立方氮化硼仿生耐磨复合材料的制备及其研究
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摘要
生物体表具有不同尺度的自组装多级结构,并且大部分属于有机／无机复合材料,有机材料具有极好的塑性和韧性,无机材料具有较高的硬度,有机材料与无机材料耦合构建的复合材料具有高的硬度和良好的耐磨性。基于国家自然科学基金重点项目“机械仿生耦合设计原理与关键技术”提出的仿生耦合设计理论,生物体通过不同的形态、结构、材料和构成等彼此之间的耦合作用而达到生物功能最优化、对环境适应最佳化和能量消耗最低化。本文综合成分、材料和结构等多因素的作用,开展了钎焊技术和SPS技术制备c-BN仿生耐磨复合材料的研究。
c-BN超硬材料为无机非金属粉末晶体在一定条件下形成的多晶聚集体,其电子配位非常稳定,钎焊法制备c-BN仿生耐磨复合材料的关键是液态钎料必须能够润湿c-BN颗粒表面。试验结果表明,Ag基活性钎料对c-BN颗粒具有良好的润湿性。系统研究了钎料成分与钎焊工艺参数(钎焊温度,保温时间,钎焊真空度等)对c-BN颗粒钎焊性能的影响规律。采用熔炼钎料和粉末钎料钎焊制备c-BN仿生耐磨复合材料,试验发现,活性钎料熔炼后,熔炼钎料中Ti元素的活性要低于粉状钎料中Ti元素的活性。同一成分的活性钎料熔炼后,钎料对c-BN的焊接性降低。AgCuTi8Sn2粉状钎料在钎焊温度为950℃,保温时间为20min的条件下,可实现Ag基活性钎料、c-BN颗粒与基体金属三者间的可靠连接,制备的c-BN仿生耐磨复合材料试件成型性好、表面平整、颗粒分布均匀。c-BN仿生耐磨复合材料试件固定在划痕试验机施加100N的载荷,无c-BN颗粒脱落现象。通过热力学理论计算并结合试验结果,揭示了Ag及活性钎料与c-BN界面间反应作用机制和对c-BN润湿性的变化规律。
基于对Ag基活性钎料钎焊制备c-BN仿生耐磨复合材料的研究基础和存在的问题,试验采用Cu基高温活性钎料钎焊制备c-BN超硬复合材料。Cu基钎料的价格低,强度高,高温性能好,以Cu及Cu-Ni为基的合金系中,在c-BN聚晶片表面上的润湿角85°一120°,属于不完全润湿。Cu基高温活性钎料钎焊制备的c-BN超硬复合材料试件表面呈现暗褐色,复合材料整体结构较疏散。划痕试验结果,制备的c-BN仿生耐磨复合材料结合强度较低,颗粒易脱落。Cu基钎料中添加Ti元素对c-BN颗粒的润湿性得到一定的提高；添加Sn利于改善c-BN仿生耐磨复合材料的表面成型质量。采用混料试验方法优化Cu基活性钎料成分,建立合金元素含量与钎料性能的回归方程,并用此模型进行优化。Cu基活性钎料钎焊c-BN聚晶片与45钢异质材料接头抗剪强度达到210Mpa—220Mpa,在c-BN聚晶片表面润湿角达到25°—35°。
研究揭示了Cu基活性钎料的润湿c-BN颗粒机制及其与c-BN颗粒的界面微观结构。Cu基活性钎料润湿c-BN为化学润湿,在钎料与c-BN界面处发生化学反应。扫描电镜和能谱分析结果表明,Cu基活性钎料与c-BN颗粒之间相互作用显著,界面处有一连续的反应薄层,活性元素Ti发生了明显的富集,浓度达到了18.70%,高于Cu基活性钎料中Ti元素的含量。界面反应产物为Ti-N和Ti-B化合物。正是由于钎料与c-BN颗粒界面反应化合物的形成,从而促进了Cu活性钎料对c-BN超硬材料的润湿与结合。
系统研究了钎料和c-BN颗粒体积百分比含量对c-BN仿生耐磨复合材料内部结合强度和耐磨性的影响规律。提高c-BN仿生耐磨复合材料中c-BN颗粒的体积百分比含量有助于提高材料的耐磨性,与此同时影响c-BN仿生耐磨复合材料中钎料与c-BN颗粒的结合强度,最终结果影响耐磨性。研究揭示,c-BN仿生耐磨复合材料中的钎料和c-BN颗粒增强硬质相在力学性能上相差较大,当c-BN仿生耐磨复合材料受到外界作用力(拉力、冲击力、摩擦力等)作用时,不能均衡承载,c-BN仿生耐磨复合材料的内部结合强度低于钎料自身的强度与钎料和钢基体的结合强度,导致c-BN颗粒增强硬质相脱落,使c-BN仿生耐磨复合材料失去其预定效能。钎料与c-BN颗粒体积百分比含量对c-BN仿生耐磨复合材料的结合强度和耐磨性试验和建立的力学模型分析结果表明,c-BN颗粒含量在40%—50%时,c-BN仿生耐磨复合材料的内部结合强度与耐磨性最好,在同等试验条件下的耐磨性是45钢淬火标样的12.34倍,结合强度达到182Mpa-187Mpa。
