半导体制冷系统强化传热的研究
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摘要
半导体制冷技术已经在一些领域得到应用，然而在应用过程中还有问题特别是热传热问题没有解决好，导致整个制冷系统效率低下，因此需要利用强化传热措施进一提高半导体制冷系统的传热性能，提高其制冷效率。本文主要研究工作如下：
1、分析了半导体制冷热电效应组成、半导体制冷系统传热及制冷特性、制冷器散热器和散冷器的连接方式等。
2、利用ANSYS软件对不同结构的散热器进行温度场数值模拟，得出在相同体积的铝制散热器散热最优化结构。
3、通过建立半导体制冷系统实验平台，在稳定工况下测量采集各种实验数据并数值模拟结果进行比较分析。
通过以上分析研究发现实验与数值模拟结果吻合较好，得出主要研究结论如下：
1、由数值模拟得体积为V=9×10~4mm~3的铝制散热器限定底板座长度和底板座宽x_1=100mm、x_2=100mm，则其最优化散热结构是底板座厚度x_3=4.6mm，翅片高度x_5=40mm，翅片数目x_6=22，翅片底端厚度x_4=0.7mm，翅片顶端厚度x_7=0.3mm。
2、半导体制冷系统采取风冷散热时对于半导体制冷器功率在60W以内时可以采12V/0.2A规格的散热风扇，其性价比最优，但在风扇选型时要注意风扇尺寸与散热器面尺寸相匹配。
3、在相同体积下散热器方形结构比梯形状结构具有更好的散热效果，散热器翅数目的增加更利于提高散热效果。在一定制冷量要求下可以适当降低半导体制冷器的定功率，这样可以在满足制冷量要求的前提下达到比较高的制冷效率。
4、导热硅胶对半导体制冷系统热端散热的作用显著，在风冷和水冷散热方式下得系统的最大COP分别由原来的22.5%、24%增加到36%、48%。
The semiconductor refrigeration has been used in some fields. However, there are someproblems during the use of semiconductor refrigeration, and the main problem is heat transfer,which results in the decrease of refrigerant efficiency. Consequently, some measures of heattransfer enhancement should be used to improve the performance of semiconductorrefrigerating system so as to increase the refrigerant efficiency. The main work of this thesisis as follows:
1.The composition of thermoelectric effect about semiconductor refrigeration wasexpounded, and the heat transfer’s features and refrigeration’s features of semiconductorrefrigeration system were analysed. Besides, the connection types about refrigerationequipments and heat dissipation equipments were analysed.
2. The temperature fields of those heat dissipation equipments with different structureswere simulated by ANSYS software, and the thesis got the optimized structure of heatdissipation equipments with the certain volume.
3. Through the establishment of experimental platform about the semiconductorrefrigeration system, experimental data was measured and analysed, and the results wascompared with numerical simulation’s.
Through above analysis the thesis found that the experiment results agree well withnumerical simulation results, the main conclusions of the thesis are as follows:
1. Through numerical simulation, if the volume of a aluminous heat dissipationequipment is V=9×10~4mm~3, limiting both the length and width of the base is x_1=100mm,x_2=100mm, and the optimized structure of the equipment is that the thickness of the base isx_3=4.6mm, the height of fins is x_5=40mm, the number of fins is x_6=22, the bottom thicknessof fins is x_4=0.7mm, and the top thickness of fins is x_7=0.3mm.
2. Adopting forced air cooling, if the refrigeration equipment’s power of semiconductorrefrigeration system is less than 60W, so as to attain the highest cost performance, the coolingfan could take 12V/0.2A. Besides, the size of the cooling fan should be matched with the heatdissipation equipment.
3. Under the same volume，the heat dissipation effect of square structure is better thanthe effect of ladder type, and the number of the fin is the more the better. Besides, with thesame refrigerating output, the power of the refrigeration equipment could be reduced by acertain degree so as to reach a high refrigeration efficiency.
