MEMS的集成设计平台建模及其系统级设计技术
|
摘要
随着MEMS向着产业化的方向发展，建立MEMS集成设计平台是实现MEMS系统、科学、规范化设计的有效手段，对于减少MEMS设计和制造过程的重复和浪费、缩短产品研发周期和提高设计与生产质量方面具有重要的意义。平台的建模和系统级设计是MEMS集成设计平台的重要组成部分，也是当前国际上MEMS研究的前沿和热点，具有重要的理论研究意义和应用价值。
本文首先以面向对象方法为指导，使用统一建模语言(UML)对基于“top-down”设计和“bottom-up”修正的MEMS集成设计平台进行了建模研究。建立了基于分布对象技术CORBA规范的MEMS集成设计平台的框架结构，采用标准数据交换格式IGES实现不同工具软件数据交换，通过“映射法”把持久对象转换为关系表格用关系数据库保存持久对象。
同时，针对MEMS的系统级模型是一个混合信号模型，具有多能量域耦合、多信号混合、离散事件子系统与连续时间子系统交互的特点，使用VHDL-AMS作为混合信号模型建模的工具，采用多端口组件网络建模方法建立了MEMS系统级模型，把微型机电系统分解为多个子系统或组件，各子系统被定义为多端口组件，子系统的内部行为通过其端口行为来描述，子系统间的能量与信号的交换通过组件的端口映射来实现，从而实现了对连续时间系统和离散事件系统的建模与仿真，满足了非线性系统以及大信号分析要求。
为了便于在不显著影响精度而能快速地仿真与分析MEMS整个系统动态行为，通过器件或组件的降阶模型(或称为宏模型)方法描述了多端口组件的端口行为，并采用有限元模型理论在三维空间内建立了微机械器件或组件宏模型，为系统级设计所需要的组件库的建立提供了理论基础和技术支持。
此外，还研究了使用能量法从三维实体自动获取宏模型的理论与方法，以用于MEMS系统级设计的反向验证。
在此基础上，使用宏模型方法对硅基微陀螺进行了系统级设计与行为仿真，为MEMS的器件级设计等提供了重要的设计依据。
With the development of MEMS towards industrialization, it is an effective means to established the integrated design platform in order to design MEMS systematically, scientifically and standardizedly, which is important to reduce the iteration and waste in the manufacturing of MEMS, shorten development cycle of products and improve the design and manufacturing quality of MEMS. The modeling of the design platform and the system-level design of MEMS are important parts of the MEMS integrated design platform and the highlight in front edge of the international MEMS research, with important theoretical significance and applied value.
At first of this thesis, the MEMS integrated design platform based on a top-down design and bottom-up verification approach was modeled by UML in the object-oriented method. The architecture of the platform was established based on the Distributed Object Computing with CORBA specifications. The Initial Graphics Exchange Specification (IGES) was introduced to interchange the information between different CAD tools. The persistent objects were saved in relational database by mapping persistent objects to relational tables.
Secondly, a network based on multi-terminal components modeling methodology was applied to model MEMS at system-level by the analogy and mixed-signal modeling tool of VHDL-AMS, for the system-level model of MEMS is a mixed signal model, which has attributes of multi-energy domains coupling, multi-signals mixed and interacting between discrete-event subsystems and continuous-time subsystems. With this method, the whole system can be divided into some subsystems defined as multi-terminal components; the behavior of the subsystems depends only on their terminal signals; the information exchange between subsystems was done by the signals at their terminals. The continuous-time systems or discrete-event systems can be modeled and simulated with this method, which satisfied the requirements of nonlinear systems and large signals analysis.
In order to simulating rapidly and analyzing the dynamic behavior of the whole MEMS but not reducing accuracy significantly, the terminal behavior of multi-terminal components was modeled as reduced-order model (or called macromodel). Upon the finite element model theory micro-mechanical devices or components were modeled in the spatial, which afforded theoretic foundation and technical
support to MEMS system-level design.
In addition, the theory and methodology of automatically generating analytical macromodels of microstructures from 3D solids was researched, which can be used to design MEMS in a bottom-up verification path at system-level.
With those understandings, a vibratory-rate micro-gyroscope was modeled and simulated at system-level with the macromodeling approach, which offered the references to the MEMS device-level design.
