激光二极管激光焊封装研究
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摘要
论文中运用ND: YAG激光对同轴激光二极管组件进行焊接封装。这种封装技术最大的缺点是会使激光二极管的封装产生焊后偏移(PWS),很少有一种机械的方法可以校正这种焊后偏移到亚微米级别,目前激光锤被证明是一种很有效的校正方法,激光锤校正作用过程就是利用金属熔化凝固冷却产生的内应力来恢复焊后偏移的过程。
论文中建立了激光二极管封装的三维有限元模型,利用通用有限元软件Ansys,编制APDL程序,模拟仿真激光锤在不同焊接参数(电压、脉冲宽度等)的作用过程的温度场、应力场以及焊后偏移校正量。焊接电压和脉宽越大,最高温度越高,热应力影响区越大,同时焊后校正偏移量越大。焊后偏移主要是横向(Y向)的影响,轴向(Z向)变形较小。在同等焊接条件下,横向变形是轴向变形的两倍。
在光斑尺寸相同的条件下,高电压小脉宽和低电压大脉宽可以使激光锤校正偏移达到相同的效果,但是高电压小脉宽的焊接参数比低电压大脉宽的焊接参数对材料的热应力影响区要小。所以在其他参数一定的条件下,高电压小脉宽的焊接条件是激光焊接的首选参数。
利用激光焊设备对激光锤过程进行了实验研究,同时也验证了有限元仿真的正确性。得到最小焊后偏移量为0.1μm,角度偏移范围为0.0005o~0.005o。角度的偏移也会影响到激光二极管的光通量效率,所以在利用激光锤校正激光二极管封装焊后偏移的过程,要充分考虑横向角度的偏移。
当脉冲宽度超过2.5ms时,由于熔池发生了复杂的变化,有可能使激光锤校正方向相反从而难以预测。
论文将对利用激光锤技术校正焊后偏移提出合理的参数选择,该研究对利用激光锤技术校正焊后偏移有非常重要的意义。
the Nd: YAG laser welding technology is being widely used in To-Can style package for laser diode. However, the disadvantage of laser welding is the so-called post-weld-shift (PWS). The end result is a reduction in light coupling efficiency. The shrinkage force generated by the solidification process is so great that no known mechanical structure can counteract the shrinkage from shifting the joint—at least at the micron level. Laser hammering (LH) was developed to minimize PWS. The laser-hammering process is the technique that utilize the solidification shrinkage to regain the optical throughput lost by PWS.
In this paper, a three-dimensional brick element model with temperature-varied material properties was built. An Ansys parametric design language (APDL) was used to simulate the temperature distribution, the distribution of the residual stresses, and PWS in process of laser hammering with variant voltage and pulse width. The fields of Von Misses stress distribution and temperature field distribution expand with voltage and pulse width increasing. At the same time, the correcting valuation of laser hammering increases with the increment of pulse and Voltage. The Y direction is the major shift. At the same welding condition, the shift of Y direction is about two times than that of Z direction.
If the weld spot size is the same, the welding- parameter both high voltage, short pulse width and low voltage, long pulse width can get the same PWS of LH. But the range of influence of thermal stress by long pulse is larger than by high voltage. High voltage, short pulse is the preferred welding-parameter in the process of welding packaging.
The experimental measurements of LH were in reasonable agreement with the numerical calculations of the finite-element method (FEM) analysis. The min PWS of LH in Y direction is 0.1μm, and the range of angle shift is from 0.0005degree to 0.005 degree. Angle shift can reduce in light coupling efficiency. Therefore, the angle shift is an important factor for light coupling efficiency when PWS is corrected by LH for laser diode packaging. When pulse width is long enough to above 2.5ms, the corrected direction of laser hammering is away from the laser head, which may be the reason for weld bath being fatal destroyed.
The purpose of this paper is to present a clear choice of welding-parameter of laser hammering induced fiber alignment shift. The research results obtained by this paper will be helpful to correct the PWS with laser hammering technique.
