密封仪器仪表的散热研究及温控系统设计
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摘要
随着智能仪器仪表不断的小型化、轻量化,密封仪器仪表的热流密度以指数比例迅速增长,大量热量聚集在密封仪表内部将直接影响仪表的可靠性,合理有效的散热方法才能从根本上解决这些问题。
本文结合航海、航空及航天等军事应用领域内密封仪器仪表的特点,对几种应用在密封仪器仪表上的散热方法进行了分析比较,提出以半导体制冷技术与冷板技术相结合的混合散热方法;并以单总线数字温度传感器作为温度测量单元,以半导体制冷器作为执行单元,使用单片机作为主控制器设计了温度模糊控制系统。该系统采用脉宽调制(PWM)的功率控制方式。经过对系统的试验设计测试,证明半导体制冷器结合冷板的散热方法可以有效地解决密封仪器仪表对散热的特殊要求,实现了散热静音化,提高了系统的可靠性,延长了密封仪器仪表的使用寿命。单总线数字温度传感器抗干扰能力强、接口简单,从而提高了系统的测控精度。模糊控制理论的应用使该温度控制系统具有较好的稳定性。
In view of the rapid increase in the miniaturization, lightweight of intelligent instrument. Increased heat fluxes pose a major cooling challenge in electronic instrument enclosure. Amount of heat accumulation directly influences the reliability of the instrument. To meet the challenge significant cooling technology enhancements will be needed.This article firstly analyzes and compares different kinds of heat transfer technologies of present applications in sealed electronic instrument. Considering special requirement of electronic enclosures in nautical and aeronautic application areas. Peltier cooling technology mixed up with cold plate technology is presented. Also, 1-wire digital thermometer as temperature probe, a microprocessor based fuzzy temperature control system is designed. The system adopts Pulse Width Modulation (PWM) as power control method. Experimental results indicate that the special heat dissipation needs of sealed instrument are satisfied. Furthermore interference-free feature and measurement control performance have been enhanced by using digital temperature sensor together with fuzzy control theory. In conclusion, the system poses advantages of no noise、 high reliability and long life.
本文结合航海、航空及航天等军事应用领域内密封仪器仪表的特点,对几种应用在密封仪器仪表上的散热方法进行了分析比较,提出以半导体制冷技术与冷板技术相结合的混合散热方法;并以单总线数字温度传感器作为温度测量单元,以半导体制冷器作为执行单元,使用单片机作为主控制器设计了温度模糊控制系统。该系统采用脉宽调制(PWM)的功率控制方式。经过对系统的试验设计测试,证明半导体制冷器结合冷板的散热方法可以有效地解决密封仪器仪表对散热的特殊要求,实现了散热静音化,提高了系统的可靠性,延长了密封仪器仪表的使用寿命。单总线数字温度传感器抗干扰能力强、接口简单,从而提高了系统的测控精度。模糊控制理论的应用使该温度控制系统具有较好的稳定性。
In view of the rapid increase in the miniaturization, lightweight of intelligent instrument. Increased heat fluxes pose a major cooling challenge in electronic instrument enclosure. Amount of heat accumulation directly influences the reliability of the instrument. To meet the challenge significant cooling technology enhancements will be needed.This article firstly analyzes and compares different kinds of heat transfer technologies of present applications in sealed electronic instrument. Considering special requirement of electronic enclosures in nautical and aeronautic application areas. Peltier cooling technology mixed up with cold plate technology is presented. Also, 1-wire digital thermometer as temperature probe, a microprocessor based fuzzy temperature control system is designed. The system adopts Pulse Width Modulation (PWM) as power control method. Experimental results indicate that the special heat dissipation needs of sealed instrument are satisfied. Furthermore interference-free feature and measurement control performance have been enhanced by using digital temperature sensor together with fuzzy control theory. In conclusion, the system poses advantages of no noise、 high reliability and long life.
引文
[1] 徐超,何雅玲.现代电子器件冷却方法研究动态.制冷与空调(北京)[J].2003,3(4):10-13,17.
[2] 孙怀义.智能仪表的可靠性设计与评估技术.工业控制计算机[J].2001年09期.
[3] Marongiu, M.J. Some Issues In Experimental Testing And Methodologies In The Thermal Management Of Telecommunication Components, Systems And Enclosures. presented at 17th International Telecommunication Energy Conference(INTELEC)[C]. The Hague, Holland Year.
