基于钎料润湿力的光纤自对准原理及激光软钎焊界面反应
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摘要
光电子封装中激光器件与光导纤维之间的对准和定位是保证器件耦合效率和可靠性的关键技术。本文提出光纤自对准激光软钎焊的方法(Fiber Self-alignment by Laser Soldering,FSLS),设想利用熔融钎料的表面张力所产生的回复力及回复转矩实现光纤在焊盘上的自动对准,由此方法产生的新工艺将使光电子封装制造成本下降。研究AuSn钎料与Au/Ti、Au/Ni/Cu两种焊盘及光纤Au/Ni镀层之间的界面组织在激光钎焊及老化过程中的演化规律,从而论证工艺的可行性;研究和阐明光纤自对准的基本原理,从理论上得出自对准的驱动力、分析材料与结构因素的影响规律并进行对准精度评价和误差估计。
光纤定位激光软钎焊工艺试验研究表明:AuSn钎料合金在氩气保护下在小功率长时间条件下易于润湿铺展,形成良好的焊点。研究表明激光钎焊过程中AuSn钎料与Au/Ti焊盘界面反应的特点是:随着激光输入能量的增加,界面区域所生成的先共析ζ相的形状由扇贝状演变为粗大的棒状或树枝状。在老化过程中AuSn-Au/Ti界面生成的ζ相不断联合、长大;AuSn-Au/Ni界面生成的针状(Au,Ni)3Sn2不断溶解到钎料中直至消失,同时在界面形成了一层(Au,Ni)Sn;钎料内部共晶组织不断球化并粗化。激光钎焊条件下在AuSn-Au/Ni/Cu及AuSn-Au/Ni两界面处所形成的针状(Au,Ni)_3Sn_2在老化过程中逐渐平坦化,界面上形成了连续的(Au,Ni)Sn层,并随老化时间的延长而增厚;两个界面附近所形成的花状(Au,Ni)_3Sn_2在老化过程中向周围的δ相中不断溶解直至消失,同时δ相中的Ni含量增加。
基于对光纤定位软钎焊焊点进行的合理假设建立焊点三维形态的数学模型,并对焊点形态的能量、体积以及边界条件进行合理描述,利用有限元法对焊点三维形态进行计算并分析材料及结构因素对焊点三维形态的影响规律,结果表明:随着钎料量的增加和焊盘尺寸的减小,钎料对光纤的包覆程度增大;随着焊盘长宽比的增加,焊点横截面曲线的弯曲程度增大。采用激光共聚焦扫描显微镜对焊点三维形态进行测量并与计算结果进行对比,结果表明焊点三维形态的试验测量结果与计算结果吻合良好,焊点三维形态计算方法及测量手段合理可靠。
通过对光纤进行受力分析,从理论上得出自对准驱动力的解析式,根据公式可以得出自对准回复力及法向力主要受液态钎料对光纤润湿力的影响,而静压力可以忽略;利用有限元计算的方法得出不同形状焊盘的理论平衡位置,并得出材料与结构因素对自对准回复力及回复转矩的影响规律,结果表明:自对准回复力随着横向对准偏移成线性变化,回复转矩随着偏转角成线性变化;在一定范围内选择较大的钎料量、采用较大的焊盘长宽比、较大表面张力的钎料以及较小的钎料-焊盘接触角更有利于对横向对准偏移的自对准,在一定范围内选择较小的钎料量、采用较大的焊盘长宽比、较大表面张力的钎料和较小的钎料-光纤接触角更有利于对初始转角的自对准。
光纤与焊盘间隙高度计算结果表明:只有钎料量超过临界值时,间隙高度才存在;间隙高度随着焊盘尺寸的减小、焊盘长宽比的减小以及钎料与光纤接触角的增加而增加。采用激光共聚焦显微镜对间隙高度测量,试验测量结果与计算结果吻合良好。
In optoelectronic packaging, alignment and attachment between laser and optical fiber is the key technology to assure component coupling efficiency and reliability. In this paper, a new method of fiber self-alignment by laser soldering has been proposed which uses the restoring force and restoring torque to accomplish the self-alignment of fiber on the pad. The manufacturing cost of optoelectronic packaging can be reduced by using the new process produced by this method. The feasibility of the process was demonstrated by studying the evolution of intermetallic compounds (IMCs) at interface between AuSn solder and pad (Au/Ti pad and Au/Ni/Cu pad) as well as that between AuSn solder and fiber metallization (Au/Ni) during laser soldering and aging process. The basic principle of fiber self-alignment was studied and demonstrated, the driving force of self-alignment educed in theory, effects of material and structure factors analyzed, and alignment precision and error estimated.
