精密金属膜电阻器用耐高温耐高湿封装涂料研究
详细信息    本馆镜像全文|  推荐本文 |  |   获取CNKI官网全文
摘要
电阻器是电子设备中常用的电子元器件之一,在某些特殊环境下,要求电阻器能耐高温和高湿,且电阻变化率很小,而电阻器用的封装涂料在制备符合性能要求的电阻器方面起着至关重要的作用。
     在电子封装中,酚醛树脂和环氧树脂具有优异的电气性能,是常用的电子封装材料。酚醛树脂固化体系简单(苯酚和甲醛聚合),是电阻器用涂料的首选材料,当前国内电阻器生产公司主要使用国产或进口的酚醛树脂涂料。但酚醛树脂存在一些难以克服的缺点,高温固化时会释放出有毒物质苯酚和甲醛,并在涂层膜中产生针孔。酚醛涂料固化物质脆、韧性差,难以满足特殊环境下的耐高温、耐高湿性能要求。为从根本上解决酚醛树脂涂料的固有缺点,本文另辟蹊径,用端羟基硅油、环氧树脂、酸酐、二元醇、纳米SiO2等首次研制出适合自动化生产线需要的精密金属膜电阻器用耐高温、耐高湿环氧树脂涂料。
     用具有活性的端羟基硅油改性环氧树脂,制得韧性较好的有机硅环氧树脂,解决了环氧树脂固化物交联密度高时韧性差的缺点。用酸酐高温固化剂、二元醇促进剂组成的潜伏性固化体系创造性地解决了电阻器用环氧树脂涂料的固化问题,从而把涂料室温使用期长(至少保质6个月)和高温快速固化(170℃时2min内表干)的矛盾统一起来。这种体系的涂料具有较好的耐高温、高湿性能,在耐高温实验中,电阻变化率在万分之五左右,满足指标ΔR/R≤1.0‰要求;耐高湿实验中,电阻变化率最小可达1.05‰,接近指标ΔR/R≤1.0‰。电解氧化腐蚀使电阻器金属膜局部或全部破坏是电阻器耐湿失效的原因。纳米SiO2具有较高的表面活性和三维对称结构,与环氧树脂有着较强的作用力。电阻涂料研究表明,纳米SiO2对环氧树脂涂料的固化具有催化作用,提高表干效果,并使涂料固化物具有较好的防水性能,满足耐高湿实验中电阻变化率小于1.0‰的要求。
     低-高温固化工艺能提高环氧树脂固化物的性能,140℃/3min-170℃/4min、140℃/3min-170℃/2min-190℃/2min等表干工艺首次应用于提高电阻涂料的耐高湿性能,取得较好的效果。249K?临界阻值电阻器在250V极限电压下实验以及2.2M?电阻器的金属膜薄,对涂料耐高湿性能要求很高;双固化剂/双促剂体系涂料的设计创造性地解决了这两种特殊电阻器的耐高湿问题,耐高湿实验后电阻变化率满足特定性能指标要求。通过与日本和国产的酚醛电阻涂料比较,所研发的环氧树脂电阻涂料具有优异的耐高湿性能,并避免了使用酚醛涂料所带来的缺点。目前,所研制涂料已通过生产线试验,正在北京公司进行240h和2000h的耐高湿、耐高温环境模拟试验。
Resistor is one of components commonly used in electronic equipments. In some special use, the resistor is required to resist high temperature and humidity and the varying ratio of resistance is very little. While the packaging paint used for resistors plays a critical role in the produce of resistors meeting performance required.
     Phenolic resin and epoxy resin is in common use in electronic packaging because of their excellent electrical properties. With simple curing system, just polymerizing of phenol and formaldehyde, phenolic resin becomes preferred material of paint for resistor. Resistor companies in our country mainly use phenolic resin paint made in our own country or imported at present. However, phenolic resin paint has some avoidless disadvantages, with toxicants released such as phenol and formaldehyde leading to pinholes in finished film when cured at high temperature. And the polymer of phenolic resin paint for resistor has bad tenacity, incapable of meeting requirements of high temperature and humidity resistance in special circumstances. In order to radically solve the intrinsic disadvantages of phenolic resin paint, a kind of paint in the paper, with properties of high temperature and humidity resistance and suitable for automated production line for mental film resistors, was first developed in a larruping way by hydroxy end capping silicone oil, epoxy resin, acid anhydride, diols, nano-SiO2 and so on.
