大功率发光二极管导热界面功能复合材料的研究
|
摘要
随着人类照明技术的发展,以及环境保护意识的提高,越来越多以高效、节能、环保、长寿命为标志的新技术,新发明在照明领域产生并逐渐推广使用;以高亮度、高发光效率、冷光、体积微小、快速响应、被动高功率因子、全色彩光、高显色性、固体光源、长寿命为显著特点的现代大功率高亮度发光二极管简称HPLED(High Power Light Emitting Diode)的逐渐广泛应用为其标志之一.随着HPLED照明领域从装饰性照明扩展到普通照明,一方面对其单位功率发光亮度要求的不断提高(每瓦流明数);另一方面通过单位面积上聚集的功率的不断上升,以提高总的流明数,例如单颗HPLED封装体积不变,但功率却从1W、3W到5W,处于实验室级别的产品功率更高.这就要求如何更加有效将HPLED发光芯片上的热取出,以最快最低热阻的方式传导给其散热装置,避免由于热蓄积引起的温升而对HPLED芯片造成致命负面影响.而HPLED的典型应用装置即HPLED灯,隐蔽微小是其不同于传统照明的一个突出方面,正因为如此,通常HPLED灯的散热装置均采用被动方式即自然方式:传导、自然对流、辐射.前两种是其散热的主要方式.从HPLED灯的发光芯片到灯体外表面或其散热装置,无可避免的要经过一处,或两处乃至三处的实体之间的界面,根据目前实用灯具的情况看两次以上的界面是最普通的应用方式.而如何将这些界面的热阻降至最低,使得热流能最大限度的通过,将是避免HPLED芯片PN结温度过高的一个行之有效的方面.
本文的研究对象是具有相变特点的功能复合界面材料,因其具有相变:固-液相变的特点,能实现实体界面之间的无缝连接,再由于其中添加了有机硅等为主要成分的填料,在正常使用条件下不会因为固-液相变导致材料层析、偏聚、缺失等情况,并由于有机硅本身相对较高的热传导系数,极弱的导电性,及低廉的价格,非常适合在HPLED的实体界面之间的应用.
本文根据具有相变特点的导热界面功能复合材料的传热特点,采用有限元分析理论,通过专用的热分析计算机技术,以特定的HPLED投光灯模型为例,建立相应的实体模型,并结合相应的实验建立了在特定功率下,不同温度,不同厚度,不同操作工艺,不同掺杂成分下,非金属基导热界面功能复合材料对HPLED投光灯的散热影响,通过其升降温曲线,特定温度测点温度变化情况分析,以期对HPLED灯的实际使用可以比较正确的指导.
With the development of human lighting technology & the improvement of the consciousness of human being to environment, more and more new technology and new invention what are as the sign of high-efficiency,saving-energy,environment-protection,long-life appeared in lighting field ,then gradually apply much.One of these signs is what has the characteristic of high luminaire,high light-efficiency,cold light-ray,tiny volume,quick reaction,high power efficiency,full color light,high displaying true color,solid light source,long-life etc,belongs to high power light emitting diode (HPLED in brief named).By the application of HPLED expands from decorative lighting to general lighting ,as the result new requirements are naturally born, the first requirement is that light luminance per power continuous improves higher,the second requirement is by gathering power in certain area to reach the goal of improving total light luminance .for example HPLED encapsulation volume per unit does not changes but its power improves from 1W, 3W to 5W.which has located in experimental grade will has more high power. All of above requiring how to conduct thermal from HPLED light emitter core to lightshell or its thermal conductivity instrument in prestissimo and low thermal resistance ways,avoiding the fatal effection of thermal deposition resulting in temperature increasing brings to HPLED light emitter core.The classic application equipment of HPLED is HPLED lamp. The tiny or small is its outstanding merit that differs from traditional lighting.Therefore the thermal conductivity equipment of HPLED are always in passive methods such as: thermal conductivity, natural thermal convection,thermal radiation.The two forward methods are primary.From HPLED light emitter core to lightshell or its thermal conductor equipment unavoidable through one or two or three solid interface. At present according to the true application ,much more two solid interfaces are common,then how to reduce these solid interfaces thermal resistance lowestly,so thermal current may pass through that in utmost degree will be the best way to avoid the PN junction temperature of HPLED light emitter core reach too high.
