基于快速原型的电铸模具成形工艺研究
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摘要
随着生活质量和欣赏水平的提高,人们对新产品的追求越来越强烈,使得现在市面上的产品更新换代越来越快。为了满足顾客的需求,提升企业的竞争力,企业的产品正在向小批量、多样化、高质量的方向发展。而现代工业品的开发和技术水平的提高在很大程度上取决于模具制造技术的发展,这使得模具的设计与制造必须尽可能的缩短周期,不断降低开发成本。
快速成形技术给模具的设计与制造带来了一次飞跃。由于快速成形技术的应用,加上此基础上的快速制模技术的发展,使模具的设计与制造逐步趋向于数字化、快速化,“基于快速原型的电铸成形模具技术”能满足模具制造的新要求。电铸工艺具有极高的复制精度,能精确的复制出金属型腔;分层实体制造(LOM)是国内推广较早、技术较成熟且成本较低的原型制造方法,研究如何更好地把二者结合起来生产金属模具,对模具技术的发展具有深远的影响。
本文首先分析影响硫酸铜溶液电铸制造铜模的因素并对主要参数进行正交实验,得到了生产高质量铜模较优的技术参数。试验条件与工厂实际生产条件相同,所研究的成果对企业有更真实的指导价值。由于LOM原型直接电铸需要复杂的前期处理,本课题避开直接用其作为电铸载体,而是经过更适合的材料翻制转换,得到合适的电铸载体,使电铸质量更高。本文还对深孔电铸进行了初步的实验研究,总结了金属在深孔中沉积的规律,提出深孔可电铸径深比的最小极限是24%,探讨了深孔电铸中质量问题的解决方案。
本文提出了LOM原型+吸塑壳型+涂覆铜粉再电铸的快速制模的新工艺。为了检验研究成果,该技术成功应用于青岛纸塑制品有限公司太阳能管的内包装模具生产上,并批量生产产品。结果表明该新工艺是完全适合市场需求和企业实际利益的。
With the development of life quality and appreciation level, the pursuance for the new products is becoming keener, which causes the products innovation to be more and more quickly in the present. The requirement of customer’s and product competitiveness are leading the modern manufacturing to the development of low volume, multi-types, high quality, low cost and promptly market responding. The development of mould has become more and more important, which makes the design and fabrication period of mould must be shorted and its cost must be cut down.
Rapid prototyping is a leap in the design and manufacture mould field and, with its extensive application and the development of rapid tooling, which makes the design and manufacture of mould to the development of digitalization and rapidity. However, electroforming which based on rapid prototyping can satisfy these requirements. Furthermore, electroformed moulds are very precise, and it can copy the exterior accurately. In addition, LOM is one of manufacturing methods and it has put in use for a long time, technical perfection and low coat. The research for combining the two technologies has important significance.
The quality of electrochemical deposit layer is influenced by many factors. In this paper, the experimental and technological factors of arc spraying copper were carried through. The main factor and the optimum parameters for archive the best properties of the electroformed layer of cooper were obtained. The research under the condition of product line had also implemented. Therefore, the results are more valuable to corporation. Avoid using the rapid prototype as electroforming carrier due to its insufficiency, and we copy the exterior using the more proper material to keep the precision. Take account for the electroforming of deep hole for finding out the rule and its result shown that the limit electroform aperture ratio of deep hole is 24%, furthermore, the method of resolving the problems in manufacture are obtained.
A new technique of consisting of LOM, plastic-absorbing shape process and covering with copper powder has demonstrated. In order to validate the above experimental conclusions, the mould of solar tube’s inner packaging was fabricated by electroforming. Molded pulp products were produced by using this mould. In a word, the new technique is accord with the demand of market and benefits of enterprise.
