KDP晶体精密切割与磨削工艺的研究
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摘要
KDP(磷酸二氢钾,KH2PO4)晶体具有较大的电光和非线性光学系数、高的激光损伤阈值、低的光学吸收系数、高的光学均匀性和良好的透过波段等特点,成为制造惯性约束核聚变(ICF)装置中唯一可以用作激光倍频和电光开关的关键非线性光学材料。由于KDP晶体具有软且脆、易潮解、各向异性等特性,是目前公认的难加工材料之一。KDP晶体的加工通常包括切割、单点金刚石切削、磨削、磁流变抛光等。当前国内单点金刚石切削、磁流变抛光等超精密加工方式存在诸如小尺度波纹度、塌边、效率较低的特点；大尺寸晶体切割缺乏有效方法,所采用的带锯切割存在工件切口大、边缘易破损等质量问题,甚至大块晶体切割过程意外炸裂等灾难性隐患。探索和研究KDP晶体的精密切割和磨削工艺,对于解决当前制约我国KDP晶体加工过程存在的技术难题具有重要的现实意义和应用价值。
论文首先针对现有基于钢带锯和电镀金刚石带锯的大尺寸KDP晶体切割工艺存在的问题,开展了金刚石线锯低应力切割KDP晶体方法的试验研究,研究了线锯切割工艺参数对诸如表面粗糙度Ra、平面度、平行度、亚表面损伤等的影响,对比分析了不同工艺方法对KDP晶体切割表面质量及亚表面损伤的影响,探讨了低应力线锯切割KDP晶体材料的去除机理和损伤形式,给出了低应力线锯切割KDP晶体的最大亚表面损伤深度及后续加工余量,提出了一种金刚石线锯低应力精密切割过程实时纠偏方案,实现了390mm切宽5mm厚度KDP晶体的低应力精密切割。
通过单点划痕试验研究KDP晶体不同晶向表面、亚表面裂纹扩展情况及亚表面损伤深度,得到KDP晶体的各向异性特性对材料加工表面、亚表面的破坏形式以及亚表面损伤深度的影响；通过单颗金刚石磨粒磨削试验,研究不同磨削形式、切深和磨粒速度对KDP晶体材料去除形式的影响。为后续KDP晶体固结磨粒加工(切/磨)工艺参数试验,表面形貌、亚表面损伤分析及去除机理分析提供依据。
开展了KDP晶体精密磨削加工方法的探索性研究。进行了磨削方式、砂轮性能、磨削参数等对表面质量、亚表面损伤、磨削力、磨削温升的影响的理论分析与试验研究,比较了旋转超声磨削和传统磨削对材料加工质量(粗糙度、表面形貌、亚表面损伤等)的影响规律,分析了材料的各向异性对加工的影响,探讨了KDP晶体磨削的材料去除机理,为今后进一步开展KDP晶体等各向异性材料的高效低损伤表面精密磨削奠定了良好的基础。
KDP(Potassium dihydrogen phosphate, KH2PO4) crystal has big electro-optic and non-linear optical coefficient, high laser damage threshold, low optical absorption coefficient, high optical uniformity and proper transparent wave band. It is the only material that can be used in ICF as laser frequency conversion part and electro-optic switch. However, it is well-known that KDP crystal is one of most difficult to machine materials because it is soft, fragile, hygroscopic and anisotropic. Slicing, single point diamond cutting, grinding and MRF polishing are usual methods in KDP crystal mahining. Currently, domestic precision machining methods such as single point diamond cutting and MRF polishing have disadvantages as follows:small scale waveness, round edge and low efficiency. Besides, big size crystal slicing is in lack of effective method, the currently adoped band saw slicing has problems such as big kerf loss, edge chipping and accidental breaking of big size crystal. Exploration and research on precision slicing and grinding processes of KDP crystal are of important practical meaning and application value to solve the current technical difficulties that restrict our machining of KDP crystal.
Firstly in this paper, based on the current problems in big size KDP crystal slicing with steel band saw and diamond plated band saw, we experimentally studied low stress slicing method for KDP crystal with diamond wiresaw which mainly focused on the influence of technical parameter on Ra, flatness, parallelism and subsurface damage. Comparison and analysis of the influence of different technical methods on surface quality and subsurface damage of sliced KDP crystal were made and material removal mechanism and damage mode for low stress wiresaw slicing of KDP crystal were discussed. Finally, the maximum subsurface damage of KDP crystal low stress wiresaw slicing and the material needed to be removed for next step machining processes were provided; a method for real time deviation correction during low stress diamond wiresaw precision slicing was developed and the low stress precision slicing of KDP crystal with 390mm slicing width and 5mm thickness was achieved.
In order to obtain the influence of anisotropy on surface and subsurface damage and its depth, single point scratching test was done to study the development of surface and subsurface cracks and the depth of SSD (subsurface damage) of different crystal orientation. Single diamond grit grinding test was done to study the influence of different grinding mode, depth of cut and grit speed on the material removal mode of KDP crystal, which can provide theoretical basis for technical parameter experiment, surface profile and subsurface damage analysis of the next step fixed abrasive machining (slicing/grinding).
