QFN封装电磁屏蔽用化学镀Cu的研究
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摘要
本论文是在环氧树脂塑料封装基底表面利用化学镀铜方法制备电磁屏蔽薄膜的研究。结果表明,所得到的化学镀铜工艺稳定性好、镀液寿命长,铜镀层具有表面电阻率低、均匀性好、电磁屏蔽(EMI shielding)性能良好、与基底间的结合力高的特性,完全可以满足QFN封装工艺的要求。
得到了优化的除油、粗化和化学镀铜工艺配方。所得到的化学镀铜溶液稳定性较高,可以正常工作至少5个周期,镀液的平均镀速为1.88μm/h。
改变粗化液的配比对改善镀层与基底间的结合力贡献不大,而提高温度可以迅速提高结合力,缩短粗化时间。优化的粗化工艺可以提高基底表面的粗糙度,改变基底表面形貌,使基底表面呈现典型的主要由SiO_2颗粒构成的“球-隙”承插型结构,这种结构对提高镀层与基底间的结合力起到了很大的作用。结果表明,在85℃下粗化20～30min即可以达到满意的效果。
使用了α-αˊ联吡啶和亚铁氰化钾作为联合稳定剂,并在镀液中加入了无水乙醇,发现无水乙醇不仅能提高镀液的稳定性,而且在适量时可以提高镀速,但浓度超过20mL/L时,反而降低镀速。根据电化学混合电位理论,用线性伏安法研究表明,α-αˊ联吡啶通过有效地抑制甲醛的阳极氧化来抑制沉铜速率; 而亚铁氰化钾主要通过抑制Cu~(2+)的还原峰电流来阻碍Cu~(2+)的还原析出,但宏观的对化学镀铜镀速的影响不大。而无水乙醇既可以降低甲醛氧化反应速率,在一定浓度范围内又促进Cu~(2+)的还原反应,它对镀速的影响与其浓度有关。
对化学镀铜过程的混合电位研究表明,诱导时间随α-αˊ联吡啶或亚铁氰化钾浓度的增加而增加,但α-αˊ联吡啶的影响更为明显; 无水乙醇在低浓度时可以缩短诱导时间,而浓度超过20mL/L时,诱导时间反而增加。
化学镀铜层的表面电阻率随镀层厚度的增加而迅速降低,在厚度大于1μm后,表面电阻基本趋于稳定值。镀铜层与基底间的结合力可以达到5B级,在经过热冲击试验和QFN封装工艺的高速砂轮线切割操作后,结合力都达到5B级。理论计算表明,当镀层厚度大于2μm后,其电磁屏蔽效果可以超过60dB,达到优秀的级别。
The process of electroless copper plating on the epoxy resin used to electronic packaging is studied in this thesis. The results show that the electroless copper plating bath have good stability and long periods, and the Cu deposition have lower surface resistance, good uniformity, better EMI shielding ability and well adhibition to the substrate. It can well fit the QFN packaging process.
The optimized process of oil removing, coarsing and electroless copper plating bath are get. The electroless copper plating bath can work at lest five periods with the average deposition velocity about 1.88μm/h.
The mixture ratio of the coarsing solution compounds have very little influence on the bonding force between the Cu deposition and substrate except the coarsing temperature. Longer coarsing time and higher coarsing temperature can enhance the bonding force, increase the surface roughness and change the surface appearance from “V” shape to “symbiotic ball-gap” shape. The surface appearance is much important than the modified surface to increase the bonding force. The best result can be get for coarsing 20～30 minutes under 85℃.
The stability of electroless copper plating bath can much be increased by using multi stabilizers. The ethanol can not only increase the stability of the bath, but also the deposition velocity when its concentration is less than 20mL/L. According to the electrochemistry mixed potential theory, the linear sweep voltammagram method is used to study the cathod and anode processes of the stabilizers. The results show that α-α’ dipyridyl can decrease the deposition velocity by inhibit the anodic oxidation of formaldehyde, and potassium ferrocyanide can stabilizing the bath by inhibit the deoxidation of Cu~(2+). The ethanol can not only inhibit the anodic oxidation of formaldehyde, but also accelerate the deoxidation of Cu~(2+) in suitable concentration.
The mixed potential of the electroless copper plating process are also studied. they show that the induction time elongate with the increasing of the concentration of α-α’ dipyridyl or formaldehyde. The ethanol can shorten the induction time in low concentration, reversely with the concentration more than 20mL/L.