快速成形技术给模具的设计与制造带来了一次飞跃。由于快速成形技术的应用,加上此基础上的快速制模技术的发展,使模具的设计与制造逐步趋向于数字化、快速化,“基于快速原型的电铸成形模具技术”能满足模具制造的新要求。电铸工艺具有极高的复制精度,能精确的复制出金属型腔;分层实体制造(LOM)是国内推广较早、技术较成熟且成本较低的原型制造方法,研究如何更好地把二者结合起来生产金属模具,对模具技术的发展具有深远的影响。
本文首先分析影响硫酸铜溶液电铸制造铜模的因素并对主要参数进行正交实验,得到了生产高质量铜模较优的技术参数。试验条件与工厂实际生产条件相同,所研究的成果对企业有更真实的指导价值。由于LOM原型直接电铸需要复杂的前期处理,本课题避开直接用其作为电铸载体,而是经过更适合的材料翻制转换,得到合适的电铸载体,使电铸质量更高。本文还对深孔电铸进行了初步的实验研究,总结了金属在深孔中沉积的规律,提出深孔可电铸径深比的最小极限是24%,探讨了深孔电铸中质量问题的解决方案。
本文提出了LOM原型+吸塑壳型+涂覆铜粉再电铸的快速制模的新工艺。为了检验研究成果,该技术成功应用于青岛纸塑制品有限公司太阳能管的内包装模具生产上,并批量生产产品。结果表明该新工艺是完全适合市场需求和企业实际利益的。
With the development of life quality and appreciation level, the pursuance for the new products is becoming keener, which causes the products innovation to be more and more quickly in the present. The requirement of customer’s and product competitiveness are leading the modern manufacturing to the development of low volume, multi-types, high quality, low cost and promptly market responding. The development of mould has become more and more important, which makes the design and fabrication period of mould must be shorted and its cost must be cut down.
Rapid prototyping is a leap in the design and manufacture mould field and, with its extensive application and the development of rapid tooling, which makes the design and manufacture of mould to the development of digitalization and rapidity. However, electroforming which based on rapid prototyping can satisfy these requirements. Furthermore, electroformed moulds are very precise, and it can copy the exterior accurately. In addition, LOM is one of manufacturing methods and it has put in use for a long time, technical perfection and low coat. The research for combining the two technologies has important significance.
The quality of electrochemical deposit layer is influenced by many factors. In this paper, the experimental and technological factors of arc spraying copper were carried through. The main factor and the optimum parameters for archive the best properties of the electroformed layer of cooper were obtained. The research under the condition of product line had also implemented. Therefore, the results are more valuable to corporation. Avoid using the rapid prototype as electroforming carrier due to its insufficiency, and we copy the exterior using the more proper material to keep the precision. Take account for the electroforming of deep hole for finding out the rule and its result shown that the limit electroform aperture ratio of deep hole is 24%, furthermore, the method of resolving the problems in manufacture are obtained.
A new technique of consisting of LOM, plastic-absorbing shape process and covering with copper powder has demonstrated. In order to validate the above experimental conclusions, the mould of solar tube’s inner packaging was fabricated by electroforming. Molded pulp products were produced by using this mould. In a word, the new technique is accord with the demand of market and benefits of enterprise.
引文
[1] 张连洪,崔国起,钟宏辉.基于快速原型制造的快速模具技术[J].机械设计,1999,(9):36～38.
[2] Prasad K.D.V.Yarlagadda,Ismet P.Ilyas, Periklis Christodoulou. Development of rapid tooling for sheet metal drawing using nickel electroforming stereolithography processes[J].Journal of Materials Processing Technology,2001,111:286～294.
[3] 王伊卿,卢凤兰,卢秉恒.电铸与电弧喷涂相结合制造 EDM 电极[J].电加工与模具,2001,4:41～43.
[4] 王伊卿,唐一平,赵文趁等.电铸与电弧喷涂相结合的模具制造方法[J].材料加工,2001,6:30～32.
[5] 朱林泉,白培康,朱江淼.快速成型与快速制造技术[M].北京:国防工业出版社,2003.1～192.
[6] 卢清萍.快速原型制造技术[M].北京:高等教育出版社,2001.1～151.
[7] 王运赣.快速成形技术[M].武汉:华中理工大学出版社,1999.1～146.
[8] 王秀峰,罗宏杰.快速原型制造技术[M].北京:中国轻工业出版社,200l.l～205.
[9] 卢秉恒,唐一平,王平.基于 RP 的快速制造技术[A].中国第二届RP技术与快速模具制造学术会议论文集[C].西安:1998.7～11.