The research object in this article is a certain functional multiple thermal interface material what has characteristic of phase-change : solid-liquid phase-change can connect between solid interface surface with no gap.Which also includes organic silicone element etc, which insures no chromatography ,no local-gathering,non-lost,etc.Moreover silicone has the characteristic of relative high thermal conductivity factor,weak electric conductivity,low cost so that very exactly fits to the application of HPLED solid interface.
According to the thermal conductivity characteristic of phase-change functional multiple materials we have adopt limited particle therory analysis in this article ,by special computer thermal anaylsis technology,aim at certain HPLED flood lighting model,established computer model .and combined a series of non-metal thermal interface materials experiments,which established in certain power,different thickness,different temperature,different trasaction,different composition, to acknowledge thermal conductivity effection of the material to HPLED flood lighting by its ascend and descend temperature curve,and certain measuring spots temperature changing,conclude what should be refer in HPLED lighting application
本文的研究对象是具有相变特点的功能复合界面材料,因其具有相变:固-液相变的特点,能实现实体界面之间的无缝连接,再由于其中添加了有机硅等为主要成分的填料,在正常使用条件下不会因为固-液相变导致材料层析、偏聚、缺失等情况,并由于有机硅本身相对较高的热传导系数,极弱的导电性,及低廉的价格,非常适合在HPLED的实体界面之间的应用.
本文根据具有相变特点的导热界面功能复合材料的传热特点,采用有限元分析理论,通过专用的热分析计算机技术,以特定的HPLED投光灯模型为例,建立相应的实体模型,并结合相应的实验建立了在特定功率下,不同温度,不同厚度,不同操作工艺,不同掺杂成分下,非金属基导热界面功能复合材料对HPLED投光灯的散热影响,通过其升降温曲线,特定温度测点温度变化情况分析,以期对HPLED灯的实际使用可以比较正确的指导.
With the development of human lighting technology & the improvement of the consciousness of human being to environment, more and more new technology and new invention what are as the sign of high-efficiency,saving-energy,environment-protection,long-life appeared in lighting field ,then gradually apply much.One of these signs is what has the characteristic of high luminaire,high light-efficiency,cold light-ray,tiny volume,quick reaction,high power efficiency,full color light,high displaying true color,solid light source,long-life etc,belongs to high power light emitting diode (HPLED in brief named).By the application of HPLED expands from decorative lighting to general lighting ,as the result new requirements are naturally born, the first requirement is that light luminance per power continuous improves higher,the second requirement is by gathering power in certain area to reach the goal of improving total light luminance .for example HPLED encapsulation volume per unit does not changes but its power improves from 1W, 3W to 5W.which has located in experimental grade will has more high power. All of above requiring how to conduct thermal from HPLED light emitter core to lightshell or its thermal conductivity instrument in prestissimo and low thermal resistance ways,avoiding the fatal effection of thermal deposition resulting in temperature increasing brings to HPLED light emitter core.The classic application equipment of HPLED is HPLED lamp. The tiny or small is its outstanding merit that differs from traditional lighting.Therefore the thermal conductivity equipment of HPLED are always in passive methods such as: thermal conductivity, natural thermal convection,thermal radiation.The two forward methods are primary.From HPLED light emitter core to lightshell or its thermal conductor equipment unavoidable through one or two or three solid interface. At present according to the true application ,much more two solid interfaces are common,then how to reduce these solid interfaces thermal resistance lowestly,so thermal current may pass through that in utmost degree will be the best way to avoid the PN junction temperature of HPLED light emitter core reach too high.
The research object in this article is a certain functional multiple thermal interface material what has characteristic of phase-change : solid-liquid phase-change can connect between solid interface surface with no gap.Which also includes organic silicone element etc, which insures no chromatography ,no local-gathering,non-lost,etc.Moreover silicone has the characteristic of relative high thermal conductivity factor,weak electric conductivity,low cost so that very exactly fits to the application of HPLED solid interface.