本文首先以面向对象方法为指导，使用统一建模语言(UML)对基于“top-down”设计和“bottom-up”修正的MEMS集成设计平台进行了建模研究。建立了基于分布对象技术CORBA规范的MEMS集成设计平台的框架结构，采用标准数据交换格式IGES实现不同工具软件数据交换，通过“映射法”把持久对象转换为关系表格用关系数据库保存持久对象。
同时，针对MEMS的系统级模型是一个混合信号模型，具有多能量域耦合、多信号混合、离散事件子系统与连续时间子系统交互的特点，使用VHDL-AMS作为混合信号模型建模的工具，采用多端口组件网络建模方法建立了MEMS系统级模型，把微型机电系统分解为多个子系统或组件，各子系统被定义为多端口组件，子系统的内部行为通过其端口行为来描述，子系统间的能量与信号的交换通过组件的端口映射来实现，从而实现了对连续时间系统和离散事件系统的建模与仿真，满足了非线性系统以及大信号分析要求。
为了便于在不显著影响精度而能快速地仿真与分析MEMS整个系统动态行为，通过器件或组件的降阶模型(或称为宏模型)方法描述了多端口组件的端口行为，并采用有限元模型理论在三维空间内建立了微机械器件或组件宏模型，为系统级设计所需要的组件库的建立提供了理论基础和技术支持。
此外，还研究了使用能量法从三维实体自动获取宏模型的理论与方法，以用于MEMS系统级设计的反向验证。
在此基础上，使用宏模型方法对硅基微陀螺进行了系统级设计与行为仿真，为MEMS的器件级设计等提供了重要的设计依据。
With the development of MEMS towards industrialization, it is an effective means to established the integrated design platform in order to design MEMS systematically, scientifically and standardizedly, which is important to reduce the iteration and waste in the manufacturing of MEMS, shorten development cycle of products and improve the design and manufacturing quality of MEMS. The modeling of the design platform and the system-level design of MEMS are important parts of the MEMS integrated design platform and the highlight in front edge of the international MEMS research, with important theoretical significance and applied value.
At first of this thesis, the MEMS integrated design platform based on a top-down design and bottom-up verification approach was modeled by UML in the object-oriented method. The architecture of the platform was established based on the Distributed Object Computing with CORBA specifications. The Initial Graphics Exchange Specification (IGES) was introduced to interchange the information between different CAD tools. The persistent objects were saved in relational database by mapping persistent objects to relational tables.
Secondly, a network based on multi-terminal components modeling methodology was applied to model MEMS at system-level by the analogy and mixed-signal modeling tool of VHDL-AMS, for the system-level model of MEMS is a mixed signal model, which has attributes of multi-energy domains coupling, multi-signals mixed and interacting between discrete-event subsystems and continuous-time subsystems. With this method, the whole system can be divided into some subsystems defined as multi-terminal components; the behavior of the subsystems depends only on their terminal signals; the information exchange between subsystems was done by the signals at their terminals. The continuous-time systems or discrete-event systems can be modeled and simulated with this method, which satisfied the requirements of nonlinear systems and large signals analysis.
In order to simulating rapidly and analyzing the dynamic behavior of the whole MEMS but not reducing accuracy significantly, the terminal behavior of multi-terminal components was modeled as reduced-order model (or called macromodel). Upon the finite element model theory micro-mechanical devices or components were modeled in the spatial, which afforded theoretic foundation and technical
support to MEMS system-level design.
In addition, the theory and methodology of automatically generating analytical macromodels of microstructures from 3D solids was researched, which can be used to design MEMS in a bottom-up verification path at system-level.
With those understandings, a vibratory-rate micro-gyroscope was modeled and simulated at system-level with the macromodeling approach, which offered the references to the MEMS device-level design.
引文
[1] Bryzel J. hnpact of MEMS technology on society[J]. Sensor and Actuators A,1996, 56:1-9
[2] 苑伟政，马炳和．微机械与微细加工技术．西安：西北工业大学出版社，2000
[3] 周兆英，李志宏．新世纪的新事业——中国MEMS调查．电子产品世界，2000．07
[4] 王跃林，王渭源．集成微光机电系统前沿(A)．中国科学院2000年高技术发展报告(C)．北京：科学出版社，2000．15：7～160
[5] 丁衡高．微型机电系统研究文集前言(A)．微型机电系统研究文集(C)．北京：清华大学出版社，2000．1
[6] 刘光辉，亢春梅．MEMS技术的现状和发展趋势．传感器技术，2001．20(1)
[7] Senturia S D. Microfabricated structures for the measurement of mechanical properties and adhesion of thin films, Proc. 4th lnt. Conf. Solid-State Sensors and Actuators (Transducers '87), Tokyo, 2-5 June, 1987.pp. 11-16
[8] Special lssue:Integrated Sensors, Microactuators & Microsystems(MEMS), ed.K,D. Wise, Proceedings of the IEEE,1998,86(8):1529-1812
[9] Senturia S D.A Computer-Aided Design System for Microelectromechanical Systems. Journal of Microelectromechanical Systems.1996, 1(1)
[10] Gilbert J R, et.al.Implementation of a MEMCAD System for Electrostatic and Mechanical Analysis of Complex Structures from Mask Descriptions,IEEE Micro Electro Mechanical Systems Workshop,(1993), Fort Lauderdale USA,p207-212.