[10] Kruth J P,Leu M C,and T Nakagawa progress in Additive Manufacturing and Rapid Prototyping[J]. Manufacturing Technology of CIRP ANNALS, 1998, 47(2): 530～535.
[11] 罗新华,唐亚新等.国内外RPM技术的应用及新进展[A].中国第二届RP技术与快速模具制造学术会议论文集[C].西安:1998.154～158.
[12] 罗兴华,花国然.国家快速成型制造技术的应用及进展[J].机械制造,1998,36(3):56～58.
[13] Wohlels T.Wohlers Report 2000:Rapid prototyping&tooling state of the industry[R].Annual Worldwide ProgressReport. Colorado,USA: WohlersAssociates, Inc.,2000.41～52.
[14] 张人佶,颜永年,单忠德.基于 CAD/CAM/RPM 的快速模具制造技术[J].计算机辅助设计与制造 CAD/CAM,2000(4):6～9.
[15] Yan Yongnian,Zhang Renji,Lu Qingping.Rapid prototyping&tooling in China[A].In:Solid Freedom Fabrication Proceedings Angust1999.Proceedings for Symposium on Solid Freedom Fabrication[C].Austin Texas,USA:Bourell D L, 1999. 83～88.
[16] 唐正连. 电铸与电弧喷涂快速制模技术研究[D].武汉.华中科技大学,2004.6.
[17] 池东明,张素风. 新技术在纸浆模塑制品生产过程中的应用[J].西南造纸,2004,33(5),42～43.
[18] 朱小东,李国兵,徐宏,帅大平. 基于 LOM 原型的电铸载体比较[J].湖南工业大学学报2007(5),39～41.
[19] 王伊卿,卢凤兰,卢秉恒,电铸与电弧喷涂相结合制造 EDM 电极[J],电加工与模具,2001,(4):41～43.
[20] Yeh S H,Liue C Y and Wang J W,etal. Microcomposite Electroforming for MEMS Technology. 1997 Symposium on Micromachining and Microfabrication,Austin,Texas,USA, 1997: 82～90.
[21] Malek C K, Thomas L. High-aspect-ratio Electroformed Ni-Co Microstructures with Improved Mold Adhesion Using a LIGA-like Process and a Novolak Sublayer. Design, Test,Integration, and Packaging of MEMS/MOEMS Meeting, Paris, France, 2000: 484～491.
[22] 赵阳培,黄因慧,喷射电铸快速成型技术的试验研究[J],徐州建筑职业技术学院学报,2003,3(1):40～42.
[23] E. S. Masuku, A. R. Mileham and H. Hardisty, et al. A Finite Element Simulation of the Electroplating Process. Annals of the CIRP, 2002, 51 (1): 169～172 .
[24] A. F. Averill, H. S. Mahmood. Determination of Tertiary Current Distribution in Electrodeposition Cells-Part 1 Computational Techniques. Transactions of the Institute of Metal Finishing, 1997, 75 (8): 228～233.
[25] A. F. Averill, H. S. Mahmood. Determination of Tertiary Current Distribution in Electrodeposition Cells-Part 2 Prediction of Current Distribution on Shaped Cathodes with Moving Electrolyte. Transactions of the Institute of Metal Finishing, 1998, 76 (2): 59～63.
[26] 孔庆华主编.特种加工[M].上海:同济大学出版社,1997.70～76.
[27] KMBahcobckar 主编.林能春等译.工业电铸[M].北京:兵器工业出版社,1991,1～200.
[28] 封万起,韩秀文,唐天军等.来复反射器注塑模具电铸工艺的研究[J].电镀与精饰,2000,5:5～9.
[29] 程深.搪瓷玩具模电铸工艺浅探[J].福建轻纺,1997,12:9～12.
[30] 刘苏南.预埋件与芯模镶拼组合整体电铸工艺技术[J].电子机械工程,1998,6:47～53.
[31] K.P.Wong, K.C.Chan, T.M.Yue. Modelling the effect of complex waveform on surface finishing in pulse current electroforming of nickel[J]. Surface and Coating Technology,2000,135:91～97.
[32] 刘仁志.快速成型技术及其在电铸中的应用[J].电镀与精饰,2006(5):24～28.
[33] 余承业.特种加工新技术[M].北京:国防工业出版社,1995.