According to the thermal conductivity characteristic of phase-change functional multiple materials we have adopt limited particle therory analysis in this article ,by special computer thermal anaylsis technology,aim at certain HPLED flood lighting model,established computer model .and combined a series of non-metal thermal interface materials experiments,which established in certain power,different thickness,different temperature,different trasaction,different composition, to acknowledge thermal conductivity effection of the material to HPLED flood lighting by its ascend and descend temperature curve,and certain measuring spots temperature changing,conclude what should be refer in HPLED lighting application
引文
1.魏云锋.《21世纪新光源LED》[J].《科技创业月刊》:2008,(5):52-53.
2.李柄乾.《1W级大功率白光LED发光效率研究》[J].《半导体光电》,2005,26(4):314-361.
3.钱可元,郑代顺,罗毅.《GaN基功率型LED芯片散热性能测试与分析》[J].《半导体光电》,2006,27(3):236-239.
4.林巧明,郭霞,顾晓玲等.《GaN基蓝光发光二极管峰值波长偏移的研究》[J].《半导体光电》,2007,28(3):338-341.
5.乐淑萍,肖慧荣,易江林.《GaN基白光LED电流加速老化特性研究》[J].《南昌航空工业学院学报(自然科学版)》,2007,21(1):10-13.
6.张贤鹏,韩彦军,罗毅等.《ICP刻蚀p-GaN表面微结构GaN基蓝光LED》[J].《半导体光电》,2008,29(1):6-15.
7.卢有祥.《LED的发展和应用》[J].《光电技术》,2008,49,(1):14-21.
8.斯芳虎.《LED灯失效的几种常见原因分析》[J].《电子质量》,2007,(9):13-14.
9.周志敏,周纪海,纪爱华.《LED驱动电路设计及应用》[M].北京,电子工业出版社,2006:1-66.
10.www.philipslumileds.com
11.屋大维,吴仍茂,杨恒亮等.《LED封装光学结构对光强分布的影响》[J].《光学精密工程》,2008,16(5):832-838.
12.陈辉.《LED封装技术的发展趋势》[J].《中国照明》,2008:95-96.
13.肖志国.《半导体照明发光材料及应用》[M].北京,化学工业出版社,2008:1-30.
14.吴淑梅,霍彦明,徐梅等.《LED光源在照明中的应用》[J].《现代显示》,2008,(90):55-58.
15.Nadarajah Narendara,Yimin Cu.Life Of LED—based white light sources[J].IEEE/OSE Journal of display technology.2005.1 (1):167-171.
16.江磊,江程,陈郁阳等.《LED恒流驱动电路效率研究》[J].《光源与照明》,2008,(1):6-8.
17.万喜玉,崔玉东.《LED户外照明应用和发展前景探讨》[J].《城市亮化》,2008,(1):38-42.
18.崔佳,齐敏杰,刘伟等.《LED环氧树脂封装材料研究进展》[J].《塑料科技》,2008,36,(8):90-92.
19.王桥立,夏志清,文静.《LED结温、热阻构成及其影响》[J].《现代显示》,2008,(89):59-61.
20.张芸,刘铁根,张学敏.《LED路灯光强模拟分布及实验验证》[J].《光学仪器》,2008,30,(1):45-49.
21.刘健,闫伟.《LED器件热阻测试仪的研制》[J].《电子测试》,2008,(7):51-54.
22.王桥立,夏志清.《LED显示模组设计方法与电磁兼容》[J].《现代显示》,2008,(91):54-57.
23.陈文华.《LED行业前途无量》[J].《中国照明》,2008,(4):115-116.
24.胡玉才,于会弟,殷平.《LED荧光粉的制备与表征》[J].《应用化工》,2008,37,(7):739-741.
25.王术军,张保洲.《LED在线分拣系统的研制》[J].《半导体光电》,2004,25,(2):108-111.
26.林志勋,黄孟娇.《LED照明产业应用趋势分析》[J].《电子与电脑》,2007,(10):72-75.
27.孙英杰,朴文斌.《LED照明的照度均匀性研究》[J].《哈尔滨师范大学学报》,2008,24,(3):50-52.
28.吴非,陈文彬.《Tracepro在OLED微透镜设计中的应用》[J].《现代显示》,2008,(88):30-33.
29.陈静波,王晶,苗洪利等.《YAG:Ge3+荧光粉对白光LED衰减的影响》[J].《光电子.激光》,2008,19,(4):453-455.
