多芯片组件热分析及热设计技术研究
|
摘要
对于某多芯片组件，其工作在高温、高湿等恶劣环境中，要求IC芯片及功率元件有很高的可靠性，多芯片组件(MCM)热分析及热设计的研究是提高其可靠性的关键。因此，对多芯片组件的热分析及热设计是十分必要的。本论文利用有限元软件(ANSYS 8.0)对多芯片组件进行了热分析，以准确、快速的热分析方法评估了该多芯片组件的热特性及各种封装参数对其热特性的影响，提出了改善多芯片组件散热特性及提高其可靠性的方法：论文还利用ANSYS 8.0对大功率多芯片组件进行了热分析，同时，提出了改善大功率多芯片组件散热特性的六种热设计方案。本论文所做的主要工作如下：
1、针对不同外界环境及不同封装参数下的多芯片组件，利用有限元热模拟技术分析了它的三维温度场，得到了影响该多芯片组件热特性的一些重要因素，这些因素包括封装底板底面的温度、粘接层的导热系数、基板材料的导热系数、封装底板的导热系数、芯片的功率密度及外界环境等。
2、针对大功率多芯片组件，利用有限元热模拟技术分析了多芯片组件的温度场，通过循序渐进的方法，提出了六种热设计的方案。这六种热设计的方案为改善大功率多芯片组件的散热特性及提高其可靠性提供了参考。这六种热设计方案包括：(1)改进封装参数；(2)采用散热铜柱及铜散热器；(3)改进铜散热器的结构；(4)直接水冷却；(5)强制空气冷却；(6)间接水冷却。其中，强制空气冷却方案及间接水冷却方案应用了有限元的热—流体耦合模拟技术。
3、通过对多芯片组件的热分析及热设计，为多芯片组件的设计提供了可靠的热分析、热设计数据及方法，具有一定的指导意义和应用价值。
The thermal analysis and design of multi-chip module (MCM) are very important and indispensable because these are the key step to raise the reliability of multi-chip module, which usually work in the circumstance of high temperature and high moisture. The thesis has made a thorough research of the thermal analysis and design of MCM with the help of the finite element software(ANSYS 8.0) to evaluate nicely and quickly the thermal performance, which is deeply influenced by packaging parameters, and puts forward the methods to improve the radiating performance and reliability of MCM, Moreover, the thesis presents six projects that improve the radiating performance of large-power MCM on the basis of analyzing the thermal performance of large-power MCM using the software (ANSYS 8.0). In general, the main work of this thesis follow as:
1. Has obtained the main influencing factors of thermal performance of MCM under different outer circumstances and packaging parameters on the basis of analyzing the 3-D temperature field of this MCM in virtue of finite element thermal simulation technique, which involve the temperature on the ground boar of packaging, the conductivity factors of cementation layer, the material of base plate and the ground plate for packaging, the power density of chip and the outer circumstances.
2. Has put forward six kinds of projects of thermal design for large power MCM by way of analyzing the temperature fields of MCM using the finite element thermal simulation technique step by step. These projects, which provide good references for improving the reliability and radiating performance of large-power MCM, include: (1) the improving of packaging parameters; (2) the adoption of radiating copper-pole and the copper radiator; (3) the improving of structure of copper radiator; (4) the direct water cooling; (5) the forced cooling of air convection; (6) the indirect water cooling. There-into, the projects (5) and (6) adopt the finite element simulation technique of thermal-fluid coupling.
3. The thesis provides reliable data and methods for thermal analysis and design of MCM and has certain value of guidance and application.
