高密度电子封装可靠性研究
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摘要
本文着重研究了汽车内环境和电子封装可靠性两部分内容，其中第一部分汽车环境研究包括以下内容：
1．汽车内环境研究对汽车电子模块设计和可靠性研究有重要意义。本文通过汽车内安装的传感器试验测量并记录了汽车在不同时间、不同行为状态下温湿度数据。在此基础上，提出了描述汽车环境的温度指数模型、密闭箱模型和乘客模型，建立了相应物理模型的解析表达式。并利用流体动力学方法通过有限元模拟给出了汽车内的空气流动和温度场分布，进一步验证了上述三种物理模型的合理性，确定了其中的主要物理参数值。另外，还讨论了太阳辐射造成的水汽凝结现象，指出它与初始水汽浓度密切相关。
2．通过VB和MATLAB/Simulink软件分别对汽车环境进行模拟仿真。将人工记录的汽车活动记录表转化为计算机可识别的活动状态表，基于该状态表和上述三种物理模型进而实现对汽车环境的模块化仿真。为汽车内电子器件封装设计初步提供了一种工具软件。迄今，国内外文献尚未见到关于汽车内温度湿度物理模型、相应的流体力学散热模拟和相应的工具软件的报道。
论文第二部分电子封装可靠性研究包含对塑封材料中水汽扩散研究、填充不流动胶的倒装焊芯片可靠性研究以及大功率器件散热问题研究三方面内容，最后为实现封装设计标准化和自动化，研究了若干最主要的电子封装构型的参数化有限元建模、加载和相应的求解方法。具体内容可以表述为以下几点：
1．利用实验称重和Fick扩散方程模拟塑封材料对水的吸收过程，得到水汽在实验塑封材料中的扩散系数和饱和浓度。塑封材料中的水分子存在于高分子链围成的微孔洞中，并与高分子聚合物以氢键相连。当水汽浓度达到饱和时，在塑封材料中可以被水分子进入的有效体积内，实验条件下的水汽密度为标准状态下水蒸气密度的100倍，为液态水密度的8％，表明在塑封材料中的水分子以一种特殊的液态水形态存在。通过倒装焊器件在高温高湿条件下的分层及其分层复合现象的实验结果与模拟结果比较，提出了关于水汽引起界面分层及分层复合的物理机制。认为在一定的水汽浓度下，器件内部塑封材
中国科学院上海微系统与信启、技术研究所博十学位论文
料在界面处的微孔洞可能出现气液两相共存。两相共存的微孔洞还山于水分
子争夺高分子的氢键使高分子与芯片表面的二氧化硅层的结合减弱，而逐步
扩展形成可观察到的分层。吸湿后的封装器件内水汽的存在形式的研究对进
一步深入研究潮气造成的封装失效问题有重要意义，目前通过试验结合有限
元模拟讨论塑封材料吸潮机理和水汽存在形态的报道还很少。
2．近年来，不流动胶倒装焊工艺己开始得到应用，但由于不流动胶的固化温度
比常规底充胶高，芯片在冷却过程中将承受更大的热应力。本文第六章用断
裂力学方涪和有限元模拟分析了填充不流动胶芯片断裂问题，计算了芯片的
应力强度因于K和能量释放率G。模拟表明，山固化温度冷却到室温时，
所研究的倒装焊封装在填充不流动胶时芯片断裂临界裂纹长度为 12pm，而
填充传统底充胶时为20Hm。芯片断裂与胶的杨氏模量和热膨胀系数相关，
与胶的铺展关系不大。山于不流动胶具有更高的CTE和更低的杨氏模量E，
因此焊点排布和焊点位置会影响芯片变形程度，进而影响芯片断裂参数。在
特定的焊点排布下，芯片断裂的可能性会达到最小。不流动胶倒装焊封装是
近年来国际上发展的新技术，本文在不流动胶倒装焊中的芯片断裂问题，属
首次报道。山于薄型芯片在高密度封装使用中越来越广泛，本文的结果对高
密度封装设计有重要意义。
3．比较了不同厚度的引线框架对大功率SOP封装器件散热性能的影晌。结果
表明，厚度对热阻的影响不是很大。引线框架厚度增加一倍，热阻仅减少2
“C／W。该结论否定了厚引线框架利于散热的简单想法，因此，在工艺上可
以选择合适厚度的引线框架，避免了过厚的引线框架切割时造成的引脚翘曲
甚至断裂情况的发生。该结论对封装工业生产有重要意义，属首次报道。
4．基于ANSYS有限元模拟软件，围绕先进电于封装设计和工具研究，为实现
封装设计标准化和自动化，研究了若干最主要的电子封装构型的参数化建模
方法，以及在相应的JEDEC标准规范条件下电于封装参数化加载方法和相
应的热学、力学、水汽扩散行为的模拟方涪。
The thesis is composed of two parts, including simulation on the environment of car and reliability research on electronic packaging.
