高速信号互连中的电磁完整性研究
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摘要
近年来，随着高速电子技术的发展，电子设备中使用的信号频率与元器件的集成度不断提高，信号的上升沿越来越陡峭。在高速互连系统中，高速信号经过互连线时会产生反射、串扰、色散、电磁干扰等电磁完整性问题，电磁完整性问题成为制约电子系统整体性能的瓶颈，这就使得电子设备的电磁完整性问题有着重要的研究意义。
本文针对高速信号互连系统设计实际工程中遇到的电磁完整性问题，采用基于电磁场理论的全波电磁分析方法，围绕电磁建模和参数提取这一中心，结合电路的实验测试分析，从分析结果中得出结论，建立设计规则，解决高速信号互连设计中的电磁完整性问题，保证高速电路系统具有良好的电磁完整性。主要研究内容包括：
1)针对高速信号互连结构设计中出现的典型连接点处不连续性问题，提出了一种新的设计方法，这种方法考虑了所有的物理效应，通过电磁仿真和电路分析得到不连续处的散射参数，进而修改不连续处的结构而保证不连续处的电磁完整性。
2)针对典型高速信号互连(微带电路)设计中出现空间分辨率和电路结构尺寸上的巨大差异，提出应用混合有限差分方法来分析设计高速电路的设想。对微带导体边缘细节部分采用准静态场仿真来估算其电磁场分布与电流分布，然后将准静态估算的结果合并到常规算法部分。这样既保持常规方法的精度又减小了计算的复杂性。
3)针对高速信号互连设计中出现不连续参考面，如：参考面上的槽缝、网孔状参考面以及电源/地面分割等，通过实验测量与电磁仿真分析了各种不连续平面对其电磁完整性性能的影响；最后总结出高速互连设计中不连续参考面的设计规则。
4)研究了高速信号互连设计中电缆-PCB连接结构的电磁辐射，在总结前人研究的基础上，重点探讨了基于电流驱动机制和电压驱动机制的共模电流辐射，提出用等效电路模型来分析电缆-PCB连接结构的辐射发射，在电源与地平面噪声辐射的问题中，提出用两步建模技术来预测辐射发射。根据这些分析结果总结出保证高速互连中数据可靠传输的电缆-PCB连接系统的设计规则。
In recent years, with the development of high-speed electronic technology, thesignal frequency and the integration densities of components continuously improve inelectronic equipments and the rising edge of signal is increasingly steep. Whenhigh-speed signals through interconnect, they will produce electromagnetic integrityproblems such as reflection, crosstalk, dispersion, electromagnetic interference etc inhigh-speed interconnect systems. The electromagnetic integrity issues have been aconstraint to the overall performance of an electronic system. This makes the researchof electromagnetic integrity problem in electronic devices have an importantsignificance.
In this paper the electromagnetic integrity problems of high-speed interconnectsystems encountered in practical engineering are investigated. With full-waveelectromagnetic analysis method based on electromagnetic field theory, theelectromagnetic modeling and parameter extraction are investigated. Combining withthe circuit test and analysis of experiments, conclusions from the results of theanalysis to establish design rules are obtained to solve the electromagnetic integrityproblems in high-speed interconnect design. It makes sure that the high-speed circuitsystem has a good electromagnetic integrity. The contents of dissertation are mainlylisted as follows:
1) For the discontinuity problem of interconnect in high-speed circuit design,electromagnetic simulation and circuit analysis are used to take into account all thephysical effects to find the scattering parameters of the location of discontinuities. Bymodifying the structure of discontinuity to ensure the electromagnetic integrity ofhigh-speed interconnect.
2) In high-speed circuit (micro-strip circuit) design, spatial resolution and circuitsize are often huge different. A new hybrid finite-difference method is proposed toanalyze and design the circuit. At geometrical details the edges of micro-strip line’splanar metal, the quasi-static field simulation is used to estimate the field and currentdistribution. Then the result is incorporated into dynamic part of the hybrid method.This will maintain accuracy of the general finite-difference method while reducingcomputational complexity.
3) High-speed interconnect often encounters discontinuous reference plane, suchas: reference surface slot, mesh-like reference plane and the power/groundsegmentation. By experimental measurement and electromagnetic simulation, theelectromagnetic integrity of a variety of discontinuous planes is investigated. Thedesign rules of high-speed interconnect about discontinuity reference plane arederived from the results obtained.
4) The electromagnetic radiation of cable-PCB connecting structure isinvestigated. Based on previous studies, focusing on current-and voltage-drivenmechanisms of the common-mode current emissions, the equivalent circuit isproposed to model and analyze the structure of cable-PCB connecting radiatedemissions problems, The proposed two-step technique modeling methods could beused to predict the radiation emission in the power and ground plane. Summarizedthese results, design rules are drawn to ensure reliable data transmission in cable-PCBconnecting system.