[4] 吴学群.舰载密闭电子设备的温度控制.舰船科学技术[J].1994,(04):25-30.
[5] Bergles, A. E. Evolution of cooling technology for electrical, electronic, and microelectronic equipment. 2003, 26(1):6-15.
[6] J.D.Cockcroft. The temperature distribution in a transformer or other laminated core of rectangular cross section in which heat is generated at a uniform rate. Proc Cambridge Philos Soc[J]. 1925, 22:759-772.
[7] 杨世铭,陶文铨.传热学(第三版)[M].北京:高等教育出版社,1998.
[8] Chein, Reiyu, Huang, Guanming. Thermoelectric cooler application in electronic cooling. 2004:2207-2217.
[9] 朱明君.密闭式电子设备的冷却散热设计.通信与广播电视[J].1994,(1):61-64,69.
[10] 胡志勇.当今电子设备冷却技术的发展趋势.电子机械工程[J].1999,(1):2-5.
[11] ALLAN,D.ABEL功率晶体管的散热.计算机工程与应用[J].1964年03期.
[12] 姜润民,Leonhard katz.电子设备的热传导设计.计算机工程与应用[J].1964年07期.
[13] 姜润民,阿尼亚英夫.电子计算机的冷却.计算机工程与应用[J].1964年06期.
[14] 周绪康.电子设备热设计的最近发展.桂林电子工业学院学报[J].1989,9(1):6-12.
[15] 宋小军,时社萍.航空电子设备密封机箱内印制电路板上温度分布的快速预测.电子机械工程[J].1994,(4):28-38.
[16] 宋小军.热分析软件CAL对强迫风冷密封机箱内温度分布的快速预测.电子机械工程[J].1998,(3):20-24.
[17] 徐丽生.若干新技术在电子设备结构设计中的应用.电子机械工程[J].1997,(1):6-9.
[18] 顾子天.计算机可靠性理论与实践[M].成都:电子科技大学出版社,1994.
[19] 白秀茹.典型的密封式电子设备结构热设计研究.电子机械工程[J].2002,(04):36-38.
[20] Misale, M. Electronic Cabinet Cooling by Natural Convection: Influence of Vent Geometry. Proc. of 3rd World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics[C] Year. 764-771.
[21] Johnson, R. D. Cooling techniques in electronics Year. 5/1-5/4.
[22] K.P.Moran, R.E.Simons. Immersion cooling systems for high density electronic packages. Nat. Elec. Pack. and Prod. Conf (NEPCON) Proc[C] Year. 396-409.
[23] Simons, R. E. The evolution of IBM high performance cooling technology Year. 102-114.
[24] LeVas,王国耀.高密度航空电子设备的液冷方法.航空电子技术[J].1994,(2):42-48.
[25] M. Barwick, M. Midkiff. Seals Liquid Flow-Through Cooling For Avionics Applications Aerospace and Electronics Conference Year.
[26] 张小旭.电子设备全密闭机距的强迫风冷设计.兰州铁道学院学报[J].1999,18(5):128-131.
[27] 白黎春.全密封发射机热设计.电子机械工程[J].2003,19(6):4-6.
[28] 杨群.冷板在电子设备中的应用.电子机械工程[J].2004,(01):13-14+18.
[29] R. M. Weber, D. C. Price (March 21, 1995). Thermal control system (U.S. Patent).
[30] R. M. Weber, D. C. Price. Expendable-liquid environmental control system for avionics. SAE AC-9 Environmental Control Systems Committee[C]. Colorado Springs, CO: Society of Automotive Engineers Year.
[31] Assouad, Y., Caplot, M. Advanced cooling techniques comparison for airborne electronic circuits Year. 131-141.
[32] 余建祖.电子设备热设计及分析技术fM]:高等教育出版社,2002.
[33] 王黛琳,陈守良.热管/散热片组合用于密封功率模块的散热.国外电力电子技术[J].1989,(1):31-32.
[34] 朱建炳,王根生.空间低温热管的设计与实验研究.真空与低温[J].2000,6(2):91-97.
[35] R. M. Weber, J.P. O'Connor. Thermal management of electronic packages using solid-to-liquid phase-change techniques. Int J MicrocircElectron Packag[J]. 1998, 20(4):593-601.
[36] 罗勇,王兰.半导体冷藏柜用热端散热器的实验研究.石家庄铁道学院学报[J].2001,14(3):34-35.