     Activated hydroxy end capping silicone oil was used for modifying epoxy resin to prepare organic silicone epoxy resin with better tenacity, which solved the disadvantage of bad tenacity of epoxy resin polymer with high crosslink density. Latent curing system, composed of acid anhydride high temperature curing agent and diols accelerant, creatively solves the curing problem of epoxy resin paint for resistor, and combines long use at room temperature, with good property kept for at least six months, to fast curing in 2min at 170℃. Such paint has good property of high temperature and humidity resistance. The varying ratio of resistance is about 0.5‰, meeting indicator requirementΔR/R≤1.0‰, in high temperature resistance experiment. The least varying ratio of resistance is about 1.05‰, close to indicator requirementΔR/R≤1.0‰, in high humidity resistance experiment. The failure of high humidity resistance for resistor is attributed to part or complete damage of metal film on resistor by electrolytic oxidation corrosion. Nano-SiO2, with higher surface activity and tridimensional symmetrical structure, has a strong force with epoxy resin. Investigation on paint for resistor shows nano-SiO2 can catalyze the curing of epoxy resin paint, improve surface dry effect, make the paint polymer has good waterproof property and meet the indicator requirementΔR/R≤1.0‰in high humidity resistance experiment.
     Low-high-temperature curing process can improve the properties of epoxy resin polymer. Surface dry processes, such as 140℃/3min-170℃/4minn and 140℃/3min-170℃/2min-190℃/2min and so on, are first used to improve the property of high humidity resistance of resistor paint and achieve better results. Critical resistance 249K? resistor, experimenting using 250V limit voltage, and 2.2M? high resistance resistor with thinner film have more rigorous requirement of high humidity resistance of resistor paint. The design of epoxy resin paint for resistor, with two curing agents and dual accelerants system, creatively resolves the problem of high humidity resistance for the two particular kinds of resistors, the varying ratio of resistance meeting indicator requirement given in high humidity resistance experiment. Compared with phenolic resin paint made in our own country and imported from Japan, the epoxy resin paint developed by us has excellent property of high humidity resistance, and avoids the disadvantages resulted from the application of phenolic resin paint. Currently, the epoxy resin paint developed has passed experiment on the production line of resistor and having experimented on high humidity and temperature surroundings simulated resistance of paint for 240h and 2000h in Bejing company.
