镀镍工艺参数多元回归分析与镀层厚度预测研究
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摘要
镀层厚度是影响镀层质量的关键因素之一,电镀生产中各项工艺参数对电镀效率及镀层的沉积速度有着不同的影响。电子行业的生产方式为少量多次的生产,批次间的质量有一定的差异,本文用多元回归方法应用于电镀效率的研究及镀层膜厚的预测,通过对影响电镀效率因素的分析,来预测镀层厚度,改善产品的质量稳定性,并降低生产成本,从而提升产品的竞争力和利润率。
本文开展了镀镍工艺参数对电流效率,以及镀层厚度预测的研究。首先介绍了电镀生产中各因素对镀镍工艺的影响,并介绍了电镀生产研究中常用的研究方法:试验设计及回归分析方法。其次介绍了电镀生产中的质量状况,在实际生产状况下分别研究了单因素(镍浓度,pH值,电流密度)对电镀效率的影响,其后用DOE及多元回归方法确定了pH值及电流密度对电流效率影响的回归方程,表明pH值对电流效率的影响要大于电流密度的影响;并预估了镀层厚度,与实际生产中的参数符合性较好,为镀层厚度的预估提供了计算依据;并设计一程式以快速确定生产中的参数值;电镀质量控制的关键是控制电镀参数的稳定。最后提出了自动控制是未来电镀的发展方向。
Thickness of electroplating is one of the key factors of affecting the quality of deposit. There are different effects on electroplating efficiency and deposition velocity by every processing parameter in the producing process of electroplating. The production mode of Electronics industry is the production of small quantity and multi times. The consistency quality from batch to batch is difficult to control. The objective of this thesis is to apply the multivariate regression method to the nickel electroplating efficiency and thickness forecasting, forecasting thickness of nickel plating through analyzing the factors of affecting efficiency of electroplating, with improving of the stability of quality, and decreasing the cost of production; to enhance the quality, the competition and the profitability of products.
The thesis studies the electroplating processing parameters on electroplating efficiency and forecasting the thickness in nickel plating. First of all, there is an introduction of the effect of all processing parameters on nickel plating process and the common research method in plating process, DOE and multivariate regression analysis method. Secondly, quality status in plating process is introduced, the effect of single factors such as concentration of nickel, pH value and current density on electroplating efficiency are studied respectively in actual production status, and next the regression equation of the effect that pH value and current density on electroplating efficiency is built in the paper with DOE and multivariate regression method. The results show that influence of the pH value on the electroplating efficiency is stronger than that of the current density; and forecasting the thickness in nickel plating; and the conformance of forecasting parameter and the parameter in actual manufacturing process is good. That is to say, this calculation method provides a method for forecasting the thickness of electrodeposits. and a calculation program is designed to calculate processing parameters; the key factors of controlling the quality is the stability of processing parameters. Finally, This paper proposed an idea that automatic control is the development direction of future plating process.
本文开展了镀镍工艺参数对电流效率,以及镀层厚度预测的研究。首先介绍了电镀生产中各因素对镀镍工艺的影响,并介绍了电镀生产研究中常用的研究方法:试验设计及回归分析方法。其次介绍了电镀生产中的质量状况,在实际生产状况下分别研究了单因素(镍浓度,pH值,电流密度)对电镀效率的影响,其后用DOE及多元回归方法确定了pH值及电流密度对电流效率影响的回归方程,表明pH值对电流效率的影响要大于电流密度的影响;并预估了镀层厚度,与实际生产中的参数符合性较好,为镀层厚度的预估提供了计算依据;并设计一程式以快速确定生产中的参数值;电镀质量控制的关键是控制电镀参数的稳定。最后提出了自动控制是未来电镀的发展方向。
Thickness of electroplating is one of the key factors of affecting the quality of deposit. There are different effects on electroplating efficiency and deposition velocity by every processing parameter in the producing process of electroplating. The production mode of Electronics industry is the production of small quantity and multi times. The consistency quality from batch to batch is difficult to control. The objective of this thesis is to apply the multivariate regression method to the nickel electroplating efficiency and thickness forecasting, forecasting thickness of nickel plating through analyzing the factors of affecting efficiency of electroplating, with improving of the stability of quality, and decreasing the cost of production; to enhance the quality, the competition and the profitability of products.
The thesis studies the electroplating processing parameters on electroplating efficiency and forecasting the thickness in nickel plating. First of all, there is an introduction of the effect of all processing parameters on nickel plating process and the common research method in plating process, DOE and multivariate regression analysis method. Secondly, quality status in plating process is introduced, the effect of single factors such as concentration of nickel, pH value and current density on electroplating efficiency are studied respectively in actual production status, and next the regression equation of the effect that pH value and current density on electroplating efficiency is built in the paper with DOE and multivariate regression method. The results show that influence of the pH value on the electroplating efficiency is stronger than that of the current density; and forecasting the thickness in nickel plating; and the conformance of forecasting parameter and the parameter in actual manufacturing process is good. That is to say, this calculation method provides a method for forecasting the thickness of electrodeposits. and a calculation program is designed to calculate processing parameters; the key factors of controlling the quality is the stability of processing parameters. Finally, This paper proposed an idea that automatic control is the development direction of future plating process.