In the first part, the temperature and the relative humidity were recorded by several sensors in a car. Based on the experimental data, three physical models and corresponding analytical expressions were developed including the exponential temperature model, the closed-box model for calculation of relative humidity and the passenger model for revising the closed-box model. The finite element simulation with computational fluid dynamics (CFD) method was used to calculate the heat dissipation by airflow and the temperature distribution in passenger compartment of a car. The reasonability of three models as above mentioned was validated. The values of some physical constants were determined from the CFD simulation. The condensation of moisture due to sun radiation was analyzed. The result indicated that the condensation was dependent on the initial humidity in a car. After translating the action records into the state table that can be called by computer, the simulation with Visual Basic and MATLAB/Simulink were carried out, respectively. The software developed could be adopted as a tool for the reliability design of automotive electronic packaging.
In the second part, the reliability research on electronic packaging was concentrated with finite element method (FEM) on moisture diffusion in plastic materials, die cracking of flip-chip with no-flow underfill and thermal performance of high power electronic components. In the last chapter, the design tool for advanced electronic package was studied. The main conclusions in the second part are as follows.
1. The moisture diffusion in plastic electronic packaging was investigated from both experiment and finite element simulation. The diffusion coefficient and the
saturate concentration were determined on the Pick's law. The results showed that the water molecules inside the plastic material were chemically bonded with polymers by hydrogen bonds in the micro-holes formed by the polymer molecule chain. On the saturate concentration, the moisture density in the micro-holes was 100 times larger than the vapor density in the standard state, but only 8% of liquid water. The water inside the plastic material was in a special liquid state. The delamination and the delamination recovery were observed by C-SAM. Delamination occurred when the liquid and gas phases of water coexist in micro-holes at chip/underfill interface. The adhesive strength between underfill and chip would be reduced due to the absorbed water molecules, resulting in extension and linkage of these micro-holes to form the delamination. The simulation results showed that the delamination might be observed when the moisture concentration was in the range of 50% and 95% of saturate concentration for non-coating, topside coating and both sides coating samples. The delamination at the interface would initiate due to the reduced adhesive strength and the high vapor pressure at high temperature would cause the popcorn during reflow. The moisture concentration of the interface was simulated to predict popcorning during the subsequent reflow.