Research on fiber attachment by laser soldering process showed that AuSn solder alloy was prone to wetting, spreading and forming good solder joint at low laser power and long heating time in argon atmosphere. The characteristics of interfacial reaction between AuSn solder and Au/Ti pad during laser soldering process showed that with the increase of laser input energy the morphology of preeutecticζ-phase changed from scallop protrusions to large cudgel shape and dendritic shape. During aging process,ζ-phase formed at the interface of AuSn-Au/Ti began to coalesce and grow, while the needle-like (Au,Ni)3Sn2 formed at the interface of AuSn-Au/Ni began to dissolve into the solder and disappear, replacing by a layer of (Au,Ni)Sn at the interface, at the same time, the eutectic microstructure of solder began to spheroidize and coarsen. During aging process, the needle-like (Au,Ni)3Sn2 formed at the interface of AuSn-Au/Ni/Cu as well as AuSn-Au/Ni under the condition of laser soldering began to flatten gradually, and a continuous layer of (Au,Ni)Sn formed at the interface, the thickness of which increased with aging time; The flower-like (Au,Ni)3Sn2 formed near the interface of AuSn-Au/Ni/Cu as well as AuSn-Au/Ni began to dissolve into the ambientδ-phase and disappear during aging, at the same time, the content of Ni inδ-phase increased.
Based on the reasonable hypothesis, the mathematical model of three dimensional (3-D) shape of solder joint in fiber attachment soldering was established, the energy, the volume and the boundary condition of solder joint shape was described in reason, 3-D shape of solder joint was calculated by employing finite element method (FEM), and the influence of material and structure factors on 3-D shape of solder joint was analyzed. The results showed that the extent of solder wetting on fiber increased with the increase of solder volume and the decrease of pad size; With the increase of aspect ratio of pad, the bending extent of curve at cross section increased. The 3-D shape of solder joint was measured by laser scanning confocal Microscope (LSCM) and the results were compared with those of calculated, the results showed that the measured results of 3-D shape of solder joint were in accordance with the calculated results, and the method of calculating and measuring of 3-D shape of solder joint was reasonable and credible.
The formulation of self-alignment driving force was deduced theoretically by analyzing the force acting on fiber. Base on the formula, the restoring force and normal reaction force could be calculated which mainly depended on the wetting force acting on fiber by solder, and the hydrostatic pressure could be ignored. The theoretical equilibrium positions of pad with different shape were calculated by FEM, and the influences of material and structure factors on self-alignment restoring force and restoring torque were analyzed. The results showed that the self-alignment restoring force changed linearly with horizontal offset and the restoring torque changed linearly with yaw angle. Bigger solder volume within limits, bigger aspect ratio of pad, bigger surface tension of solder and smaller solder-pad contact angle were propitious to the self-alignment for horizontal offset, while smaller solder volume within limits, bigger aspect ratio of pad, bigger surface tension of solder and smaller solder-fiber contact angle were propitious to the self-alignment for yaw angle.
Calculation results on stand-off height (SOH) between fiber and pad showed that the SOH existed when the solder volume exceeded the critical volume. SOH increased with the decrease of pad size, the decrease of aspect ratio and the increase of solder-fiber contact angle. SOH was measured by LSCM, and the measured results were in accordance with the calculated results.
光纤定位激光软钎焊工艺试验研究表明:AuSn钎料合金在氩气保护下在小功率长时间条件下易于润湿铺展,形成良好的焊点。研究表明激光钎焊过程中AuSn钎料与Au/Ti焊盘界面反应的特点是:随着激光输入能量的增加,界面区域所生成的先共析ζ相的形状由扇贝状演变为粗大的棒状或树枝状。在老化过程中AuSn-Au/Ti界面生成的ζ相不断联合、长大;AuSn-Au/Ni界面生成的针状(Au,Ni)3Sn2不断溶解到钎料中直至消失,同时在界面形成了一层(Au,Ni)Sn;钎料内部共晶组织不断球化并粗化。激光钎焊条件下在AuSn-Au/Ni/Cu及AuSn-Au/Ni两界面处所形成的针状(Au,Ni)_3Sn_2在老化过程中逐渐平坦化,界面上形成了连续的(Au,Ni)Sn层,并随老化时间的延长而增厚;两个界面附近所形成的花状(Au,Ni)_3Sn_2在老化过程中向周围的δ相中不断溶解直至消失,同时δ相中的Ni含量增加。
基于对光纤定位软钎焊焊点进行的合理假设建立焊点三维形态的数学模型,并对焊点形态的能量、体积以及边界条件进行合理描述,利用有限元法对焊点三维形态进行计算并分析材料及结构因素对焊点三维形态的影响规律,结果表明:随着钎料量的增加和焊盘尺寸的减小,钎料对光纤的包覆程度增大;随着焊盘长宽比的增加,焊点横截面曲线的弯曲程度增大。采用激光共聚焦扫描显微镜对焊点三维形态进行测量并与计算结果进行对比,结果表明焊点三维形态的试验测量结果与计算结果吻合良好,焊点三维形态计算方法及测量手段合理可靠。
通过对光纤进行受力分析,从理论上得出自对准驱动力的解析式,根据公式可以得出自对准回复力及法向力主要受液态钎料对光纤润湿力的影响,而静压力可以忽略;利用有限元计算的方法得出不同形状焊盘的理论平衡位置,并得出材料与结构因素对自对准回复力及回复转矩的影响规律,结果表明:自对准回复力随着横向对准偏移成线性变化,回复转矩随着偏转角成线性变化;在一定范围内选择较大的钎料量、采用较大的焊盘长宽比、较大表面张力的钎料以及较小的钎料-焊盘接触角更有利于对横向对准偏移的自对准,在一定范围内选择较小的钎料量、采用较大的焊盘长宽比、较大表面张力的钎料和较小的钎料-光纤接触角更有利于对初始转角的自对准。