基体材料耐磨性差导致c-BN颗粒的脱落是c-BN仿生耐磨复合材料失效的主要原因之一。钎焊法制备的c-BN仿生耐磨复合材料,Cu基活性钎料凝固后的组织为铸态组织,组织较疏松,耐磨性较差,在磨损过程中先期被磨损掉,高硬度的c-BN颗粒则相对突起形成非光滑表面,抵抗磨粒的磨损,在外部作用力较大的情况下将导致c-BN颗粒的脱落,降低c-BN仿生耐磨复合材料的耐磨性。基于放电等离子烧结技术特点,试验开展放电等离子烧结技术制备c-BN仿生耐磨复合材料。
研究工艺参数对SPS技术制备c-BN仿生耐磨复合材料性能的影响规律。烧结工艺参数(温度、压力、时间)、材料(c-BN颗粒大小、c-BN颗粒体积百分比含量与基体合金力学性能)与外界工况条件等多种因素对其性能都有影响。研究结果表明,烧结工艺参数是可控因素,直接影响c-BN仿生耐磨复合材料内在质量。试验采用正交多项式回归设计方法,建立起了各参数与c-BN仿生耐磨复合材料性能之间的回归方程,研究各因素对性能影响的权重,并用此模型进行优化,确定SPS技术制备c-BN仿生耐磨复合材料的最优工艺参数,轴向压力28Mpa—33Mpa、烧结温度780℃—800℃、保温时间4.6mmin—5min。
SPS技术制备c-BN仿生耐磨复合材料,合金中活性元素Ti也能与c-BN之间有化学反应发生,通过反应在c-BN表面分解形成新相。更重要的一点是SPS技术制备的c-BN仿生耐磨复合材料,基体合金凝固后的组织得到改善,颗粒均匀地分布在基体合金上；制备温度较低,降低内部的残余应力,避免c-BN颗粒的破碎,提高c-BN颗粒与基体合金的结合强度,耐磨性要优于钎焊法制备c-BN仿生耐磨复合材料的耐磨性,其耐磨性为同等条件下淬火45钢的14.73倍。SPS技术制备的c-BN仿生耐磨复合材料在摩擦热作用下,对偶件与c-BN仿生耐磨复合材料有很强的粘结作用,c-BN仿生耐磨复合材料的磨损主要形式为粘着磨损,并伴有磨粒磨损和疲劳磨损。
试验初步探讨了通过SPS技术实现c-BN颗粒、Cu基活性合金及其与45钢之间的一体化烧结,实现粉体与钢基体同步焊接研究,为研发仿生耐磨复合材料和其它难焊材料提供新的方法。
Biology body surfaces have different sized and self-assembled multilevel structure and the great mass of them belong to organic or inorganic composite materials. The organic materials have wonderful plastic and toughness properties and the inorganic materials have higher hardness. The composite materials constituted by coupling of organic and inorganic materials have high hardness and good anti-wear properties. Basing on the design theory of mechanic bionic coupling and key technology coming from the keystone item of national nature science foundation in china, the design theory of bionic coupling is bought forward. Biology body obtains the optimization of biology function and the maximization of adopting circumstance and minimization of energy consumed, which are acquired by the mutual coupling action of different morphologies and structures and materials and composing et al. In this paper, the mutual action of multi factor (components, materials, structures) is synthesized and the studies of c-BN bionic anti-wear composite materials fabricated by SPS and brazing technology were developed.