2. The die cracking with no-flow underfill was analyzed during cooling process from the curing temperature of underfill to the room temperature or to the lowest temperature (-55) in thermal cycle test. The stress intensity factor (SIF) and the strain energy release rate were simulated with different pre-crack length for the cases with no-flow underfill and with capillary-flow underfill. The cracking with these two types of underfill might become unstable and lead to catastrophic failure at the end. The critical length was about 12m for the assembly with no-flow underfill and 20m for the package with capillary-flow underfill at 20癈. The height and angle of no-flow underfill fillet little effects on the die cracking. However, the die cracking was dependent on the Young's modulus and CTE of underfill materials. Due to the higher CTE
1．汽车内环境研究对汽车电子模块设计和可靠性研究有重要意义。本文通过汽车内安装的传感器试验测量并记录了汽车在不同时间、不同行为状态下温湿度数据。在此基础上，提出了描述汽车环境的温度指数模型、密闭箱模型和乘客模型，建立了相应物理模型的解析表达式。并利用流体动力学方法通过有限元模拟给出了汽车内的空气流动和温度场分布，进一步验证了上述三种物理模型的合理性，确定了其中的主要物理参数值。另外，还讨论了太阳辐射造成的水汽凝结现象，指出它与初始水汽浓度密切相关。
2．通过VB和MATLAB/Simulink软件分别对汽车环境进行模拟仿真。将人工记录的汽车活动记录表转化为计算机可识别的活动状态表，基于该状态表和上述三种物理模型进而实现对汽车环境的模块化仿真。为汽车内电子器件封装设计初步提供了一种工具软件。迄今，国内外文献尚未见到关于汽车内温度湿度物理模型、相应的流体力学散热模拟和相应的工具软件的报道。
论文第二部分电子封装可靠性研究包含对塑封材料中水汽扩散研究、填充不流动胶的倒装焊芯片可靠性研究以及大功率器件散热问题研究三方面内容，最后为实现封装设计标准化和自动化，研究了若干最主要的电子封装构型的参数化有限元建模、加载和相应的求解方法。具体内容可以表述为以下几点：
1．利用实验称重和Fick扩散方程模拟塑封材料对水的吸收过程，得到水汽在实验塑封材料中的扩散系数和饱和浓度。塑封材料中的水分子存在于高分子链围成的微孔洞中，并与高分子聚合物以氢键相连。当水汽浓度达到饱和时，在塑封材料中可以被水分子进入的有效体积内，实验条件下的水汽密度为标准状态下水蒸气密度的100倍，为液态水密度的8％，表明在塑封材料中的水分子以一种特殊的液态水形态存在。通过倒装焊器件在高温高湿条件下的分层及其分层复合现象的实验结果与模拟结果比较，提出了关于水汽引起界面分层及分层复合的物理机制。认为在一定的水汽浓度下，器件内部塑封材
中国科学院上海微系统与信启、技术研究所博十学位论文
料在界面处的微孔洞可能出现气液两相共存。两相共存的微孔洞还山于水分
子争夺高分子的氢键使高分子与芯片表面的二氧化硅层的结合减弱，而逐步
扩展形成可观察到的分层。吸湿后的封装器件内水汽的存在形式的研究对进
一步深入研究潮气造成的封装失效问题有重要意义，目前通过试验结合有限
元模拟讨论塑封材料吸潮机理和水汽存在形态的报道还很少。
2．近年来，不流动胶倒装焊工艺己开始得到应用，但由于不流动胶的固化温度
比常规底充胶高，芯片在冷却过程中将承受更大的热应力。本文第六章用断
裂力学方涪和有限元模拟分析了填充不流动胶芯片断裂问题，计算了芯片的
应力强度因于K和能量释放率G。模拟表明，山固化温度冷却到室温时，
所研究的倒装焊封装在填充不流动胶时芯片断裂临界裂纹长度为 12pm，而
填充传统底充胶时为20Hm。芯片断裂与胶的杨氏模量和热膨胀系数相关，
与胶的铺展关系不大。山于不流动胶具有更高的CTE和更低的杨氏模量E，
因此焊点排布和焊点位置会影响芯片变形程度，进而影响芯片断裂参数。在
特定的焊点排布下，芯片断裂的可能性会达到最小。不流动胶倒装焊封装是
近年来国际上发展的新技术，本文在不流动胶倒装焊中的芯片断裂问题，属
首次报道。山于薄型芯片在高密度封装使用中越来越广泛，本文的结果对高
密度封装设计有重要意义。
3．比较了不同厚度的引线框架对大功率SOP封装器件散热性能的影晌。结果
表明，厚度对热阻的影响不是很大。引线框架厚度增加一倍，热阻仅减少2
“C／W。该结论否定了厚引线框架利于散热的简单想法，因此，在工艺上可
以选择合适厚度的引线框架，避免了过厚的引线框架切割时造成的引脚翘曲
甚至断裂情况的发生。该结论对封装工业生产有重要意义，属首次报道。
4．基于ANSYS有限元模拟软件，围绕先进电于封装设计和工具研究，为实现
封装设计标准化和自动化，研究了若干最主要的电子封装构型的参数化建模
方法，以及在相应的JEDEC标准规范条件下电于封装参数化加载方法和相
应的热学、力学、水汽扩散行为的模拟方涪。
The thesis is composed of two parts, including simulation on the environment of car and reliability research on electronic packaging.
