新型轻质低膨胀高导热电子封装材料的研究
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摘要
对于航空航天飞行器领域使用的电子封装材料，在满足低膨胀、高热导等基本要求的同时，还要满足材料气密性与强度的要求，而且轻质是其首要问题。高硅铝合金作为轻质电子封装材料，不但可通过改变合金成分实现材料物理性能设计，而且兼有优异的综合性能。高硅铝合金材料的低膨胀主要通过提高合金中硅含量来实现，但随着硅含量增加，一是加工脆性增大，难以成材，二是热导性能随之降低，这是一对突出的矛盾，从而制约了其应用。本文研究的低密度、低膨胀、高热导高硅铝合金材料是航空航天电子封装材料重要的发展方向，其科学理论与制备技术研究具有重要的科学意义和应用价值。
论文结合军工项目(低密度低膨胀高热导高硅铝合金电子封装材料)的研究任务，针对高硅铝合金电子封装材料制备与应用中存在的问题，主要做了如下研究工作：
采用粉末冶金与真空包套热挤压相结合的方法制备了二元高硅铝合金材料，并系统研究了挤压温度、粉末粒度与Si含量对材料组织及性能的影响，结果表明，选择硅含量较低的合金，解决了加工成形及导热系数问题，但材料膨胀系数及抗拉强度不能满足电子封装材料使用要求。
为了提高合金材料强度，降低材料膨胀系数，通过对二元高硅铝合金基体添加低膨胀系数、低成本的SiC_P与SiO_2颗粒，制备了颗粒增强铝硅基复合材料，研究了热挤压与热压两种工艺所制备的SiC与SiO_2颗粒增强铝硅基复合材料微观组织及性能，引入Turner和Kerner模型及等效粒径EMA模型分别对材料热膨胀系数及导热系数进行了验证计算。二元高硅铝合金添加SiC与SiO_2颗粒后，材料热膨胀系数下降的同时，其导热系数也随之急剧下降，且其成形性较差，无法测定材料抗拉强度，所制备的两种颗粒增强铝硅基复合材料仍不能满足电子封装材料使用要求。
为了达到低膨胀、高导热与高强度的理想匹配，首次应用高温空气氧化与高能球磨分别对Al-Si合金粉末进行预处理，以提高合金粉末氧含量，再结合包套挤压制备了Al_2O_3与SiO_2弥散强化的复合材料。探讨了Al-Si合金粉末氧化热力学与动力学条件，计算并绘制了合金氧化、择优氧化和无氧化热力学条件区位图，系统深入研究了氧化时间、球磨时间、球料比及硅含量对Al-Si合金粉末氧含量、材料组织及电子封装材料所要求性能的影响。
通过对高硅铝合金材料的系统研究，论文发现：对Al-Si合金粉末进行高能球磨预处理后所制备材料综合性能最好，所有性能均可满足电子封装材料使用要求，并优化出最佳球磨工艺参数。论文在研究了Al-Si合金粉末氧化热力学的基础上，建立了其氧化、择优氧化和无氧化热力学条件区位图。研制出一种新型的具有低密度、低膨胀、高导热性的电子封装材料。
Electronic packaging materials used in aerospace vehicles should notonly meet the basic need of low thermal expansion coefficient (TEC) andhigh thermal conductivity (TC), but also the need of hermeticity andstrength, and lightweight is the precondition to use. High-siliconaluminum alloys used as lightweight electronic packaging material cannot only realize the design of physical properties by changing thecomposition of alloy, but also have excellent comprehensive properties.Its low expansion coefficient can be obtained by increasing Si content,however, alloy brittleness increases and thermal conductivity decreaseswith the increase of Si content, which restricts its application.High-silicon aluminum alloy materials with lightweight, low thermalexpansion coefficient and high thermal conductivity, studied in this paper,is important developing direction in electronic packaging materials usedin aerospace, the researches on its scientific theory and preparationtechnology have important scientific and practical significance.
