基于ANSYS的DC/DC电源模块热分析和热设计研究
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摘要
对于DC/DC电源模块,随着使用领域的不断扩大其工作环境日趋恶劣,要求IC芯片及功率元件有很高的可靠性,DC/DC电源模块热分析及热设计的研究是提高其可靠性的关键。因此,DC/DC电源模块的热分析及热设计是十分必要的。本论文利用有限元软件(ANSYS 11.0)对DC/DC电源模块进行了热分析,评估了该多芯片组件的热特性及各种封装参数对其热特性的影响,提出了改善多芯片组件散热特性及提高其可靠性的方法。论文还利用ANSYS11.0对大功率多芯片组件进行了热分析,同时,提出了改善大功率多芯片组件散热特性的六种热设计措施。本论文所做的主要工作如下:
1、针对不同外界环境及不同封装参数下的DC/DC电源模块,利用有限元热模拟技术分析了它的三维温度场,和影响该DC/DC电源模块热特性的一些重要因素,这些因素包括封装底板底面的温度、粘接层的导热系数、基板材料的导热系数、封装底板的导热系数、芯片的功率密度、拓扑结构及外界环境等。
2、针对大功率DC/DC电源模块,利用有限元热模拟技术分析了DC/DC电源模块的温度场,通过循序渐进的方法,采用六种热设计措施进行改进。这六种热设计的措施为改善大功率DC/DC电源模块的散热特性及提高其可靠性提供了参考。这六种热设计措施包括:(1)改进基板材料及粘接材料;(2)采用其他底板材料;(3)改进管壳散热结构;(4)采用导热系数好的填充物;(5)改变芯片的面积(6)优化拓扑结构。并研究了大功率DC/DC电源模块使用中温度控制,这部分应用了有限元的热-流体耦合模拟技术。
3、通过对DC/DC电源模块的热分析及热设计,为DC/DC电源模块的工艺设计提供了可靠的热分析、热设计数据。仿真结果表明,所进行的设计满足技术要求,其结果可以用于生产中。
The thermal analysis and design of DC/DC modular circuit (DC/DC) are very important and indispensable because these are the key step to raise the reliability of DC/DC, which usually work in the circumstance of high temperature and high moisture. The thesis has made a thorough research of the thermal analysis and design of DC/DC with the help of the finite element software(ANSYS11.0) to evaluate nicely and quickly the thermal performance,which is deeply influenced by packaging parameters,and puts forward the methods to improve the radiating performance and reliability of DC/DC,Moreover,the thesis presents five projects that improve the radiating performance of large-power DC/DC on the basis of analyzing the thermal performance of large-power DC/DC using the software (ANSYS11.0). In general the main work of this thesis follow as:
1.According to the DC/DC under the different outer circumstances & packaging parameters,taking good advantages of finite element thermal simulation technique,I have analyzed the 3-D temperature field of the DC/DC and the main influencing factors of thermal performance of DC/DC in this article,which involve the temperature on the ground boar of packaging,the conductivity factors of cementation layer,the material of base plate and the ground plate for packaging,topology of electrical circuit,schemethe power density of chip and the outer circumstances.
2. According to high power DC/DC,taking advantage of the finite element thermal simulation technique,6 thermal design measures are taken to make better step by step. These 6 measures,which have provided good references for improving the reliability and radiating performance of large-power DC/DC,include:(1)the improving of placode material and splice material;(2) the improving of baseboard material;(3) the improving of structure of baseboard radiator;(4)the using of diathermancy filling;(5) the improving of chip area;(6)optimization topology of electrical circuit.At the same time Study temperature control of using high power DC/DC adopt the finite element simulation technique of thermal-fluid coupling.
3. By way of thermal analysis and design of DC/DC,reliable analyzing & designing data have been provided for the DC/DC design. The practice shows that the design satisfied the technical demand and the result can be put into multi-produce.