30.深圳雷曼光电科技有限公司.《白光LED的封装材料对其光衰影响的实验研究》[J].《现代显示》,2008,(86):60-62.
31.杨正名,柴国生,张明等.《白光LED的进展及应用》[J].《中国照明》,2008,(5):90-94.
32.郑毅夫.《白光LED的封装对其性能的影响》[J].《现代显示》,2008,(85):60-63.
33.宋国华,宋建新,繆建文.《白光LED能量转化效率的研究》[J].《半导体技术》,2008,33,(7):592-596.
34.王涛,井艳军,朱月华等.《白光LED用钨,钼酸盐红色荧光粉的研究进展》[J].《中国照明电器》,2008,(2):15-20.
35.丁唯嘉,张梅,余瑞金等.《白光LED用新型低温玻璃荧光体SiO2-YAG:Ce3+的制备及性能研究》[J].《中山大学学报(自然科学版)》,2008,47,(4):55-58.
36.祁萍,唐建华.《半导体照明LED及其应用产业化》[J].《中国照明》,2008,(7):76-80.
37.郑清洪,刘宝林,张保平.《表面粗化提高GaN基LED光提取效率的模拟》[J].《电子器件》,2008,31,(4):1077-1080.
38.黄杨程,夏勋力,陈波等.《大尺寸液晶电视LED背光源的研制》[J].《半导体光电》,2007,28, (5):642-644.
39.诸昌玲.《LED显示屏系统原理及工程技术》[M].成都:电子科技大学出版社,2000,1-30.
40.(美)哈拍(Herper,C.A.)主编,沈卓身,贾松良主译.《电子封装材料与工艺》第三版[M].北京:化学工业出版社,2006:84-112.
41.杨世铭.《传热学基础》第二版[M].北京:高等教育出版社,2003,1-60.
42.章学来邹复秉.《石蜡类相变材料传热性能研究》[D].上海:上海海事大学出版社,2006:1-70.
43.房华,李阳.《大功率LED的热量分析与设计》[J].《现代显示》,2007,(79):67-70.
44.庄鹏.《大功率LED的热阻测量与结构分析》[J].《现代显示》,2008,(91):25-29.
45.马志凌,郑学仁.《大功率LED的热阻计算方法》[J].《科学技术与工程》,2007,7,(24):6416-6419.
46.程骞.《大功率LED封装的热管理》[J].《电子工艺技术》,2007,28,(6):311-315.
47.戴维德.《大功率LED的散热设计》[J].《今日电子》,2007,69-72.
48.戴玮锋,王珺,李越生.《大功率LED封装的温度场和热应力分布的分析》[J].《半导体光电》,2008,29,(3):324-328.
49.李华平,柴广跃,彭文达等.《大功率LED的封装及其散热基板的研究》[J].《半导体光电》,2007,28,(1):47-50.
50.齐昆,陈旭.《大功率LED封装界面材料的热分析》[J].《电子与封装》,2007,7,(6):8-12.
51.苏达,王德苗.《大功率LED封装散热技术的研究》[J].《半导体技术》,2007,32,(9):742-749.
52.包书林,胡建宏.《几种典型LED封装结构初探》[J].《中国照明》,2007,(8):102-104.
53.田大垒,关荣锋,王杏.《大功率LED封装有限元热分析》[J].《半导体技术》,2008,33,(3):248-251.
54.王多笑,沐方清,李佳.《大功率LED陶瓷封装技术研究》[J].《混合微电子技术》,2008,19,(2):2-44.
55.陈伟,罗小兵,程婷等.《大功率LED用微喷射流冷却系统的实验研究》[J].《半导体光电》,2007,28,(4):478-486.
56.钱可元,胡飞,吴慧颖等.《大功率白光LED封装技术的研究》[J].《半导体光电》,2005,26,(2):118-120.
57.王春青,李焕然.《大功率白光LED封装温度场模拟及材料优化》[J].《焊接》,2008,(6):2-5.
58.马洪霞,钱可元,韩彦军.《大功率氮化镓基白光LED模组的散热设计》[J].《半导体光电》,2007,28,(5):627-630.
59.王立彬,陈宇,刘志强等.《大功率倒装结构LED芯片热模拟及分析》[J].《半导体光电》,2007,28,(6):769-773.