论文中建立了激光二极管封装的三维有限元模型,利用通用有限元软件Ansys,编制APDL程序,模拟仿真激光锤在不同焊接参数(电压、脉冲宽度等)的作用过程的温度场、应力场以及焊后偏移校正量。焊接电压和脉宽越大,最高温度越高,热应力影响区越大,同时焊后校正偏移量越大。焊后偏移主要是横向(Y向)的影响,轴向(Z向)变形较小。在同等焊接条件下,横向变形是轴向变形的两倍。
在光斑尺寸相同的条件下,高电压小脉宽和低电压大脉宽可以使激光锤校正偏移达到相同的效果,但是高电压小脉宽的焊接参数比低电压大脉宽的焊接参数对材料的热应力影响区要小。所以在其他参数一定的条件下,高电压小脉宽的焊接条件是激光焊接的首选参数。
利用激光焊设备对激光锤过程进行了实验研究,同时也验证了有限元仿真的正确性。得到最小焊后偏移量为0.1μm,角度偏移范围为0.0005o~0.005o。角度的偏移也会影响到激光二极管的光通量效率,所以在利用激光锤校正激光二极管封装焊后偏移的过程,要充分考虑横向角度的偏移。
当脉冲宽度超过2.5ms时,由于熔池发生了复杂的变化,有可能使激光锤校正方向相反从而难以预测。
论文将对利用激光锤技术校正焊后偏移提出合理的参数选择,该研究对利用激光锤技术校正焊后偏移有非常重要的意义。
the Nd: YAG laser welding technology is being widely used in To-Can style package for laser diode. However, the disadvantage of laser welding is the so-called post-weld-shift (PWS). The end result is a reduction in light coupling efficiency. The shrinkage force generated by the solidification process is so great that no known mechanical structure can counteract the shrinkage from shifting the joint—at least at the micron level. Laser hammering (LH) was developed to minimize PWS. The laser-hammering process is the technique that utilize the solidification shrinkage to regain the optical throughput lost by PWS.
In this paper, a three-dimensional brick element model with temperature-varied material properties was built. An Ansys parametric design language (APDL) was used to simulate the temperature distribution, the distribution of the residual stresses, and PWS in process of laser hammering with variant voltage and pulse width. The fields of Von Misses stress distribution and temperature field distribution expand with voltage and pulse width increasing. At the same time, the correcting valuation of laser hammering increases with the increment of pulse and Voltage. The Y direction is the major shift. At the same welding condition, the shift of Y direction is about two times than that of Z direction.
If the weld spot size is the same, the welding- parameter both high voltage, short pulse width and low voltage, long pulse width can get the same PWS of LH. But the range of influence of thermal stress by long pulse is larger than by high voltage. High voltage, short pulse is the preferred welding-parameter in the process of welding packaging.
The experimental measurements of LH were in reasonable agreement with the numerical calculations of the finite-element method (FEM) analysis. The min PWS of LH in Y direction is 0.1μm, and the range of angle shift is from 0.0005degree to 0.005 degree. Angle shift can reduce in light coupling efficiency. Therefore, the angle shift is an important factor for light coupling efficiency when PWS is corrected by LH for laser diode packaging. When pulse width is long enough to above 2.5ms, the corrected direction of laser hammering is away from the laser head, which may be the reason for weld bath being fatal destroyed.
The purpose of this paper is to present a clear choice of welding-parameter of laser hammering induced fiber alignment shift. The research results obtained by this paper will be helpful to correct the PWS with laser hammering technique.