引文
[1] 王伟.环氧树脂固化技术及其固化剂研究进展.热固性树脂,2001,16(3):29-33
    [2] 王志高.耐高温环氧树脂胶粘剂粘接.粘接,1991,12(3):20-21
    [3] 张多太.耐高温阻燃新型F系列环氧树脂固化剂在胶粘剂中的应用研究.热固性树脂,1997,12(4):52-55
    [4] 叶枫,李恩普,张忠武等.环氧树脂柔韧固化剂-链烯基琥珀酸酐的研究.热固性树脂,1996,11(2):28-33
    [5] 李清秀等.环氧树脂的韧性固化剂的合成.复旦学报(自然科学版),1997,36(4):469-474
    [6] 韦春.一种韧性环氧固化剂的合成研究.绝缘材料通讯,1998,(3):1l-13
    [7] 何培新,肖卫东.环氧树脂固化物的阻燃化研究.辽宁化工,1998,27(4):187-191
    [8] 陈红,吴良义.磷系阻燃环氧树脂与固化剂.热固性树脂,2002,17(1):39-43
    [9] Shieh, Jeng-Yueh; Wang, Chun-Shan.Synthesis and properties of Novel phosphorus-containing Hardener for Epoxy Resins. Journal of Applied Polymer Science, 2000,78(9):1636-1644
    [10] 张多太,张曦.耐高温阻燃新型F系列环氧树脂固化剂的性能.宇航材料工艺,1998,28(5):29-33
    [11] 杨耘.新型环氧树脂固化剂的研究进展.郑州工业高等专科学校学报,2001,17(2):17-19
    [12] 徐羽梧,倪才华.一种新型环氧树脂固化剂固化性能的研究.化学世界,1990,31(11):499-501
    [13] 荷兰开发出涂料用新型异氰酸酯型低温固化剂.新材料产业,2003,(7):50-51
    [14] 刘东晖,刘培礼,黄徽波.新型环氧树脂固化剂-端氨基聚氧化丙烯醚.热固性树脂,2001,16(2):30-33
    [15] 袁劲松,吴海峰.新型环氧树脂固化剂的研究.绝缘材料通讯,1999,(3):4-6
    [16] Khurana Parveen, Choudhary Veena,Narula A.K. Curing and thermal behavior of diglycidyl ether of bisphenol A in the presence of a mixture of amines. Journal of Applied Polymer Science,2003,90(7):1739-1747
    [17] 宁荣昌,舒武炳,马蕊然等.中温固化树脂的研究(二)E-51环氧树脂/DDS/钝化咪唑体系.热固性树脂,1993,8(1):l8-22
    [18] 许显成.新型环氧树脂固化体系的研究.绝缘材料通讯,1995,(4):4-7
    [19] 焦剑,蓝立文,宁荣昌.改性双氰胺固化环氧树脂的研究.西北工业大学学报,1999,17(4):619-623
    [20] Lee F W,Baron K S. Modified imidazole latent epoxy resin catalysts and systems comprising them, United States Patent, 4742148, 1988 -07-02
    [21] Beitchman, Burton D Z, Philip J, Isocyanate blocked imidazoles and imidazolines for epoxy powder coating, United States Patent US, 4335228, 1982-04-15
    [22] 郑亚萍,宁荣昌.环氧/咪唑固化体系性能研究,工程塑料应用.2000,28(9):13-15
    [23] 潘煜怡.咪唑类环氧树脂固化剂的改性方法及其应用.热固性树脂,2001,16(4): 21-24
    [24] Smith J DB .Metal acetylacetonates as latent accelerators for anhydride-cured epoxy resins. Journal of Applied Polymer Science,1981,26(3):979-986
    [25] 韩丽洁,陈平.稀土有机化合物做酸酐/环氧树脂体系潜伏性促进剂的研究.中国胶粘剂,1994,4(4):20-24
    [26] 陈平,刘立柱等.苄基二甲胺/双氰胺/环氧树脂体系固化反应和固化物性能的研究.纤维复合材料,1997,14(3):5-10
    [27] 袁知舜,吕凌.潜伏性二酰肼固化剂的研制及应用.河南化工,1997,(l1):11-13
    [28] 李建宗,程时远.环氧树脂/BPEA-2潜伏性固化体系的研究.粘接,1992,13(6):8-10
    [29] 洪宗国,杨政险.三氟化硼微胶囊热固化环氧树脂胶粘剂研究.粘接,2000,21(6):7-10
    [30] K Hong, S Park. Melamine resin microcapsules containing fragrant oil: synthesis and characterization. Materials Chemistry and Physics,1999, 58:l28-l3l
    [31] Kunz-Douglass S, Beaumont P W R, Ashby M F. Model for the toughness of epoxy-rubber particulate composites . Journal of Materials Science, 1980,15(5):1109-1123
    [32] Bacson, Jones, Peyser.Acoustic emission from composite-reinforced metals. Journal of Applied Polymer Science,1 975,19(1):2545-2549