60.张淑芳,方亮,付光宗等.《导热涂层对LED散热性能的影响》[J].《半导体光电》,2007,28,(6):793-796.
61.www.primolite.com.cn
62.www.laird.com
2.李柄乾.《1W级大功率白光LED发光效率研究》[J].《半导体光电》,2005,26(4):314-361.
3.钱可元,郑代顺,罗毅.《GaN基功率型LED芯片散热性能测试与分析》[J].《半导体光电》,2006,27(3):236-239.
4.林巧明,郭霞,顾晓玲等.《GaN基蓝光发光二极管峰值波长偏移的研究》[J].《半导体光电》,2007,28(3):338-341.
5.乐淑萍,肖慧荣,易江林.《GaN基白光LED电流加速老化特性研究》[J].《南昌航空工业学院学报(自然科学版)》,2007,21(1):10-13.
6.张贤鹏,韩彦军,罗毅等.《ICP刻蚀p-GaN表面微结构GaN基蓝光LED》[J].《半导体光电》,2008,29(1):6-15.
7.卢有祥.《LED的发展和应用》[J].《光电技术》,2008,49,(1):14-21.
8.斯芳虎.《LED灯失效的几种常见原因分析》[J].《电子质量》,2007,(9):13-14.
9.周志敏,周纪海,纪爱华.《LED驱动电路设计及应用》[M].北京,电子工业出版社,2006:1-66.
10.www.philipslumileds.com
11.屋大维,吴仍茂,杨恒亮等.《LED封装光学结构对光强分布的影响》[J].《光学精密工程》,2008,16(5):832-838.
12.陈辉.《LED封装技术的发展趋势》[J].《中国照明》,2008:95-96.
13.肖志国.《半导体照明发光材料及应用》[M].北京,化学工业出版社,2008:1-30.
14.吴淑梅,霍彦明,徐梅等.《LED光源在照明中的应用》[J].《现代显示》,2008,(90):55-58.
15.Nadarajah Narendara,Yimin Cu.Life Of LED—based white light sources[J].IEEE/OSE Journal of display technology.2005.1 (1):167-171.
16.江磊,江程,陈郁阳等.《LED恒流驱动电路效率研究》[J].《光源与照明》,2008,(1):6-8.
17.万喜玉,崔玉东.《LED户外照明应用和发展前景探讨》[J].《城市亮化》,2008,(1):38-42.
18.崔佳,齐敏杰,刘伟等.《LED环氧树脂封装材料研究进展》[J].《塑料科技》,2008,36,(8):90-92.
19.王桥立,夏志清,文静.《LED结温、热阻构成及其影响》[J].《现代显示》,2008,(89):59-61.
20.张芸,刘铁根,张学敏.《LED路灯光强模拟分布及实验验证》[J].《光学仪器》,2008,30,(1):45-49.
21.刘健,闫伟.《LED器件热阻测试仪的研制》[J].《电子测试》,2008,(7):51-54.
22.王桥立,夏志清.《LED显示模组设计方法与电磁兼容》[J].《现代显示》,2008,(91):54-57.
23.陈文华.《LED行业前途无量》[J].《中国照明》,2008,(4):115-116.
24.胡玉才,于会弟,殷平.《LED荧光粉的制备与表征》[J].《应用化工》,2008,37,(7):739-741.
25.王术军,张保洲.《LED在线分拣系统的研制》[J].《半导体光电》,2004,25,(2):108-111.
26.林志勋,黄孟娇.《LED照明产业应用趋势分析》[J].《电子与电脑》,2007,(10):72-75.
27.孙英杰,朴文斌.《LED照明的照度均匀性研究》[J].《哈尔滨师范大学学报》,2008,24,(3):50-52.
28.吴非,陈文彬.《Tracepro在OLED微透镜设计中的应用》[J].《现代显示》,2008,(88):30-33.
29.陈静波,王晶,苗洪利等.《YAG:Ge3+荧光粉对白光LED衰减的影响》[J].《光电子.激光》,2008,19,(4):453-455.
30.深圳雷曼光电科技有限公司.《白光LED的封装材料对其光衰影响的实验研究》[J].《现代显示》,2008,(86):60-62.
31.杨正名,柴国生,张明等.《白光LED的进展及应用》[J].《中国照明》,2008,(5):90-94.
