热流道热平衡及测控系统的应用研究
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摘要
热流道可看作是注射成型机的延伸,是注塑模结构的一部分。它连接注塑机喷嘴和模具型腔,把注塑机射出的熔融塑料输送到型腔内部。和传统的冷流道不同,它具有自己的加热系统或采用绝热方式,从而保持流道内的塑料在成型期间始终处于熔融状态。在模具开模时,流道内的塑料熔体不需要固化为废料取出,而滞留在流道内的熔体可以在下一次注射时注入模具型腔,提高了材料利用率。热流道技术是注射成型工艺技术上的一次革命,是注射成型技术的一个重要发展方向。
热流道模塑作为注塑模具工业发展的一项前沿技术,目前主要由少数欧美著名热流道公司研制开发和商业化应用。这一技术在国内尚处于逐步推广阶段,前景很好,潜在市场很大,热流道技术的开发应用势在必行。开展对热流道技术相关理论和设计要点的探索,无疑有助于热流道技术在国内的普及应用和更快的发展,以缩短同国外先进热流道技术水平的差距。
保证热流道系统的热平衡状态是热流道的关键技术之一。系统的理想状态是保持给定的温度,使塑料熔体控制在恒定状态。加热器能均匀加热,补偿热量的损失。
本文在参阅大量国内外资料的基础上,分析了影响热流道热损失的各因素,并计算加热元件所需的功率。根据传热学原理,建立了热流道热平衡的数学模型。同时利用ANSYS进行热分析,优化加热元件的布局,以保证热流道加热的均匀性。开发了基于PID控制的单片机测控系统,利用灵敏的热电偶,对热流道系统的流道板和各喷嘴进行精确的温度控制。
As components in injection mould, Hot runner system can be seen as an extention of injection molding machine. The purpose of an hot runner system is to feeds plasticised material into the cavity of the mould in a similar state to that in which it left the injection moulding machine nozzle. Different from the traditional cold runner gating system, hot runners has its own heating system or insulation to hold the the melt state during the processing. When open the mold, sprue removal needn't take out, and can be used in the next cycle time, so raised material utilization ratio. Hot runner technology is a revolution and an important direction of development in injection moulding and processing.
As an advanced technology in injection molding industry, hot runner technology is developed and commercial applied by small number of well-known European and American companies, however the application of this technology is still at the stage of gradual promotion in our country. With great prospects and market potential, the development and application of hot runner technology is imperative. It is no doubt that the theory study of hot runner technology will improve far-ranging application and fast development, so as to fill the gap with the advanced country.
One of the key points is to hold the hot runner system in a state of thermal equilibrium,which means that heat losses must be compensated for by heating. In the ideal case, an hot runner system will be in an isothermal state.
Reference to a large number of information at home and abroad , the paper analyzed the power consumption and how to calculate the power demand. According to the principles of heat transfer, mathematical model of thermal equilibrium is established, and ANSYS software is to be used for the optimal layout of the heating element. According to the MCU regulator with PID control algorithms and sensitive thermocouples, the precision temperature control can be attained.
热流道模塑作为注塑模具工业发展的一项前沿技术,目前主要由少数欧美著名热流道公司研制开发和商业化应用。这一技术在国内尚处于逐步推广阶段,前景很好,潜在市场很大,热流道技术的开发应用势在必行。开展对热流道技术相关理论和设计要点的探索,无疑有助于热流道技术在国内的普及应用和更快的发展,以缩短同国外先进热流道技术水平的差距。
保证热流道系统的热平衡状态是热流道的关键技术之一。系统的理想状态是保持给定的温度,使塑料熔体控制在恒定状态。加热器能均匀加热,补偿热量的损失。
本文在参阅大量国内外资料的基础上,分析了影响热流道热损失的各因素,并计算加热元件所需的功率。根据传热学原理,建立了热流道热平衡的数学模型。同时利用ANSYS进行热分析,优化加热元件的布局,以保证热流道加热的均匀性。开发了基于PID控制的单片机测控系统,利用灵敏的热电偶,对热流道系统的流道板和各喷嘴进行精确的温度控制。
As components in injection mould, Hot runner system can be seen as an extention of injection molding machine. The purpose of an hot runner system is to feeds plasticised material into the cavity of the mould in a similar state to that in which it left the injection moulding machine nozzle. Different from the traditional cold runner gating system, hot runners has its own heating system or insulation to hold the the melt state during the processing. When open the mold, sprue removal needn't take out, and can be used in the next cycle time, so raised material utilization ratio. Hot runner technology is a revolution and an important direction of development in injection moulding and processing.
