大功率半导体器件在脉冲放电环境下的导通机理及其温度特性的研究
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摘要
脉冲功率源技术是各种新概念武器包括电磁发射的基础技术。其作用是向其发射平台提供大容量、高电压、大电流和高能量密度的电能。随着脉冲功率源小型化、模块化的发展趋势,对其重要组成部分——大功率半导体器件有了更高的要求。因为在脉冲浪涌放电环境下,器件要承受高电压、大电流和高的电流上升率等工作特点,工作环境非常恶劣,其工频环境下的技术参数已经不能准确反应其在该环境下的工作情况,浪涌参数才是需要重点研究的技术指标。本文正是基于此应用背景下研究大功率半导体器件,文章的主要工作有以下几点:
     首先,介绍脉冲功率源系统的基本概念,实验装置和技术特点,并由单模块PFN脉冲成形网络列出状态方程并推广到一般情况,介绍引出本文所要研究的大功率半导体器件。
     其次,以大功率可控硅为代表,理论上分析其导通机理及其动态特性参数的相互影响,从半导体物理的角度分析大功率可控硅在浪涌放电环境下的承受能力。
     然后,在脉冲功率源放电实验中,测试系统脉冲大电流,大功率器件的动态参数,并通过实验数据分析其在脉冲环境下的动态特性。
     最后,分析大功率半导体器件损坏的失效模式和常见的外应力,研究在脉冲功率源系统环境下,大功率续流硅堆的温度特性,通过实验分析器件芯片结温和管片温度之间的相互联系。
     通过本文,对大功率半导体器件在脉冲浪涌放电环境的的动态特性及其温度特性进行了系统的分析研究,对脉冲功率电源模块的设计具有一定的指导意义。
Pulsed power technology is the basic technology of electromagnetic launch. Its role is to provide high-capacity, high-voltage, high current and high energy density of power to launch platform. At present, the development trend of pulsed power technology is miniaturization and modularization. As an important part of pulsed power technology, high-power semiconductor devices are working surge in pulse discharge environment, the main references at this time are no longer under its usual technical parameters, but its surge environment technical parameters. The systematic research is about the characteristic of pluse for high power semiconductor. The main works are as fellows:
     First, introduced on the basic concept of experimental equipment and technical characteristics. By means of theoretical analysis the theory of high-power semiconductor devices in pulse forming network features, extended the equation of state under normal circumstances, this leads to the study of high-power semiconductor devices.
     Secondly, select SCR as the representative to high power semiconductor, research its mechanism and its on-dynamic parameters of the mutual impact in theory. Analyse high power SCR which surge in the discharge environment sustainability from semiconductor physics.
     Then, in the discharge of pulsed power source, test the large current pulse, the dynamic parameters of high-power semiconductor devices. Analyse their experimental data in the pulse of the dynamic environment.
     Finally, analyse the failure modes and common stress of high-power semiconductor devices, research its temperature characterisitic in pulsed power source system environment. Through this dissertation, a research has been made on the high-power semiconductor devices in the discharge pulse surge to the dynamic nature of the environment and temperature characteristics of the system, which has a guiding significance on the design of pulsed power supply module.