光纤与焊盘间隙高度计算结果表明:只有钎料量超过临界值时,间隙高度才存在;间隙高度随着焊盘尺寸的减小、焊盘长宽比的减小以及钎料与光纤接触角的增加而增加。采用激光共聚焦显微镜对间隙高度测量,试验测量结果与计算结果吻合良好。
In optoelectronic packaging, alignment and attachment between laser and optical fiber is the key technology to assure component coupling efficiency and reliability. In this paper, a new method of fiber self-alignment by laser soldering has been proposed which uses the restoring force and restoring torque to accomplish the self-alignment of fiber on the pad. The manufacturing cost of optoelectronic packaging can be reduced by using the new process produced by this method. The feasibility of the process was demonstrated by studying the evolution of intermetallic compounds (IMCs) at interface between AuSn solder and pad (Au/Ti pad and Au/Ni/Cu pad) as well as that between AuSn solder and fiber metallization (Au/Ni) during laser soldering and aging process. The basic principle of fiber self-alignment was studied and demonstrated, the driving force of self-alignment educed in theory, effects of material and structure factors analyzed, and alignment precision and error estimated.
Research on fiber attachment by laser soldering process showed that AuSn solder alloy was prone to wetting, spreading and forming good solder joint at low laser power and long heating time in argon atmosphere. The characteristics of interfacial reaction between AuSn solder and Au/Ti pad during laser soldering process showed that with the increase of laser input energy the morphology of preeutecticζ-phase changed from scallop protrusions to large cudgel shape and dendritic shape. During aging process,ζ-phase formed at the interface of AuSn-Au/Ti began to coalesce and grow, while the needle-like (Au,Ni)3Sn2 formed at the interface of AuSn-Au/Ni began to dissolve into the solder and disappear, replacing by a layer of (Au,Ni)Sn at the interface, at the same time, the eutectic microstructure of solder began to spheroidize and coarsen. During aging process, the needle-like (Au,Ni)3Sn2 formed at the interface of AuSn-Au/Ni/Cu as well as AuSn-Au/Ni under the condition of laser soldering began to flatten gradually, and a continuous layer of (Au,Ni)Sn formed at the interface, the thickness of which increased with aging time; The flower-like (Au,Ni)3Sn2 formed near the interface of AuSn-Au/Ni/Cu as well as AuSn-Au/Ni began to dissolve into the ambientδ-phase and disappear during aging, at the same time, the content of Ni inδ-phase increased.
Based on the reasonable hypothesis, the mathematical model of three dimensional (3-D) shape of solder joint in fiber attachment soldering was established, the energy, the volume and the boundary condition of solder joint shape was described in reason, 3-D shape of solder joint was calculated by employing finite element method (FEM), and the influence of material and structure factors on 3-D shape of solder joint was analyzed. The results showed that the extent of solder wetting on fiber increased with the increase of solder volume and the decrease of pad size; With the increase of aspect ratio of pad, the bending extent of curve at cross section increased. The 3-D shape of solder joint was measured by laser scanning confocal Microscope (LSCM) and the results were compared with those of calculated, the results showed that the measured results of 3-D shape of solder joint were in accordance with the calculated results, and the method of calculating and measuring of 3-D shape of solder joint was reasonable and credible.
The formulation of self-alignment driving force was deduced theoretically by analyzing the force acting on fiber. Base on the formula, the restoring force and normal reaction force could be calculated which mainly depended on the wetting force acting on fiber by solder, and the hydrostatic pressure could be ignored. The theoretical equilibrium positions of pad with different shape were calculated by FEM, and the influences of material and structure factors on self-alignment restoring force and restoring torque were analyzed. The results showed that the self-alignment restoring force changed linearly with horizontal offset and the restoring torque changed linearly with yaw angle. Bigger solder volume within limits, bigger aspect ratio of pad, bigger surface tension of solder and smaller solder-pad contact angle were propitious to the self-alignment for horizontal offset, while smaller solder volume within limits, bigger aspect ratio of pad, bigger surface tension of solder and smaller solder-fiber contact angle were propitious to the self-alignment for yaw angle.