引文
[1] Hunziker W, Vogt W. Low-loss, self-aligned flip-chip technique for interchip andfiber array to waveguide OEIC packaging. In: lasers and electro-optics society annualmeeting, 1994. LEOS’94 Conference Proceedings, IEEE, 1994,2:269~270
[2] Y. M. Cheung, C. H. Yiu. Simulation of the alignment sensitivity on the couplingefficiency of a ball-lens capped TO-can laser diode source into a single-mode fiber[C].4th International Symposium on Electronic Materials and Packaging (EMAP)，Kaohsiung, Taiwan, China ,2002. 197-203
[3] B. Mathews, M. Macdonalds,K. R. Preston. Optical components-The newchallenge in packaging. IEEE Trans. Comp. Hybrids，Manufact. Technol, 1990, vol.13[4], 798-806
[4] 王立斌编译. 日本微电子和光电子工业中激光组装技术的应用及展望. 光机电信息. 2003 年第 5 期：3~10
[5] Soon Jang, Packaging of photonic devices using laser welding. SPIE ,1996,Vol.2610, 138-149
[6] 李建强，韩国明，何雨.激光焊接的模拟仿真研究. 电焊机，2003, Vol.33, No.9,
[7] W. H. Cheng, W. H. Wang, Y. M. Huang. Failure Mechanism of Hole Formation inLaser Welding Technique for Optoelectronic Packaging. 1995 ,IEEE, 914-916
[8] Jao-Hwa Kuang, Maw-Tyan Sheen, Szu-Chun Wang, Gow-Ling Wang, andWood-Hi Cheng. Post-Weld-Shift in Dual-in-Line Laser Packaging. IEEE Transactionon Advanced Packaging. 2001, Vol.24, No.1, 81-85
[9] Wood-Hi Cheng, Maw-Tyan Sheen, Gow-Ling Wang, Szu-Chun Wang, andJao-Hwa Kuang. Fiber Alignment Shift Formation Mechanisms of Fiber-Solder-FerruleJoints in Laser Module Packaging. Journal of Lightwave Technology. 2001, Vol. 19, No.8, 1177-1184
[10] Wood-Hi Cheng, Maw-Tyan Sheen, Chia-Ming Chang, Yih-Tun Tseng. AnOptimum Approach for Reduction of Fiber Alignment Shift of Fiber-Solder-FerruleJoints in Laser Module Packaging. Journal of Lightwave Technology. 2004,Vol. 22, No.2, 589-594
[11] 汪建华，戚新海，钟小敏，等. 焊接结构三维热变形的有限元模拟. 上海交通大学学报. 1994，28(6): 59-65
[12] D.-H. Kang, K.-J.Son, Y.-S. Yang. Analysis of laser weldment distortion in theEDFA LD pump Packaging. Finite Elements in Analysis and Design. 37(2001) 749-760
[13] 吴礼刚，孙峰，王涛，等. SOA 器件中激光焊接温度场与构件热弹性变形.半导体光电.2003,Vol.24, No.2, 100~103
[14] 李景涌. 有限元法. 北京：北京邮电大学出版社.1999
[15] 王国强. 实用工程数值模拟技术及其在 ANSYS 上的实践. 西安：西北工业大学出版.1999
[16] 王歇成，助敏. 有限元法基本原理和数值方法. 北京：清华大学出版社.1997
[17] 庄其仁. 激光焊接温度场解析计算. 华侨大学学报（自然科学版）.2001 年 7月第 3 期：247～252.
[18] Habib L.M, Kleen U, Otremba F. Numerical simulation of weld residual stressesand countermeasures in austenitic steel piping. International Conference on NuclearEngineering. Proceedings，ICONE，1997, 25-29
[19] Nasstrom N, Wilander L, Karlsson L, et al. Combined 3-D and shell modeling ofwelding. Proc of IUTAM SymPosium on the Mechanical Effects of Welding. Lulea,Sweden: Springer, Germany, 1992,197-206
[20] Ueda Y, Wang J, Murakawa H, et al. Three dimensional numerical simulation ofvarious thermal 一 mechanical processes by FEM (Report l). Trans JWRI. 1992, 21(2):111-117
[21] CarPenter N. Locking and shear scaling factors in CO bending Elements.Computers &Structures. 1956, 22(l): 39-52.