1、针对不同外界环境及不同封装参数下的DC/DC电源模块,利用有限元热模拟技术分析了它的三维温度场,和影响该DC/DC电源模块热特性的一些重要因素,这些因素包括封装底板底面的温度、粘接层的导热系数、基板材料的导热系数、封装底板的导热系数、芯片的功率密度、拓扑结构及外界环境等。
2、针对大功率DC/DC电源模块,利用有限元热模拟技术分析了DC/DC电源模块的温度场,通过循序渐进的方法,采用六种热设计措施进行改进。这六种热设计的措施为改善大功率DC/DC电源模块的散热特性及提高其可靠性提供了参考。这六种热设计措施包括:(1)改进基板材料及粘接材料;(2)采用其他底板材料;(3)改进管壳散热结构;(4)采用导热系数好的填充物;(5)改变芯片的面积(6)优化拓扑结构。并研究了大功率DC/DC电源模块使用中温度控制,这部分应用了有限元的热-流体耦合模拟技术。
3、通过对DC/DC电源模块的热分析及热设计,为DC/DC电源模块的工艺设计提供了可靠的热分析、热设计数据。仿真结果表明,所进行的设计满足技术要求,其结果可以用于生产中。
The thermal analysis and design of DC/DC modular circuit (DC/DC) are very important and indispensable because these are the key step to raise the reliability of DC/DC, which usually work in the circumstance of high temperature and high moisture. The thesis has made a thorough research of the thermal analysis and design of DC/DC with the help of the finite element software(ANSYS11.0) to evaluate nicely and quickly the thermal performance,which is deeply influenced by packaging parameters,and puts forward the methods to improve the radiating performance and reliability of DC/DC,Moreover,the thesis presents five projects that improve the radiating performance of large-power DC/DC on the basis of analyzing the thermal performance of large-power DC/DC using the software (ANSYS11.0). In general the main work of this thesis follow as:
1.According to the DC/DC under the different outer circumstances & packaging parameters,taking good advantages of finite element thermal simulation technique,I have analyzed the 3-D temperature field of the DC/DC and the main influencing factors of thermal performance of DC/DC in this article,which involve the temperature on the ground boar of packaging,the conductivity factors of cementation layer,the material of base plate and the ground plate for packaging,topology of electrical circuit,schemethe power density of chip and the outer circumstances.
2. According to high power DC/DC,taking advantage of the finite element thermal simulation technique,6 thermal design measures are taken to make better step by step. These 6 measures,which have provided good references for improving the reliability and radiating performance of large-power DC/DC,include:(1)the improving of placode material and splice material;(2) the improving of baseboard material;(3) the improving of structure of baseboard radiator;(4)the using of diathermancy filling;(5) the improving of chip area;(6)optimization topology of electrical circuit.At the same time Study temperature control of using high power DC/DC adopt the finite element simulation technique of thermal-fluid coupling.
3. By way of thermal analysis and design of DC/DC,reliable analyzing & designing data have been provided for the DC/DC design. The practice shows that the design satisfied the technical demand and the result can be put into multi-produce.
引文
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[16]杨邦朝,张经国.多芯片组件(MCM)技术及其应用[M].成都:电子科技人学出版社.2001.8
[17]杜平安.结构有限元分析建模方法[M].北京:机械工业出版社.1998.5
[18]祝效华,余志样.ANSYS高级有限元分析范例精选[M].北京:电子工业出版社.2004.10
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[22]孙菊芳.有限元法及其应用[M].北京:北京航空航天大学出版.1990.7
[23]博弈创作室.ANSYS7.0基础教程与实例详解[M].北京:中国水利水电出版社.2004.1
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[27]张家荣,赵廷元.工程常用物质的物理性质手册[M].新时代出版社.
[28] A Dasgupta. Fracture mechanism model for cyclic fatigue. IEEE Trans Reliability[J],1993,vol.42, NoA:548
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[30] S M Lee. ASME [J] Elect Pack[J],1992,vol.14, No.6:109
[31] Kitaio S,Takeda Y,Kurokawa Y,et al,Eighth IEEE SEMI ThermalTEMSymposium[J].1992: 119-124
[32] H Solomon. Fatigue of 60/40 tin-lead solder[J]. IEEE-CHMT,1986,vol.9,NoA:423
[33] Qzmat B.[J].IEEE Transactions on Components, Hybrids and ManufacturingTechnology[J], 1992, 15:860-869
[34]博弈创作室.APDL参数化有限元分析技术及其实用实例[M].北京:中国水利水电出版社.2004.2
[35]倪栋,程进,许久成.通用有限元分析ANSYS7.0实例精解[M].北京:电子工业出版社.2003. 10
[36]施人说.计算传热学[M].北京:科学出版社.1987.12
[37]郭宽良.计算传热学[M].中国科学技术人学出版社.1988
[38]圣文锉.传热学[M].西安交通人学出版社.1995
[39]陶文锉.计算流体力学与传热学[M].北京:中国建筑工业出版社.1991.11
[40]项宝卫.结构优化中模拟退火算法的研究和应用[M].大连理工大学.2004.
[41]王乃龙,戴宏宇,周润德.用模拟退火算法实现集成电路热布局优化[J].半导体学报.第24卷.第4期,2003:427-431.