[11] http://www.intellisense.com/software.html
[12] Crary S B,Zhang Y.CAEMEMS:An intergrated computer-aided engineering workbench for micro-electro mechanical systems, In MEMS 90, pages 113-115, Institute of Electrical Engineers.1990.
[13] Andrzej P. AN INTEGRATED MULTIDISCIPLINARY CAD/CAE ENVIRONMENT FOR MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS).http://www.cfdrc.con/datab news/articles/PA9834. pdf
[14] Stout P J, Yang H Q.Dionne P,Leonard P,Tan Z,Przekwas A, Krishnan, A. CFD-ACE+:A CAD System for Simulation and Modeling of MEMS, Proc. Design, Test, and Microfabrication of MEMS/MOEMS.Paris,1999.3
[15] http://www.tanner.com. eda/
[16] Mary A M, Hee J L MEMS Systems Design and Verification Tools, SPIE's 5 th.Annual
International Symposium on Smart Structures and Materials Symposium, March 1-5, 1998,San Diego, CA.
[17] A Workshop Sponsored by the National Science Foundation.Structured Design Methed for MEMS Final Report.http://www.design.caltech.edu/NSF_MEMS_Workshop
[18] Fedder G K. A Vision of Structured CAD for MEMS, in Proceedings of the Fifth ACM/SIGDA Physical Design Workshop,Reston.VA,Apr.15-17,1996, pp.53-60.
[19] T.Mukherjee, G.K.Fedder,Structured Design Of Microelectromechanical Systems, in Proceedings of 341h Design Automation Conference, Anaheim,CA,June 1997, pp. 680-685
[20] http://www.conventorware.com
[21] Clark J V,Zhou N,Pister K S J. MEMS Simulation Using SUGARv0.5,Tech. Digest, Solid-State Sensor and Actuator Workshop, Hilton Head Island SC, pp.191-196,Jun8-11(1998).
[22] N. Zhou, J. V. Clark, K. S. J. Pister, Nodal Analysis for MEMS Design Using SUGARv0.5, Santa Clara CAApril 6-8 (1998).
[23] Veijola T, Kuisma H,Lahdenper J.Dynamic Modelling and Simulation of Microelectromechanical Devices With a Circuit Simulation Program,Proceedings of MSM'98,Santa Clara.April 6-8, 1998.
[24] Equivalent Circuit Models for Micromechanical Inertial Sensors. http://www.aplac.hut.fi/publications/ct-39/main.html
[25] Lynn D. Gabbay.Computer Aided Macromodeling for MEMS,Ph.D.,June 1998, MIT.
[26] Neul R, Becket U,Lorenz G.,Schwarz P.Haase J,Wnsche S.A Modeling Approach to Include Mechanical Microsystem Components into the System Simulation,1998 Design Automation and Test in Europe,Paris,FRANCE.1998
[27] Schwarz P.;Haase,J.:Behavioral Modeling of Complex Heterogeneous Microsystems. Proc. 1st Intern.Forum on Design Languagues (FDL'98), Lausanne, Sept.1998, vol. 2, 53-62
[28] Dewey H,Dussault J. Hanna E,Christen G. Fedder,Maher M.Energy-Based Characterization of Microelectromechanical Systems (MEMS) and Component Modeling Using VHDL-AMS. Proc.Modeling and Simulation of Microsystems,Semiconductors, Sensors, and Actuators {MSM 99), San Juan, Puerto Rico, 19-21 April 1999.
[29] Dewey, Icoz E.Visual Modeling and Design of Microelectromechanical Systems (MEMS) Transducers.Proc.Modeling and Simulation of Microsystems,Semiconductors,Sensors, and Actuators(MSM 99). San Juan, Puerto Rico.19-21 April 1999.
[30] 朱俊华，周兆英．叶雄英，微型机电系统的计算机辅助设计系统简介．仪表技术与传感
器．2001．1
[31] 孙道恒，黄元庆．郑炜．朱立秒，李文望．李文望．MEMS系统级仿真建模理论与方法的研究．厦门大学学报(自然科学版)．第40卷，第2期．2001年3月
[32] 刘恒，虞烈，谢友柏．现代设计方法与新产品开发．中国机械工程．第10卷第1期．1999年1月
[33] http://www.cims.edu.cn/MonographicTech/support/frame/index.htm
[34] The Object Management Oroup,The Common Object Request Broker: Architecture and Specification.Version 2.2,Feburary,1998.
[35] 李师贤等著．CORBA企业解决方案．北京：机械工业出版社，2001．
[36] Object Management Group,OMG Unified Modeling Language Specification.Version 1.3,March 2000. http://www.omg.org
[37] Flowler,Martin,Scott K, UML Distilled:Applying the Standard Object Modeling Language,MA :Addision-Wesley, 1997.