Calculation results on stand-off height (SOH) between fiber and pad showed that the SOH existed when the solder volume exceeded the critical volume. SOH increased with the decrease of pad size, the decrease of aspect ratio and the increase of solder-fiber contact angle. SOH was measured by LSCM, and the measured results were in accordance with the calculated results.
引文
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52 O. Solgaard, M. Daneman, N.C. Tien. Optoelectronic Packaging Using Silicon Surface-Micromachined Alignment Mirrors. IEEE Photonics Technology Letters. 1995,7(1):41-43
53 R. Heyler, N. Zhang. Sub-Micron Fiber Attachment Using Laser-Assisted Fluxless Solder Reflow. Proceedings of the 50th Electronic Components and Technology Conference, 2000:1652-1657
54 C. Flanagan, S. Trask, R. Heyler. Direct-Coupling Fiber Retention Using Laser Soldering: Technical and Economic Benefits. Proceedings of the 53th Electronic Components and Technology Conference, 2003:1308-1311
55 N. Koopman, S. Nangalia, V. Rogers. Fluxless No-Clean Assembly of Solder Bumped Flip Chips. Proceedings of the 46th Electronic Components and Technology Conference, 1996:552-558
56 R.W. Chuang, D.W. Kim, J. Park, C.C. Lee. A Fluxless Process of Producing Tin-Rich Gold-Tin Joints in Air. IEEE Transactions on Components and Packaging Technologies. 2004,27(1):177-181
57 S.M. Scheifers. C.J. Raleigh. Effects of Flux Contamination on Flip Chip Reliability. Proc. Sensors Electron. Packag. ASME, 1995,(14):101-109
58 T. Nishikawa, M. Ijuin, R. Satoh, Y. Iwata, M. Tamura, M. Shirai. Fluxless Soldering Process Technology. Proc. 44th ECTC. 1994:286-292
59 J.F. Kuhmann, A. Preuss, B. Adolphi, et al. Oxidation and Reduction Kinetics of Eutectic SnPb, InSn, and AuSn: A Knowledge Base for Fluxless Solder Bonding Applications. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part C. 1998,21(2):134-141
60 N.R. Basavanhally, M.F. Brady, D.B. Buchholz. Optoelectronic Packaging of Two-Dimensional Surface Active Devices. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B. 1996,19(1):107-115
61 Y.Y. liu, C.S. Premachandran, S.W. Yoon, et al. Characterization of AuSn Solder in Laser Die Attachment for Photonic Packaging Applications. Electronics Packaging Technology Conference, 2007:370-373
62 G.S. Matijasevic, C.C. Lee, C.Y. Wang. Au-Sn Alloy Phase Diagram and Properties Related to Its Use as a Bonding Medium. Thin Solid Films. 1993, 223(2):276-287
63 E. Zakel, J. Gwiasda, J. Kloeser, et al. Fluxless Flip Chip Assembly on Rigid and Flexible Polymer Substrates Using the Au-Sn Metallurgy. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, La Jolla, CA, USA, 1994:177-184
64 D.G. Ivey. Microstructural Characterization of Au/Sn Solder for Packaging in Optoelectronic Applications. Micron. 1998,29(4):281-287
65 S. Wei, V. Bader, G. Azdasht, et al. Fluxless Die Bonding of High Power Laser Bars using the AuSn-Metallurgy. Proceedings of the 47th Electronic Components and Technology Conference. 1997:780-787
66 T.S. Thang, S. Decai, H.K. Koay, et al. Characterization of Au-Sn Eutectic Die Attach Process for Optoelectronics Device. Electronics Materials and Packaging. 2005:118-124
67 C.C. Lee, R.W. Chuang. Fluxless Non-Eutectic Joints Fabricated Using Gold-Tin Multilayer Composite. IEEE Transactions on Components and Packaging Technologies. 2003,26(2):416-422
68 J.W. Ronnie Teo, F.L. Ng, L.S. Kip Goi, et al. Microstructure of Eutectic 80Au/20Sn Solder Joint in Laser Diode Package. Microelectronic Engineering. 2008(85):512-517
69 Y.C. Liu, J.W.R. Teo, S.K. Tung, K.H. Lam. High-Temperature Creep andHardness of Eutectic 80Au/20Sn Solder. Journal of Alloys and Compounds. 2008(448):340-343
70 R.W. Chuang. A Fluxless Au-Sn Bonding Process of Tin-Rich Compositions Achieved in Ambient Air. Proceedings of the 52th Electronic Components and Technology Conference. 2002:134-137
71 J. Doesburg, D.G. Ivey. Microstructure and Preferred Orientation of Au-Sn Alloy Plated Deposits. Materials Science and Engineering B. 2000(78):44-52
