高体积分数SiC颗粒增强Al基复合材料的制备和性能研究
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摘要
高体积分数SiC/Al复合材料具有高热导率、低密度和较高的力学性能等优点,而且可通过调整SiC体积分数来调整膨胀系数实现与各种基板的热匹配,使其在微波集成电路、功率模块和微处器盖板等领域得到广泛应用。高体积分数SiC/Al复合材料加工困难,开发能近净成形复杂形状SiC/Al复合材料构件的方法成为目前这一领域的研究热点。
本文探讨了高体积分数SiC/Al复合材料的制备方法,通过粉末注射成形和压力浸渗法成功地制备了近净成形的高体积分数SiC/Al复合材料,首先用粉末注射成形制备出具有一定体积分数的碳化硅预制件,其中采用粗细碳化硅粉末搭配和新型粘结剂可以获得较高的粉末装载量(65 vol.%),注射坯60℃溶剂中脱脂9小时,可将粘结剂中的可溶性组分脱除70%以上并有效地避免了热脱脂缺陷的形成;接着施加压力使铝熔体浸渗到预制件的孔隙中形成接近全致密的复合材料,体积分数为65%的复合材料的典型性能如下:密度3.00g.cm~(-3),30-100℃热膨胀系数7.18×10~(-6).K~(-1),热导率175W/m.K,强度431MPa,可以满足电子封装的使用要求。
本文通过金相显微技术、扫描电镜分析、能谱分析、X射线衍射分析、SEM等现代分析手段开展了大量的实验工作及理论分析,主要得到以下结论:热脱脂后的碳化硅预制件的孔隙率符合粉末装载量并具有很高的开孔率。复合材料致密度高,粗细碳化硅粉末可以均匀地分布在铝基体上,XRD分析和TEM证实了碳化硅和铝基体并没有发生界面反应。复合材料断裂模式基本为增强体解理类型,这是由于大粒径碳化硅颗粒很难和基体协调变形;碳化硅粉末的粒径越大,复合材料的力学性能就越差。利用Hasselman and Johnson方程预测了复合材料的导热性能,结果符合样品导热性能的变化趋势。最后分析了温度,碳化硅体积分数、粒径和深冷处理等对复合材料热膨胀性能的影响。
SiC/Al composites with high volume fraction have the properties of high thermal conductivity,low density and high mechanical properties, which can also be adjusted by the reinforcement according to their usage. Therefore,SiC/Al composites have received great interest as potential materials for most the electronic packaging and thermal management. However,as the high workability of the SiC/Al composites with high volume fraction,to develop a new method to manufacture the composite pasts with near-net shape and complex geometry have become a hot point in this composite area.
In this work,powder injection molding and pressure infiltration have been employed to manufacture the SiC/Al composites with high volume fraction and near-net shape.Firstly,the SiC perform with the desired volume fraction was prepared by powder injection molding.The feedstock with high powder(65 vol.%)is easy to obtain by the means of using the SiC power with bimodal particle size and a new binder system. Most of the binder is extracted after 9 hours' solvent debinding at 60℃, which can avoid the appearance of the defects during the thermal debinding.Secondly,the molten alloy was pressure infiltrated into the pores among the performs to form the dens composites.The as-prepared SiC/Al composite(65 vol.%)with the properties of density 3.00g·cm~(-3), coefficient of thermal expansion 7.18×10~(-6)·K~(-1)(30～100℃),thermal conductivity 175W/m.K and bending strength 431MPa can fully meet the requirements of the electric package.
The composites have been investigated by the means of Metallographic analysis,XRD,Emerge spectrum,SEM and TEM.The major conclusion in the current paper is introduced as follows:the SiC preforms have the desired volume fraction and high open pores ratio.The coarse and fine SiC particles distribute evenly dense composites,and there is no interface reaction observed according to the XRD and TEM analysis.The mechanical properties are desired by the size of the coarse particles,the larger of the coarse particles,the worse of the mechanical properties.The thermal conductivity of the composites is accounted according to Hasselman and Johnson equation,and the results show the same rules among the composites.Finally,effects of the temperature,the volume fraction and particle size of the reinforcement and the cryogenic treatment on the coefficient of thermal expansion was investigated.