[38] Page-Jones,Meilir.Fundamentals of Object-Oriented Design in UML,Reading,MA: Addison-Wesley. 2000
[39] 胡春华，朱庆华，张智勇．吴波，杨叔子．基于 CORBA的分布式网络化制造系统建模．机械与电子．2001．2
[40] 鲍剑洋，吴文清．通过CORBA规范访问数据库的方法和途径．计算机工程与应用，2000．1
[41] 韩鑫，王建民，孙家广．基于构件技术的产品数据管理服务模型．清华大学学报(自然科学版)．2001年第41卷第1期
[42] 刘润东著．UML 对象设计与编程．北京：北京希望电子出版社．2001．3
[43] 曾健，王家弟，卢晨，丁文江等．UGⅡ和PROCAST之间的图形数据交换研究．铸造．1999．12
[44] 张思荣，谭建荣，张家泰，邱长华．STEP应用协议201 工具的研究和开发．机械科学与技术．第18卷．第4期．1999年7月
[45] IGES Organization.Initial Graphics Exchange Specification (Ver 5.1)[S]. New York:ISO.1991.
[46] 14.ISO-10303-1 .Overview and Fundamental Principles
[47] Hanna J P, Hillman R G.. A Common Basis for Mixed-Technology MicroSystem Modeling,Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems, MSM 99. April 19-21, 1999, San Juan, Puerto Rico, U.S.A.. pp. 132-135.
[48] Jing Q, Fedder G. K. Proceedings of 1998 IEEE/VIUF International Workshop on Behavioral Modeling and Simulation (BMAS'98), October 26-28, 1998, Orlando, FL,
USA
[49] Courtois B, Karam J M, Lubaszewski M, Szekely V,Rencz M,Hofmann K, Glesner M.Design and Test of MEMS, 12th International Confenrence on VLSI Design, Janurary, 1999
[50] Jacquemod G..Vuorinen K,Gaffiot F,Spisser A,Seassal C,Leclercq J-L,P. Rojo-Romeo, Viktorovitch P.MOEMS Modeling For Opto-Electro -Mechanical Co-Simulation. Journal of Modeling and Simulation of Microsystems. Vol. 1, No.1,pages 39-48,1999.
[51] Karam J M, Courtois B. Boutamine H, Drake P.Rencz M, Poppe A,Szkely V, Hofmann K, Glesner M. CAD and foundries for microsystems, Proceedings of the 1997 Design Automation Conference, Anaheim,CA, June 1997, pp. 674-679.
[52] Clauss Chr, Haase,J,Schwarz P,An approach to analogue behavioral modelling. Proc. VHDL User Forum Europe,Dresden,5-8. May 1996, 181-192
[53] Peter S,Joachim H.Behavioral Modeling of Complex Heterogeneous Microsystems Proc.Ist Intern.Forum on Design Languagues (FDL'98), Lausanne,Sept.1998, vol.2, 53-62
[54] Hogan N.Integrated modeling of physical system dynamics,Class notes,Massachusetts Institute of Technology,Cambridge,1994, pp.207-224.
[55] Haus H A,Melcher J R.Electromagnetic Fields and Energy. Englewood Cliffs, NJ: Prentice-Hall,1989
[56] Christoph C.Joachim H, Peter S. An Approach To Analogue Behavioural Modelling. VHDL User Forum Europe,SIG-VHDL Spring '96 Working Conference,Dresden Germany,May 5-8 1996,pp. 181-192
[57] Gupta R K,Hung E S.Yang Y J,Anantha-suresh G K,Senturia S D.Pull-in dynamics of elec-trostatically-actuated beams,Proc.Solid-state Sensor&Actuator Workshop,.June 1996.
[58] Veijola T,Kuisma H, Lahdenper J.Dynamic Modelling and Simulation of Microelectromechanical Devices With a Circuit Simulation Program,Proceedings of MSM'98, Santa Clara.April 6-8, 1998.
[59] Equivalent Circuit Models for Micromechanical Inertial Sensors. http://www.aplac.hut.fi(?)publications/ct-39/main.html
[60] Veijola T,Kuisma H..Lahdenpera J, Ryhanen T,Equivalent-circuit model of the squeezed gas.Im in a silicon accelerometer,Sensors and Actuators A, A(48). 1995.pp.239-248.
[61] Ananthasuresh G K, Gupta R K, Senturia S D.An approach to macromodeling of MEMS for nonlinear dynamic simulation, ASME 96 Interntional Mechanical Engineering
Congress and Exposition.Proc.Of Dynamics Systems and Controls,DSCvol.59, Atlanta,Nov.1996,pp.401-407.