Precision grinding process of KDP crystal was explored which included the theoretical analysis and experimental research of influence of grinding mode, wheel performance and grinding parameter on surface quality, subsurface damage, grinding force and temperature. The comparison of rotary ultrasonic grinding and traditional grinding was carried out concentrating on workpiece machining quality (Ra, surface profile and subsurface damage etc.). The influence of material anisotropy on machining was analyzed and the material removal mechanism of KDP crystal grinding was discussed. The work establishes good foundation for future efficient and low damage surface precision grinding of anisotropic material such as KDP crystal.
论文首先针对现有基于钢带锯和电镀金刚石带锯的大尺寸KDP晶体切割工艺存在的问题,开展了金刚石线锯低应力切割KDP晶体方法的试验研究,研究了线锯切割工艺参数对诸如表面粗糙度Ra、平面度、平行度、亚表面损伤等的影响,对比分析了不同工艺方法对KDP晶体切割表面质量及亚表面损伤的影响,探讨了低应力线锯切割KDP晶体材料的去除机理和损伤形式,给出了低应力线锯切割KDP晶体的最大亚表面损伤深度及后续加工余量,提出了一种金刚石线锯低应力精密切割过程实时纠偏方案,实现了390mm切宽5mm厚度KDP晶体的低应力精密切割。
通过单点划痕试验研究KDP晶体不同晶向表面、亚表面裂纹扩展情况及亚表面损伤深度,得到KDP晶体的各向异性特性对材料加工表面、亚表面的破坏形式以及亚表面损伤深度的影响；通过单颗金刚石磨粒磨削试验,研究不同磨削形式、切深和磨粒速度对KDP晶体材料去除形式的影响。为后续KDP晶体固结磨粒加工(切/磨)工艺参数试验,表面形貌、亚表面损伤分析及去除机理分析提供依据。
开展了KDP晶体精密磨削加工方法的探索性研究。进行了磨削方式、砂轮性能、磨削参数等对表面质量、亚表面损伤、磨削力、磨削温升的影响的理论分析与试验研究,比较了旋转超声磨削和传统磨削对材料加工质量(粗糙度、表面形貌、亚表面损伤等)的影响规律,分析了材料的各向异性对加工的影响,探讨了KDP晶体磨削的材料去除机理,为今后进一步开展KDP晶体等各向异性材料的高效低损伤表面精密磨削奠定了良好的基础。
KDP(Potassium dihydrogen phosphate, KH2PO4) crystal has big electro-optic and non-linear optical coefficient, high laser damage threshold, low optical absorption coefficient, high optical uniformity and proper transparent wave band. It is the only material that can be used in ICF as laser frequency conversion part and electro-optic switch. However, it is well-known that KDP crystal is one of most difficult to machine materials because it is soft, fragile, hygroscopic and anisotropic. Slicing, single point diamond cutting, grinding and MRF polishing are usual methods in KDP crystal mahining. Currently, domestic precision machining methods such as single point diamond cutting and MRF polishing have disadvantages as follows:small scale waveness, round edge and low efficiency. Besides, big size crystal slicing is in lack of effective method, the currently adoped band saw slicing has problems such as big kerf loss, edge chipping and accidental breaking of big size crystal. Exploration and research on precision slicing and grinding processes of KDP crystal are of important practical meaning and application value to solve the current technical difficulties that restrict our machining of KDP crystal.
Firstly in this paper, based on the current problems in big size KDP crystal slicing with steel band saw and diamond plated band saw, we experimentally studied low stress slicing method for KDP crystal with diamond wiresaw which mainly focused on the influence of technical parameter on Ra, flatness, parallelism and subsurface damage. Comparison and analysis of the influence of different technical methods on surface quality and subsurface damage of sliced KDP crystal were made and material removal mechanism and damage mode for low stress wiresaw slicing of KDP crystal were discussed. Finally, the maximum subsurface damage of KDP crystal low stress wiresaw slicing and the material needed to be removed for next step machining processes were provided; a method for real time deviation correction during low stress diamond wiresaw precision slicing was developed and the low stress precision slicing of KDP crystal with 390mm slicing width and 5mm thickness was achieved.
In order to obtain the influence of anisotropy on surface and subsurface damage and its depth, single point scratching test was done to study the development of surface and subsurface cracks and the depth of SSD (subsurface damage) of different crystal orientation. Single diamond grit grinding test was done to study the influence of different grinding mode, depth of cut and grit speed on the material removal mode of KDP crystal, which can provide theoretical basis for technical parameter experiment, surface profile and subsurface damage analysis of the next step fixed abrasive machining (slicing/grinding).
Precision grinding process of KDP crystal was explored which included the theoretical analysis and experimental research of influence of grinding mode, wheel performance and grinding parameter on surface quality, subsurface damage, grinding force and temperature. The comparison of rotary ultrasonic grinding and traditional grinding was carried out concentrating on workpiece machining quality (Ra, surface profile and subsurface damage etc.). The influence of material anisotropy on machining was analyzed and the material removal mechanism of KDP crystal grinding was discussed. The work establishes good foundation for future efficient and low damage surface precision grinding of anisotropic material such as KDP crystal.
引文
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