[22] 李亚江，王娟，刘鹏. 特种焊接技术及应用. 北京：化学工业出版社，2004
[23] 赵熹华. 焊接方法与机电一体化. 北京：机械工业出版社.2001
[24] 李俊昌. 激光的衍射及热作用计算. 北京：科学出版社，2002
[25] Li Yidan, Xin Guohun, Li Zenguo. Three-dimensional joussian oistributed heatflow calculation[J]. J. Welding, 1997, 18(4): 251~255
[26] O. C. Zienkiwicz and R.L. Taylor, The Finite Element Method. New York:McGraw-Hill, 1991, ch. 5
[27] [美]Saeed Moaveni 著，欧阳宇，王菘等译. 有限元分析—ANSYS 理论与应用.北京：电子工业出版社，2003
[28] 龚曙光，谢桂兰编著. ANSYS 操作命令与参数化编程. 北京：机械工业出版.2004
[29] 唐兴伦, 范群波, 张朝晖, 等. ANSYS 工程应用教程—热与电磁学篇. 北京：中国铁道出版社. 2003
[30] 戴锅生. 传热学. 北京：高等教育出版社. 1999
[31] W.H Cheng, Y.C Huang, M.T. Sheen. Reduction of Fiber Alignment Shifts inHigh-Speed Laser Module Packaging. The 6th Chinese Optoelectronics Symposium(COES). Hong Kong, China, 2003, 247-250
[32] Kamran S. Mobarhan, Soon Jang. Laser Diode Packaging Technology：CoaxialModuleAssembly.ApplicationNotesNo.7,NewportInc.http://www.newport.com/Support/Application Notes. 2002.9(download)/2000.7(update)
[33] 薛忠明, 顾兰, 张彦华. 激光焊接温度场数值模拟. 焊接学报. 2003, Vol.24[2],79-82 ng Goo Kang, Nam Hwang, etal. Laser Weldability Analysis of :机械工业出版社. 1997
[34] 肖忠群,柯黎明,杨勇章,等. 热影响区焊接温度场分析. 南昌航空工业学院学报. 1997,Vol(2),19-22
[35] Min Kyu Song, SeuHigh-Speed Optical Transmission Device Packaging[J]. IEEE Trans. Comp.. Packaging and Manufact. Technol. 1996, 19(4):758-762
[36] D.拉达伊著. 熊第京, 等译.焊接热效应. 北京
[37] 焦馥杰. 焊接结构分析基础. 上海:上海科学技术文献出版社. 1989
[38] 华工激光. HGL-LWY50C3 焊接机说明书. 武汉华工激光工程有限责任公司
[2] Y. M. Cheung, C. H. Yiu. Simulation of the alignment sensitivity on the couplingefficiency of a ball-lens capped TO-can laser diode source into a single-mode fiber[C].4th International Symposium on Electronic Materials and Packaging (EMAP)，Kaohsiung, Taiwan, China ,2002. 197-203
[3] B. Mathews, M. Macdonalds,K. R. Preston. Optical components-The newchallenge in packaging. IEEE Trans. Comp. Hybrids，Manufact. Technol, 1990, vol.13[4], 798-806
[4] 王立斌编译. 日本微电子和光电子工业中激光组装技术的应用及展望. 光机电信息. 2003 年第 5 期：3~10
[5] Soon Jang, Packaging of photonic devices using laser welding. SPIE ,1996,Vol.2610, 138-149
[6] 李建强，韩国明，何雨.激光焊接的模拟仿真研究. 电焊机，2003, Vol.33, No.9,
[7] W. H. Cheng, W. H. Wang, Y. M. Huang. Failure Mechanism of Hole Formation inLaser Welding Technique for Optoelectronic Packaging. 1995 ,IEEE, 914-916
[8] Jao-Hwa Kuang, Maw-Tyan Sheen, Szu-Chun Wang, Gow-Ling Wang, andWood-Hi Cheng. Post-Weld-Shift in Dual-in-Line Laser Packaging. IEEE Transactionon Advanced Packaging. 2001, Vol.24, No.1, 81-85
[9] Wood-Hi Cheng, Maw-Tyan Sheen, Gow-Ling Wang, Szu-Chun Wang, andJao-Hwa Kuang. Fiber Alignment Shift Formation Mechanisms of Fiber-Solder-FerruleJoints in Laser Module Packaging. Journal of Lightwave Technology. 2001, Vol. 19, No.8, 1177-1184
[10] Wood-Hi Cheng, Maw-Tyan Sheen, Chia-Ming Chang, Yih-Tun Tseng. AnOptimum Approach for Reduction of Fiber Alignment Shift of Fiber-Solder-FerruleJoints in Laser Module Packaging. Journal of Lightwave Technology. 2004,Vol. 22, No.2, 589-594
[11] 汪建华，戚新海，钟小敏，等. 焊接结构三维热变形的有限元模拟. 上海交通大学学报. 1994，28(6): 59-65
[12] D.-H. Kang, K.-J.Son, Y.-S. Yang. Analysis of laser weldment distortion in theEDFA LD pump Packaging. Finite Elements in Analysis and Design. 37(2001) 749-760
[13] 吴礼刚，孙峰，王涛，等. SOA 器件中激光焊接温度场与构件热弹性变形.半导体光电.2003,Vol.24, No.2, 100~103
[14] 李景涌. 有限元法. 北京：北京邮电大学出版社.1999
[15] 王国强. 实用工程数值模拟技术及其在 ANSYS 上的实践. 西安：西北工业大学出版.1999
[16] 王歇成，助敏. 有限元法基本原理和数值方法. 北京：清华大学出版社.1997
[17] 庄其仁. 激光焊接温度场解析计算. 华侨大学学报（自然科学版）.2001 年 7月第 3 期：247～252.