72 G. Elger, M. Hutter, H. Oppermann. Development of an Assembly Process and Reliability Investigations for Flip-Chip LEDs Using the AuSn Soldering. Microsystem Technologies. 2002(7):239-243
73 H.G. Song, J.W. Morris, M.T. McCormack. Microstructure of Ultrafine Eutectic Au-Sn Solder Joints On Cu. Journal of Electronic Materials. 2000,29(8):1038-1046
74 C.Y. Lee, K.L. Lin. Interaction Kinetics and Compound Formation Between Electroless Ni-P and Solder. Thin Solid Films. 1994,249(2):201-206
75 E. Zakel, T. Teutsch. Roadmap to Low Cost Bumping For DCA, COF, CSP and BGA. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Berlin, Germany, 1998:55-62
76 P.L. Liu, Z. Xu, J.K. Shang. Thermal Stability of Electroless-Nickel/Solder Interface: Part A. Interfacial Chemistry and Microstructure. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 2000,31(11):2857-2866
77 J.W. Jang, P.G. Kim, K.N. Tu, et al. Solder Reaction-Assisted Crystallization of Electroless Ni-P Under Bump Metallization in Low Cost Flip Chip Technology. Journal of Applied Physics. 1999,85(12):8456-8463
78 C. Kallmayer, D. Lin, J. Kloeser, et al. Fluxless Flip-Chip Attachment Techniques Using the Au/Sn Metallurgy. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Austin, TX, USA, 1995:20-28
79 E. Bradley, K. Banerji. Effect of PCB Finish on the Reliability and Wettability of Ball Grid Array Packages. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging.1996,19(2):320-330
80 C.H. Lee, Y.M. Wong, C. Doherty, et al. Study of Ni as a Barrier Metal in AuSn Soldering Application for Laser Chip/Submount Assembly. Journal of Applied Physics. 1992,72(8):3808-3815
81 H.G. Song, J.P. Ahn, J.W. Morris. The Microstructure of Eutectic Au-Sn Solder Bumps on Cu/Electroless Ni/Au. Journal of Electronic Materials. 2001,30(9):1083-1087
82 M.W. Beranek, M. Rassaian, C.H. Tang, et al. Characterization of 63Sn37Pb and 80Au20Sn Solder Sealed Optical Fiber Feedthroughs Subjected to Repetitive Thermal Cycling. IEEE Transactions on Advanced Packaging. 2001,24(4):576-585
83 D.G. Ivey. Microstructural Characterization of Au/Sn Solder for Packaging in Optoelectronic Applications. Micron. 1998,29(4):281-287
84 C.H. Lee, K.L. Tai, D.D. Bacon, et al. Bonding of InP Laser Diodes by Au-Sn Solder and Tungsten-Based Barrier Metallization Schemes. Semiconductor Science and Technology. 1994,9(4):379-386
85丁汉,朱利民,林忠钦.面向芯片封装的高加速度运动系统的精确定位和操作.自然科学进展. 2003,13(6):568-574
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88 S.K. Patra, Y.C. Lee. Modeling of Self-alignment Mechanism in Flip-Chip Soldering. II. Multichip Solder Joints. Proceedings of the 4lst ECTC. 1991:783-788
89 S.K. Patra, Y.C. Lee. Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering - Part I: Single Solder Joint. Journal of Electronic Packaging. 1991(113):337-342
90 W. Lin, S.K. Patra, Y.C. Lee. Design of Solder Joints for Self-Aligned Optoelectronic Assemblies. IEEE CPMT-Part B. 1995,18(3):543-551
91 Y.C. Chan, P.L. Tu, K.C. Huang. Study of the Self-alignment of No-Flow Underfill for Micro-BGA Assembly. Microelectronics Reliability. 2001,41(3):1867-1875
92 K. Sato, K. Ito, S. Hata. Self-Alignment of Microparts Using Liquid SurfaceTension—Behavior of Micropart and Alignment Characteristics. Precision Engineering. 2003(27):42-50
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6 M.H. Choi, H.J. Koh, E.S. Yoon. Self-Aligning Silicon Groove Technology Platform for the Low Cost Optical Module. IEEE Electronic Components and Technology Conference, 1999:1140-1144
7 K. Keranen, J.T. Makinen, K.T. Kautio. Fiber Pigtailed Multimode Laser Module Based on Passive Device Alignment on an LTCC Substrate. IEEE Transactions on Advanced Packaging. 2006,29(3):463-472
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9 L. Dellmann, T. Lamprecht, S. Oggioni. Butt-Coupled Optoelectronic Modules for High-Speed Optical Interconnects. Lasers and Electro-Optics Europe Conference, 2005:476-478