[62] Bart F.R.VHDL 1076.1 MEMS Modeling Examples.http://www.vhdl-ams.com
[63] Dewey,et.al.,VHDL-AMS Modeling Considerations and Styles for Composite Systems, Defense Advance Research Projects Agency(DARPA),Version 1.0,1998.
[64] Dewey A,Dussault H.Hanna J,Christen E,Fedder G,Maher M.Energy-Based Characterization of Microelectromechanical Systems(MEMS) and Component Modeling Using VHDL-AMS, Modeling and Simulation of Microsystems,Semiconductors,Sensors, and Actuators(MSM), April 1999.
[65] Senturia S.CAD Challenges for Microsensors,Microactuators,and Microsystems. Proceedings of the IEEE.Vol 86,No 8,August 1998.
[66] Technical Report.Nodal Design of Actuators and Sensors,Department of Electrical and Computer Engineering Carnegie Mellon University,May 7, 1998
[67] Lorenz G,Neul R,Robert B G.Network-type modeling of micromachined sensors system.Technical Proceedings 1998 International Conference on Modeling and Simulation of Microsystems, Santa Clara,California,USA April 6-8,1998
[68] Vandemeer J E.Kranz M S,Fedder G K.Hierarcbical Representation and Simulation of Micro-machined Inertial Sensors. Proc.Modeling and Simulation of Microsystems Workshop,Santa Clara. CA.April 6-8.1998.
[69] Varghese M,Rabinovich V L,Senturia S D.Reduced-order modeling of Lorentz force actuation with modal basis functions.Technical Proceedings 1999 International Conference on Modeling and Simulation of Microsystems.San Juan,Puerto Rico,USA April 19-21,1999
[70] Haus H,Melcher J. EIectromagnetic Fields and Energy,Pretence Hall,1989.
[71] 王茂成，邵敏．有限单元法的基本原理和数值方法．北京：清华书店出版社(第二版)．1997，3
[72] 孙家广．计算机图形学(第三版)．北京为：清华大学出版社．1997．9，pp374～375
[73] 萧龙翔，贾启芬，邓惠和理论力学．天津大学出版社．1995，9
[74] Tang W C, Nguyen T-C H. Howe R T.Laterally driven polysilicon resonant microstructures.In Proceedings,IEEE Micro Electro Mechanical Systems Workshop,Salt Lake City, Utah.February 1989,pp53-59
[75] Fedder G. K, Simulation of Microelectromechanical Systems. Ph.D.Thesis.1994, University of California at Berkeley
[76] McNeil V M,Novack M J.Design and fabrication of thin-film microaccelerameters using wafer bonding,In Technical Digest 7th Inter.Con.on Solids-State Sensors and Actuators
(Transducers'93), Yokohama, Japan, June 1993,pp.822-825
[77] Hung E S,Yang Y-J,Senturia S D,Low-Order Models For Fast Dynamical Simulation of MEMS Microstructures,Transducers "97, pp.1101-1104.
[78] Gabbay L D.Computer Aided Macromodeling for MEMS,Ph.D.,June 1998, MIT.
[79] 杨畅．航天惯性仪表40年与未来趋势．导弹与航天运载技术，2000．1．
[80] 李万玉等．关于提取微机械陀螺仪输入角速度的研究．传感器技术，1999．2．
[81] Mochida Y,Tamura M,Ohwada K.A micromachined vibrating rate gyroscope with independent beams for the drive and detection modes.Sensors and Actuators 80 2000 170-178
[82] Fedder G K,Mukherjee T,Physical Design For Surface-Micromachined MEMS.In Proceedings of the 5th ACM/SIGDA Physical Design Workshop,Reston,VA USA, April 15-17,1996, pp. 53-60.
[83] Mukherjee T,Iyer S. Optimization-based Synthesis Of Microresonators,Draft of Journal paper, August 24, 1999.
[84] 裘安萍，蔡体箐等．音叉式硅微机械振动陀螺的粘滞阻尼研究．东南大学学报．第30卷．第1期．2000年1月
[85] Johnson W A, Warne L K.Electrophysics of Micromechanical Comb Actuators,J.of Microelectromechanical Systems, v.4, no.1, March 1995, pp.49-59.