    [33] Kinloch,Shaw,Huston. Deformation and fracture behaviour of a rubber-toughened epoxy: Microstructure and fracture studies. Polymer,1983, 24(10):1 341-1 354
    [34] Yee A F, Pearson R A. Toughening mechanisms in elastomer-modified epoxy. part l: Mechanical studies. Journal of Materials Science,1986,21(7):2 462-2474
    [35] Lange F F.Model for the toughness of epoxy-rubber particulate composite. Philosophical Magazine,1970(22):983-987
    [36] Margolina A, Wu Souheng. Percolation model for brittle tough transition in polymer blends. Polymer,1988(29): 2l70-2l73
    [37] Wu Souheng, Margolina A. Letter: reply to comments. Polymer, 1 990(31): 972-974
    [38] Spanoudakis Young. Crack propagation in a glass particle-filled epoxy resin. part 2: Effect of particle-matrix adhesion. Journal of Materials Science, 1984,19(2): 487-496
    [39] Kinloch Young Maxwel1. Fracture of hybrid-particulate composites. Journal of Materials Science,1985,20(1): 4169-4184
    [40] 孙以实,张增民,傅增力等.弹性体共混改性聚丙烯的增韧机理.高分子学报,1995(1):82-87
    [41] 吕素平,漆宗能.聚合物共混体脆韧转变的损伤竞争理论—聚合物脆韧转变的分子链参数判据.科学通报,1995,40(6):523-525
    [42] Bahadur S, Tabor D. The wear of filled polytetra fluoroethylene. Wear, 1984, 98(5): 1-13
    [43] Yu Laigui, Bahadur S, Xue Qunji. An investigation of the friction and wear behaviors of ceramic particle filled polyphenylene dulfide composites. Wear, 1992, 154(2): 151- 165
    [44] 史孝群,肖久梅,龚睿秀等.环氧树脂增韧研究进展.绝缘材料,2002(1):31-34
    [45] M imura K, Ito H, Fu iioka H. Improvement of thermal and mechanical properties by control of morphologies in PES-modified epoxy resins. Polymer, 2000,41(12): 4451-1156
    [46] Huang Ping, Zheng Sixun, Huang Jinyu et a1. Miscibility and mechanical properties of epoxy resin/polysulfone blends. Polymer, 1997, 38(22):5565-5570
    [47] M urakami A, Shonaike G, Poishi K et a1. Fracture toughness of PEI modified epoxy resin CFRP composites. Journal of Reinforced Plastics and Composites, 2000, 1 9(2): 137-141
    [48] Rong Minzhi, Zeng Hanmin. Polycarbonate-epoxy semi-in-terpenetrating polymer network: phase separation and morphology. Polymer, 1997,38(2): 269-274
    [49] Merfeld Glen D, Yeager Gary W, Chao Herbert S et a1. Phase behavior and morphology of poly(phenylene ether)/epoxy blends. Polymer, 2003,44(1 7): 4981-4992
    [50] 陈平,孙明,唐忠鹏等.环氧树脂增韧技术研究进展及发展方向.纤维复合材料,2003,20(2):12-15
    [51] Varley R J, Hodgkin J H,Simon G P. Toughening of a tri-functional epoxy system. Part VI. Structure property relationships of the thermoplastic toughened system. Polymer, 2001, 42(8):3847-3858
    [52] 薛寒松,李华基,王勇勤.薄壁件差压铸造的充型特点及影响因素.重庆大学学报,2002,25(10):20-22
    [53] 董选普,黄乃瑜,吴树森等.用真空差压铸造法生产复杂薄壁铝合金铸件.特种铸造及有色合金,2001,(4):21-23
    [54] 刘志明,曲万春,董秀琪等.关于低压及差压铸造发展方向的探讨.铸造技术,1999,(2):25-28