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11 M. Datta, Z. Hu, M. Dagenais. A Novel Method for Fabrication of a Hybrid Optoelectronic Packaging Platform Utilizing Passive-Active Alignment. IEEE Photon. Technol. Lett.. 2003,15(2):299-301
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19 Y.M. Lin, W.N. Liu, F.G. Shi. Laser Welding Induced Alignment Distortion in Butterfly Laser Module Packages: Effect of Welding Sequence. IEEE Transactions on Advanced Packaging. 2002,25(1):73-78
20 Y.M. Lin, C. Eichele, F.G. Shi. Effect of Welding Sequence on Welding-Induced-Alignment-Distortion in Packaging of Butterfly Laser Diode Modules: Simulation and Experiment. Lightwave Technology. 2005,23(2):615 - 623
21 D.H. Kang, K.J. Son, Y.S. Yang. Analysis of Laser Weldment Distortion in the EDFA LD Pump Packaging. Finite Elements in Analysis and Design. 2001,37(9):749-760
22 J.H. Kuang, M.T. Sheen, W.H. Cheng. Post-Weld-Shift in Dual-In-Line Laser Package. IEEE Transactions on Advanced Packaging. 2001,24(1):81-85
23 Y.C. Hsu, Y.C. Tsai, W.H. Cheng. A Novel Fiber Alignment Shift Measurement and Correction Technique in Laser-Welded Laser Module Packaging. Journal of Lightwave Technology. 2005,23(2):486-494
24 W.H. Cheng, M.T. Sheen, G.L. Wang, S.C. Wang. Fiber Alignment Shift Formation Mechanisms of Fiber-Solder-Ferrule Joints in Laser ModulePackaging. Lightwave Technology, 2001,19(8):1177-1184
25 W.H. Cheng, M.T. Sheen, C.M. Chang. An Optimum Approach for Reduction of Fiber Alignment Shift of Fiber-Solder-Ferrule Joints in Laser Module Packaging. Lightwave Technology. 2004,22(2):589-594
26 W.H. Cheng, Y.C. Hsu, W.K. Huang, et al. Reduction of Fiber Alignment Shifts in High-Speed Laser Module Packaging. IEEE The 6th Chinese Optoelectronics Symposium (COES), Hong Kong, China, 2003:247-250
27 W.H. Cheng, M.T. Sheen, C.P. Chien, H.L. Chang, J.H. Kuang. Reduction of Fiber Alignment Shifts in Semiconductor Laser Module Packaging. Lightwave Technology. 2000,18(6):842-848
28 Y.T. Tseng, Y.C. Chang. Active Fiber-Solder-Ferrule Alignment Method for High-performance Opto-Electronic Device Packaging. IEEE Transactions on Components and Packaging Technologies. 2003,26(3):541-547
29 M. Labudovic, M. Burka. Finite Element Analysis of Post-Weld Shift During Fiber Pigtail of 980 nm Pump Lasers. IEEE Transactions on Advanced Packaging. 2003,26(1):41-46
30 Y.C. Hsu, Y.C. Tsai, J.H. Kuang, W.H. Cheng. Postweld-Shift-Induced Fiber Alignment Shifts in Laser-Welded Laser Module Packages: Experiments and Simulations. Lightwave Technology. 2005,23(12):4287-4295
31 Y.T. Tseng, H.C. Sung. A Novel Inspection of Fiber Post-Weld-Shift in Butterfly Laser Module Packaging. IEEE Transactions on Advanced Packaging. 2005,28(4):713-719
32 W.H. Cheng, Y.C. Hsu, J.H. Kuang. Post-Weld-Shift Compensation Techniques in TO-Can and Butterfly Types Laser-Welded Laser Module Packages. IEEE Lasers and Electro-Optics Society (LEOS). 2005:521-522
33 Z.Y. Zhang, J.R. Liu, P. Zhao, et al. Active Alignment of Optical Fibers to Planar Waveguides Using a Thermal-Curing Adhesive. Lightwave Technology. 2005,23(2):567-572
34 Y.C. Hsu, Y.K. Lin, C.C. Tsai, et al. Failure Mechanisms Associated with Lens Shape of High-Power LED Modules in Aging Test. IEEE Lasers and Electro-Optics Society (LEOS) 2007:570-571
35 Z. Tang, R. Zhang, F.G. Shi. Effects of Angular Misalignments on Fiber-Optic Alignment Automation. Optics Communications. 2001,196(1-6):173-180
36 G. Elger, J. Voigt, H. Oppermann. Application of Flip-Chip-Bonders in AuSn Solder Processes to Achieve High After Bonding Accuracy for Optoelectronic Modules. Proc. LEOS 14th Conf, 2001:437-438
37 S. Lindgren, H. Ahlfeldt, L. Backlin. 24-GHz Modulation Bandwidth and Passive Alignment of Flip-Chip Mounted DFB Laser Diodes. IEEE Photonics Technology Letters. 1997,9(3):306-308
38 M. Wale, M. Goodwin. Flip-Chip Bonding Optimizes Opto-Ics. IEEE Circuits and Devices Magazine. 1992,8(6):25-31
39 W. Hunziker, W. Vogt, H. Melchior. Low Cost Packaging of Semiconductor Laser Arrays Using Passive Self-Aligned Flip-Chip Technique on Si motherboard. Electronic Components and Technology Conference Proceedings. 1996:8-12