[37] 傅明星,蒋大宗.热电制冷摄像机密封腔研究.润滑与密封[J].2000,(5):58-60.
[38] 孙志刚,郭旺锁.多级循环的密闭式混合冷却系统.电子机械工程[J].1996,(02):8-10.
[39] 徐德胜.半导体制冷与应用技术(第二版)[M].上海:上海交通大学出版社,1999.
[40] 钟广学.半导体制冷器及其应用[M].北京:科学出版社,1989.11.
[41] Marlow Industries, Inc (1994). Thermoelectric Cooling Systems Design Guide (Publication No. 017-7939, Rev 1).
[42] 祝保英.基于半导体制冷技术的番茄DFT营养液温控系统的应用研究[D].北京:中国农业大学,2004.6.
[43] 陆荣根.DJS-186计算机的热设计.计算机工程与应用[J].1983年12期.
[44] 金以慧.过程控制[M].北京:清华大学出版社,1993,01.
[45] 余勇,万德钧.一种基于Smith预估器的温度控制系统.自动化与仪器仪表[J].2000,(01):8-9+12.
[46] 全国大学生电子设计竞赛组委会.全国大学生电子设计竞赛获奖作品汇编[M].北京:北京理工大学出版社,2004.08.
[47] 崔坤林,张翼飞.时滞系统的经典控制与智能控制.微计算机信息[J].2004,20(6):25-26.
[48] J, Palmor Z. Stability properties of Smith dead time compensator controller. 1980, 32(6):937～949.
[49] 姜孝华.电焊机的单片微机专家智能控制.西南交通大学学报[J].1994,29(5):472-476.
[50] 彭祖林,邓罗根,刘细华.用于测量体温的无线实时监测系统的设计与实现.微计算机信息[J].2005:59-60.
[51] 章卫国,杨向忠.模糊控制理论与应用[M].西安:西北工业大学出版社,1999.
[52] 余永权.模糊控制技术与模糊家用电器[M].北京:北京航空航天大学出版社,2000,12.
[2] 孙怀义.智能仪表的可靠性设计与评估技术.工业控制计算机[J].2001年09期.
[3] Marongiu, M.J. Some Issues In Experimental Testing And Methodologies In The Thermal Management Of Telecommunication Components, Systems And Enclosures. presented at 17th International Telecommunication Energy Conference(INTELEC)[C]. The Hague, Holland Year.
[4] 吴学群.舰载密闭电子设备的温度控制.舰船科学技术[J].1994,(04):25-30.
[5] Bergles, A. E. Evolution of cooling technology for electrical, electronic, and microelectronic equipment. 2003, 26(1):6-15.
[6] J.D.Cockcroft. The temperature distribution in a transformer or other laminated core of rectangular cross section in which heat is generated at a uniform rate. Proc Cambridge Philos Soc[J]. 1925, 22:759-772.
[7] 杨世铭,陶文铨.传热学(第三版)[M].北京:高等教育出版社,1998.
[8] Chein, Reiyu, Huang, Guanming. Thermoelectric cooler application in electronic cooling. 2004:2207-2217.
[9] 朱明君.密闭式电子设备的冷却散热设计.通信与广播电视[J].1994,(1):61-64,69.
[10] 胡志勇.当今电子设备冷却技术的发展趋势.电子机械工程[J].1999,(1):2-5.
[11] ALLAN,D.ABEL功率晶体管的散热.计算机工程与应用[J].1964年03期.
[12] 姜润民,Leonhard katz.电子设备的热传导设计.计算机工程与应用[J].1964年07期.
[13] 姜润民,阿尼亚英夫.电子计算机的冷却.计算机工程与应用[J].1964年06期.
[14] 周绪康.电子设备热设计的最近发展.桂林电子工业学院学报[J].1989,9(1):6-12.
[15] 宋小军,时社萍.航空电子设备密封机箱内印制电路板上温度分布的快速预测.电子机械工程[J].1994,(4):28-38.
[16] 宋小军.热分析软件CAL对强迫风冷密封机箱内温度分布的快速预测.电子机械工程[J].1998,(3):20-24.
[17] 徐丽生.若干新技术在电子设备结构设计中的应用.电子机械工程[J].1997,(1):6-9.
[18] 顾子天.计算机可靠性理论与实践[M].成都:电子科技大学出版社,1994.
[19] 白秀茹.典型的密封式电子设备结构热设计研究.电子机械工程[J].2002,(04):36-38.