[2] 苑伟政，马炳和．微机械与微细加工技术．西安：西北工业大学出版社，2000
[3] 周兆英，李志宏．新世纪的新事业——中国MEMS调查．电子产品世界，2000．07
[4] 王跃林，王渭源．集成微光机电系统前沿(A)．中国科学院2000年高技术发展报告(C)．北京：科学出版社，2000．15：7～160
[5] 丁衡高．微型机电系统研究文集前言(A)．微型机电系统研究文集(C)．北京：清华大学出版社，2000．1
[6] 刘光辉，亢春梅．MEMS技术的现状和发展趋势．传感器技术，2001．20(1)
[7] Senturia S D. Microfabricated structures for the measurement of mechanical properties and adhesion of thin films, Proc. 4th lnt. Conf. Solid-State Sensors and Actuators (Transducers '87), Tokyo, 2-5 June, 1987.pp. 11-16
[8] Special lssue:Integrated Sensors, Microactuators & Microsystems(MEMS), ed.K,D. Wise, Proceedings of the IEEE,1998,86(8):1529-1812
[9] Senturia S D.A Computer-Aided Design System for Microelectromechanical Systems. Journal of Microelectromechanical Systems.1996, 1(1)
[10] Gilbert J R, et.al.Implementation of a MEMCAD System for Electrostatic and Mechanical Analysis of Complex Structures from Mask Descriptions,IEEE Micro Electro Mechanical Systems Workshop,(1993), Fort Lauderdale USA,p207-212.
[11] http://www.intellisense.com/software.html
[12] Crary S B,Zhang Y.CAEMEMS:An intergrated computer-aided engineering workbench for micro-electro mechanical systems, In MEMS 90, pages 113-115, Institute of Electrical Engineers.1990.
[13] Andrzej P. AN INTEGRATED MULTIDISCIPLINARY CAD/CAE ENVIRONMENT FOR MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS).http://www.cfdrc.con/datab news/articles/PA9834. pdf
[14] Stout P J, Yang H Q.Dionne P,Leonard P,Tan Z,Przekwas A, Krishnan, A. CFD-ACE+:A CAD System for Simulation and Modeling of MEMS, Proc. Design, Test, and Microfabrication of MEMS/MOEMS.Paris,1999.3
[15] http://www.tanner.com. eda/
[16] Mary A M, Hee J L MEMS Systems Design and Verification Tools, SPIE's 5 th.Annual
International Symposium on Smart Structures and Materials Symposium, March 1-5, 1998,San Diego, CA.
[17] A Workshop Sponsored by the National Science Foundation.Structured Design Methed for MEMS Final Report.http://www.design.caltech.edu/NSF_MEMS_Workshop
[18] Fedder G K. A Vision of Structured CAD for MEMS, in Proceedings of the Fifth ACM/SIGDA Physical Design Workshop,Reston.VA,Apr.15-17,1996, pp.53-60.
[19] T.Mukherjee, G.K.Fedder,Structured Design Of Microelectromechanical Systems, in Proceedings of 341h Design Automation Conference, Anaheim,CA,June 1997, pp. 680-685
[20] http://www.conventorware.com
[21] Clark J V,Zhou N,Pister K S J. MEMS Simulation Using SUGARv0.5,Tech. Digest, Solid-State Sensor and Actuator Workshop, Hilton Head Island SC, pp.191-196,Jun8-11(1998).
[22] N. Zhou, J. V. Clark, K. S. J. Pister, Nodal Analysis for MEMS Design Using SUGARv0.5, Santa Clara CAApril 6-8 (1998).
[23] Veijola T, Kuisma H,Lahdenper J.Dynamic Modelling and Simulation of Microelectromechanical Devices With a Circuit Simulation Program,Proceedings of MSM'98,Santa Clara.April 6-8, 1998.
[24] Equivalent Circuit Models for Micromechanical Inertial Sensors. http://www.aplac.hut.fi/publications/ct-39/main.html
[25] Lynn D. Gabbay.Computer Aided Macromodeling for MEMS,Ph.D.,June 1998, MIT.
[26] Neul R, Becket U,Lorenz G.,Schwarz P.Haase J,Wnsche S.A Modeling Approach to Include Mechanical Microsystem Components into the System Simulation,1998 Design Automation and Test in Europe,Paris,FRANCE.1998
[27] Schwarz P.;Haase,J.:Behavioral Modeling of Complex Heterogeneous Microsystems. Proc. 1st Intern.Forum on Design Languagues (FDL'98), Lausanne, Sept.1998, vol. 2, 53-62
[28] Dewey H,Dussault J. Hanna E,Christen G. Fedder,Maher M.Energy-Based Characterization of Microelectromechanical Systems (MEMS) and Component Modeling Using VHDL-AMS. Proc.Modeling and Simulation of Microsystems,Semiconductors, Sensors, and Actuators {MSM 99), San Juan, Puerto Rico, 19-21 April 1999.
[29] Dewey, Icoz E.Visual Modeling and Design of Microelectromechanical Systems (MEMS) Transducers.Proc.Modeling and Simulation of Microsystems,Semiconductors,Sensors, and Actuators(MSM 99). San Juan, Puerto Rico.19-21 April 1999.