[18] Habib L.M, Kleen U, Otremba F. Numerical simulation of weld residual stressesand countermeasures in austenitic steel piping. International Conference on NuclearEngineering. Proceedings，ICONE，1997, 25-29
[19] Nasstrom N, Wilander L, Karlsson L, et al. Combined 3-D and shell modeling ofwelding. Proc of IUTAM SymPosium on the Mechanical Effects of Welding. Lulea,Sweden: Springer, Germany, 1992,197-206
[20] Ueda Y, Wang J, Murakawa H, et al. Three dimensional numerical simulation ofvarious thermal 一 mechanical processes by FEM (Report l). Trans JWRI. 1992, 21(2):111-117
[21] CarPenter N. Locking and shear scaling factors in CO bending Elements.Computers &Structures. 1956, 22(l): 39-52.
[22] 李亚江，王娟，刘鹏. 特种焊接技术及应用. 北京：化学工业出版社，2004
[23] 赵熹华. 焊接方法与机电一体化. 北京：机械工业出版社.2001
[24] 李俊昌. 激光的衍射及热作用计算. 北京：科学出版社，2002
[25] Li Yidan, Xin Guohun, Li Zenguo. Three-dimensional joussian oistributed heatflow calculation[J]. J. Welding, 1997, 18(4): 251~255
[26] O. C. Zienkiwicz and R.L. Taylor, The Finite Element Method. New York:McGraw-Hill, 1991, ch. 5
[27] [美]Saeed Moaveni 著，欧阳宇，王菘等译. 有限元分析—ANSYS 理论与应用.北京：电子工业出版社，2003
[28] 龚曙光，谢桂兰编著. ANSYS 操作命令与参数化编程. 北京：机械工业出版.2004
[29] 唐兴伦, 范群波, 张朝晖, 等. ANSYS 工程应用教程—热与电磁学篇. 北京：中国铁道出版社. 2003
[30] 戴锅生. 传热学. 北京：高等教育出版社. 1999
[31] W.H Cheng, Y.C Huang, M.T. Sheen. Reduction of Fiber Alignment Shifts inHigh-Speed Laser Module Packaging. The 6th Chinese Optoelectronics Symposium(COES). Hong Kong, China, 2003, 247-250
[32] Kamran S. Mobarhan, Soon Jang. Laser Diode Packaging Technology：CoaxialModuleAssembly.ApplicationNotesNo.7,NewportInc.http://www.newport.com/Support/Application Notes. 2002.9(download)/2000.7(update)
[33] 薛忠明, 顾兰, 张彦华. 激光焊接温度场数值模拟. 焊接学报. 2003, Vol.24[2],79-82 ng Goo Kang, Nam Hwang, etal. Laser Weldability Analysis of :机械工业出版社. 1997
[34] 肖忠群,柯黎明,杨勇章,等. 热影响区焊接温度场分析. 南昌航空工业学院学报. 1997,Vol(2),19-22
[35] Min Kyu Song, SeuHigh-Speed Optical Transmission Device Packaging[J]. IEEE Trans. Comp.. Packaging and Manufact. Technol. 1996, 19(4):758-762
[36] D.拉达伊著. 熊第京, 等译.焊接热效应. 北京
[37] 焦馥杰. 焊接结构分析基础. 上海:上海科学技术文献出版社. 1989
[38] 华工激光. HGL-LWY50C3 焊接机说明书. 武汉华工激光工程有限责任公司