C-BN super-hardness materials are polycrystalline conglomeration body fabricated using inorganic nonmetal powders under a condition and the electronic Coordination are highly stable. The key of c-BN bionic anti-wear composite materials fabricated is that liquid state solders can wet the surface of c-BN powders. Test results indicate that the wettability of Ag-based activation solders vs c-BN powders is well. The rules of effect solder compositions and brazing technological parameters (brazing temperature, holding time of brazing time and brazing vacuum degree et al) on c-BN powders performance were studied. C-BN bionic anti-wear composite materials were fabricated using brazing of smelting solders and powder solders. The tests show that the activation of Ti element in smelting solders is lower than that in powder solders after activation solders smelted. After activation solders with identical composition were smelted, the welding property of solders vs c-BN was decreased. The dependable joining among Ag-based activation solders and c-BN powders and substrate metal can be obtained using AgCuTi8Sn2 powder solders under the condition of brazing temperature 950℃and holding time 20min. The molding property of samples fabricated is well and the surface is smooth and the distribution of grains is uniform. The samples of c-BN bionic anti-wear composite materials were fixed on scratch testing machine, the phenomenon of c-BN powders fell off was not be found under 100N load. It is found that the interface reaction action mechanism among Ag and activation solders and c-BN and the changed rules of these vs c-BN wettablity.
Basing on the research foundation of Ag-based activation solders brazing used to fabricate c-BN bionic anti-wear composite materials and the existent guestion, the tests were adopted to fabricate c-BN super-hardness composite materials. The price of cu-basic solders is low and the strength is high and the high-temperature is well. The wettablity angle is 85°-120°on the surface of c-BN polycrystalline plates in Cu and Cu-Ni-based alloy system, which belong to incomplete wetting. The sample surfaces take on dust-colour and the total structure of composite materials is scattered. The results of scratch testing show that the strength of c-BN bionic anti-wear composite materials fabricated is lower and the grains are easily fell off. The wettability of C-BN grains was increased by addition Ti element in Cu-based solders and the surface molding mass of those was improved by addition Sn. the regression equation between the content of alloy elements and solders peoperties was establish by the mixing tested method to optimize the the composition of Cu-based activation solders. the joining shearing strengths between Cu-based solders brazing c-BN polycrystallinte plates and 45 steel heterogeneity material arrive 210Mpa-220Mpa. The surface wetting angles arrive 25°-35°on c-BN polycrystallinte plates.
Researches found the wetting mechanism of Cu-based activation solders vs c-BN grains and the interfacial micro-structures between Cu-based activation solders and c-BN grains were observed. The wetting of Cu-based activation solders vs c-BN belongs to chemical wetting and the chemical reactions happy at the interface of solders and c-BN. The results of SEM and EDS analyzed show that the mutual action is remarkable between Cu-based activation solders and c-BN grains, and there is a continuous reaction thin layer in interface, and the activation Ti element happens enrichment, and the concentration is arrived 18.70% and is higher than the content in Cu-based activation solders. The interfacial reaction produces are compound. The wetting and coalescent of Cu-based activation solders vs c-BN super-hardness materials were promoted owing to the formation of interfacial reaction compound between the grains and c-BN grains.
It is investigated that the interior joint strength and the effect rule of anti-wear property of the solders and the percentage content of c-BN grains volume vs the c-BN bionic anti-wear composite materials. Increasing of percentage content of c-BN grains volume helps to increase materials anti-wear property and effect joint strength between c-BN bionic anti-wear composite materials and solders at the same time, the anti-wear property was affected at last. The investigations show that mechanics property discrepancy between solders in c-BN bionic anti-wear composite materials and c-BN grains reinforced rigid hardness phase is larger. The outside forces (pull, wallop and friction et al) can't be uniformly loaded by c-BN bionic anti-wear composite materials because the inside joint strengths in these are lower than solders strength itself and joint strength between solders and steel substrate, owing to c-BN grains reinforced rigid hardness phase fell off, and the destining efficiency of c-BN bionic anti-wear composite materials was lost. The analytic results from tests and mechanics model established show that the inside joint strength and anti-wear property in c-BN bionic anti-wear composite materials are the highest when the content of c-BN grains is from 40% to 50%. At the same testing condition, the ant-wear property of as-fabricated materials is 12.34 times of normal 45 steel quenched, the joint strengths arrive 182Mpa-187Mpa.
