大功率DC/DC模块电源的研究
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摘要
高压直流电源是飞机第三大供电体系。它的二次电源有两种，一种是把270VDC变换为28VDC的直流变换器，另一种是把270VDC变换为115V／400Hz交流电的静止变流器。本文研究DC／DC二次电源的模块化。
本文分析了大功率DC／DC电源模块化的难点，采用一种新型的三维封装结构，完成了一台270VDC输入，28V／36ADC输出的DC／DC模块电源，并对样机进行了测试。样机运用了软开关技术、铝基板、表面贴装技术、平面变压器和尖峰抑制器等新技术。尺寸：160×95×23(mm)，重量：小于1kg，满载效率92％。
为实现更高的功率密度，本文把微电子行业中广泛应用的倒装芯片技术应用于模块电源研究中，完成了一个半桥FC-IPEM(Flip chip-Integrated power electronics module)模块。文章主要对装配工艺进行了探索。
The high-voltage dc electric system is the third aviation power supply. There are two kinds of secondary power supply in high-voltage dc electric system, one is DC/DC converter that converts 270VDC to 28VDC, the other is static converter that converts 270VDC to 115VAC/400Hz. The modularity of the second power supply is important to the power system's performance.
The paper analyzes the key issues in the design of a high power modular power supply. A new three-dimensional package structures is introduced, and a prototype of 270VDC input, 28V/36ADC output is built in the lab. Many new technologies, including soft switching technology, Al substrate, SMT, planar transformer and noise suppressors are applied. The size of the prototype is 60x95x23 (mm), and the weight is less than 1kg, and its full-load efficiency is 92%. The assembly process and experimental results are included in this paper.
In order to increase the power density of the module, a three-dimensional FC-IPEM package structure is introduced. A half-bridge FC-IPEM module is built in the lab with BGA power devices and flip-chip technique. The assembly process is presented in this paper.
本文分析了大功率DC／DC电源模块化的难点，采用一种新型的三维封装结构，完成了一台270VDC输入，28V／36ADC输出的DC／DC模块电源，并对样机进行了测试。样机运用了软开关技术、铝基板、表面贴装技术、平面变压器和尖峰抑制器等新技术。尺寸：160×95×23(mm)，重量：小于1kg，满载效率92％。
为实现更高的功率密度，本文把微电子行业中广泛应用的倒装芯片技术应用于模块电源研究中，完成了一个半桥FC-IPEM(Flip chip-Integrated power electronics module)模块。文章主要对装配工艺进行了探索。
The high-voltage dc electric system is the third aviation power supply. There are two kinds of secondary power supply in high-voltage dc electric system, one is DC/DC converter that converts 270VDC to 28VDC, the other is static converter that converts 270VDC to 115VAC/400Hz. The modularity of the second power supply is important to the power system's performance.
The paper analyzes the key issues in the design of a high power modular power supply. A new three-dimensional package structures is introduced, and a prototype of 270VDC input, 28V/36ADC output is built in the lab. Many new technologies, including soft switching technology, Al substrate, SMT, planar transformer and noise suppressors are applied. The size of the prototype is 60x95x23 (mm), and the weight is less than 1kg, and its full-load efficiency is 92%. The assembly process and experimental results are included in this paper.
In order to increase the power density of the module, a three-dimensional FC-IPEM package structure is introduced. A half-bridge FC-IPEM module is built in the lab with BGA power devices and flip-chip technique. The assembly process is presented in this paper.
引文
[1] 严仰光，航空航天器供电系统，航空工业出版社，1995年第一版．
[2] 王友仁，严仰光，陈鸿茂，飞机电气系统综合控制技术综述，航空电子技术，1998．92(3)：44-48．
[3] J.D. Van Wyk and E C. Lee, "Power electronics technology at the dawn of the new millennium- status and future," Proe. of IEEE PESC' 1999, pp.3-12.
[4] F. C. Lee, D. Borojevic, K. Xing,G Thandi, and H. Zhu, "PEBBs and system integration at Virginia Power Electronics Center," Integrated power electronics module-a building block concept for system integration, Volume X of the CPES-VT Publication Series, 2000, pp.1-4.
[5] 刘选忠，模块式电源分册，辽宁科学技术出版社，1999年1月．
[6] 吴金宏，崔同欣，刘丽娜，模块电源的应用，国外电子元器件，1999．No．11：8．10．
[7] 陈一清，中国通信电源市场的回顾与展望，电源技术应用，2000年第3期：129-130．
[8] 李靖，中国开关电源市场的分析，电工技术杂志，2000年第2期：44-45．
[9] 高峰，众商汇集，逐鹿中原．我们模块电源市场扫描，电子产品世界，2000年第4期：9-11．
[10] http://www.c114.net/market/marketread.asp?articleid=2328，国内中小功率模块电源市场现状．
[11] 赵英，电子组件表面组装技术，机械工业出版社，1991年11月．
[12] R. Redl, N. O. Sokal and L. Balogh, "A novel soft-switching full-bridge DC/DC converter: analysis, design considerations, at 1.5kW, 100kHz," Proc. of IEEE Trans. on Power Electronics, vol.6, no.3, July 1991, pp.408-418.