As an advanced technology in injection molding industry, hot runner technology is developed and commercial applied by small number of well-known European and American companies, however the application of this technology is still at the stage of gradual promotion in our country. With great prospects and market potential, the development and application of hot runner technology is imperative. It is no doubt that the theory study of hot runner technology will improve far-ranging application and fast development, so as to fill the gap with the advanced country.
One of the key points is to hold the hot runner system in a state of thermal equilibrium,which means that heat losses must be compensated for by heating. In the ideal case, an hot runner system will be in an isothermal state.
Reference to a large number of information at home and abroad , the paper analyzed the power consumption and how to calculate the power demand. According to the principles of heat transfer, mathematical model of thermal equilibrium is established, and ANSYS software is to be used for the optimal layout of the heating element. According to the MCU regulator with PID control algorithms and sensitive thermocouples, the precision temperature control can be attained.
引文
[1][瑞典]丹尼尔·弗伦克勒,[波兰]亨利克·扎维斯托夫斯基著.[英]罗伯特·沃克登英译.徐佩弦译.注射模具的热流道[M].北京:化学工业出版社,2005.
[2]李德群.现代塑料注射成型德原理、方法与应用[M].上海:上海交通大学出版社,2005.
[3]杨世铭,陶文铨.传热学-4[M].北京:高等教育出版社,2006.
[4][德]Georg Menges,Walter Michaeli,Paul Mohren著.闫光荣,许鹤峰译.注射模具制造工程[M].北京:化学工业出版社,2002.
[5][美]T.A.奥斯瓦德,L.特恩格,P.J.格尔曼著.吴其晔等译.注射成型手册[M].北京:化学工业出版社,2005.
[6]王建华,徐佩弦.注射模的热流道技术[M].北京:机械工业出版社,2005.
[7][加拿大]Henry Rozemd.王恩权译.成型热塑性塑料的新颖热流道浇口[J].模具技术,1990(5):32-36
[8]陈剑玲,黄锐,刘廷华.浅析热流道模具加热式喷嘴的径向热传导问题[J].模具工业,2004(3):48-50
[9][德]K.斯托克海特著.荣逎珊,徐正宝译.注射成型模具102例[M].北京:中国轻工业出版社,1991.
[10]Daniel Frenkler and Henryk Zawistowski.English translation by Robert Walkden.Hot Runners in Injection Moulds.UK:Rapra Technology Limited,2001.
[11]刘小文.钢轨气压焊参数检测与温度场有限元模拟研究[D],成都:西南交通大学硕士论文.2006,4.
[12][美]Saeed Moaveni著.欧阳宇,王崧等译.有限元分析:ANSYS理论与应用[M].北京:电子工业出版社,2003.6
[13]张国智,胡仁喜等编著.ANSYS10.0热力学有限元分析实例指导教程[M].北京:机械工业出版社,2007.6
[14]丁浩.塑料工业实用手册[M].北京:化学工业出版社,1996.
[15]叶香美.基于单片机的柴油发动机冷却水温控制系统的研究[D],武汉:华中农业大学硕士论文.2005,5.
[16]王福瑞.单片机测控系统设计大全[M].北京:北京航空航天大学出版社,1998.4
[17]姜忠良,陈秀云编著.温度的测量与控制[M].北京:清华大学出版社,2005.8
[18]徐显海.一种电阻炉智能温度控制仪的研制[D],东南大学硕士论文.2006,3.
[19]盛范成.基于P89LPC934单片机实现的热流道温度控制器[J].自动化仪表,2007,2(42).
