基于MEMS热电堆的表面高温测试技术研究
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摘要
瞬态温度由于其温度过高或作用时间很短,难以用传统的热电偶来进行测量。基于微电子技术和半导体技术的的MEMS热电堆传感器,以红外辐射为机理,作为一种非接触式测温器件,不需与被测物体接触,能够有效地消除接触式传感器因安装使温度场产生畸变而出现的测温误差,可以实现非接触式测温;同时由于物体微小的温度波动会产生较大的辐射能量的变化,故传感器的灵敏度很高。因此,可利用MEMS热电堆传感器进行瞬态表面高温测试研究。本文以红外辐射测温为背景,围绕MEMS热电堆传感器表面高温测试系统展开论述,论文主要从理论设计、重点部分性能分析两方面进行了探索。
论文首先分析了瞬态温度测试的研究现状,并介绍了热电堆传感器的结构、发展现状及应用。其次,针对测温现状,提出一种用MEMS热电堆传感器来实现高温测量的新方法,设计了基于MEMS热电堆的瞬态(ms量级)表面高温(1500℃-3000℃)测试系统,对系统各部分的功能及材料的选择进行了深入的探讨;同时提出了系统的静动态标定方法,为进一步的研制提供了理论依据。再次,对系统的关键元件陶瓷材料衰减片的红外吸收系数进行研究,分析了典型的傅里叶变换红外光谱仪测量法,并结合系统的特点,提出了一种新的测量方法——MEMS热电堆测量法。两种方法互为验证,试验结果表明MEMS热电堆测量法具有计算更加简单、准确的优点,为系统的实现提供了良好依据。最后,采用先成型后烧结法研制了4.5mm、5.5mm氧化锆陶瓷薄片,并对其吸收系数进行实验,实验结果表明性能良好,可用于MEMS热电堆表面高温测试系统中,为系统的进一步完善打下基础。
HTransient temperatureH can hardly be measured using the traditional thermocouple as it is toohigh or the acting time is too short.Based on the HmicroelectronicsH technology and theHsemiconductor technologyH, MEMS Hthermopile sensorH which is a non-contact temperaturemeasuring device, using the Hinfrared radiationH as its mechanism, is not needed to contact themeasured objects and can effectively eliminate the errors of temperature field caused by theinstallation of the sensor to achieve non-contact temperature measurement; at the same time,as the micro temperature fluctuation of the object can cause a great change in radiation energy,the sensitivity of the Hinfrared radiation thermometersH is high.Therefore, the research oftransient surface high temperature measurement is available using MEMS thermopile sensor.Based on the Hinfrared radiation temperature measurementH, this paper Hspreads out expositionHaround the system of surface high temperature measurement using MEMS thermopile sensorand explores it in the aspects of Htheoretical designH and key part Hperformance analysisH.This paper firstly analyzes the Hcurrent research statusH of Htransient temperature testH andintroduces the structure, nowaday development and application of the Hthermopile sensorH.
Then, aiming at the temperature measuring actuality, a new method of high temperaturemeasurement is proposed using MEMS thermopile sensor and the system of transient (msscale) surface high temperature (1500℃--3000℃) measurement based on MEMS thermopileis designed, the function of various parts of the system and the selection of the material.arediscussed further;at one time, the static and dynamic calibration method of the system aresuggested and provide a theoretical basis to further the investigation.In addition, researchingon the infrared Habsorption coefficientH of key organ of the system--the ceramic material attenuation slice, typical FTIS measurement was discussed，and combination the characteristics ofhigh-temperature test system，a new measurement method—MEMS thermopile measurement wasproposed。The two methods verify each other and the test results show that MEMS thermopilemeasurement has a simpler and more accurate advantage, which gives a good basis for thesystem to achieve.At last, 4.5mm,5.5mm ZrOB2 Bceramic thin slices are manufactured in theway of molding before sintering and its absorption coefficient is being experimented. The testresults show that it has a good performance which can be using in the system of MEMSthermopile surface high temperature measurement and make a basis of furthering theimprovement of the system.