The surface resistance can decrease much with the increase of the Cu deposition thickness. After the thickness reach 1μm, the decrease value become little. The bonding force between the Cu deposition and substrate can reach 5B grade even after
the thermal shock test and the cut by using high-speed grinding wheel of the QFN process. The theoretical calculation results show that the EMI shielding ability can reach 60dB with the Cu deposition thickness more than 2μm.
得到了优化的除油、粗化和化学镀铜工艺配方。所得到的化学镀铜溶液稳定性较高,可以正常工作至少5个周期,镀液的平均镀速为1.88μm/h。
改变粗化液的配比对改善镀层与基底间的结合力贡献不大,而提高温度可以迅速提高结合力,缩短粗化时间。优化的粗化工艺可以提高基底表面的粗糙度,改变基底表面形貌,使基底表面呈现典型的主要由SiO_2颗粒构成的“球-隙”承插型结构,这种结构对提高镀层与基底间的结合力起到了很大的作用。结果表明,在85℃下粗化20～30min即可以达到满意的效果。
使用了α-αˊ联吡啶和亚铁氰化钾作为联合稳定剂,并在镀液中加入了无水乙醇,发现无水乙醇不仅能提高镀液的稳定性,而且在适量时可以提高镀速,但浓度超过20mL/L时,反而降低镀速。根据电化学混合电位理论,用线性伏安法研究表明,α-αˊ联吡啶通过有效地抑制甲醛的阳极氧化来抑制沉铜速率; 而亚铁氰化钾主要通过抑制Cu~(2+)的还原峰电流来阻碍Cu~(2+)的还原析出,但宏观的对化学镀铜镀速的影响不大。而无水乙醇既可以降低甲醛氧化反应速率,在一定浓度范围内又促进Cu~(2+)的还原反应,它对镀速的影响与其浓度有关。
对化学镀铜过程的混合电位研究表明,诱导时间随α-αˊ联吡啶或亚铁氰化钾浓度的增加而增加,但α-αˊ联吡啶的影响更为明显; 无水乙醇在低浓度时可以缩短诱导时间,而浓度超过20mL/L时,诱导时间反而增加。
化学镀铜层的表面电阻率随镀层厚度的增加而迅速降低,在厚度大于1μm后,表面电阻基本趋于稳定值。镀铜层与基底间的结合力可以达到5B级,在经过热冲击试验和QFN封装工艺的高速砂轮线切割操作后,结合力都达到5B级。理论计算表明,当镀层厚度大于2μm后,其电磁屏蔽效果可以超过60dB,达到优秀的级别。
The process of electroless copper plating on the epoxy resin used to electronic packaging is studied in this thesis. The results show that the electroless copper plating bath have good stability and long periods, and the Cu deposition have lower surface resistance, good uniformity, better EMI shielding ability and well adhibition to the substrate. It can well fit the QFN packaging process.
The optimized process of oil removing, coarsing and electroless copper plating bath are get. The electroless copper plating bath can work at lest five periods with the average deposition velocity about 1.88μm/h.
The mixture ratio of the coarsing solution compounds have very little influence on the bonding force between the Cu deposition and substrate except the coarsing temperature. Longer coarsing time and higher coarsing temperature can enhance the bonding force, increase the surface roughness and change the surface appearance from “V” shape to “symbiotic ball-gap” shape. The surface appearance is much important than the modified surface to increase the bonding force. The best result can be get for coarsing 20～30 minutes under 85℃.
The stability of electroless copper plating bath can much be increased by using multi stabilizers. The ethanol can not only increase the stability of the bath, but also the deposition velocity when its concentration is less than 20mL/L. According to the electrochemistry mixed potential theory, the linear sweep voltammagram method is used to study the cathod and anode processes of the stabilizers. The results show that α-α’ dipyridyl can decrease the deposition velocity by inhibit the anodic oxidation of formaldehyde, and potassium ferrocyanide can stabilizing the bath by inhibit the deoxidation of Cu~(2+). The ethanol can not only inhibit the anodic oxidation of formaldehyde, but also accelerate the deoxidation of Cu~(2+) in suitable concentration.
The mixed potential of the electroless copper plating process are also studied. they show that the induction time elongate with the increasing of the concentration of α-α’ dipyridyl or formaldehyde. The ethanol can shorten the induction time in low concentration, reversely with the concentration more than 20mL/L.
The surface resistance can decrease much with the increase of the Cu deposition thickness. After the thickness reach 1μm, the decrease value become little. The bonding force between the Cu deposition and substrate can reach 5B grade even after
the thermal shock test and the cut by using high-speed grinding wheel of the QFN process. The theoretical calculation results show that the EMI shielding ability can reach 60dB with the Cu deposition thickness more than 2μm.
引文
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