[13] 赵修科，实用电源技术手册磁性元器件分册，辽宁科学技术出版社，2002年8月．
[14] 丁志刚，电磁式同步电机多功能交流励磁电源及高压大功率DC／DC全桥变换器研究，南京航空航天大学硕士学位论文，2003年3月．
[15] O. Arakawa, T. Yamada, R. Hirarnatsu, "Magnetic snubber using amorphous saturable reactor-amorphous beads," Proe. of IEEE APEC'1988, pp.334-340.
[16] N. Dai, A. W. Lofti, G.Skutt, W. Tabisz, E C. Lee, "A comparative study of high-frequency, low-profile planar transformer technologies," Proc. of IEEE APEC, 1994,pp. 226-232.
[17] C.Quinn,K.Rirme,T.O'Dormell,M.Duffy, C.0.Math?na,"A review of planar magnetic techniques and technologies,"in Proc. of IEEE APEC'2001, pp.1175-1183.
[18] D. van der Linde, C. A. M. Boon, J. Ben Klaassens, "Design of a high-frequency planar power transformer in multilayer technology," Proc. IEEE Trans.on Ind.
Electro., Vol.38 No.2, April 1991, pp.135-141.
[19] M. Rascon, R. Prieto, O. Garcia, J. A. Cobos, J. Uceda, "Design of very low profile magnetic components using flex foils," Proe. of IEEE APEC'1997, pp.561-567.
[20] 范和平，于洁，陈宗元，李为民，壬琛，柔性印制电路基板的粘接工艺研究，粘接，1998年第4期：31-34．
[21] Philiphs Magnetic Product,Application Note, "Design of planar power transformer".
[22] 阮新波 严仰光，脉宽调制DC／DC全桥变换器的软开关技术，科学出版社，1999年9月．
[23] J. A. Sabate, V. Vlatkovic, F. C. Lee, B. H. Cho, "Design consideration for high-voltage high-power full-bridge zero-voltage-switched PWM converter," Proc. of IEEE APEC' 1990, pp.275-284.
[24] K. Xing, E C. Lee, and D. Borojevic, "Extraction of parasitics within wire-bond IGBT modules," Proc. of IEEE APEC' 1998, pp.497-503.
[25] R. Fisher, R. Fillion, J. Burgess, and W. Hennessy, "High frequency, low cost, power packaging using thin film power overlay technology," Proc. of IEEE APEC" 1995, pp.12-17.
[26] S. Haque, K. Xing, G. Q. Lu, D. Nelson, D. Borojevic, F. C. Lee, "Packaging of power electronics building blocks using metal posts interconnected parallel plate structure" Proc. of VPEC Seminar, 1997, pp. 115-120.
[27] A. Ward, G. Q. Lu, "High density power electronic packaging," Proc. of VPEC Seminar, 1997, pp.221-224.
[28] D." Lang, Guidelines for Mounting Fairchild's BGA Package, Farichild Semiconductor Corporation,Application note 7001, March 2002.
[29] X. Liu, S. Haque, J. Wang, G. Q. Lu, "Packaging of integrated power electronics modules using flip-chip technology," Proc. of IEEE APEC'2000, pp.290-296.
[30] X. Liu, S. Xu, G. Q. Lu, D. A. Dillard, "Stacked sloder bumping technology for improved solder joint reliability," Microelectronics Reliability 41(2001), pp.1979-1992.
[31] I. Dutta, A. Gopinath, C. Marshall, "Underfill constraint effects during therrno-mechanical cycling of flip chip solder joint," J.Electronic Mater., Vol.31, April 2002, pp.253-264.
[2] 王友仁，严仰光，陈鸿茂，飞机电气系统综合控制技术综述，航空电子技术，1998．92(3)：44-48．
[3] J.D. Van Wyk and E C. Lee, "Power electronics technology at the dawn of the new millennium- status and future," Proe. of IEEE PESC' 1999, pp.3-12.
[4] F. C. Lee, D. Borojevic, K. Xing,G Thandi, and H. Zhu, "PEBBs and system integration at Virginia Power Electronics Center," Integrated power electronics module-a building block concept for system integration, Volume X of the CPES-VT Publication Series, 2000, pp.1-4.