One of the key reasons, which result in invalidation of c-BN bionic anti-wear composite materials, is c-BN groins taking off due to the less anti-wear property of based material. The structure of c-BN bionic anti-wear composite materials fabricated using brazing method is the structure of cast shape owing to the structure loosing and anti-wear property less. These materials were worn out during wearing process firstly and the comparatively protuberant high hardness c-BN grains were formed into the non-smooth surfaces to resist wearing out of abrading grains. The anti-wear property of as-fabricated materials was decreased and c-BN grains were fell off under the instance of bigger outside force. Basing on the technological characteristic of SPS, SPS technology was used to fabricate c-BN bionic anti-wear composite materials.
It was researched that the influencing rule of technologic parameters vs properties of c-BN bionic anti-wear composite materials fabricated using SPS technology. The multi-factors, which include sinter technological parameters (temperature, stress, time) and materials (sizes of c-BN grains, the volume percentage content c-BN, mechanics properties of substrate alloy) and the condition of outside circumstance, have effect on properties. The research results show that sinter technological parameters is a controllable factor and effect internality mass of c-BN bionic anti-wear composite materials. Tests adopted the method of orthogonal polynomial repression design to establish regression equation of kinds of parameters and properties of c-BN bionic anti-wear composite materials. Weight between kinds of factors and properties effect was studied to optimize the model. It were ensure that technological parameters optimized of c-BN bionic anti-wear composite materials fabricated using SPS technology, axial stresses are 28Mpa-33Mpa and sintered temperatures are 780℃-800℃and holding times are 4.6min-5min.
SPS technology was used to fabricate c-BN bionic anti-wear composite materials. The chemical reaction can be happened between activation element Ti in alloy and c-BN. New phases can be formed by reaction decomposing on c-BN surfaces. The key was that structure of as-fabricated materials was improved owing to grains distributed uniformly on substrate alloy and fabrication temperature lower and inside remains stress decreased and c-BN grains fragmentation avoided and joint strength increased between c-BN grains and substrate alloy. Anti-wear property of as-fabricated materials is higher than those materials fabricated using brazing method, which is 14.73 times of 45 steel quenched. As-fabricated materials have strongly adhesion effect on parts contacted under the friction heat effect and the key abrasion shape belongs to adherence abrasion with abrasive grain abrasion and fatigue abrasion.
It was discussed by tests using SPS technology that integrative sintering realized among c-BN grains and Cu-based activation alloy and 45 steel. The simultaneity welding was realized between powders and steel substrate. New method was obtained to research bionic anti-wear composite materials and the other hard welding materials.