本文探讨了高体积分数SiC/Al复合材料的制备方法,通过粉末注射成形和压力浸渗法成功地制备了近净成形的高体积分数SiC/Al复合材料,首先用粉末注射成形制备出具有一定体积分数的碳化硅预制件,其中采用粗细碳化硅粉末搭配和新型粘结剂可以获得较高的粉末装载量(65 vol.%),注射坯60℃溶剂中脱脂9小时,可将粘结剂中的可溶性组分脱除70%以上并有效地避免了热脱脂缺陷的形成;接着施加压力使铝熔体浸渗到预制件的孔隙中形成接近全致密的复合材料,体积分数为65%的复合材料的典型性能如下:密度3.00g.cm~(-3),30-100℃热膨胀系数7.18×10~(-6).K~(-1),热导率175W/m.K,强度431MPa,可以满足电子封装的使用要求。
本文通过金相显微技术、扫描电镜分析、能谱分析、X射线衍射分析、SEM等现代分析手段开展了大量的实验工作及理论分析,主要得到以下结论:热脱脂后的碳化硅预制件的孔隙率符合粉末装载量并具有很高的开孔率。复合材料致密度高,粗细碳化硅粉末可以均匀地分布在铝基体上,XRD分析和TEM证实了碳化硅和铝基体并没有发生界面反应。复合材料断裂模式基本为增强体解理类型,这是由于大粒径碳化硅颗粒很难和基体协调变形;碳化硅粉末的粒径越大,复合材料的力学性能就越差。利用Hasselman and Johnson方程预测了复合材料的导热性能,结果符合样品导热性能的变化趋势。最后分析了温度,碳化硅体积分数、粒径和深冷处理等对复合材料热膨胀性能的影响。
SiC/Al composites with high volume fraction have the properties of high thermal conductivity,low density and high mechanical properties, which can also be adjusted by the reinforcement according to their usage. Therefore,SiC/Al composites have received great interest as potential materials for most the electronic packaging and thermal management. However,as the high workability of the SiC/Al composites with high volume fraction,to develop a new method to manufacture the composite pasts with near-net shape and complex geometry have become a hot point in this composite area.
In this work,powder injection molding and pressure infiltration have been employed to manufacture the SiC/Al composites with high volume fraction and near-net shape.Firstly,the SiC perform with the desired volume fraction was prepared by powder injection molding.The feedstock with high powder(65 vol.%)is easy to obtain by the means of using the SiC power with bimodal particle size and a new binder system. Most of the binder is extracted after 9 hours' solvent debinding at 60℃, which can avoid the appearance of the defects during the thermal debinding.Secondly,the molten alloy was pressure infiltrated into the pores among the performs to form the dens composites.The as-prepared SiC/Al composite(65 vol.%)with the properties of density 3.00g·cm~(-3), coefficient of thermal expansion 7.18×10~(-6)·K~(-1)(30～100℃),thermal conductivity 175W/m.K and bending strength 431MPa can fully meet the requirements of the electric package.
The composites have been investigated by the means of Metallographic analysis,XRD,Emerge spectrum,SEM and TEM.The major conclusion in the current paper is introduced as follows:the SiC preforms have the desired volume fraction and high open pores ratio.The coarse and fine SiC particles distribute evenly dense composites,and there is no interface reaction observed according to the XRD and TEM analysis.The mechanical properties are desired by the size of the coarse particles,the larger of the coarse particles,the worse of the mechanical properties.The thermal conductivity of the composites is accounted according to Hasselman and Johnson equation,and the results show the same rules among the composites.Finally,effects of the temperature,the volume fraction and particle size of the reinforcement and the cryogenic treatment on the coefficient of thermal expansion was investigated.
引文
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