[5] 刘选忠，模块式电源分册，辽宁科学技术出版社，1999年1月．
[6] 吴金宏，崔同欣，刘丽娜，模块电源的应用，国外电子元器件，1999．No．11：8．10．
[7] 陈一清，中国通信电源市场的回顾与展望，电源技术应用，2000年第3期：129-130．
[8] 李靖，中国开关电源市场的分析，电工技术杂志，2000年第2期：44-45．
[9] 高峰，众商汇集，逐鹿中原．我们模块电源市场扫描，电子产品世界，2000年第4期：9-11．
[10] http://www.c114.net/market/marketread.asp?articleid=2328，国内中小功率模块电源市场现状．
[11] 赵英，电子组件表面组装技术，机械工业出版社，1991年11月．
[12] R. Redl, N. O. Sokal and L. Balogh, "A novel soft-switching full-bridge DC/DC converter: analysis, design considerations, at 1.5kW, 100kHz," Proc. of IEEE Trans. on Power Electronics, vol.6, no.3, July 1991, pp.408-418.
[13] 赵修科，实用电源技术手册磁性元器件分册，辽宁科学技术出版社，2002年8月．
[14] 丁志刚，电磁式同步电机多功能交流励磁电源及高压大功率DC／DC全桥变换器研究，南京航空航天大学硕士学位论文，2003年3月．
[15] O. Arakawa, T. Yamada, R. Hirarnatsu, "Magnetic snubber using amorphous saturable reactor-amorphous beads," Proe. of IEEE APEC'1988, pp.334-340.
[16] N. Dai, A. W. Lofti, G.Skutt, W. Tabisz, E C. Lee, "A comparative study of high-frequency, low-profile planar transformer technologies," Proc. of IEEE APEC, 1994,pp. 226-232.
[17] C.Quinn,K.Rirme,T.O'Dormell,M.Duffy, C.0.Math?na,"A review of planar magnetic techniques and technologies,"in Proc. of IEEE APEC'2001, pp.1175-1183.
[18] D. van der Linde, C. A. M. Boon, J. Ben Klaassens, "Design of a high-frequency planar power transformer in multilayer technology," Proc. IEEE Trans.on Ind.
Electro., Vol.38 No.2, April 1991, pp.135-141.
[19] M. Rascon, R. Prieto, O. Garcia, J. A. Cobos, J. Uceda, "Design of very low profile magnetic components using flex foils," Proe. of IEEE APEC'1997, pp.561-567.
[20] 范和平，于洁，陈宗元，李为民，壬琛，柔性印制电路基板的粘接工艺研究，粘接，1998年第4期：31-34．
[21] Philiphs Magnetic Product,Application Note, "Design of planar power transformer".
[22] 阮新波 严仰光，脉宽调制DC／DC全桥变换器的软开关技术，科学出版社，1999年9月．
[23] J. A. Sabate, V. Vlatkovic, F. C. Lee, B. H. Cho, "Design consideration for high-voltage high-power full-bridge zero-voltage-switched PWM converter," Proc. of IEEE APEC' 1990, pp.275-284.
[24] K. Xing, E C. Lee, and D. Borojevic, "Extraction of parasitics within wire-bond IGBT modules," Proc. of IEEE APEC' 1998, pp.497-503.
[25] R. Fisher, R. Fillion, J. Burgess, and W. Hennessy, "High frequency, low cost, power packaging using thin film power overlay technology," Proc. of IEEE APEC" 1995, pp.12-17.
[26] S. Haque, K. Xing, G. Q. Lu, D. Nelson, D. Borojevic, F. C. Lee, "Packaging of power electronics building blocks using metal posts interconnected parallel plate structure" Proc. of VPEC Seminar, 1997, pp. 115-120.
[27] A. Ward, G. Q. Lu, "High density power electronic packaging," Proc. of VPEC Seminar, 1997, pp.221-224.
[28] D." Lang, Guidelines for Mounting Fairchild's BGA Package, Farichild Semiconductor Corporation,Application note 7001, March 2002.
[29] X. Liu, S. Haque, J. Wang, G. Q. Lu, "Packaging of integrated power electronics modules using flip-chip technology," Proc. of IEEE APEC'2000, pp.290-296.
[30] X. Liu, S. Xu, G. Q. Lu, D. A. Dillard, "Stacked sloder bumping technology for improved solder joint reliability," Microelectronics Reliability 41(2001), pp.1979-1992.
[31] I. Dutta, A. Gopinath, C. Marshall, "Underfill constraint effects during therrno-mechanical cycling of flip chip solder joint," J.Electronic Mater., Vol.31, April 2002, pp.253-264.