[42]王世萍.高组装密度器件的散热分析[J].半导体学报.Vol. 17,No.5 May 1996
[43]杜则裕.工程材料简明手册[M].电子工业出版社.1997.
[44]李智诚.常用电子金属材料手册[M].中国物资出版社.1994.
[45]曲喜新.电子元件材料手册[M].电子工业出版社.1989.
[46]付桂翠,高泽溪,邹航,王诞燕.功率器件热设计及散热器的优化设计[M].半导体技术.第29卷.第1期.2004:78-85.
[47]贾松良,朱浩颗.半导体技术[J].Vol.6,1997:6-11
[48] ANSYS用户使用手册[M].ANSYS in USA
[49] BGA封装类型简单介绍[J].半导体杂志.Vo1.22,No.4,1997(12):40-41
[50] S.Witzman,D.Newport and T.Nicoletta.Free Convection Air Cooling of The Electronic Equipment:Still A Miracle Waiting to be Explored and Explained[J]. 5th. IEEE SEMI-THERM Symposium. l989:98-103.
[51] Anis Ammous,Sami Ghedira,Bruno Allard. Herv'e More,and Denise Renault. Choosing a Thermal Model for Electrothermal Simulation of Power Semiconductor Devices[J].IEEE Transctions on Power Electronics. 1999 Vol. 14,No. 2:300-307.
[52] S M Heinrich,S Shakya,Y Wang and P S Lee.Improved yield and performance of ball-grid array packages design and processing guidelines for uniform and non-uniform arrays IEEE-CPMT[J],1996,part B,vol.l9,No.2:310
[53] Tao Y X,Manickamdalli R,Jensen R,et al. Thermal Characterization of Stacked Aluminium Nitride Multichip Modules[J]. lntersociety Conference on Thermal Phenomena, 1996:334-340
[54] Rao R. Tummala. Fundaments of Microsystem Packaging[J]. McGraw-Hil1.2001,NewYorK
[55]胡红军,杨明波,张丁非.材料工程有限元分析实例教程.电子工业出版社[M].2008
[2]齐永强,何雅玲等.电子设备热设计的初步研究[J].现代电子技术.2003第1期:73-79.
[3]章云峰.电子组件热分布的测试与分析[D].江苏大学硕士论文.2005.
[4] Prosenjit Ghosh.1998 InterSociety Conference on Thermal Phenomena[M],378～385.
[5] David W.Snyder.Eighth IEEE SEMI-ThermTM Symposium[J],1992:101～109.
[6] Y-X.Tao,R.Manickamdalli,R.Jensen and P.Devgan.Thermal Characterization of Stacked Aluminum Nitride Multichip Modules[J],1996 Intersociety Conference on Thermal Phenomena:334～340.
[7] S.Kitajo,Y.Takeda,Y.Kurokawa,T.Ohta and H.Mizunashi.Eighth IEEE SEMI-Thermal TEM Symposium[J]:119～124.
[8] Robert Darveaux,Lih-Tyng Hwang,Arnold Reisman and Iwona Turlik.Journal of Electronic Materials[J],Vol 18,No.2,1989:267～274.
[9]丁连芬.电子设备可靠性热设计手册[M].电子工业出版社.1989.
[10]丁晓东.简谈电子设备的热设计[J].现代电子技术.2000第118期.
[11] B.Cahlon,I.E.Schocnetman and M.Shillor.Convective Colling and Optimal Placement Of Electronic Components With Variable Ambient Temperature I.The linear model,Journal of Computationa and Applied Mathematics[J], vol. 47, 1993.
[12] G.E.Moore.Electronics[M],Vo1.38,1965:14-16
[13] J. H. Lau and S-W. R. Lee.Chip Scale Package[J]. McGraw-Hill New York,1999
[14] David W,Snyder.Eighth IEEE SEMI-Therm TM Symposium[J],1992:101-109
[15] Liu Joshua C.Electronic package thermal design using boundary elements.The Sixth IEEE SEMITHERMTM Symp[J],1990:65-69.
[16]杨邦朝,张经国.多芯片组件(MCM)技术及其应用[M].成都:电子科技人学出版社.2001.8
[17]杜平安.结构有限元分析建模方法[M].北京:机械工业出版社.1998.5
[18]祝效华,余志样.ANSYS高级有限元分析范例精选[M].北京:电子工业出版社.2004.10
[19] S M Heinrich,S Shakya,Y Wang and P S Lee.Improved yield and performance of ball-grid array packages design and processing guidelines for uniform and non-uniform arrays IEEE-CPMT,1996,part B[J],vol.l9, No.2:310
[20]朱颂养.多芯片组件热设计技术综述[J].混合微电子技术.1996,9,Vo1.7,N0.3: 20-30
[21]王国强.实用工程数值模拟技术.ANSYS上的实践[M].西安:西安工业大学出版社1999.8
[22]孙菊芳.有限元法及其应用[M].北京:北京航空航天大学出版.1990.7
[23]博弈创作室.ANSYS7.0基础教程与实例详解[M].北京:中国水利水电出版社.2004.1
[24] D.R.克罗夫特,D. G.利著,张风禄等译.传热的有限差分方程计算[M].冶金工业出版社.1982.