c-BN超硬材料为无机非金属粉末晶体在一定条件下形成的多晶聚集体,其电子配位非常稳定,钎焊法制备c-BN仿生耐磨复合材料的关键是液态钎料必须能够润湿c-BN颗粒表面。试验结果表明,Ag基活性钎料对c-BN颗粒具有良好的润湿性。系统研究了钎料成分与钎焊工艺参数(钎焊温度,保温时间,钎焊真空度等)对c-BN颗粒钎焊性能的影响规律。采用熔炼钎料和粉末钎料钎焊制备c-BN仿生耐磨复合材料,试验发现,活性钎料熔炼后,熔炼钎料中Ti元素的活性要低于粉状钎料中Ti元素的活性。同一成分的活性钎料熔炼后,钎料对c-BN的焊接性降低。AgCuTi8Sn2粉状钎料在钎焊温度为950℃,保温时间为20min的条件下,可实现Ag基活性钎料、c-BN颗粒与基体金属三者间的可靠连接,制备的c-BN仿生耐磨复合材料试件成型性好、表面平整、颗粒分布均匀。c-BN仿生耐磨复合材料试件固定在划痕试验机施加100N的载荷,无c-BN颗粒脱落现象。通过热力学理论计算并结合试验结果,揭示了Ag及活性钎料与c-BN界面间反应作用机制和对c-BN润湿性的变化规律。
基于对Ag基活性钎料钎焊制备c-BN仿生耐磨复合材料的研究基础和存在的问题,试验采用Cu基高温活性钎料钎焊制备c-BN超硬复合材料。Cu基钎料的价格低,强度高,高温性能好,以Cu及Cu-Ni为基的合金系中,在c-BN聚晶片表面上的润湿角85°一120°,属于不完全润湿。Cu基高温活性钎料钎焊制备的c-BN超硬复合材料试件表面呈现暗褐色,复合材料整体结构较疏散。划痕试验结果,制备的c-BN仿生耐磨复合材料结合强度较低,颗粒易脱落。Cu基钎料中添加Ti元素对c-BN颗粒的润湿性得到一定的提高；添加Sn利于改善c-BN仿生耐磨复合材料的表面成型质量。采用混料试验方法优化Cu基活性钎料成分,建立合金元素含量与钎料性能的回归方程,并用此模型进行优化。Cu基活性钎料钎焊c-BN聚晶片与45钢异质材料接头抗剪强度达到210Mpa—220Mpa,在c-BN聚晶片表面润湿角达到25°—35°。
研究揭示了Cu基活性钎料的润湿c-BN颗粒机制及其与c-BN颗粒的界面微观结构。Cu基活性钎料润湿c-BN为化学润湿,在钎料与c-BN界面处发生化学反应。扫描电镜和能谱分析结果表明,Cu基活性钎料与c-BN颗粒之间相互作用显著,界面处有一连续的反应薄层,活性元素Ti发生了明显的富集,浓度达到了18.70%,高于Cu基活性钎料中Ti元素的含量。界面反应产物为Ti-N和Ti-B化合物。正是由于钎料与c-BN颗粒界面反应化合物的形成,从而促进了Cu活性钎料对c-BN超硬材料的润湿与结合。
系统研究了钎料和c-BN颗粒体积百分比含量对c-BN仿生耐磨复合材料内部结合强度和耐磨性的影响规律。提高c-BN仿生耐磨复合材料中c-BN颗粒的体积百分比含量有助于提高材料的耐磨性,与此同时影响c-BN仿生耐磨复合材料中钎料与c-BN颗粒的结合强度,最终结果影响耐磨性。研究揭示,c-BN仿生耐磨复合材料中的钎料和c-BN颗粒增强硬质相在力学性能上相差较大,当c-BN仿生耐磨复合材料受到外界作用力(拉力、冲击力、摩擦力等)作用时,不能均衡承载,c-BN仿生耐磨复合材料的内部结合强度低于钎料自身的强度与钎料和钢基体的结合强度,导致c-BN颗粒增强硬质相脱落,使c-BN仿生耐磨复合材料失去其预定效能。钎料与c-BN颗粒体积百分比含量对c-BN仿生耐磨复合材料的结合强度和耐磨性试验和建立的力学模型分析结果表明,c-BN颗粒含量在40%—50%时,c-BN仿生耐磨复合材料的内部结合强度与耐磨性最好,在同等试验条件下的耐磨性是45钢淬火标样的12.34倍,结合强度达到182Mpa-187Mpa。
基体材料耐磨性差导致c-BN颗粒的脱落是c-BN仿生耐磨复合材料失效的主要原因之一。钎焊法制备的c-BN仿生耐磨复合材料,Cu基活性钎料凝固后的组织为铸态组织,组织较疏松,耐磨性较差,在磨损过程中先期被磨损掉,高硬度的c-BN颗粒则相对突起形成非光滑表面,抵抗磨粒的磨损,在外部作用力较大的情况下将导致c-BN颗粒的脱落,降低c-BN仿生耐磨复合材料的耐磨性。基于放电等离子烧结技术特点,试验开展放电等离子烧结技术制备c-BN仿生耐磨复合材料。
研究工艺参数对SPS技术制备c-BN仿生耐磨复合材料性能的影响规律。烧结工艺参数(温度、压力、时间)、材料(c-BN颗粒大小、c-BN颗粒体积百分比含量与基体合金力学性能)与外界工况条件等多种因素对其性能都有影响。研究结果表明,烧结工艺参数是可控因素,直接影响c-BN仿生耐磨复合材料内在质量。试验采用正交多项式回归设计方法,建立起了各参数与c-BN仿生耐磨复合材料性能之间的回归方程,研究各因素对性能影响的权重,并用此模型进行优化,确定SPS技术制备c-BN仿生耐磨复合材料的最优工艺参数,轴向压力28Mpa—33Mpa、烧结温度780℃—800℃、保温时间4.6mmin—5min。
SPS技术制备c-BN仿生耐磨复合材料,合金中活性元素Ti也能与c-BN之间有化学反应发生,通过反应在c-BN表面分解形成新相。更重要的一点是SPS技术制备的c-BN仿生耐磨复合材料,基体合金凝固后的组织得到改善,颗粒均匀地分布在基体合金上；制备温度较低,降低内部的残余应力,避免c-BN颗粒的破碎,提高c-BN颗粒与基体合金的结合强度,耐磨性要优于钎焊法制备c-BN仿生耐磨复合材料的耐磨性,其耐磨性为同等条件下淬火45钢的14.73倍。SPS技术制备的c-BN仿生耐磨复合材料在摩擦热作用下,对偶件与c-BN仿生耐磨复合材料有很强的粘结作用,c-BN仿生耐磨复合材料的磨损主要形式为粘着磨损,并伴有磨粒磨损和疲劳磨损。
试验初步探讨了通过SPS技术实现c-BN颗粒、Cu基活性合金及其与45钢之间的一体化烧结,实现粉体与钢基体同步焊接研究,为研发仿生耐磨复合材料和其它难焊材料提供新的方法。
Biology body surfaces have different sized and self-assembled multilevel structure and the great mass of them belong to organic or inorganic composite materials. The organic materials have wonderful plastic and toughness properties and the inorganic materials have higher hardness. The composite materials constituted by coupling of organic and inorganic materials have high hardness and good anti-wear properties. Basing on the design theory of mechanic bionic coupling and key technology coming from the keystone item of national nature science foundation in china, the design theory of bionic coupling is bought forward. Biology body obtains the optimization of biology function and the maximization of adopting circumstance and minimization of energy consumed, which are acquired by the mutual coupling action of different morphologies and structures and materials and composing et al. In this paper, the mutual action of multi factor (components, materials, structures) is synthesized and the studies of c-BN bionic anti-wear composite materials fabricated by SPS and brazing technology were developed.