引文
[1] 樊菊红,电镀镍添加剂的研究, 西安理工大学硕士论文,2006
[2] 黄子勋,吴纯素,电镀理论,中国农业机械出版社,1982,1
[3] 张甲敏等,钢带氨基磺酸盐镀镍工艺,电镀与涂饰,2007,26(6),7～9
[4] 王改民等,电镀度制品中镀层时间参数的计算研究,金刚石与磨料磨具工程,2007,4, 59～62
[5] 梁国柱, 广东镀镍工艺的发展与展望, 材料保护,2000,33(1):51～58
[6] 陈天玉,镀镍工艺基础,北京,化学工业出版社,2007,5
[7] 李声泽 张明祥,魏福群,氨基磺酸镀镍工艺,西南师范学院学报,1981,1:32
[8] Don Baudrand ,Nickel Sulfamate Plating, Its Mystique and Practicality ,Metal Finishing,Vol.94,1996,No.7,p.15～18
[9] 穆敦发,陈文录,正交试验设计及其在电镀参数优化中的应用,孔化与电镀,2002,10,34～37
[10] 李波等,试验设计与优化,中国皮革,32(1),26~28
[11] 童修强,工艺因素对氨基磺酸镍镀层内应力的影响,材料保护 1987,1,23～26
[12] 赵平堂,氨基磺酸高速镀镍工艺的应用,材料保护,2002,35(3):51
[13] Trouble shooting Electroplating Installations; Nickel Sulfamate Plating Systems,N.V. Mandich; D.W. Baudrand,Plating & Surface Finishing ,2002, vol.89, no.9,p.68～76
[14] 陈敏,氨基磺酸镀镍电解液物化性能对电沉积镍工艺的影响,上海电镀,1997,3: 2～4
[15] 羊秋福,印制电路板氨基磺酸盐镀镍工艺,电镀与精饰,2004,26(1),23～25
[16] 张允诚,胡如南,向荣,电镀手册(上册),第二版,北京,国防工业出版社,1997,281,308
[17] 曹洪江,李为众,用《正交试验法》选择镀镍最优工艺参数,机械设计与制造,1985,03,25～27
[18] 高云霞,多元线性回归离子选择电极法同时测定铅和镉的研究,天津大学硕士论文,2006
[19] 高平,EXCEL在多元线性回归分析中的应用,青海统计,2006,12,27～29
[20] 邵碧雄,叶左局,利用Excel软件进行多元回归与多项式回归分析,广东奶业,2006,2, 11～15
[21] 陈永福,浅谈电镀工艺管理,电镀与环保,2007,27(1),44～45
[22] 邱安生,电镀电流参数在线测量,电镀与环保,2007,27(1),32～36
[23] 李雄涛,杜贵平,李树强,基于电源装备的电镀工艺过程控制系统,电镀与涂饰,2007, 26(2),51～53
[2] 黄子勋,吴纯素,电镀理论,中国农业机械出版社,1982,1
[3] 张甲敏等,钢带氨基磺酸盐镀镍工艺,电镀与涂饰,2007,26(6),7～9
[4] 王改民等,电镀度制品中镀层时间参数的计算研究,金刚石与磨料磨具工程,2007,4, 59～62
[5] 梁国柱, 广东镀镍工艺的发展与展望, 材料保护,2000,33(1):51～58
[6] 陈天玉,镀镍工艺基础,北京,化学工业出版社,2007,5
[7] 李声泽 张明祥,魏福群,氨基磺酸镀镍工艺,西南师范学院学报,1981,1:32
[8] Don Baudrand ,Nickel Sulfamate Plating, Its Mystique and Practicality ,Metal Finishing,Vol.94,1996,No.7,p.15～18
[9] 穆敦发,陈文录,正交试验设计及其在电镀参数优化中的应用,孔化与电镀,2002,10,34～37
[10] 李波等,试验设计与优化,中国皮革,32(1),26~28
[11] 童修强,工艺因素对氨基磺酸镍镀层内应力的影响,材料保护 1987,1,23～26
[12] 赵平堂,氨基磺酸高速镀镍工艺的应用,材料保护,2002,35(3):51
[13] Trouble shooting Electroplating Installations; Nickel Sulfamate Plating Systems,N.V. Mandich; D.W. Baudrand,Plating & Surface Finishing ,2002, vol.89, no.9,p.68～76
[14] 陈敏,氨基磺酸镀镍电解液物化性能对电沉积镍工艺的影响,上海电镀,1997,3: 2～4
[15] 羊秋福,印制电路板氨基磺酸盐镀镍工艺,电镀与精饰,2004,26(1),23～25
[16] 张允诚,胡如南,向荣,电镀手册(上册),第二版,北京,国防工业出版社,1997,281,308
[17] 曹洪江,李为众,用《正交试验法》选择镀镍最优工艺参数,机械设计与制造,1985,03,25～27
[18] 高云霞,多元线性回归离子选择电极法同时测定铅和镉的研究,天津大学硕士论文,2006
[19] 高平,EXCEL在多元线性回归分析中的应用,青海统计,2006,12,27～29
[20] 邵碧雄,叶左局,利用Excel软件进行多元回归与多项式回归分析,广东奶业,2006,2, 11～15
[21] 陈永福,浅谈电镀工艺管理,电镀与环保,2007,27(1),44～45
[22] 邱安生,电镀电流参数在线测量,电镀与环保,2007,27(1),32～36
[23] 李雄涛,杜贵平,李树强,基于电源装备的电镀工艺过程控制系统,电镀与涂饰,2007, 26(2),51～53