This dissertation based on the study of military industry project:electronic packaging material of high-silicon aluminum alloys withlow-density, low thermal expansion coefficient and high thermalconductivity, in order to solve problems occurred in the preparation anduse of electronic packaging material of high-silicon aluminum alloys, themain researches are as follows:
Binary high-silicon aluminum alloys were prepared by powdermetallurgy and vacuum canning hot-extrusion process, and the effect ofextrusion temperature, powder size and Si content on microstructure andproperties of material was comprehensively studied. The results show that:binary high-silicon aluminum alloy with lower Si content solves theproblem of brittleness and gains better thermal conductivity, but it dosenot satisfy the need of the TEC and tensile strength of electronicpackaging material.
In order to improve the tensile strength and decrease the TEC, SiC_pand SiO_2 with low TEC and cost addition were put into binaryhigh-silicon aluminum alloy matrix to prepare particle reinforcing Al-Si matrix composites. The microstructure and properties of SiC and SiO_2particle reinforced Al-Si matrix composites prepared by hot-extrusion andhot-press respectively were studied, TEC and TC were verifiedrespectively by Turner, Kerner and EMA (Effective MediumApproximation) models. The TEC of the composites decreases, at thesame time, the TC of them decreases rapidly and the tensile strength cannot be tested because of the bad formability of materials, they can alsonot meet the using need of electronic packaging materials.
In order to gaining the best comprehensive properties,high-temperature air-oxidation and high-energy milling pretreatmentprocesses, introduced in this paper for the first time, were applied toincrease the oxygen content of Al-Si alloy powder, combined withvacuum canning hot-extrusion process to fabricate SiO_2 and Al_2O_3dispersion strengthening composites. The oxidation thermodynamics andkinetics condition of Al-Si alloy powder were discussed, thethermodynamics condition of oxidation, priority oxidation andnonoxidation were calculated and drew, the effect of oxidation time,milling time, the ratio of ball to powder and Si content on powder oxygencontent, material microstructure and properties were comprehensivelystudied.
At last, all processes used in fabricating high-silicon aluminum alloycomposites were synthetically analyzed and compared, It can beconcluded that: the comprehensive properties of the composites preparedby powder after high-energy milling process are the best, all propertiescan entirely meet the need of electronic packaging materials, and theparameters of milling process were optimized. In this paper, thethermodynamics condition of oxidation, priority oxidation andnonoxidation has been established based on the investigation of theoxidation thermodynamics and kinetics condition of Al-Si alloy powder.A novel low-density, low thermal expansion coefficient(TEC) and highthermal conductivity(TC) electronic package material was developed.
论文结合军工项目(低密度低膨胀高热导高硅铝合金电子封装材料)的研究任务，针对高硅铝合金电子封装材料制备与应用中存在的问题，主要做了如下研究工作：
采用粉末冶金与真空包套热挤压相结合的方法制备了二元高硅铝合金材料，并系统研究了挤压温度、粉末粒度与Si含量对材料组织及性能的影响，结果表明，选择硅含量较低的合金，解决了加工成形及导热系数问题，但材料膨胀系数及抗拉强度不能满足电子封装材料使用要求。
为了提高合金材料强度，降低材料膨胀系数，通过对二元高硅铝合金基体添加低膨胀系数、低成本的SiC_P与SiO_2颗粒，制备了颗粒增强铝硅基复合材料，研究了热挤压与热压两种工艺所制备的SiC与SiO_2颗粒增强铝硅基复合材料微观组织及性能，引入Turner和Kerner模型及等效粒径EMA模型分别对材料热膨胀系数及导热系数进行了验证计算。二元高硅铝合金添加SiC与SiO_2颗粒后，材料热膨胀系数下降的同时，其导热系数也随之急剧下降，且其成形性较差，无法测定材料抗拉强度，所制备的两种颗粒增强铝硅基复合材料仍不能满足电子封装材料使用要求。
为了达到低膨胀、高导热与高强度的理想匹配，首次应用高温空气氧化与高能球磨分别对Al-Si合金粉末进行预处理，以提高合金粉末氧含量，再结合包套挤压制备了Al_2O_3与SiO_2弥散强化的复合材料。探讨了Al-Si合金粉末氧化热力学与动力学条件，计算并绘制了合金氧化、择优氧化和无氧化热力学条件区位图，系统深入研究了氧化时间、球磨时间、球料比及硅含量对Al-Si合金粉末氧含量、材料组织及电子封装材料所要求性能的影响。
通过对高硅铝合金材料的系统研究，论文发现：对Al-Si合金粉末进行高能球磨预处理后所制备材料综合性能最好，所有性能均可满足电子封装材料使用要求，并优化出最佳球磨工艺参数。论文在研究了Al-Si合金粉末氧化热力学的基础上，建立了其氧化、择优氧化和无氧化热力学条件区位图。研制出一种新型的具有低密度、低膨胀、高导热性的电子封装材料。