    [55] 施利毅,陈伟.PU/EP共混物中的化学反应及粘接性能的研究.中国胶粘剂,1998,7(1):20-22
    [56] 管云林,郭锦棠.聚氨酯/环氧树脂互穿网络聚合物相行为与粘接剪切性能的研究.高分子材料科学与工程,1996,12(5):122-127
    [57] Ishizu K. Synthesis and structural ordering of core–shell polymer microspheres. Progress in Polymer Science, 1998, 23(8):1383-1408
    [58] Ueta Shigeyuki, Lei Wei-Yuan, Koga Keiko et a1. Preparation of N-grafted poly(p-phenyleneterephthalamide) and applications to a molecular composite with epoxy resin. Journal of Polymer Science, 1993, 25(2):185-191
    [59] 陈春伟,姚萍. 聚甲基苯基硅氧烷改性环氧树脂. 合成树脂及塑料,1991,8(4):8-12
    [60] Lee S S, Kim S C. Morphology and properties of polydimethylsiloxane-modified epoxy resin . Journal of Applied Polymer Science, 1997, 64(5): 94l-955
    [61] 侯庆普,黄英. 环氧模塑料的低应力化技术.中国塑料,1999,13(10):5-10
    [62] 储九荣. 有机硅高聚物改性环氧树脂的方法与机理. 高分子通报,1999, (2): 66-72
    [63] Divid Levy. Novel Inorgaic/organic Hybrid Materials Prepared by a Sol-gel Spinning Technique. Advanced Materials, 1995, (7): 120-128
    [64] 井新利,郑茂盛.PMMA-SiO2原位复合材料制备及性能研究.高分子材料科学与工程,1998,14(4):62- 64
    [65] 王庭蔚,陈逸范.高介电性能的陶瓷-聚合物复合材料初探.高分子材料科学与工程,1995,12(5):77-82
    [66] 章永华.有机-无机混杂纳米材料.高技术通讯,1995,(7):56-59
    [67] 黄金满,杨毅.硫化镉纳米微粒在聚合物网络中的组装.高等学校化学学报,1995,16(12):1976-1977
    [68] Colvin V L, Goldstein A N, Alivisatos A P. Semicon-duetor Nanocrystals Covalently Bound to Metal Surfaces with Self-assembled Monolayers . Journal of the American Chemical Society, 1992, 114(13): 5221- 5230
    [69] 宋国君,舒文艺.聚合物纳米复合材料.材料导报,1996,(4):57-62
    [70] 肖冰.聚合物/粘土纳米复合材料最新进展.工程塑料应用,1998,26(8):28-30
    [71] 王洪祚,王颖.橡胶增韧聚合物机理.环氧树脂应用技术,2000,17(2):29-32
    [72] 吕彦梅,唐华杰,侯馨.刚性增韧材料.塑料科技,1999,(1):33-37
    [73] 郑亚萍,宁荣昌.纳米SiO2环氧树脂复合材料性能研究,玻璃钢/复合材料,2001(2):34-36
    [74] 傅万里,刘竞超,陈小飞等.环氧树脂/粘土纳米复合材料的研究.热固性树脂,2002,17(2):19-21
    [75] Wetzel Bernd, Haupert Frank, Zhang M ingqiu. Epoxy nanocomposites with high mechanical and tribological performance. Composites Science and Technology, 2003, 63(14): 2055-2067
    [76] 刘竞超,张华林,李小兵等.粒子分散性对环氧树脂/纳米SiO2材料性能的影响.合成树脂及塑料,2002,l9(1):30-33
    [77] 刘竞超,李小兵,杨亚辉等.偶联剂在环氧树脂/纳米SiO2复合材料中的应用.中国塑料,2000,14(9):45-48
    [78] 李小兵,刘竞超.超声波在制备nano- SiO2/环氧树脂复合材料中的应用.热固性树脂,1999,14(2):l9-22
    [79] 彭志刚,张炜,曾金芳.纳米SiO2粒子对环氧粘接剂力学性能影响研究.固体火箭技术,2002,25(4):50-52
    [80] Sungtack Kang, Sung H Hong, Chul Rim et al. Preparation and Characterization of Epoxy Composites Filled with Functionalized Nanosilica Particales Obtained Via Sol-Gel Process. Polymer,2001,(42):879-887
    [81] 于淑丽.纳米SiO2/环氧树脂复合材料摩擦磨损性能研究:[硕士学位论文],广州;中山大学,1999
    [82] 郑亚萍,宁荣昌,乔生儒等.聚合物基纤维纳米复合材料研究,工程塑料应用,1999,27(12):4-5
    [83] 黄国丰,黄玉东,王兴华等.纳米SiO2在玻璃钢拉挤制品中的应用.玻璃钢/复合材料,2002,(3):35-36
    [84] 胡斌.图表细说电子元器件. 北京:电子工业出版社,2004,10-20
    [85] 陈德萍.耐高温环氧树脂胶粘剂研究进展.热固性树脂,2000,(4):16-20.