1、针对不同外界环境及不同封装参数下的多芯片组件，利用有限元热模拟技术分析了它的三维温度场，得到了影响该多芯片组件热特性的一些重要因素，这些因素包括封装底板底面的温度、粘接层的导热系数、基板材料的导热系数、封装底板的导热系数、芯片的功率密度及外界环境等。
2、针对大功率多芯片组件，利用有限元热模拟技术分析了多芯片组件的温度场，通过循序渐进的方法，提出了六种热设计的方案。这六种热设计的方案为改善大功率多芯片组件的散热特性及提高其可靠性提供了参考。这六种热设计方案包括：(1)改进封装参数；(2)采用散热铜柱及铜散热器；(3)改进铜散热器的结构；(4)直接水冷却；(5)强制空气冷却；(6)间接水冷却。其中，强制空气冷却方案及间接水冷却方案应用了有限元的热—流体耦合模拟技术。
3、通过对多芯片组件的热分析及热设计，为多芯片组件的设计提供了可靠的热分析、热设计数据及方法，具有一定的指导意义和应用价值。
The thermal analysis and design of multi-chip module (MCM) are very important and indispensable because these are the key step to raise the reliability of multi-chip module, which usually work in the circumstance of high temperature and high moisture. The thesis has made a thorough research of the thermal analysis and design of MCM with the help of the finite element software(ANSYS 8.0) to evaluate nicely and quickly the thermal performance, which is deeply influenced by packaging parameters, and puts forward the methods to improve the radiating performance and reliability of MCM, Moreover, the thesis presents six projects that improve the radiating performance of large-power MCM on the basis of analyzing the thermal performance of large-power MCM using the software (ANSYS 8.0). In general, the main work of this thesis follow as:
1. Has obtained the main influencing factors of thermal performance of MCM under different outer circumstances and packaging parameters on the basis of analyzing the 3-D temperature field of this MCM in virtue of finite element thermal simulation technique, which involve the temperature on the ground boar of packaging, the conductivity factors of cementation layer, the material of base plate and the ground plate for packaging, the power density of chip and the outer circumstances.
2. Has put forward six kinds of projects of thermal design for large power MCM by way of analyzing the temperature fields of MCM using the finite element thermal simulation technique step by step. These projects, which provide good references for improving the reliability and radiating performance of large-power MCM, include: (1) the improving of packaging parameters; (2) the adoption of radiating copper-pole and the copper radiator; (3) the improving of structure of copper radiator; (4) the direct water cooling; (5) the forced cooling of air convection; (6) the indirect water cooling. There-into, the projects (5) and (6) adopt the finite element simulation technique of thermal-fluid coupling.
3. The thesis provides reliable data and methods for thermal analysis and design of MCM and has certain value of guidance and application.
引文
[1] 田民波．电子封装工程．北京：清华大学出版社，2003．9
[2] 杨邦朝．张经国．多芯片组件(MCM)技术及其应用．成都：电子科技大学出版社，2001．8
[3] 李秀清．高密度三维封装技术，半导体情报，1998．12．Vol．35，NO．6：25-31
[4] 毕克允．微电子封装技术．合肥：中国科学技术大学出版社．2003．4
[5] 朱颂春．多芯片组件热设计技术综述．混合微电子技术．1996，9，Vol．7，NO．3：20-30
[6] 邱成悌．电子设备结构设计原理．南京：东南大学出版社，2001．12
[7] 邱成悌．电子组装技术．南京：东南大学出版社，1998．8
[8] 陆鸣．多芯片组件(MCM)封装技术，上海微电子技术和应用，1995．2．41-48
[9] 陶文铨．计算流体力学与传热学．北京：中国建筑工业出版社，1991．11
[10] 施天谟．计算传热学．北京：科学出版社．1987．12
[11] 陈景仁．流体力学及传热学．北京：国防工业出版社，1984．12
[12] G.E.Moore.Electronics,Vol.38,1965:14～16
[13] J. H. Lau and S-W. R. Lee, Chip Scale Package, McGraw-Hill New York, 1999