[25]唐兴伦,范群波等.ANSYS工程应用教程[M].中国铁道出版社.
[26]于慈远,于湘珍等.电子设备热分析/热设计/热测试技术初步研究[[J].微电子学.2000.
[27]张家荣,赵廷元.工程常用物质的物理性质手册[M].新时代出版社.
[28] A Dasgupta. Fracture mechanism model for cyclic fatigue. IEEE Trans Reliability[J],1993,vol.42, NoA:548
[29] Prosenjit Ghosh.1998 InterSociety Conference on Thermal Phenomena[J],378-385
[30] S M Lee. ASME [J] Elect Pack[J],1992,vol.14, No.6:109
[31] Kitaio S,Takeda Y,Kurokawa Y,et al,Eighth IEEE SEMI ThermalTEMSymposium[J].1992: 119-124
[32] H Solomon. Fatigue of 60/40 tin-lead solder[J]. IEEE-CHMT,1986,vol.9,NoA:423
[33] Qzmat B.[J].IEEE Transactions on Components, Hybrids and ManufacturingTechnology[J], 1992, 15:860-869
[34]博弈创作室.APDL参数化有限元分析技术及其实用实例[M].北京:中国水利水电出版社.2004.2
[35]倪栋,程进,许久成.通用有限元分析ANSYS7.0实例精解[M].北京:电子工业出版社.2003. 10
[36]施人说.计算传热学[M].北京:科学出版社.1987.12
[37]郭宽良.计算传热学[M].中国科学技术人学出版社.1988
[38]圣文锉.传热学[M].西安交通人学出版社.1995
[39]陶文锉.计算流体力学与传热学[M].北京:中国建筑工业出版社.1991.11
[40]项宝卫.结构优化中模拟退火算法的研究和应用[M].大连理工大学.2004.
[41]王乃龙,戴宏宇,周润德.用模拟退火算法实现集成电路热布局优化[J].半导体学报.第24卷.第4期,2003:427-431.
[42]王世萍.高组装密度器件的散热分析[J].半导体学报.Vol. 17,No.5 May 1996
[43]杜则裕.工程材料简明手册[M].电子工业出版社.1997.
[44]李智诚.常用电子金属材料手册[M].中国物资出版社.1994.
[45]曲喜新.电子元件材料手册[M].电子工业出版社.1989.
[46]付桂翠,高泽溪,邹航,王诞燕.功率器件热设计及散热器的优化设计[M].半导体技术.第29卷.第1期.2004:78-85.
[47]贾松良,朱浩颗.半导体技术[J].Vol.6,1997:6-11
[48] ANSYS用户使用手册[M].ANSYS in USA
[49] BGA封装类型简单介绍[J].半导体杂志.Vo1.22,No.4,1997(12):40-41
[50] S.Witzman,D.Newport and T.Nicoletta.Free Convection Air Cooling of The Electronic Equipment:Still A Miracle Waiting to be Explored and Explained[J]. 5th. IEEE SEMI-THERM Symposium. l989:98-103.
[51] Anis Ammous,Sami Ghedira,Bruno Allard. Herv'e More,and Denise Renault. Choosing a Thermal Model for Electrothermal Simulation of Power Semiconductor Devices[J].IEEE Transctions on Power Electronics. 1999 Vol. 14,No. 2:300-307.
[52] S M Heinrich,S Shakya,Y Wang and P S Lee.Improved yield and performance of ball-grid array packages design and processing guidelines for uniform and non-uniform arrays IEEE-CPMT[J],1996,part B,vol.l9,No.2:310
[53] Tao Y X,Manickamdalli R,Jensen R,et al. Thermal Characterization of Stacked Aluminium Nitride Multichip Modules[J]. lntersociety Conference on Thermal Phenomena, 1996:334-340
[54] Rao R. Tummala. Fundaments of Microsystem Packaging[J]. McGraw-Hil1.2001,NewYorK
[55]胡红军,杨明波,张丁非.材料工程有限元分析实例教程.电子工业出版社[M].2008