C-BN super-hardness materials are polycrystalline conglomeration body fabricated using inorganic nonmetal powders under a condition and the electronic Coordination are highly stable. The key of c-BN bionic anti-wear composite materials fabricated is that liquid state solders can wet the surface of c-BN powders. Test results indicate that the wettability of Ag-based activation solders vs c-BN powders is well. The rules of effect solder compositions and brazing technological parameters (brazing temperature, holding time of brazing time and brazing vacuum degree et al) on c-BN powders performance were studied. C-BN bionic anti-wear composite materials were fabricated using brazing of smelting solders and powder solders. The tests show that the activation of Ti element in smelting solders is lower than that in powder solders after activation solders smelted. After activation solders with identical composition were smelted, the welding property of solders vs c-BN was decreased. The dependable joining among Ag-based activation solders and c-BN powders and substrate metal can be obtained using AgCuTi8Sn2 powder solders under the condition of brazing temperature 950℃and holding time 20min. The molding property of samples fabricated is well and the surface is smooth and the distribution of grains is uniform. The samples of c-BN bionic anti-wear composite materials were fixed on scratch testing machine, the phenomenon of c-BN powders fell off was not be found under 100N load. It is found that the interface reaction action mechanism among Ag and activation solders and c-BN and the changed rules of these vs c-BN wettablity.
Basing on the research foundation of Ag-based activation solders brazing used to fabricate c-BN bionic anti-wear composite materials and the existent guestion, the tests were adopted to fabricate c-BN super-hardness composite materials. The price of cu-basic solders is low and the strength is high and the high-temperature is well. The wettablity angle is 85°-120°on the surface of c-BN polycrystalline plates in Cu and Cu-Ni-based alloy system, which belong to incomplete wetting. The sample surfaces take on dust-colour and the total structure of composite materials is scattered. The results of scratch testing show that the strength of c-BN bionic anti-wear composite materials fabricated is lower and the grains are easily fell off. The wettability of C-BN grains was increased by addition Ti element in Cu-based solders and the surface molding mass of those was improved by addition Sn. the regression equation between the content of alloy elements and solders peoperties was establish by the mixing tested method to optimize the the composition of Cu-based activation solders. the joining shearing strengths between Cu-based solders brazing c-BN polycrystallinte plates and 45 steel heterogeneity material arrive 210Mpa-220Mpa. The surface wetting angles arrive 25°-35°on c-BN polycrystallinte plates.