[30] 朱俊华，周兆英．叶雄英，微型机电系统的计算机辅助设计系统简介．仪表技术与传感
器．2001．1
[31] 孙道恒，黄元庆．郑炜．朱立秒，李文望．李文望．MEMS系统级仿真建模理论与方法的研究．厦门大学学报(自然科学版)．第40卷，第2期．2001年3月
[32] 刘恒，虞烈，谢友柏．现代设计方法与新产品开发．中国机械工程．第10卷第1期．1999年1月
[33] http://www.cims.edu.cn/MonographicTech/support/frame/index.htm
[34] The Object Management Oroup,The Common Object Request Broker: Architecture and Specification.Version 2.2,Feburary,1998.
[35] 李师贤等著．CORBA企业解决方案．北京：机械工业出版社，2001．
[36] Object Management Group,OMG Unified Modeling Language Specification.Version 1.3,March 2000. http://www.omg.org
[37] Flowler,Martin,Scott K, UML Distilled:Applying the Standard Object Modeling Language,MA :Addision-Wesley, 1997.
[38] Page-Jones,Meilir.Fundamentals of Object-Oriented Design in UML,Reading,MA: Addison-Wesley. 2000
[39] 胡春华，朱庆华，张智勇．吴波，杨叔子．基于 CORBA的分布式网络化制造系统建模．机械与电子．2001．2
[40] 鲍剑洋，吴文清．通过CORBA规范访问数据库的方法和途径．计算机工程与应用，2000．1
[41] 韩鑫，王建民，孙家广．基于构件技术的产品数据管理服务模型．清华大学学报(自然科学版)．2001年第41卷第1期
[42] 刘润东著．UML 对象设计与编程．北京：北京希望电子出版社．2001．3
[43] 曾健，王家弟，卢晨，丁文江等．UGⅡ和PROCAST之间的图形数据交换研究．铸造．1999．12
[44] 张思荣，谭建荣，张家泰，邱长华．STEP应用协议201 工具的研究和开发．机械科学与技术．第18卷．第4期．1999年7月
[45] IGES Organization.Initial Graphics Exchange Specification (Ver 5.1)[S]. New York:ISO.1991.
[46] 14.ISO-10303-1 .Overview and Fundamental Principles
[47] Hanna J P, Hillman R G.. A Common Basis for Mixed-Technology MicroSystem Modeling,Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems, MSM 99. April 19-21, 1999, San Juan, Puerto Rico, U.S.A.. pp. 132-135.
[48] Jing Q, Fedder G. K. Proceedings of 1998 IEEE/VIUF International Workshop on Behavioral Modeling and Simulation (BMAS'98), October 26-28, 1998, Orlando, FL,
USA
[49] Courtois B, Karam J M, Lubaszewski M, Szekely V,Rencz M,Hofmann K, Glesner M.Design and Test of MEMS, 12th International Confenrence on VLSI Design, Janurary, 1999
[50] Jacquemod G..Vuorinen K,Gaffiot F,Spisser A,Seassal C,Leclercq J-L,P. Rojo-Romeo, Viktorovitch P.MOEMS Modeling For Opto-Electro -Mechanical Co-Simulation. Journal of Modeling and Simulation of Microsystems. Vol. 1, No.1,pages 39-48,1999.
[51] Karam J M, Courtois B. Boutamine H, Drake P.Rencz M, Poppe A,Szkely V, Hofmann K, Glesner M. CAD and foundries for microsystems, Proceedings of the 1997 Design Automation Conference, Anaheim,CA, June 1997, pp. 674-679.
[52] Clauss Chr, Haase,J,Schwarz P,An approach to analogue behavioral modelling. Proc. VHDL User Forum Europe,Dresden,5-8. May 1996, 181-192
[53] Peter S,Joachim H.Behavioral Modeling of Complex Heterogeneous Microsystems Proc.Ist Intern.Forum on Design Languagues (FDL'98), Lausanne,Sept.1998, vol.2, 53-62
[54] Hogan N.Integrated modeling of physical system dynamics,Class notes,Massachusetts Institute of Technology,Cambridge,1994, pp.207-224.
[55] Haus H A,Melcher J R.Electromagnetic Fields and Energy. Englewood Cliffs, NJ: Prentice-Hall,1989
[56] Christoph C.Joachim H, Peter S. An Approach To Analogue Behavioural Modelling. VHDL User Forum Europe,SIG-VHDL Spring '96 Working Conference,Dresden Germany,May 5-8 1996,pp. 181-192
[57] Gupta R K,Hung E S.Yang Y J,Anantha-suresh G K,Senturia S D.Pull-in dynamics of elec-trostatically-actuated beams,Proc.Solid-state Sensor&Actuator Workshop,.June 1996.
[58] Veijola T,Kuisma H, Lahdenper J.Dynamic Modelling and Simulation of Microelectromechanical Devices With a Circuit Simulation Program,Proceedings of MSM'98, Santa Clara.April 6-8, 1998.