[34] Masanori Kunieda et al.Rapid Prototying by Selective Electrodeposition Using Electrolyte Jet. Annals of theCIRP,1998,47.
[35] J A McGeough, M C Leu,K P Rajurkar.Electroforming process and application to micro/macro manufacturing.keynote paper in annals of CIRP,2001,50(2):499～513.
[36] K.P.Wong, K.C.Chan, T.M.Yue. Modelling the effect of complex waveform on surface finishingin pulse current electroforming of nickel[J]. Surface and Coating Technology,2000,135:91～97.
[37] A. Arthur, R.C. Cobb, P.M. Dickens. The potential for rapid prototyped EDM electrodes using stereolithography models [A]. in: Proceedings of the First National Conference on Rapid Prototyping and Tooling Research[C]. UK :Buckinghamshire College, November 1995, 221～235.
[38] P.K.D.V. Yarlagadda, V. Subramanian, P. Christodoulou.Feasibilitystudieson production of electro-discharge machining electrodes bystereolithography and electroforming process[J].Process Technology. 1999,89:231～237.
[39] PrasadK.D.V.Yarlagadda,Ismet P.ILyas,Periklis Christodoulou.Development of rapidtooling for sheet metal drawing using nickel electroforming and stereolithography process[J]. Journal of Materials Processing Technology, 2001, 111(2):286～294.
[40] L.S.Johansen, M.Ginnerup, J.T.Ravankikle, et al,Electroforming of 3D microstructures on highly structured surfaces [J]. Sensors and actuators, 2000, 83: 156～160.
[41] Allan E.W.Rennie, Chris E.Boking, Graham R.Bennett. Electroforming of rapid prototyping mandrels for electrodischarge machining electrodes [J]. Journal ofMaterials Processing Technology, 2001, 110: 186～196.
[42] 邹国林.熔融沉积制造精度及快速模具制造技术的研究[D].大连:大连理工大学,2002.
[43] 李健心.电铸技术在模具制造中的应用[J].潍坊高等专科学校学报,2000,(4):7～8.
[44] 吕益炎,王帮峰,吴安德,黄因慧.发展中的电铸技术[J].电加工模具,2000,(4):44～46.
[45] 陈国华,王光信.电化学方法[M].北京:化学工业出版社,2002.1～10.
[46] 王永祝.波导电铸的快速电沉积技术[J].电镀与精饰,1983 (5).
[47] 华涛.基于快速原型的快速模具制造[D].大连:大连理工大学,2003.
[48] 郭海生,金孝红,云乃彰.选择性电沉积快速成型法[J].电加工与模具,2000,(5):41～43.
[49] 李铭华,袁诗璞,黄渭澄,等编.高速电镀[M].成都:四川人民出版社, 1980. 30～43,73～77.
[50] 朱获,傅琼华.组合式电铸技术的试验研究[J].航空工艺技术,1996, (1) :3～5.
[51] 朱荻.组合式电铸工艺在精密微波器件上的应用[J].新技术新工艺,1996, (4) :43～44.
[52] 王帮峰,吴安德,吕益艳,黄因慧,余承业.一种解决传统电铸缺陷的新方 法[J].机械设计与制造工程,2001,30(3):66～68.
[53] Riegel H,Mitrovic J,Stephan K.Role of mass transfer on hydrogen evolution in aqueous media.Journal of Applied Electrochemistry,1998,28:10～17.
[54] Ghaemia M,BinderL.Effects of direct and pulse current on elec-trodeposition of manganese dioxide[J].Journal of Power Sources,2002,111:248～254.
[55] 王鸿建.电镀工艺学[M].哈尔滨:哈尔滨工业大学出版社,1995.
[56] Rpachitei I, Duszczyk J. Hydrofen evolution,incorporation and removal in electroless nickel composite coating on aluminium.Journal of Applied Electrochemistry,1999,29:837～843.
[57] 傅若清.从氛灯反光镜生产看电铸制造工艺[J].影视技术,2000,(7) :19～21.
[58] 赵剑峰,朱荻,云乃彰.精密模具电铸工艺研究[J].模具工业,1997,(6):41～44.
[59] 季峻.工程师质量管理实用教程[M].上海:上海科学技术出版社,1992,96～106.