[14] David W, Snyder.Eighth IEEE SEMI-Therm TM Symposium.1992:101-109
[15] J. H. Lau, IEEE Trans. Component, Packaging, and Manufacturing Technology, 1996, vol.19, No.4:728
[16] PM Hall, et al. Thermal deformation observed in LCCC mounted to print wiring boards. In Proc 33rd Elect Compon And Techn Conf, 1983, 350
[17] 杜平安．结构有限元分析建模方法．北京：机械工业出版社，1998．5
[18] 祝效华，余志祥．ANSYS高级工程有限元分析范例精选．北京：电子工业出版社，2004．10
[19] 王国强．实用工程数值模拟技术．ANSYS上的实践．西安：西安工业大学出版社．1999．8
[20] 博弈创作室．ANSYS7．0基础教程与实例详解．北京：中国水利水电出版社，2004．1
[21] 孙菊芳．有限元法及其应用．北京：北京航空航天大学出版，1990．7
[22] Qiang Yu and M Shiratori. Fatigue strength prediction of micro electronic solder Joints under thermal eyelie loading. IEEE-CPMT 1997,part A, vol.20, No.3:266
[23] 史保华．贾新章，张德胜．微电子器件可靠性．西安电子科技大学出版社，2001．8
[24] 朱正涌．半导体集成电路．清华大学出版社，2001
[25] 杜磊，孙承永，杨海燕．混合微电子技术，Vol 10，No．10，1999：75～84
[26] A Dasgupta. Fracture mechanism model for cyclic fatigue. IEEE Trans Reliability, 1993, vol.42, No.4:548
[27] Prosenjit Ghosh.1998 InterSociety Conference on Thermal Phenomena,378～385
[28] S M Lee．ABME[J] Elect Pack，1 992,vol．14，No．6：109
[29] John H Lau，Shi-Wei Ricky Lee著，贾松良，王水弟，蔡坚等 译．芯片尺寸封装：设计、材料、工艺、可靠性及应用．北京：清华大学出版社，2003．10
[30] 博亦创作室．APDL参数化有限元分析技术及其实用实例．北京：中国水利水电出版社，2004．2
[31] 倪栋，程进，徐久成．通用有限元分析ANSYS7.0实例精解．北京：电子工业出版社，2003．10
[32] 郭宽良．计算传热学．中国科学技术大学出版社，1988
[33] 李皓月，周田朋，刘相新．ANSYS 工程计算应用教程．北京：中国铁道出版社，2003，1
[34] 邵蕴秋．ANSYS8.0有限元分析实例导航．北京：中国铁道出版社，2004，4
[35] Gini Courter,Annette Marquis著，魏江力，石雄等 译．Excel 2002 从入门到精通．北京：电子工业版社，2002．2
[36] Kitaio S, Takeda Y, Kurokawa Y, et al, Eighth IEEE SEMI ThermalTEM Symposium.1992:119-124
[37] H Solomon. Fatigue of 60/40 tin-lead solder. IEEE-CHMT, 1986, vol.9, No.4: 423
[38] Qzmat B. [J] . IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1992, 15:860-869
[39] 圣宏天．多芯片组件的热分析．混合微电子技术．1993,Vol．3,NO．4：24-32
[40] 王世萍．雷达信号处理专用芯片及其热设计技术．电子机械工程，1997．4：32-36
[41] 圣文铨．传热学．西安交通大学出版社，1995
[42] V Sanhan. Engergy based Methodology for damage and life prediction of solder joint under thermal cycling. IEEE-CPMT, 1994, part B, vol.7, No.4:636
[43] DarveauxR, HwangLih-Tyng. Journal of Electronic Materials, 1989, vol.18, No.2: 267-274
[44] 王世萍．高组装密度器件的散热分析，半导体学报，Vol．17,No．5 May 1996
[45] 贾松良，朱浩颖．半导体技术，Vol．6，1997：6～11
[46] ANSYS 用户使用手册．ANSYS in USA
[47] BGA封装类型简单介绍．半导体杂志，Vol．22，No．4，1997(12)：40～41
[48] C.A.Harper.Electronic Packaging and Interconnection Handbook,McGraw-Hill,New York,NY, 1991
[49] S M Heinrich, S Shakya, Y Wang and P S Lee.Improved yield and performance of ball-grid array packages design and processing guidelines for uniform and non-uniform arrays. IEEE-CPMT, 1996, part B, vol.19, No.2:310
[50] Tao Y X, Manickamdalli R, Jensen R, et al. Thermal Characterization of Stacked Aluminium Nitride Multichip Modules.Intersociety Conference on Thermal Phenomena, 1996:334-340
[51] Rao R. Tummala. Fundaments of Microsystem Packaging. McGraw-Hill.2001, NewYorK
[2] 杨邦朝．张经国．多芯片组件(MCM)技术及其应用．成都：电子科技大学出版社，2001．8
[3] 李秀清．高密度三维封装技术，半导体情报，1998．12．Vol．35，NO．6：25-31
[4] 毕克允．微电子封装技术．合肥：中国科学技术大学出版社．2003．4
[5] 朱颂春．多芯片组件热设计技术综述．混合微电子技术．1996，9，Vol．7，NO．3：20-30
[6] 邱成悌．电子设备结构设计原理．南京：东南大学出版社，2001．12
[7] 邱成悌．电子组装技术．南京：东南大学出版社，1998．8