[20]求是科技.单片机典型外围器件及应用实例[M].北京:人民邮电出版社,2006.
[21]徐爱钧,彭秀华.Keil Cx51 V7.0单片机高级语言编程与μ Vision2应用实践[M].北京:电子工业出版社,2004.
[22]李正军.计算机测控系统设计应用[M].北京:机械工业出版社,2004.
[23]靳桅,潘育山,邬芝权.单片机原理及应用--C51编程技术[M].成都:西南交通大学出版社,2004.
[24]张洪润,刘秀英,张亚凡等.单片机应用设计200例[M].北京:北京航空航天大学出版社,2006.
[25]孙占辉,张欣,张村峰等.基于C语言编程MCS-51单片机原理与应用[M].北京:清华大学出版社,2002.
[26]求是科技.单片机典型模块设计实例导航[M].北京:人民邮电出版社,2004.
[27]王建校,杨建国,宁改娣,危建国.51系列单片机及C51程序设计[M].北京:科学出版社,2002.
[28]陈汝全,林水生,夏利.实用微机与单片机控制技术[M].成都:电子科技大学出版社,1998.
[29]刘金锟.先进PID控制及MATLAB仿真[M].北京:电子工业出版社,2003.1
[30]杨宁主编.单片机与控制技术[M].北京:北京航空航天大学出版社,2005.2
[31]谢维成,杨加国编著.单片机原理与应用及C51程序设计[M].北京:清华大学出版社,2006.8
[32]刘文涛编著.单片机语言C51典型应用设计[M].北京:人民邮电出版社,2005.10
[33]于永,戴佳,常江.51单片机C语言常用模块与综合系统设计实例精讲[M].北京:电子工业出版社,2007.4
[34]孙传友等编著.测控系统原理与设计[M].北京:北京航空航天大学出版社,2002.9
[35]王正谋,朱力恒.Protel 99 SE电路设计与仿真技术[M].福建:福建科学技术,2005.1
[36]精英科技编著.电路板设计完全手册[M].北京:中国电力出版社,2002.1
[37]Dominick V.Rosato,Donald V.Rosato,Marlcne G.Rosato.Injection Molding handbook.Kluwcr Academic Publishers,2000.
[38]王幸之等编著.单片机应用系统电磁干扰与抗干扰技术[M].北京:北京航空航天大学出版社,2006.2
[39]范立南,李雪飞,尹授远.单片微型计算机控制系统设计[M].北京:人民邮电出版 社,2004.3
[40]苏娟华.注射模热流道喷嘴加热功率的计算[J].洛阳工学院学报,1995,(04)
[41]魏汝梅,周玉华.热流道注射模喷嘴设计及热平衡分析[J].模具工业,1995,(05)
[42]Gunther Heisskanaltechnik GmbH.Hot-runner manifolds get new heater technology.Modern Plastics,2002(7):70
[2]李德群.现代塑料注射成型德原理、方法与应用[M].上海:上海交通大学出版社,2005.
[3]杨世铭,陶文铨.传热学-4[M].北京:高等教育出版社,2006.
[4][德]Georg Menges,Walter Michaeli,Paul Mohren著.闫光荣,许鹤峰译.注射模具制造工程[M].北京:化学工业出版社,2002.
[5][美]T.A.奥斯瓦德,L.特恩格,P.J.格尔曼著.吴其晔等译.注射成型手册[M].北京:化学工业出版社,2005.
[6]王建华,徐佩弦.注射模的热流道技术[M].北京:机械工业出版社,2005.
[7][加拿大]Henry Rozemd.王恩权译.成型热塑性塑料的新颖热流道浇口[J].模具技术,1990(5):32-36
[8]陈剑玲,黄锐,刘廷华.浅析热流道模具加热式喷嘴的径向热传导问题[J].模具工业,2004(3):48-50
[9][德]K.斯托克海特著.荣逎珊,徐正宝译.注射成型模具102例[M].北京:中国轻工业出版社,1991.
[10]Daniel Frenkler and Henryk Zawistowski.English translation by Robert Walkden.Hot Runners in Injection Moulds.UK:Rapra Technology Limited,2001.
