of return path disconnect on signal integrity, the method of achieve usefulcircuits based on changing power distribution network and the issues of signal integrityand electromagnetic interference in three dimension integrated circuits based on throughsilicon vias are studied carefully. The main research achievements are as follows:
1. The planar Electromagnetic Band-Gap structure used in high-speed circuits isanalyzed in this dissertation. A novel planar Electromagnetic Band-Gap structure withultra wideband simultaneous switch noise suppression is proposed. The design,simulation, analysis and application of embedded planar compact electromagneticband-gap structure for high-speed digital circuit or mixed circuit application areconducted. Some practical design tips are deduced in the paper.
2. The effects of return current path disconnect on signal integrity are discussedcarefully. The effects of two main return paths disconnect structure, such as slots onpower plane and vias, are described. Based on microwave network methods combinedthe actual three-dimensional structure, a fast method for solving the crosstalk inhigh-speed circuits is proposed. The shorting lines which cross the slot in return path plane is used to bypass slot line mode in order to improve transfer performance andsuppress crosstalk. With comparison to traditional decouple capacitor method, themethod proposed in this dissertation has benefits of wide bandwidth, easy layout andlow cost. For practical engineering applications, a complete study of the slot in powerplane with a ground plane under it is done. The signal transmission characteristics andcrosstalk affected by the power ground plane pair resonance is given in the paper.
3. The different useful circuits are accomplished through changing the structure ofcurrent return path. A new microstrip vertical transition based on via in multilayeredprinted circuit board is proposed for ultra wide-band (UWB) application. The planarelectromagnetic band-gap unit is etched on power plane around the vias to suppressresonance and reduce self-impedance of the power distribution network (PDN), andthen transmission performance is improved. By comparison with the method of addingshorting vias between PDN, the structure proposed in this dissertation benefits of lowcost, deeply noise suppression and small factor with considerable performance. Themushroom liked Electromagnetic Band-Gap is introduced in the differential circuits tosuppression the common-mode noise.
4. The related problem in three-dimension integrated circuits based on throughsilicon via are discussed in the paper. The electrical property and the methods of extractthe RLGC parameters of the TSV are studied carefully. The crosstalk of the TSVs areanalyzed based the electrical property. Some factors affected the performance, such asthe TSV structure and the placement methods, are simulated with3-D full wavesimulator, and some useful design tips in the3-D integrated designs are introduced inthe paper.
1.对应用于高速电路中的平面电磁带隙结构进行了研究。提出了一种新的可抑制超宽带同步切换噪声的电磁带隙结构，讨论了电磁带隙结构上方有电源或地平面覆盖时电源分布网络中噪声传播问题。针对相应问题，给出了具体的工程解决方案。
2.深入研究了返回路径不连续对信号完整性的影响。对过孔和返回平面上开槽等两种不连续结构所引起的信号完整性问题进行了分析。使用微波网络分析方法结合实际三维结构，提出了基于模式分解的高速互连电路中串扰机制的快速求解方法。使用跨接于开槽两端的短路线来旁路槽线模式电磁场，从而改善传输特性，抑制串扰。针对具体的工程应用，研究了开槽下方有完整平面时，信号传输特性和串扰受电源分布网络谐振效应的影响情况及解决方案。
3.通过改变信号返回路径的形状和特性，实现不同的滤波与转换结构。提出了一种适用于超宽带通信的基于过孔的微带垂直转换结构。通过在过孔附近的电源层上蚀刻平面电磁带隙单元来抑制电源分配网络谐振，降低其在过孔处的自阻抗，以改善垂直互连结构传输性能。将蘑菇型电磁带隙结构引入到差分电路中，用以滤除共模干扰，该方法具有占用面积小、带内抑制大、设计简单等优点。
4.分析了基于硅通孔的三维集成电路中的相关问题。主要分析了硅通孔的电特性和RLGC参数提取方案，讨论了MOS效应对硅通孔寄生电容的影响。在基本硅通孔的电特性研究基础上分析了三维集成电路中的串扰问题，讨论了硅通孔结构和放置方法对串扰的影响，得出了一些可直接用于三维集成电路设计的方法和结论。
The trend in the electronic system to the high speed, high power, high density, lowvoltage and high current, high-speed interconnect effects such as signal integrity, powerintegrity, and electromagnetic compatibility become the dominant factor limiting overallperformance of high speed circuits and system on package. On the one hand, at the timeof the switching state the chip needs to draw a large number of transient current, whichresulting in fluctuations in the power supply, and the rail voltage fluctuations in thepower distribution network could form a distributed power supply noise. Meanwhile,power supply noise could be coupled through the power distribution network to thesignal line, causing signal distortion, eye closure and other signal integrity issues.Electromagnetic integrity has become one of the major issues in printed circuit boardand integrated circuit design. As the increasing of the data rate of the system, the restrictrelationship between signal integrity and power integrity has become more prominent.To improve the system performance in high-speed circuit, it is necessary to analysis thesignal integrity and power integrity simultaneously. Base on existing research results, asystematic analysis of the circuit board level and package level electromagneticintegrity were conducted in this dissertation. The interaction mechanism of signalintegrity and power integrity, the analysis method of signal integrity and power integrity,the effects of return path disconnect on signal integrity, the method of achieve usefulcircuits based on changing power distribution network and the issues of signal integrityand electromagnetic interference in three dimension integrated circuits based on throughsilicon vias are studied carefully. The main research achievements are as follows:
1. The planar Electromagnetic Band-Gap structure used in high-speed circuits isanalyzed in this dissertation. A novel planar Electromagnetic Band-Gap structure withultra wideband simultaneous switch noise suppression is proposed. The design,simulation, analysis and application of embedded planar compact electromagneticband-gap structure for high-speed digital circuit or mixed circuit application areconducted. Some practical design tips are deduced in the paper.
2. The effects of return current path disconnect on signal integrity are discussedcarefully. The effects of two main return paths disconnect structure, such as slots onpower plane and vias, are described. Based on microwave network methods combinedthe actual three-dimensional structure, a fast method for solving the crosstalk inhigh-speed circuits is proposed. The shorting lines which cross the slot in return path plane is used to bypass slot line mode in order to improve transfer performance andsuppress crosstalk. With comparison to traditional decouple capacitor method, themethod proposed in this dissertation has benefits of wide bandwidth, easy layout andlow cost. For practical engineering applications, a complete study of the slot in powerplane with a ground plane under it is done. The signal transmission characteristics andcrosstalk affected by the power ground plane pair resonance is given in the paper.
3. The different useful circuits are accomplished through changing the structure ofcurrent return path. A new microstrip vertical transition based on via in multilayeredprinted circuit board is proposed for ultra wide-band (UWB) application. The planarelectromagnetic band-gap unit is etched on power plane around the vias to suppressresonance and reduce self-impedance of the power distribution network (PDN), andthen transmission performance is improved. By comparison with the method of addingshorting vias between PDN, the structure proposed in this dissertation benefits of lowcost, deeply noise suppression and small factor with considerable performance. Themushroom liked Electromagnetic Band-Gap is introduced in the differential circuits tosuppression the common-mode noise.
4. The related problem in three-dimension integrated circuits based on throughsilicon via are discussed in the paper. The electrical property and the methods of extractthe RLGC parameters of the TSV are studied carefully. The crosstalk of the TSVs areanalyzed based the electrical property. Some factors affected the performance, such asthe TSV structure and the placement methods, are simulated with3-D full wavesimulator, and some useful design tips in the3-D integrated designs are introduced inthe paper.
引文
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