[8] 陆鸣．多芯片组件(MCM)封装技术，上海微电子技术和应用，1995．2．41-48
[9] 陶文铨．计算流体力学与传热学．北京：中国建筑工业出版社，1991．11
[10] 施天谟．计算传热学．北京：科学出版社．1987．12
[11] 陈景仁．流体力学及传热学．北京：国防工业出版社，1984．12
[12] G.E.Moore.Electronics,Vol.38,1965:14～16
[13] J. H. Lau and S-W. R. Lee, Chip Scale Package, McGraw-Hill New York, 1999
[14] David W, Snyder.Eighth IEEE SEMI-Therm TM Symposium.1992:101-109
[15] J. H. Lau, IEEE Trans. Component, Packaging, and Manufacturing Technology, 1996, vol.19, No.4:728
[16] PM Hall, et al. Thermal deformation observed in LCCC mounted to print wiring boards. In Proc 33rd Elect Compon And Techn Conf, 1983, 350
[17] 杜平安．结构有限元分析建模方法．北京：机械工业出版社，1998．5
[18] 祝效华，余志祥．ANSYS高级工程有限元分析范例精选．北京：电子工业出版社，2004．10
[19] 王国强．实用工程数值模拟技术．ANSYS上的实践．西安：西安工业大学出版社．1999．8
[20] 博弈创作室．ANSYS7．0基础教程与实例详解．北京：中国水利水电出版社，2004．1
[21] 孙菊芳．有限元法及其应用．北京：北京航空航天大学出版，1990．7
[22] Qiang Yu and M Shiratori. Fatigue strength prediction of micro electronic solder Joints under thermal eyelie loading. IEEE-CPMT 1997,part A, vol.20, No.3:266
[23] 史保华．贾新章，张德胜．微电子器件可靠性．西安电子科技大学出版社，2001．8
[24] 朱正涌．半导体集成电路．清华大学出版社，2001
[25] 杜磊，孙承永，杨海燕．混合微电子技术，Vol 10，No．10，1999：75～84
[26] A Dasgupta. Fracture mechanism model for cyclic fatigue. IEEE Trans Reliability, 1993, vol.42, No.4:548
[27] Prosenjit Ghosh.1998 InterSociety Conference on Thermal Phenomena,378～385
[28] S M Lee．ABME[J] Elect Pack，1 992,vol．14，No．6：109
[29] John H Lau，Shi-Wei Ricky Lee著，贾松良，王水弟，蔡坚等 译．芯片尺寸封装：设计、材料、工艺、可靠性及应用．北京：清华大学出版社，2003．10
[30] 博亦创作室．APDL参数化有限元分析技术及其实用实例．北京：中国水利水电出版社，2004．2
[31] 倪栋，程进，徐久成．通用有限元分析ANSYS7.0实例精解．北京：电子工业出版社，2003．10
[32] 郭宽良．计算传热学．中国科学技术大学出版社，1988
[33] 李皓月，周田朋，刘相新．ANSYS 工程计算应用教程．北京：中国铁道出版社，2003，1
[34] 邵蕴秋．ANSYS8.0有限元分析实例导航．北京：中国铁道出版社，2004，4
[35] Gini Courter,Annette Marquis著，魏江力，石雄等 译．Excel 2002 从入门到精通．北京：电子工业版社，2002．2
[36] Kitaio S, Takeda Y, Kurokawa Y, et al, Eighth IEEE SEMI ThermalTEM Symposium.1992:119-124
[37] H Solomon. Fatigue of 60/40 tin-lead solder. IEEE-CHMT, 1986, vol.9, No.4: 423
[38] Qzmat B. [J] . IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1992, 15:860-869
[39] 圣宏天．多芯片组件的热分析．混合微电子技术．1993,Vol．3,NO．4：24-32
[40] 王世萍．雷达信号处理专用芯片及其热设计技术．电子机械工程，1997．4：32-36
[41] 圣文铨．传热学．西安交通大学出版社，1995
[42] V Sanhan. Engergy based Methodology for damage and life prediction of solder joint under thermal cycling. IEEE-CPMT, 1994, part B, vol.7, No.4:636
[43] DarveauxR, HwangLih-Tyng. Journal of Electronic Materials, 1989, vol.18, No.2: 267-274
[44] 王世萍．高组装密度器件的散热分析，半导体学报，Vol．17,No．5 May 1996
[45] 贾松良，朱浩颖．半导体技术，Vol．6，1997：6～11
[46] ANSYS 用户使用手册．ANSYS in USA
[47] BGA封装类型简单介绍．半导体杂志，Vol．22，No．4，1997(12)：40～41
[48] C.A.Harper.Electronic Packaging and Interconnection Handbook,McGraw-Hill,New York,NY, 1991
[49] S M Heinrich, S Shakya, Y Wang and P S Lee.Improved yield and performance of ball-grid array packages design and processing guidelines for uniform and non-uniform arrays. IEEE-CPMT, 1996, part B, vol.19, No.2:310
[50] Tao Y X, Manickamdalli R, Jensen R, et al. Thermal Characterization of Stacked Aluminium Nitride Multichip Modules.Intersociety Conference on Thermal Phenomena, 1996:334-340
[51] Rao R. Tummala. Fundaments of Microsystem Packaging. McGraw-Hill.2001, NewYorK