4. Silica gel is helpful to semiconductor refrigeration system’s heat dissipation. With the use of silica gel, the system’s COP increases to 36% from 22.5% for forced air cooling, andincreases to 48% from 24% for water cooling.
1、分析了半导体制冷热电效应组成、半导体制冷系统传热及制冷特性、制冷器散热器和散冷器的连接方式等。
2、利用ANSYS软件对不同结构的散热器进行温度场数值模拟，得出在相同体积的铝制散热器散热最优化结构。
3、通过建立半导体制冷系统实验平台，在稳定工况下测量采集各种实验数据并数值模拟结果进行比较分析。
通过以上分析研究发现实验与数值模拟结果吻合较好，得出主要研究结论如下：
1、由数值模拟得体积为V=9×10~4mm~3的铝制散热器限定底板座长度和底板座宽x_1=100mm、x_2=100mm，则其最优化散热结构是底板座厚度x_3=4.6mm，翅片高度x_5=40mm，翅片数目x_6=22，翅片底端厚度x_4=0.7mm，翅片顶端厚度x_7=0.3mm。
2、半导体制冷系统采取风冷散热时对于半导体制冷器功率在60W以内时可以采12V/0.2A规格的散热风扇，其性价比最优，但在风扇选型时要注意风扇尺寸与散热器面尺寸相匹配。
3、在相同体积下散热器方形结构比梯形状结构具有更好的散热效果，散热器翅数目的增加更利于提高散热效果。在一定制冷量要求下可以适当降低半导体制冷器的定功率，这样可以在满足制冷量要求的前提下达到比较高的制冷效率。
4、导热硅胶对半导体制冷系统热端散热的作用显著，在风冷和水冷散热方式下得系统的最大COP分别由原来的22.5%、24%增加到36%、48%。
The semiconductor refrigeration has been used in some fields. However, there are someproblems during the use of semiconductor refrigeration, and the main problem is heat transfer,which results in the decrease of refrigerant efficiency. Consequently, some measures of heattransfer enhancement should be used to improve the performance of semiconductorrefrigerating system so as to increase the refrigerant efficiency. The main work of this thesisis as follows:
1.The composition of thermoelectric effect about semiconductor refrigeration wasexpounded, and the heat transfer’s features and refrigeration’s features of semiconductorrefrigeration system were analysed. Besides, the connection types about refrigerationequipments and heat dissipation equipments were analysed.
2. The temperature fields of those heat dissipation equipments with different structureswere simulated by ANSYS software, and the thesis got the optimized structure of heatdissipation equipments with the certain volume.
3. Through the establishment of experimental platform about the semiconductorrefrigeration system, experimental data was measured and analysed, and the results wascompared with numerical simulation’s.
Through above analysis the thesis found that the experiment results agree well withnumerical simulation results, the main conclusions of the thesis are as follows:
1. Through numerical simulation, if the volume of a aluminous heat dissipationequipment is V=9×10~4mm~3, limiting both the length and width of the base is x_1=100mm,x_2=100mm, and the optimized structure of the equipment is that the thickness of the base isx_3=4.6mm, the height of fins is x_5=40mm, the number of fins is x_6=22, the bottom thicknessof fins is x_4=0.7mm, and the top thickness of fins is x_7=0.3mm.
2. Adopting forced air cooling, if the refrigeration equipment’s power of semiconductorrefrigeration system is less than 60W, so as to attain the highest cost performance, the coolingfan could take 12V/0.2A. Besides, the size of the cooling fan should be matched with the heatdissipation equipment.
3. Under the same volume，the heat dissipation effect of square structure is better thanthe effect of ladder type, and the number of the fin is the more the better. Besides, with thesame refrigerating output, the power of the refrigeration equipment could be reduced by acertain degree so as to reach a high refrigeration efficiency.
4. Silica gel is helpful to semiconductor refrigeration system’s heat dissipation. With the use of silica gel, the system’s COP increases to 36% from 22.5% for forced air cooling, andincreases to 48% from 24% for water cooling.
引文
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