[60] 任露泉.实验优化技术[M].机械工业出版社,1996.
[61] 王运赣.快速成形技术[M].武汉:华中理工大学出版社,1999.135～137.
[62] 张允诚,胡如南,向荣.电镀手册(第二版)[M].北京:国防工业出版社.691～704.
[63] 徐金全.非金属电镀工艺[P].中国专利:92105061.5,1992.6～26.
[64] 罗新华,唐亚新等.国内外 RPM 技术的应用及新进展[A].中国第二届 RP 技术与快速模具制造学术会议论文集[C].西安:1998.154～158.
[65] 唐正连.电铸与电弧喷涂快速制模技术研究[D].武汉:华中科技大学,2004.4～6.
[66] 松江.模具制造技术与发展趋势[J].模具制造,2006.3～6.
[67] 唐正连,叶升平.纸质原型的电铸预处理工艺[J].电镀与涂饰,2004,(2),9～12.
[68] 杨大春,云乃彰.组合式可溶性象形阳极电铸技术研究[J].新技术新工艺,2004,(2),33～34.
[69] 朱小东,张孝徽.纸浆模塑技术的发展及其模具的革新[J].株洲工学院学报,2002,(1),1～3.
[70] 朱小东,李国兵,徐宏,帅大平,王政.基于 RP 技术的纸浆模塑衬模电铸成形工艺研究[J]. 2007 中国机械工程学会年会论文集,2007,100～101.
[2] Prasad K.D.V.Yarlagadda,Ismet P.Ilyas, Periklis Christodoulou. Development of rapid tooling for sheet metal drawing using nickel electroforming stereolithography processes[J].Journal of Materials Processing Technology,2001,111:286～294.
[3] 王伊卿,卢凤兰,卢秉恒.电铸与电弧喷涂相结合制造 EDM 电极[J].电加工与模具,2001,4:41～43.
[4] 王伊卿,唐一平,赵文趁等.电铸与电弧喷涂相结合的模具制造方法[J].材料加工,2001,6:30～32.
[5] 朱林泉,白培康,朱江淼.快速成型与快速制造技术[M].北京:国防工业出版社,2003.1～192.
[6] 卢清萍.快速原型制造技术[M].北京:高等教育出版社,2001.1～151.
[7] 王运赣.快速成形技术[M].武汉:华中理工大学出版社,1999.1～146.
[8] 王秀峰,罗宏杰.快速原型制造技术[M].北京:中国轻工业出版社,200l.l～205.
[9] 卢秉恒,唐一平,王平.基于 RP 的快速制造技术[A].中国第二届RP技术与快速模具制造学术会议论文集[C].西安:1998.7～11.
[10] Kruth J P,Leu M C,and T Nakagawa progress in Additive Manufacturing and Rapid Prototyping[J]. Manufacturing Technology of CIRP ANNALS, 1998, 47(2): 530～535.
[11] 罗新华,唐亚新等.国内外RPM技术的应用及新进展[A].中国第二届RP技术与快速模具制造学术会议论文集[C].西安:1998.154～158.
[12] 罗兴华,花国然.国家快速成型制造技术的应用及进展[J].机械制造,1998,36(3):56～58.
[13] Wohlels T.Wohlers Report 2000:Rapid prototyping&tooling state of the industry[R].Annual Worldwide ProgressReport. Colorado,USA: WohlersAssociates, Inc.,2000.41～52.
[14] 张人佶,颜永年,单忠德.基于 CAD/CAM/RPM 的快速模具制造技术[J].计算机辅助设计与制造 CAD/CAM,2000(4):6～9.
[15] Yan Yongnian,Zhang Renji,Lu Qingping.Rapid prototyping&tooling in China[A].In:Solid Freedom Fabrication Proceedings Angust1999.Proceedings for Symposium on Solid Freedom Fabrication[C].Austin Texas,USA:Bourell D L, 1999. 83～88.
[16] 唐正连. 电铸与电弧喷涂快速制模技术研究[D].武汉.华中科技大学,2004.6.
[17] 池东明,张素风. 新技术在纸浆模塑制品生产过程中的应用[J].西南造纸,2004,33(5),42～43.