32.郑毅夫.《白光LED的封装对其性能的影响》[J].《现代显示》,2008,(85):60-63.
33.宋国华,宋建新,繆建文.《白光LED能量转化效率的研究》[J].《半导体技术》,2008,33,(7):592-596.
34.王涛,井艳军,朱月华等.《白光LED用钨,钼酸盐红色荧光粉的研究进展》[J].《中国照明电器》,2008,(2):15-20.
35.丁唯嘉,张梅,余瑞金等.《白光LED用新型低温玻璃荧光体SiO2-YAG:Ce3+的制备及性能研究》[J].《中山大学学报(自然科学版)》,2008,47,(4):55-58.
36.祁萍,唐建华.《半导体照明LED及其应用产业化》[J].《中国照明》,2008,(7):76-80.
37.郑清洪,刘宝林,张保平.《表面粗化提高GaN基LED光提取效率的模拟》[J].《电子器件》,2008,31,(4):1077-1080.
38.黄杨程,夏勋力,陈波等.《大尺寸液晶电视LED背光源的研制》[J].《半导体光电》,2007,28, (5):642-644.
39.诸昌玲.《LED显示屏系统原理及工程技术》[M].成都:电子科技大学出版社,2000,1-30.
40.(美)哈拍(Herper,C.A.)主编,沈卓身,贾松良主译.《电子封装材料与工艺》第三版[M].北京:化学工业出版社,2006:84-112.
41.杨世铭.《传热学基础》第二版[M].北京:高等教育出版社,2003,1-60.
42.章学来邹复秉.《石蜡类相变材料传热性能研究》[D].上海:上海海事大学出版社,2006:1-70.
43.房华,李阳.《大功率LED的热量分析与设计》[J].《现代显示》,2007,(79):67-70.
44.庄鹏.《大功率LED的热阻测量与结构分析》[J].《现代显示》,2008,(91):25-29.
45.马志凌,郑学仁.《大功率LED的热阻计算方法》[J].《科学技术与工程》,2007,7,(24):6416-6419.
46.程骞.《大功率LED封装的热管理》[J].《电子工艺技术》,2007,28,(6):311-315.
47.戴维德.《大功率LED的散热设计》[J].《今日电子》,2007,69-72.
48.戴玮锋,王珺,李越生.《大功率LED封装的温度场和热应力分布的分析》[J].《半导体光电》,2008,29,(3):324-328.
49.李华平,柴广跃,彭文达等.《大功率LED的封装及其散热基板的研究》[J].《半导体光电》,2007,28,(1):47-50.
50.齐昆,陈旭.《大功率LED封装界面材料的热分析》[J].《电子与封装》,2007,7,(6):8-12.
51.苏达,王德苗.《大功率LED封装散热技术的研究》[J].《半导体技术》,2007,32,(9):742-749.
52.包书林,胡建宏.《几种典型LED封装结构初探》[J].《中国照明》,2007,(8):102-104.
53.田大垒,关荣锋,王杏.《大功率LED封装有限元热分析》[J].《半导体技术》,2008,33,(3):248-251.
54.王多笑,沐方清,李佳.《大功率LED陶瓷封装技术研究》[J].《混合微电子技术》,2008,19,(2):2-44.
55.陈伟,罗小兵,程婷等.《大功率LED用微喷射流冷却系统的实验研究》[J].《半导体光电》,2007,28,(4):478-486.
56.钱可元,胡飞,吴慧颖等.《大功率白光LED封装技术的研究》[J].《半导体光电》,2005,26,(2):118-120.
57.王春青,李焕然.《大功率白光LED封装温度场模拟及材料优化》[J].《焊接》,2008,(6):2-5.
58.马洪霞,钱可元,韩彦军.《大功率氮化镓基白光LED模组的散热设计》[J].《半导体光电》,2007,28,(5):627-630.
59.王立彬,陈宇,刘志强等.《大功率倒装结构LED芯片热模拟及分析》[J].《半导体光电》,2007,28,(6):769-773.
60.张淑芳,方亮,付光宗等.《导热涂层对LED散热性能的影响》[J].《半导体光电》,2007,28,(6):793-796.
61.www.primolite.com.cn
62.www.laird.com