    [86] Lee H, Neville K. Hand book of Epoxy Resins, second edition. New York: McGraw-Hil, 1967, 69-71
    [87] 孙曼灵.环氧树脂应用原理与技术.北京:机械工业出版社,2002,140-157
    [88] 陈平.固化环氧树脂用促进剂.中国胶粘剂,1991,1(5):24-25
    [89] 毕春华,甘常林,赵世崎.环氧树脂固化促进剂作用特性研究.热固性树脂,1996,11(2):34-37
    [90] 陈平.酸酐/环氧树脂潜伏性快速固化体系的研究.中国胶粘剂,1993,3(2):7-10
    [91] 李令明,李刚,秦永标.汽车点火线圈环氧灌封料的初步研究.热固性树脂,2000,15(4):13-15
    [92] 毕春华,甘常林,赵世崎.咪唑盐的合成、固化反应及性能研究.热固性树脂,1997,12(1):12-15
    [93] J D B. Smith. Metal acetylacetonates as latent aecelerators for anhydride-cured epoxy resin. Journal of Applied Polymer Science, 1981, 26(3): 979-986
    [94] D M Stoakley, A K St Clair. The effect of cobal complex addition on the cure and properties of an epoxy matrix Presin. Journal of Applied Polymer Science, 1986,31(1): 225-236
    [95] P V Reddy, R Thiayarajan, M C Ratra et a1. Transition metal chelates as accelerators for epoxy resin systems studies with cobalt(Ⅲ ) Acetylacetonate. Journal of Applied Polymer Science. 1990, 41(1-2): 319-328
    [96] 张保龙,门培元,黄吉莆等.金属螯合物催化环氧树脂E-51/酸酐体系催化及固化过程.高分子学报,1991,12(1):139-141
    [97] 陈平,刘胜平,宋永贤等.乙酰丙酮金属络合物对酸酐固化环氧树脂潜伏性促进作用的研究.高分子学报,1993,11(4)485-489
    [98] 陈平,宋永贤.酸酐固化环氧树脂潜伏性促进体系的研究.纤维复合材料,1993,10(1):1-6
    [99] 陈平,张庆兴,韩丽洁.稀土有机化合物/酸酐/环氧树脂体系固化反应和固化物性能的研究.复合材料学报,1997,14(4):33-37
    [100] 陈平.季铵盐对酸酐/环氧树脂体系固化反应和性能影响的研究.热固性树脂,1996,11(1):24-26
    [101] 刘祥萱,陆路德,杨绪杰等.热分析法研究复合纳米TiO2 催化酸酐/环氧树脂固化特性.热固性树脂,2000,15 (1):26-29
    [102] 陈平,王德中. 环氧树脂及其应用[M]. 北京:化学工业出版社, 2004, 103-106
    [103] 龚海青,郭洪猷. 表面张力引起的涂层弊病(Ⅰ).现代涂料与涂装, 2000, (3):1-2
    [104] 龚海青,郭洪猷. 表面张力引起的涂层弊病(Ⅱ).2现代涂料与涂装, 2000,(4):1-2
    [105] Bach Van N, Noel C. Effect of chemical structure and thermal history on the β-transition of polystyrene and some substituted polystyrenes. Journal of Polymer Science Part A: Polymer Chemistry Edition, 1976, 14(7): 1627–1636
    [106] Punit Boolchand. Insulating and semiconducting glass. New York:World Scientific Publishing Company, 1999: 1-52
    [107] Aurora Nogales, Alejandro Sanz, Tiberio A. Ezquerra .On the role of the β process as precursor of the α relaxation in aromatic polyesters . Journal of Non-Crystalline Solids, 2006, 352(42-49): 4649-4655
    [108] Juan P Fernández-Blázquez, Antonio Bello, Ernesto Pérez. Dynamic mechanical analysis of the two glass transitions in a thermotropic polymer. Polymer, 2005, 46(23) :10004-10010
    [109] Pisignano D, Capaccioli S, Casalini R et al. Study of the relaxation behaviour of a tri-epoxy compound in the supercooled and glassy state by broadband dielectric spectroscopy, Journal of physics-condensed matter, 2001,13(20): 4405-4419
    [110] S Corezzi, M Beiner, H Huth et al. Two crossover regions in the dynamics of glass forming epoxy resins. The Journal of Chemical Physics, 2002, 117(5): 2435-2448
    [111] R Casalini, C M Roland. Pressure Evolution of the Excess Wing in a Type-B Glass Former. Physical review letters, 2003,91(1): 0157021- 0157024
    [112] K L Ngai, M Paluch. Inference of the Evolution from Caged Dynamics to Cooperative Relaxation in Glass-Formers from Dielectric Relaxation Data. The Journal of Physical Chemistry B, 2003, 107(28): 6865-6872