[18] 朱小东,李国兵,徐宏,帅大平. 基于 LOM 原型的电铸载体比较[J].湖南工业大学学报2007(5),39～41.
[19] 王伊卿,卢凤兰,卢秉恒,电铸与电弧喷涂相结合制造 EDM 电极[J],电加工与模具,2001,(4):41～43.
[20] Yeh S H,Liue C Y and Wang J W,etal. Microcomposite Electroforming for MEMS Technology. 1997 Symposium on Micromachining and Microfabrication,Austin,Texas,USA, 1997: 82～90.
[21] Malek C K, Thomas L. High-aspect-ratio Electroformed Ni-Co Microstructures with Improved Mold Adhesion Using a LIGA-like Process and a Novolak Sublayer. Design, Test,Integration, and Packaging of MEMS/MOEMS Meeting, Paris, France, 2000: 484～491.
[22] 赵阳培,黄因慧,喷射电铸快速成型技术的试验研究[J],徐州建筑职业技术学院学报,2003,3(1):40～42.
[23] E. S. Masuku, A. R. Mileham and H. Hardisty, et al. A Finite Element Simulation of the Electroplating Process. Annals of the CIRP, 2002, 51 (1): 169～172 .
[24] A. F. Averill, H. S. Mahmood. Determination of Tertiary Current Distribution in Electrodeposition Cells-Part 1 Computational Techniques. Transactions of the Institute of Metal Finishing, 1997, 75 (8): 228～233.
[25] A. F. Averill, H. S. Mahmood. Determination of Tertiary Current Distribution in Electrodeposition Cells-Part 2 Prediction of Current Distribution on Shaped Cathodes with Moving Electrolyte. Transactions of the Institute of Metal Finishing, 1998, 76 (2): 59～63.
[26] 孔庆华主编.特种加工[M].上海:同济大学出版社,1997.70～76.
[27] KMBahcobckar 主编.林能春等译.工业电铸[M].北京:兵器工业出版社,1991,1～200.
[28] 封万起,韩秀文,唐天军等.来复反射器注塑模具电铸工艺的研究[J].电镀与精饰,2000,5:5～9.
[29] 程深.搪瓷玩具模电铸工艺浅探[J].福建轻纺,1997,12:9～12.
[30] 刘苏南.预埋件与芯模镶拼组合整体电铸工艺技术[J].电子机械工程,1998,6:47～53.
[31] K.P.Wong, K.C.Chan, T.M.Yue. Modelling the effect of complex waveform on surface finishing in pulse current electroforming of nickel[J]. Surface and Coating Technology,2000,135:91～97.
[32] 刘仁志.快速成型技术及其在电铸中的应用[J].电镀与精饰,2006(5):24～28.
[33] 余承业.特种加工新技术[M].北京:国防工业出版社,1995.
[34] Masanori Kunieda et al.Rapid Prototying by Selective Electrodeposition Using Electrolyte Jet. Annals of theCIRP,1998,47.
[35] J A McGeough, M C Leu,K P Rajurkar.Electroforming process and application to micro/macro manufacturing.keynote paper in annals of CIRP,2001,50(2):499～513.
[36] K.P.Wong, K.C.Chan, T.M.Yue. Modelling the effect of complex waveform on surface finishingin pulse current electroforming of nickel[J]. Surface and Coating Technology,2000,135:91～97.
[37] A. Arthur, R.C. Cobb, P.M. Dickens. The potential for rapid prototyped EDM electrodes using stereolithography models [A]. in: Proceedings of the First National Conference on Rapid Prototyping and Tooling Research[C]. UK :Buckinghamshire College, November 1995, 221～235.
[38] P.K.D.V. Yarlagadda, V. Subramanian, P. Christodoulou.Feasibilitystudieson production of electro-discharge machining electrodes bystereolithography and electroforming process[J].Process Technology. 1999,89:231～237.
[39] PrasadK.D.V.Yarlagadda,Ismet P.ILyas,Periklis Christodoulou.Development of rapidtooling for sheet metal drawing using nickel electroforming and stereolithography process[J]. Journal of Materials Processing Technology, 2001, 111(2):286～294.
[40] L.S.Johansen, M.Ginnerup, J.T.Ravankikle, et al,Electroforming of 3D microstructures on highly structured surfaces [J]. Sensors and actuators, 2000, 83: 156～160.