40 M.S. Cohen, M.F. Cina, E. Bassous. Passive Laser-Fiber Alignment by Index Method. IEEE Photonics Technology Letters. 1991,3(11):985-987
41 J.C.C. Lo, S.W.R. Lee, et al. Modified Passive Alignment of Optical Fibers with Low Viscosity Epoxy Flow Running in V-Grooves. Electronic Components and Technology Conference Proceedings. 2004:830-834
42 J.C.C. Lo, C.Y. Li, C.L. Tai, S.W.R. Lee. Optimization of Epoxy Flow for Passive Alignment of Optical Fiber Arrays. EMAP, 2005:132-136
43 K.S. Moon, J.L. Wu, and C.P. Wong. Study on Self-Alignment Capability of Electrically Conductive Adhesives (ECAs) for Flip-Chip Application. Advanced Packaging Materials: Processes, Properties and Interfaces International Symposium Proceedings. 2001:341-346
44 J. Goodrich. A Silicon Optical Bench Approach to Low Cost High Speed Transceivers. Electronic Components and Technology Conference Proceedings. 2001:238-241
45 F. Nikolajeff, O. Larsson, S. Hard, M. Kindlundh. Self-Aligned Optofiber/Waveguide Connector with Integrated V-Grooves and Diffractive Optical Elements. Optical MEMs, Conference Digest. 2002:185-186
46 P. Zhang, G.Y. Wu, Y.L. Hao. A Novel Structure of Micromachined Optical Switch with Self-Aligned Holding Structures of Optical Fibers. Proc. LEOS 13th Conf, 2000,(1):52-53
47 W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, P. Vettiger. Passive Self-Aligned Low-Cost Packaging of Semiconductor Laser Arrays on Si Motherboard. IEEE Photonics Technology Letters. 1995,7(11):1324-1326
48 S.J. Park, K.T. Jeong, S.H. Park, H.K. Sung. A Novel Method for Fabrication of a PLC Platform for Hybrid Integration of an Optical Module by Passive Alignment. IEEE Photonics Technology Letters. 2002,14(4):486-488
49 M. Datta, Z.Y. Hu, M. Dagenais. A Novel Method for Fabrication of A Hybrid Optoelectronic Packaging Platform Utilizing Passive-Active Alignment. IEEE Photonics Technology Letters. 2003,15(2):299-301
50 J.V. Collins, I.F. Lealman, A. Kelly, C.W. Ford. Passive Alignment of Second Generation Optoelectronic Devices. Selected IEEE Topics in Quantum Electronics. 1998,3(6):1441-1444
51 H. Han, J.E. Schramm, J. Mathews, R.A. Roudreau. Micromachined Silicon Structures for Single Mode Passive Alignment. SPIE 1996,(2691):118-123
52 O. Solgaard, M. Daneman, N.C. Tien. Optoelectronic Packaging Using Silicon Surface-Micromachined Alignment Mirrors. IEEE Photonics Technology Letters. 1995,7(1):41-43
53 R. Heyler, N. Zhang. Sub-Micron Fiber Attachment Using Laser-Assisted Fluxless Solder Reflow. Proceedings of the 50th Electronic Components and Technology Conference, 2000:1652-1657
54 C. Flanagan, S. Trask, R. Heyler. Direct-Coupling Fiber Retention Using Laser Soldering: Technical and Economic Benefits. Proceedings of the 53th Electronic Components and Technology Conference, 2003:1308-1311
55 N. Koopman, S. Nangalia, V. Rogers. Fluxless No-Clean Assembly of Solder Bumped Flip Chips. Proceedings of the 46th Electronic Components and Technology Conference, 1996:552-558
56 R.W. Chuang, D.W. Kim, J. Park, C.C. Lee. A Fluxless Process of Producing Tin-Rich Gold-Tin Joints in Air. IEEE Transactions on Components and Packaging Technologies. 2004,27(1):177-181
57 S.M. Scheifers. C.J. Raleigh. Effects of Flux Contamination on Flip Chip Reliability. Proc. Sensors Electron. Packag. ASME, 1995,(14):101-109
58 T. Nishikawa, M. Ijuin, R. Satoh, Y. Iwata, M. Tamura, M. Shirai. Fluxless Soldering Process Technology. Proc. 44th ECTC. 1994:286-292
59 J.F. Kuhmann, A. Preuss, B. Adolphi, et al. Oxidation and Reduction Kinetics of Eutectic SnPb, InSn, and AuSn: A Knowledge Base for Fluxless Solder Bonding Applications. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part C. 1998,21(2):134-141
60 N.R. Basavanhally, M.F. Brady, D.B. Buchholz. Optoelectronic Packaging of Two-Dimensional Surface Active Devices. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B. 1996,19(1):107-115
61 Y.Y. liu, C.S. Premachandran, S.W. Yoon, et al. Characterization of AuSn Solder in Laser Die Attachment for Photonic Packaging Applications. Electronics Packaging Technology Conference, 2007:370-373