本文针对高速信号互连系统设计实际工程中遇到的电磁完整性问题，采用基于电磁场理论的全波电磁分析方法，围绕电磁建模和参数提取这一中心，结合电路的实验测试分析，从分析结果中得出结论，建立设计规则，解决高速信号互连设计中的电磁完整性问题，保证高速电路系统具有良好的电磁完整性。主要研究内容包括：
1)针对高速信号互连结构设计中出现的典型连接点处不连续性问题，提出了一种新的设计方法，这种方法考虑了所有的物理效应，通过电磁仿真和电路分析得到不连续处的散射参数，进而修改不连续处的结构而保证不连续处的电磁完整性。
2)针对典型高速信号互连(微带电路)设计中出现空间分辨率和电路结构尺寸上的巨大差异，提出应用混合有限差分方法来分析设计高速电路的设想。对微带导体边缘细节部分采用准静态场仿真来估算其电磁场分布与电流分布，然后将准静态估算的结果合并到常规算法部分。这样既保持常规方法的精度又减小了计算的复杂性。
3)针对高速信号互连设计中出现不连续参考面，如：参考面上的槽缝、网孔状参考面以及电源/地面分割等，通过实验测量与电磁仿真分析了各种不连续平面对其电磁完整性性能的影响；最后总结出高速互连设计中不连续参考面的设计规则。
4)研究了高速信号互连设计中电缆-PCB连接结构的电磁辐射，在总结前人研究的基础上，重点探讨了基于电流驱动机制和电压驱动机制的共模电流辐射，提出用等效电路模型来分析电缆-PCB连接结构的辐射发射，在电源与地平面噪声辐射的问题中，提出用两步建模技术来预测辐射发射。根据这些分析结果总结出保证高速互连中数据可靠传输的电缆-PCB连接系统的设计规则。
In recent years, with the development of high-speed electronic technology, thesignal frequency and the integration densities of components continuously improve inelectronic equipments and the rising edge of signal is increasingly steep. Whenhigh-speed signals through interconnect, they will produce electromagnetic integrityproblems such as reflection, crosstalk, dispersion, electromagnetic interference etc inhigh-speed interconnect systems. The electromagnetic integrity issues have been aconstraint to the overall performance of an electronic system. This makes the researchof electromagnetic integrity problem in electronic devices have an importantsignificance.
In this paper the electromagnetic integrity problems of high-speed interconnectsystems encountered in practical engineering are investigated. With full-waveelectromagnetic analysis method based on electromagnetic field theory, theelectromagnetic modeling and parameter extraction are investigated. Combining withthe circuit test and analysis of experiments, conclusions from the results of theanalysis to establish design rules are obtained to solve the electromagnetic integrityproblems in high-speed interconnect design. It makes sure that the high-speed circuitsystem has a good electromagnetic integrity. The contents of dissertation are mainlylisted as follows:
1) For the discontinuity problem of interconnect in high-speed circuit design,electromagnetic simulation and circuit analysis are used to take into account all thephysical effects to find the scattering parameters of the location of discontinuities. Bymodifying the structure of discontinuity to ensure the electromagnetic integrity ofhigh-speed interconnect.
2) In high-speed circuit (micro-strip circuit) design, spatial resolution and circuitsize are often huge different. A new hybrid finite-difference method is proposed toanalyze and design the circuit. At geometrical details the edges of micro-strip line’splanar metal, the quasi-static field simulation is used to estimate the field and currentdistribution. Then the result is incorporated into dynamic part of the hybrid method.This will maintain accuracy of the general finite-difference method while reducingcomputational complexity.
3) High-speed interconnect often encounters discontinuous reference plane, suchas: reference surface slot, mesh-like reference plane and the power/groundsegmentation. By experimental measurement and electromagnetic simulation, theelectromagnetic integrity of a variety of discontinuous planes is investigated. Thedesign rules of high-speed interconnect about discontinuity reference plane arederived from the results obtained.
4) The electromagnetic radiation of cable-PCB connecting structure isinvestigated. Based on previous studies, focusing on current-and voltage-drivenmechanisms of the common-mode current emissions, the equivalent circuit isproposed to model and analyze the structure of cable-PCB connecting radiatedemissions problems, The proposed two-step technique modeling methods could beused to predict the radiation emission in the power and ground plane. Summarizedthese results, design rules are drawn to ensure reliable data transmission in cable-PCBconnecting system.
引文
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