论文首先分析了瞬态温度测试的研究现状,并介绍了热电堆传感器的结构、发展现状及应用。其次,针对测温现状,提出一种用MEMS热电堆传感器来实现高温测量的新方法,设计了基于MEMS热电堆的瞬态(ms量级)表面高温(1500℃-3000℃)测试系统,对系统各部分的功能及材料的选择进行了深入的探讨;同时提出了系统的静动态标定方法,为进一步的研制提供了理论依据。再次,对系统的关键元件陶瓷材料衰减片的红外吸收系数进行研究,分析了典型的傅里叶变换红外光谱仪测量法,并结合系统的特点,提出了一种新的测量方法——MEMS热电堆测量法。两种方法互为验证,试验结果表明MEMS热电堆测量法具有计算更加简单、准确的优点,为系统的实现提供了良好依据。最后,采用先成型后烧结法研制了4.5mm、5.5mm氧化锆陶瓷薄片,并对其吸收系数进行实验,实验结果表明性能良好,可用于MEMS热电堆表面高温测试系统中,为系统的进一步完善打下基础。
HTransient temperatureH can hardly be measured using the traditional thermocouple as it is toohigh or the acting time is too short.Based on the HmicroelectronicsH technology and theHsemiconductor technologyH, MEMS Hthermopile sensorH which is a non-contact temperaturemeasuring device, using the Hinfrared radiationH as its mechanism, is not needed to contact themeasured objects and can effectively eliminate the errors of temperature field caused by theinstallation of the sensor to achieve non-contact temperature measurement; at the same time,as the micro temperature fluctuation of the object can cause a great change in radiation energy,the sensitivity of the Hinfrared radiation thermometersH is high.Therefore, the research oftransient surface high temperature measurement is available using MEMS thermopile sensor.Based on the Hinfrared radiation temperature measurementH, this paper Hspreads out expositionHaround the system of surface high temperature measurement using MEMS thermopile sensorand explores it in the aspects of Htheoretical designH and key part Hperformance analysisH.This paper firstly analyzes the Hcurrent research statusH of Htransient temperature testH andintroduces the structure, nowaday development and application of the Hthermopile sensorH.
Then, aiming at the temperature measuring actuality, a new method of high temperaturemeasurement is proposed using MEMS thermopile sensor and the system of transient (msscale) surface high temperature (1500℃--3000℃) measurement based on MEMS thermopileis designed, the function of various parts of the system and the selection of the material.arediscussed further;at one time, the static and dynamic calibration method of the system aresuggested and provide a theoretical basis to further the investigation.In addition, researchingon the infrared Habsorption coefficientH of key organ of the system--the ceramic material attenuation slice, typical FTIS measurement was discussed，and combination the characteristics ofhigh-temperature test system，a new measurement method—MEMS thermopile measurement wasproposed。The two methods verify each other and the test results show that MEMS thermopilemeasurement has a simpler and more accurate advantage, which gives a good basis for thesystem to achieve.At last, 4.5mm,5.5mm ZrOB2 Bceramic thin slices are manufactured in theway of molding before sintering and its absorption coefficient is being experimented. The testresults show that it has a good performance which can be using in the system of MEMSthermopile surface high temperature measurement and make a basis of furthering theimprovement of the system.
引文
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[15]OMRON Releases New,Cyclone-Type MEMS Flow Sensor[J].Business Wire,2007,9.
[16]刘义冬CMOS兼容的微机械P/N多晶硅热电堆红外传感器[J]功能材料与器件学报. 2007,13(3):226-232
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[19]田涛.一种新型MEMS微波功率传感器的设计与模拟[J].传感技术学报.2008,21(4):611-614
[20]许雄.基于A2TOPMI的电磁炉非接触式测温方案[J].实验科学与技术.2006,5:120-122
[21]Jayanta S.Kapat, Ultra-high temperature micro-electro-mechanical systems (MEMS)- based sensors[P], United States Patent, US7338202B1 2008-3-4 13-19
[22]S. Udina, M. Carmona, G. Carles, J. Santander, L. Fonseca, S. Marco, Sensors and Actuators B: Chemical, Volume 134, Issue 2, 25 September 2008, Pages 551-558
[23]P.Adrian.IRThermopile Have Growth Opportunities in Diverse OEM Applications.Sensor Business Digest[J]: Sensor Industry Developments and Trends, 2001,10
[24]Danijela Randjelovic, Zoran Djuric, Anastasios Petropoulos, Grigoris Kaltsas, Zarko Lazic, Mirjana Popovic,Microelectronic Engineering, In Press, Corrected Proof, Available online 13 December 2008
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