[59] Equivalent Circuit Models for Micromechanical Inertial Sensors. http://www.aplac.hut.fi(?)publications/ct-39/main.html
[60] Veijola T,Kuisma H..Lahdenpera J, Ryhanen T,Equivalent-circuit model of the squeezed gas.Im in a silicon accelerometer,Sensors and Actuators A, A(48). 1995.pp.239-248.
[61] Ananthasuresh G K, Gupta R K, Senturia S D.An approach to macromodeling of MEMS for nonlinear dynamic simulation, ASME 96 Interntional Mechanical Engineering
Congress and Exposition.Proc.Of Dynamics Systems and Controls,DSCvol.59, Atlanta,Nov.1996,pp.401-407.
[62] Bart F.R.VHDL 1076.1 MEMS Modeling Examples.http://www.vhdl-ams.com
[63] Dewey,et.al.,VHDL-AMS Modeling Considerations and Styles for Composite Systems, Defense Advance Research Projects Agency(DARPA),Version 1.0,1998.
[64] Dewey A,Dussault H.Hanna J,Christen E,Fedder G,Maher M.Energy-Based Characterization of Microelectromechanical Systems(MEMS) and Component Modeling Using VHDL-AMS, Modeling and Simulation of Microsystems,Semiconductors,Sensors, and Actuators(MSM), April 1999.
[65] Senturia S.CAD Challenges for Microsensors,Microactuators,and Microsystems. Proceedings of the IEEE.Vol 86,No 8,August 1998.
[66] Technical Report.Nodal Design of Actuators and Sensors,Department of Electrical and Computer Engineering Carnegie Mellon University,May 7, 1998
[67] Lorenz G,Neul R,Robert B G.Network-type modeling of micromachined sensors system.Technical Proceedings 1998 International Conference on Modeling and Simulation of Microsystems, Santa Clara,California,USA April 6-8,1998
[68] Vandemeer J E.Kranz M S,Fedder G K.Hierarcbical Representation and Simulation of Micro-machined Inertial Sensors. Proc.Modeling and Simulation of Microsystems Workshop,Santa Clara. CA.April 6-8.1998.
[69] Varghese M,Rabinovich V L,Senturia S D.Reduced-order modeling of Lorentz force actuation with modal basis functions.Technical Proceedings 1999 International Conference on Modeling and Simulation of Microsystems.San Juan,Puerto Rico,USA April 19-21,1999
[70] Haus H,Melcher J. EIectromagnetic Fields and Energy,Pretence Hall,1989.
[71] 王茂成，邵敏．有限单元法的基本原理和数值方法．北京：清华书店出版社(第二版)．1997，3
[72] 孙家广．计算机图形学(第三版)．北京为：清华大学出版社．1997．9，pp374～375
[73] 萧龙翔，贾启芬，邓惠和理论力学．天津大学出版社．1995，9
[74] Tang W C, Nguyen T-C H. Howe R T.Laterally driven polysilicon resonant microstructures.In Proceedings,IEEE Micro Electro Mechanical Systems Workshop,Salt Lake City, Utah.February 1989,pp53-59
[75] Fedder G. K, Simulation of Microelectromechanical Systems. Ph.D.Thesis.1994, University of California at Berkeley
[76] McNeil V M,Novack M J.Design and fabrication of thin-film microaccelerameters using wafer bonding,In Technical Digest 7th Inter.Con.on Solids-State Sensors and Actuators
(Transducers'93), Yokohama, Japan, June 1993,pp.822-825
[77] Hung E S,Yang Y-J,Senturia S D,Low-Order Models For Fast Dynamical Simulation of MEMS Microstructures,Transducers "97, pp.1101-1104.
[78] Gabbay L D.Computer Aided Macromodeling for MEMS,Ph.D.,June 1998, MIT.
[79] 杨畅．航天惯性仪表40年与未来趋势．导弹与航天运载技术，2000．1．
[80] 李万玉等．关于提取微机械陀螺仪输入角速度的研究．传感器技术，1999．2．
[81] Mochida Y,Tamura M,Ohwada K.A micromachined vibrating rate gyroscope with independent beams for the drive and detection modes.Sensors and Actuators 80 2000 170-178
[82] Fedder G K,Mukherjee T,Physical Design For Surface-Micromachined MEMS.In Proceedings of the 5th ACM/SIGDA Physical Design Workshop,Reston,VA USA, April 15-17,1996, pp. 53-60.
[83] Mukherjee T,Iyer S. Optimization-based Synthesis Of Microresonators,Draft of Journal paper, August 24, 1999.
[84] 裘安萍，蔡体箐等．音叉式硅微机械振动陀螺的粘滞阻尼研究．东南大学学报．第30卷．第1期．2000年1月
[85] Johnson W A, Warne L K.Electrophysics of Micromechanical Comb Actuators,J.of Microelectromechanical Systems, v.4, no.1, March 1995, pp.49-59.