    [113] D Prevosto, S Capaccioli, M Lucchesi et al. Ngai, Dynamics of supercooled and glassy dipropyleneglycol dibenzoate as function of temperature and aging: interpretation within the Coupling Model framework, The Journal of Chemical Physics, 2004,120(10): 4808-4815
    [114] 罗运军,桂红星. 有机硅树脂及其应用. 北京:化学工业出版社(第一版), 2002:132-147
    [115] 李仰平,彭宗仁,王永忠.有机硅改善环氧树脂性能的研究.绝缘材料,2003,(3):3-5
    [116] M Ochi, K Takemiya, O Kiyohara et al. Effect of the addition of aramid–silicone block copolymer on the phase structure and toughness of cured epoxy resins modified with RTV silicone. Polymer, 2000, 41(1):195-201
    [117] M Ochi, R Takahashi, A Terauchi. Phase structure and mechanical and adhesion properties of epoxy/silica hybrids. Polymer, 2001, 42(12): 5151-5158
    [118] Tsung-Han Ho, Chun-Shan Wang. Modification of epoxy resin with siloxane containing phenol aralkyl epoxy resin for electronic encapsulation application . European Polymer Journal, 2001,37(2): 267-274
    [119] Mitsukazu Ochi, Shinzi Shimaoka. Phase structure and toughness of silicone-modified epoxy resin with added silicone graft copolymer. Polymer, 1999, 40(5):1305-1312
    [120] Minoru Miwa, Akiyoshi Takeno, Katsumi Hara et al. Surface modification of epoxy resin with telechelic silicone. Polymer, 1993, 34(16): 3416-3420
    [121] 鲁照玲,刘光明,周宇.环氧改性有机硅树脂的合成. 涂料工业, 1999,(4):1-2
    [122] 傅献彩,沈文霞,姚天扬. 物理化学. 北京:高等教育出版社,1990,742-750
    [123] Yotkgitis E M, Wilkes G L, McGrath J E et al. Elastomeric polysiloxane modifiers for epoxy resins, II, Influence of the modifier on solid state properties and morphology. Polymeric Materials Science and Engineering, 1983, 49: 508-512
    [124] 谢晶曦.红外光谱在有机化学药物化学中的应用.北京:科学出版社,1987
    [125] 卢湧泉,邓振华.实用红外光谱解析.北京:电子工业出版社,1989
    [126] 董庆年.红外光谱法.北京:石油化学工业出版社,1977
    [127] 陈晓欢,李峰,梁世飘等.固化体系对环氧树脂耐高温性能的影响.中国胶粘剂,2005,14(3):11-17
    [128] 常鹏善,左瑞霖,王汝敏等.一种液晶环氧树脂增韧的研究.高分子学报,2002,(5):682-684
    [129] Y Diamant, G Marom, L J Broutman. Effect of network structure on moistureabsorption of epoxy resins. Journal of Applied Polymer Science, 1981, 26(9):3015-3025
    [130] 胡玉明,吴良义. 固化剂, 北京:化学工业出版社,2004,456-461
    [131] 毕春华,甘常林,赵世琦.环氧树脂固化促进剂作用特性研究.热固性树脂,1996,11(2):34-37
    [132] 夏友谊. 水热-微波干燥合成高结晶纳米棒 WO3及其光催化活性.精细化工,2005,22(9):649-652
    [133] Alexeev O, Gates B C.Iridium clusters supported on γ- Al2O3: Structural characterization and catalysis of toluene hydrogenation. Journal of Catalysis, 1998, 176(2): 310-320
    [134] Ying Jackie Y, Tschope A. Synthesis and characteristics of nonstoichiometric nanocrystalline cerium oxide-based catalysts. Chemical Engineering, 1996, 649(2): 225-237
    [135] 冯丽娟,赵宇靖,陈诵英.超细粒子催化剂.石油化工,1991,20(9):633-639
    [136] 何曼君,陈维孝,董西侠. 高分子物理.上海:复旦大学出版社,1990:371-387
    [137] A R Blythe. Electrical properties of polymers. London:Cambridge Univesity Press, 1979:27-56
    [138] 李桂森. 环氧树脂与环氧涂料. 北京:化学工业出版社,2003,212-213
    [139] 电阻器. 天津大学无线电材料与元件教研室编.北京:技术标准出版社,1981,118-130
    [140] 方俊鑫,陆栋.固体物理学.上海:上海科学技术出版社, 1980,285-303
    [141] G. 奥迪安[美](李弘,黄文强,顾忠伟等译). 聚合物反应原理,北京:科学出版社,1987:443-444

© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号

地址:北京市海淀区学院路29号 邮编:100083

电话:办公室:(+86 10)66554848;文献借阅、咨询服务、科技查新:66554700