[20] Misale, M. Electronic Cabinet Cooling by Natural Convection: Influence of Vent Geometry. Proc. of 3rd World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics[C] Year. 764-771.
[21] Johnson, R. D. Cooling techniques in electronics Year. 5/1-5/4.
[22] K.P.Moran, R.E.Simons. Immersion cooling systems for high density electronic packages. Nat. Elec. Pack. and Prod. Conf (NEPCON) Proc[C] Year. 396-409.
[23] Simons, R. E. The evolution of IBM high performance cooling technology Year. 102-114.
[24] LeVas,王国耀.高密度航空电子设备的液冷方法.航空电子技术[J].1994,(2):42-48.
[25] M. Barwick, M. Midkiff. Seals Liquid Flow-Through Cooling For Avionics Applications Aerospace and Electronics Conference Year.
[26] 张小旭.电子设备全密闭机距的强迫风冷设计.兰州铁道学院学报[J].1999,18(5):128-131.
[27] 白黎春.全密封发射机热设计.电子机械工程[J].2003,19(6):4-6.
[28] 杨群.冷板在电子设备中的应用.电子机械工程[J].2004,(01):13-14+18.
[29] R. M. Weber, D. C. Price (March 21, 1995). Thermal control system (U.S. Patent).
[30] R. M. Weber, D. C. Price. Expendable-liquid environmental control system for avionics. SAE AC-9 Environmental Control Systems Committee[C]. Colorado Springs, CO: Society of Automotive Engineers Year.
[31] Assouad, Y., Caplot, M. Advanced cooling techniques comparison for airborne electronic circuits Year. 131-141.
[32] 余建祖.电子设备热设计及分析技术fM]:高等教育出版社,2002.
[33] 王黛琳,陈守良.热管/散热片组合用于密封功率模块的散热.国外电力电子技术[J].1989,(1):31-32.
[34] 朱建炳,王根生.空间低温热管的设计与实验研究.真空与低温[J].2000,6(2):91-97.
[35] R. M. Weber, J.P. O'Connor. Thermal management of electronic packages using solid-to-liquid phase-change techniques. Int J MicrocircElectron Packag[J]. 1998, 20(4):593-601.
[36] 罗勇,王兰.半导体冷藏柜用热端散热器的实验研究.石家庄铁道学院学报[J].2001,14(3):34-35.
[37] 傅明星,蒋大宗.热电制冷摄像机密封腔研究.润滑与密封[J].2000,(5):58-60.
[38] 孙志刚,郭旺锁.多级循环的密闭式混合冷却系统.电子机械工程[J].1996,(02):8-10.
[39] 徐德胜.半导体制冷与应用技术(第二版)[M].上海:上海交通大学出版社,1999.
[40] 钟广学.半导体制冷器及其应用[M].北京:科学出版社,1989.11.
[41] Marlow Industries, Inc (1994). Thermoelectric Cooling Systems Design Guide (Publication No. 017-7939, Rev 1).
[42] 祝保英.基于半导体制冷技术的番茄DFT营养液温控系统的应用研究[D].北京:中国农业大学,2004.6.
[43] 陆荣根.DJS-186计算机的热设计.计算机工程与应用[J].1983年12期.
[44] 金以慧.过程控制[M].北京:清华大学出版社,1993,01.
[45] 余勇,万德钧.一种基于Smith预估器的温度控制系统.自动化与仪器仪表[J].2000,(01):8-9+12.
[46] 全国大学生电子设计竞赛组委会.全国大学生电子设计竞赛获奖作品汇编[M].北京:北京理工大学出版社,2004.08.
[47] 崔坤林,张翼飞.时滞系统的经典控制与智能控制.微计算机信息[J].2004,20(6):25-26.
[48] J, Palmor Z. Stability properties of Smith dead time compensator controller. 1980, 32(6):937～949.
[49] 姜孝华.电焊机的单片微机专家智能控制.西南交通大学学报[J].1994,29(5):472-476.
[50] 彭祖林,邓罗根,刘细华.用于测量体温的无线实时监测系统的设计与实现.微计算机信息[J].2005:59-60.
[51] 章卫国,杨向忠.模糊控制理论与应用[M].西安:西北工业大学出版社,1999.
[52] 余永权.模糊控制技术与模糊家用电器[M].北京:北京航空航天大学出版社,2000,12.