[41] Allan E.W.Rennie, Chris E.Boking, Graham R.Bennett. Electroforming of rapid prototyping mandrels for electrodischarge machining electrodes [J]. Journal ofMaterials Processing Technology, 2001, 110: 186～196.
[42] 邹国林.熔融沉积制造精度及快速模具制造技术的研究[D].大连:大连理工大学,2002.
[43] 李健心.电铸技术在模具制造中的应用[J].潍坊高等专科学校学报,2000,(4):7～8.
[44] 吕益炎,王帮峰,吴安德,黄因慧.发展中的电铸技术[J].电加工模具,2000,(4):44～46.
[45] 陈国华,王光信.电化学方法[M].北京:化学工业出版社,2002.1～10.
[46] 王永祝.波导电铸的快速电沉积技术[J].电镀与精饰,1983 (5).
[47] 华涛.基于快速原型的快速模具制造[D].大连:大连理工大学,2003.
[48] 郭海生,金孝红,云乃彰.选择性电沉积快速成型法[J].电加工与模具,2000,(5):41～43.
[49] 李铭华,袁诗璞,黄渭澄,等编.高速电镀[M].成都:四川人民出版社, 1980. 30～43,73～77.
[50] 朱获,傅琼华.组合式电铸技术的试验研究[J].航空工艺技术,1996, (1) :3～5.
[51] 朱荻.组合式电铸工艺在精密微波器件上的应用[J].新技术新工艺,1996, (4) :43～44.
[52] 王帮峰,吴安德,吕益艳,黄因慧,余承业.一种解决传统电铸缺陷的新方 法[J].机械设计与制造工程,2001,30(3):66～68.
[53] Riegel H,Mitrovic J,Stephan K.Role of mass transfer on hydrogen evolution in aqueous media.Journal of Applied Electrochemistry,1998,28:10～17.
[54] Ghaemia M,BinderL.Effects of direct and pulse current on elec-trodeposition of manganese dioxide[J].Journal of Power Sources,2002,111:248～254.
[55] 王鸿建.电镀工艺学[M].哈尔滨:哈尔滨工业大学出版社,1995.
[56] Rpachitei I, Duszczyk J. Hydrofen evolution,incorporation and removal in electroless nickel composite coating on aluminium.Journal of Applied Electrochemistry,1999,29:837～843.
[57] 傅若清.从氛灯反光镜生产看电铸制造工艺[J].影视技术,2000,(7) :19～21.
[58] 赵剑峰,朱荻,云乃彰.精密模具电铸工艺研究[J].模具工业,1997,(6):41～44.
[59] 季峻.工程师质量管理实用教程[M].上海:上海科学技术出版社,1992,96～106.
[60] 任露泉.实验优化技术[M].机械工业出版社,1996.
[61] 王运赣.快速成形技术[M].武汉:华中理工大学出版社,1999.135～137.
[62] 张允诚,胡如南,向荣.电镀手册(第二版)[M].北京:国防工业出版社.691～704.
[63] 徐金全.非金属电镀工艺[P].中国专利:92105061.5,1992.6～26.
[64] 罗新华,唐亚新等.国内外 RPM 技术的应用及新进展[A].中国第二届 RP 技术与快速模具制造学术会议论文集[C].西安:1998.154～158.
[65] 唐正连.电铸与电弧喷涂快速制模技术研究[D].武汉:华中科技大学,2004.4～6.
[66] 松江.模具制造技术与发展趋势[J].模具制造,2006.3～6.
[67] 唐正连,叶升平.纸质原型的电铸预处理工艺[J].电镀与涂饰,2004,(2),9～12.
[68] 杨大春,云乃彰.组合式可溶性象形阳极电铸技术研究[J].新技术新工艺,2004,(2),33～34.
[69] 朱小东,张孝徽.纸浆模塑技术的发展及其模具的革新[J].株洲工学院学报,2002,(1),1～3.
[70] 朱小东,李国兵,徐宏,帅大平,王政.基于 RP 技术的纸浆模塑衬模电铸成形工艺研究[J]. 2007 中国机械工程学会年会论文集,2007,100～101.