[11]刘小文.钢轨气压焊参数检测与温度场有限元模拟研究[D],成都:西南交通大学硕士论文.2006,4.
[12][美]Saeed Moaveni著.欧阳宇,王崧等译.有限元分析:ANSYS理论与应用[M].北京:电子工业出版社,2003.6
[13]张国智,胡仁喜等编著.ANSYS10.0热力学有限元分析实例指导教程[M].北京:机械工业出版社,2007.6
[14]丁浩.塑料工业实用手册[M].北京:化学工业出版社,1996.
[15]叶香美.基于单片机的柴油发动机冷却水温控制系统的研究[D],武汉:华中农业大学硕士论文.2005,5.
[16]王福瑞.单片机测控系统设计大全[M].北京:北京航空航天大学出版社,1998.4
[17]姜忠良,陈秀云编著.温度的测量与控制[M].北京:清华大学出版社,2005.8
[18]徐显海.一种电阻炉智能温度控制仪的研制[D],东南大学硕士论文.2006,3.
[19]盛范成.基于P89LPC934单片机实现的热流道温度控制器[J].自动化仪表,2007,2(42).
[20]求是科技.单片机典型外围器件及应用实例[M].北京:人民邮电出版社,2006.
[21]徐爱钧,彭秀华.Keil Cx51 V7.0单片机高级语言编程与μ Vision2应用实践[M].北京:电子工业出版社,2004.
[22]李正军.计算机测控系统设计应用[M].北京:机械工业出版社,2004.
[23]靳桅,潘育山,邬芝权.单片机原理及应用--C51编程技术[M].成都:西南交通大学出版社,2004.
[24]张洪润,刘秀英,张亚凡等.单片机应用设计200例[M].北京:北京航空航天大学出版社,2006.
[25]孙占辉,张欣,张村峰等.基于C语言编程MCS-51单片机原理与应用[M].北京:清华大学出版社,2002.
[26]求是科技.单片机典型模块设计实例导航[M].北京:人民邮电出版社,2004.
[27]王建校,杨建国,宁改娣,危建国.51系列单片机及C51程序设计[M].北京:科学出版社,2002.
[28]陈汝全,林水生,夏利.实用微机与单片机控制技术[M].成都:电子科技大学出版社,1998.
[29]刘金锟.先进PID控制及MATLAB仿真[M].北京:电子工业出版社,2003.1
[30]杨宁主编.单片机与控制技术[M].北京:北京航空航天大学出版社,2005.2
[31]谢维成,杨加国编著.单片机原理与应用及C51程序设计[M].北京:清华大学出版社,2006.8
[32]刘文涛编著.单片机语言C51典型应用设计[M].北京:人民邮电出版社,2005.10
[33]于永,戴佳,常江.51单片机C语言常用模块与综合系统设计实例精讲[M].北京:电子工业出版社,2007.4
[34]孙传友等编著.测控系统原理与设计[M].北京:北京航空航天大学出版社,2002.9
[35]王正谋,朱力恒.Protel 99 SE电路设计与仿真技术[M].福建:福建科学技术,2005.1
[36]精英科技编著.电路板设计完全手册[M].北京:中国电力出版社,2002.1
[37]Dominick V.Rosato,Donald V.Rosato,Marlcne G.Rosato.Injection Molding handbook.Kluwcr Academic Publishers,2000.
[38]王幸之等编著.单片机应用系统电磁干扰与抗干扰技术[M].北京:北京航空航天大学出版社,2006.2
[39]范立南,李雪飞,尹授远.单片微型计算机控制系统设计[M].北京:人民邮电出版 社,2004.3
[40]苏娟华.注射模热流道喷嘴加热功率的计算[J].洛阳工学院学报,1995,(04)
[41]魏汝梅,周玉华.热流道注射模喷嘴设计及热平衡分析[J].模具工业,1995,(05)
[42]Gunther Heisskanaltechnik GmbH.Hot-runner manifolds get new heater technology.Modern Plastics,2002(7):70