62 G.S. Matijasevic, C.C. Lee, C.Y. Wang. Au-Sn Alloy Phase Diagram and Properties Related to Its Use as a Bonding Medium. Thin Solid Films. 1993, 223(2):276-287
63 E. Zakel, J. Gwiasda, J. Kloeser, et al. Fluxless Flip Chip Assembly on Rigid and Flexible Polymer Substrates Using the Au-Sn Metallurgy. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, La Jolla, CA, USA, 1994:177-184
64 D.G. Ivey. Microstructural Characterization of Au/Sn Solder for Packaging in Optoelectronic Applications. Micron. 1998,29(4):281-287
65 S. Wei, V. Bader, G. Azdasht, et al. Fluxless Die Bonding of High Power Laser Bars using the AuSn-Metallurgy. Proceedings of the 47th Electronic Components and Technology Conference. 1997:780-787
66 T.S. Thang, S. Decai, H.K. Koay, et al. Characterization of Au-Sn Eutectic Die Attach Process for Optoelectronics Device. Electronics Materials and Packaging. 2005:118-124
67 C.C. Lee, R.W. Chuang. Fluxless Non-Eutectic Joints Fabricated Using Gold-Tin Multilayer Composite. IEEE Transactions on Components and Packaging Technologies. 2003,26(2):416-422
68 J.W. Ronnie Teo, F.L. Ng, L.S. Kip Goi, et al. Microstructure of Eutectic 80Au/20Sn Solder Joint in Laser Diode Package. Microelectronic Engineering. 2008(85):512-517
69 Y.C. Liu, J.W.R. Teo, S.K. Tung, K.H. Lam. High-Temperature Creep andHardness of Eutectic 80Au/20Sn Solder. Journal of Alloys and Compounds. 2008(448):340-343
70 R.W. Chuang. A Fluxless Au-Sn Bonding Process of Tin-Rich Compositions Achieved in Ambient Air. Proceedings of the 52th Electronic Components and Technology Conference. 2002:134-137
71 J. Doesburg, D.G. Ivey. Microstructure and Preferred Orientation of Au-Sn Alloy Plated Deposits. Materials Science and Engineering B. 2000(78):44-52
72 G. Elger, M. Hutter, H. Oppermann. Development of an Assembly Process and Reliability Investigations for Flip-Chip LEDs Using the AuSn Soldering. Microsystem Technologies. 2002(7):239-243
73 H.G. Song, J.W. Morris, M.T. McCormack. Microstructure of Ultrafine Eutectic Au-Sn Solder Joints On Cu. Journal of Electronic Materials. 2000,29(8):1038-1046
74 C.Y. Lee, K.L. Lin. Interaction Kinetics and Compound Formation Between Electroless Ni-P and Solder. Thin Solid Films. 1994,249(2):201-206
75 E. Zakel, T. Teutsch. Roadmap to Low Cost Bumping For DCA, COF, CSP and BGA. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Berlin, Germany, 1998:55-62
76 P.L. Liu, Z. Xu, J.K. Shang. Thermal Stability of Electroless-Nickel/Solder Interface: Part A. Interfacial Chemistry and Microstructure. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 2000,31(11):2857-2866
77 J.W. Jang, P.G. Kim, K.N. Tu, et al. Solder Reaction-Assisted Crystallization of Electroless Ni-P Under Bump Metallization in Low Cost Flip Chip Technology. Journal of Applied Physics. 1999,85(12):8456-8463
78 C. Kallmayer, D. Lin, J. Kloeser, et al. Fluxless Flip-Chip Attachment Techniques Using the Au/Sn Metallurgy. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Austin, TX, USA, 1995:20-28
79 E. Bradley, K. Banerji. Effect of PCB Finish on the Reliability and Wettability of Ball Grid Array Packages. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging.1996,19(2):320-330
80 C.H. Lee, Y.M. Wong, C. Doherty, et al. Study of Ni as a Barrier Metal in AuSn Soldering Application for Laser Chip/Submount Assembly. Journal of Applied Physics. 1992,72(8):3808-3815
81 H.G. Song, J.P. Ahn, J.W. Morris. The Microstructure of Eutectic Au-Sn Solder Bumps on Cu/Electroless Ni/Au. Journal of Electronic Materials. 2001,30(9):1083-1087
82 M.W. Beranek, M. Rassaian, C.H. Tang, et al. Characterization of 63Sn37Pb and 80Au20Sn Solder Sealed Optical Fiber Feedthroughs Subjected to Repetitive Thermal Cycling. IEEE Transactions on Advanced Packaging. 2001,24(4):576-585
83 D.G. Ivey. Microstructural Characterization of Au/Sn Solder for Packaging in Optoelectronic Applications. Micron. 1998,29(4):281-287
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