Researches found the wetting mechanism of Cu-based activation solders vs c-BN grains and the interfacial micro-structures between Cu-based activation solders and c-BN grains were observed. The wetting of Cu-based activation solders vs c-BN belongs to chemical wetting and the chemical reactions happy at the interface of solders and c-BN. The results of SEM and EDS analyzed show that the mutual action is remarkable between Cu-based activation solders and c-BN grains, and there is a continuous reaction thin layer in interface, and the activation Ti element happens enrichment, and the concentration is arrived 18.70% and is higher than the content in Cu-based activation solders. The interfacial reaction produces are compound. The wetting and coalescent of Cu-based activation solders vs c-BN super-hardness materials were promoted owing to the formation of interfacial reaction compound between the grains and c-BN grains.
It is investigated that the interior joint strength and the effect rule of anti-wear property of the solders and the percentage content of c-BN grains volume vs the c-BN bionic anti-wear composite materials. Increasing of percentage content of c-BN grains volume helps to increase materials anti-wear property and effect joint strength between c-BN bionic anti-wear composite materials and solders at the same time, the anti-wear property was affected at last. The investigations show that mechanics property discrepancy between solders in c-BN bionic anti-wear composite materials and c-BN grains reinforced rigid hardness phase is larger. The outside forces (pull, wallop and friction et al) can't be uniformly loaded by c-BN bionic anti-wear composite materials because the inside joint strengths in these are lower than solders strength itself and joint strength between solders and steel substrate, owing to c-BN grains reinforced rigid hardness phase fell off, and the destining efficiency of c-BN bionic anti-wear composite materials was lost. The analytic results from tests and mechanics model established show that the inside joint strength and anti-wear property in c-BN bionic anti-wear composite materials are the highest when the content of c-BN grains is from 40% to 50%. At the same testing condition, the ant-wear property of as-fabricated materials is 12.34 times of normal 45 steel quenched, the joint strengths arrive 182Mpa-187Mpa.
One of the key reasons, which result in invalidation of c-BN bionic anti-wear composite materials, is c-BN groins taking off due to the less anti-wear property of based material. The structure of c-BN bionic anti-wear composite materials fabricated using brazing method is the structure of cast shape owing to the structure loosing and anti-wear property less. These materials were worn out during wearing process firstly and the comparatively protuberant high hardness c-BN grains were formed into the non-smooth surfaces to resist wearing out of abrading grains. The anti-wear property of as-fabricated materials was decreased and c-BN grains were fell off under the instance of bigger outside force. Basing on the technological characteristic of SPS, SPS technology was used to fabricate c-BN bionic anti-wear composite materials.
It was researched that the influencing rule of technologic parameters vs properties of c-BN bionic anti-wear composite materials fabricated using SPS technology. The multi-factors, which include sinter technological parameters (temperature, stress, time) and materials (sizes of c-BN grains, the volume percentage content c-BN, mechanics properties of substrate alloy) and the condition of outside circumstance, have effect on properties. The research results show that sinter technological parameters is a controllable factor and effect internality mass of c-BN bionic anti-wear composite materials. Tests adopted the method of orthogonal polynomial repression design to establish regression equation of kinds of parameters and properties of c-BN bionic anti-wear composite materials. Weight between kinds of factors and properties effect was studied to optimize the model. It were ensure that technological parameters optimized of c-BN bionic anti-wear composite materials fabricated using SPS technology, axial stresses are 28Mpa-33Mpa and sintered temperatures are 780℃-800℃and holding times are 4.6min-5min.
SPS technology was used to fabricate c-BN bionic anti-wear composite materials. The chemical reaction can be happened between activation element Ti in alloy and c-BN. New phases can be formed by reaction decomposing on c-BN surfaces. The key was that structure of as-fabricated materials was improved owing to grains distributed uniformly on substrate alloy and fabrication temperature lower and inside remains stress decreased and c-BN grains fragmentation avoided and joint strength increased between c-BN grains and substrate alloy. Anti-wear property of as-fabricated materials is higher than those materials fabricated using brazing method, which is 14.73 times of 45 steel quenched. As-fabricated materials have strongly adhesion effect on parts contacted under the friction heat effect and the key abrasion shape belongs to adherence abrasion with abrasive grain abrasion and fatigue abrasion.
It was discussed by tests using SPS technology that integrative sintering realized among c-BN grains and Cu-based activation alloy and 45 steel. The simultaneity welding was realized between powders and steel substrate. New method was obtained to research bionic anti-wear composite materials and the other hard welding materials.
引文
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