Electronic packaging materials used in aerospace vehicles should notonly meet the basic need of low thermal expansion coefficient (TEC) andhigh thermal conductivity (TC), but also the need of hermeticity andstrength, and lightweight is the precondition to use. High-siliconaluminum alloys used as lightweight electronic packaging material cannot only realize the design of physical properties by changing thecomposition of alloy, but also have excellent comprehensive properties.Its low expansion coefficient can be obtained by increasing Si content,however, alloy brittleness increases and thermal conductivity decreaseswith the increase of Si content, which restricts its application.High-silicon aluminum alloy materials with lightweight, low thermalexpansion coefficient and high thermal conductivity, studied in this paper,is important developing direction in electronic packaging materials usedin aerospace, the researches on its scientific theory and preparationtechnology have important scientific and practical significance.
This dissertation based on the study of military industry project:electronic packaging material of high-silicon aluminum alloys withlow-density, low thermal expansion coefficient and high thermalconductivity, in order to solve problems occurred in the preparation anduse of electronic packaging material of high-silicon aluminum alloys, themain researches are as follows:
Binary high-silicon aluminum alloys were prepared by powdermetallurgy and vacuum canning hot-extrusion process, and the effect ofextrusion temperature, powder size and Si content on microstructure andproperties of material was comprehensively studied. The results show that:binary high-silicon aluminum alloy with lower Si content solves theproblem of brittleness and gains better thermal conductivity, but it dosenot satisfy the need of the TEC and tensile strength of electronicpackaging material.
In order to improve the tensile strength and decrease the TEC, SiC_pand SiO_2 with low TEC and cost addition were put into binaryhigh-silicon aluminum alloy matrix to prepare particle reinforcing Al-Si matrix composites. The microstructure and properties of SiC and SiO_2particle reinforced Al-Si matrix composites prepared by hot-extrusion andhot-press respectively were studied, TEC and TC were verifiedrespectively by Turner, Kerner and EMA (Effective MediumApproximation) models. The TEC of the composites decreases, at thesame time, the TC of them decreases rapidly and the tensile strength cannot be tested because of the bad formability of materials, they can alsonot meet the using need of electronic packaging materials.
In order to gaining the best comprehensive properties,high-temperature air-oxidation and high-energy milling pretreatmentprocesses, introduced in this paper for the first time, were applied toincrease the oxygen content of Al-Si alloy powder, combined withvacuum canning hot-extrusion process to fabricate SiO_2 and Al_2O_3dispersion strengthening composites. The oxidation thermodynamics andkinetics condition of Al-Si alloy powder were discussed, thethermodynamics condition of oxidation, priority oxidation andnonoxidation were calculated and drew, the effect of oxidation time,milling time, the ratio of ball to powder and Si content on powder oxygencontent, material microstructure and properties were comprehensivelystudied.
At last, all processes used in fabricating high-silicon aluminum alloycomposites were synthetically analyzed and compared, It can beconcluded that: the comprehensive properties of the composites preparedby powder after high-energy milling process are the best, all propertiescan entirely meet the need of electronic packaging materials, and theparameters of milling process were optimized. In this paper, thethermodynamics condition of oxidation, priority oxidation andnonoxidation has been established based on the investigation of theoxidation thermodynamics and kinetics condition of Al-Si alloy powder.A novel low-density, low thermal expansion coefficient(TEC) and highthermal conductivity(TC) electronic package material was developed.
引文
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