In the first part, the temperature and the relative humidity were recorded by several sensors in a car. Based on the experimental data, three physical models and corresponding analytical expressions were developed including the exponential temperature model, the closed-box model for calculation of relative humidity and the passenger model for revising the closed-box model. The finite element simulation with computational fluid dynamics (CFD) method was used to calculate the heat dissipation by airflow and the temperature distribution in passenger compartment of a car. The reasonability of three models as above mentioned was validated. The values of some physical constants were determined from the CFD simulation. The condensation of moisture due to sun radiation was analyzed. The result indicated that the condensation was dependent on the initial humidity in a car. After translating the action records into the state table that can be called by computer, the simulation with Visual Basic and MATLAB/Simulink were carried out, respectively. The software developed could be adopted as a tool for the reliability design of automotive electronic packaging.
In the second part, the reliability research on electronic packaging was concentrated with finite element method (FEM) on moisture diffusion in plastic materials, die cracking of flip-chip with no-flow underfill and thermal performance of high power electronic components. In the last chapter, the design tool for advanced electronic package was studied. The main conclusions in the second part are as follows.
1. The moisture diffusion in plastic electronic packaging was investigated from both experiment and finite element simulation. The diffusion coefficient and the
saturate concentration were determined on the Pick's law. The results showed that the water molecules inside the plastic material were chemically bonded with polymers by hydrogen bonds in the micro-holes formed by the polymer molecule chain. On the saturate concentration, the moisture density in the micro-holes was 100 times larger than the vapor density in the standard state, but only 8% of liquid water. The water inside the plastic material was in a special liquid state. The delamination and the delamination recovery were observed by C-SAM. Delamination occurred when the liquid and gas phases of water coexist in micro-holes at chip/underfill interface. The adhesive strength between underfill and chip would be reduced due to the absorbed water molecules, resulting in extension and linkage of these micro-holes to form the delamination. The simulation results showed that the delamination might be observed when the moisture concentration was in the range of 50% and 95% of saturate concentration for non-coating, topside coating and both sides coating samples. The delamination at the interface would initiate due to the reduced adhesive strength and the high vapor pressure at high temperature would cause the popcorn during reflow. The moisture concentration of the interface was simulated to predict popcorning during the subsequent reflow.
2. The die cracking with no-flow underfill was analyzed during cooling process from the curing temperature of underfill to the room temperature or to the lowest temperature (-55) in thermal cycle test. The stress intensity factor (SIF) and the strain energy release rate were simulated with different pre-crack length for the cases with no-flow underfill and with capillary-flow underfill. The cracking with these two types of underfill might become unstable and lead to catastrophic failure at the end. The critical length was about 12m for the assembly with no-flow underfill and 20m for the package with capillary-flow underfill at 20癈. The height and angle of no-flow underfill fillet little effects on the die cracking. However, the die cracking was dependent on the Young's modulus and CTE of underfill materials. Due to the higher CTE
引文
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