引文
[1]董健年.电容储能脉冲成形网络技术及在电热化学炮中的应用.博士学位论文.南京理工大学.2001.3
    [2]杨世荣,王莹,徐海荣,洛颖.电磁发射器的原理与应用物理学与高新技术,2003(32):25-28
    [3]李立毅.电磁发射的历史及发展趋势.微电机,2004(37):41-44
    [4]古刚、向阳.国际电场发射技术研究现状.舰船科学技术,2007(29):156-158
    [5]Lehmann P.Overview of the electric launch activities at the French-German Research Insritute of Saint-Louis(ISL).IEEE Trans.On Mag 2003,39(1),24-28
    [6]Weise TH,Mang J,Zimmermann G.National overview of the German ETC Program,IEEE Trans,On Mag,2003,39(1):35-38
    [7]Jung J W,Kim S H,Yang K S.Overview of ETC research in Korea.IEEE Transaction on Magnetics,2003,39(1):22-23
    [8]Bhasavanich D.Demonstration of a modular,repetitive-fired 1/4-MJ PFN for ETC Guns.IEEE Transtractions on Magnetics,1999,35(1):426-431
    [9]Wisken H G.High energy density capacitors for ETC Gun applications.IEEE Transtactions on Magnetics,2001(37):332-335
    [10]Fair H D.Electromagnetic Launch Science and Technology in the United States Enters a New Era.IEEE Transactions on Magntics,2005,41(1):158-164
    [11]李勇,李力毅,程树康,王莹.电磁弹射技术的原理与现状.微电机,2001(5):3-5
    [12]郭明安,李斌康,孙风荣.便携式ns级脉冲功率高压源的设计与实现.高电压技术,2004(2):48-50
    [13]彭涛,辜承林.脉冲强磁场及其发展动态.电工技术,2002(11):1-4
    [14]Eric I Carroll.用于大功率领域的功率半导体器.国外内燃机车,2000(2):12-17
    [15]张波,李肇基,方健.功率半导体器件的研究与进展.中国集成电路,2003(2):8-12
    [16]李焕炀,余岳辉,胡乾.RSD开关在脉冲电源中的应用研究.中国电机工程学报,2003(11):22-27
    [17]李正瀛.脉冲功率技术.北京:水利电力出版社,1992
    [18]Parker J V,Berry D T,Snowden P T.The IAT Electromagnetic Launch Research Facility.IEEE Transactions on Magnetics,1997(1):129-133
    [19]Spahn E,High Voltage Thyrisistor Switch for Pulse Power Applications.Proceeding of 5~(th)European Symposium on Electromagnetic Launch Technology,1995(4):61-64
    [20]Spahn E,Wenning W.A Compact Pulse Forming,Based on Semiconducting Switches,for Electric Gun Applications.IEEE Transactions On Magnetics.1999(1):378-382
    [21]Alex Pokryvailo,Yefim Yankelevich,Michael Wolf,Eli Abramzon,Shlomo Wald,Welleman A.A High-Power Pulsed Corona Source for Pollution Control Applications.IEEE Transactions on Plasma Science,2004(5):2045-2054
    [22]Jiannian Dong,Wenbin Hu,Jun Zhang,Yingchun Gui,Jun Li.A 100kJ modular pulsed power supply with thyristors.13th Electromagnetic launch technology Symposium,2006
    [23]何孟兵,李劲,姚宗干.高功率脉冲放电间隙开关综述.高电压技术,2000(4):33-35
    [24]Hardev Singh,Charles R.Advanced semiconductor swithes for EM launchers Magnetics.IEEE Transactions On Magnetics,2001(37):394-397
    [25]Dunlop A W.Semiconductor Devices For Pulsed Power Applications.Semiconductor Devices For Pulsed Power Applications,2000(3):1-4
    [26]北京市技术交流站可控硅元件培训班.大功率可控硅元件原理与设计.北京:人民教育出版社,1975
    [27]维捷斯拉夫.本达,约翰.戈沃著,吴郁,张万荣译.功率半导体器件理论及应用.化学工业出版社,2005
    [28]TAYLOR P D.著,顾廉楚译.晶闸管的设计与制造.北京:中国铁道出版社,1992
    [29]聂代祚.电力半导体器件.北京:电子工业出版社,1994
    [30]W.格尔拉赫.晶闸管.北京:机械工业出版社,1984
    [31]马鹤亭.电力电子元件.杭州:浙江大学出版社,1987
    [32]王兆安,黄俊,电力电子技术.北京:机械工业出版社,2006
    [33]颜廷刚,鲁广斌.提高晶闸管器件对di/dt的耐压能力的途径.信息技术,2002(9):67-68
    [34]刘刚,余岳辉,史济群.半导体器件.北京:电子工业出版社,1990
    [35]张仁豫,陈昌渔.高电压实验技术.北京:清华大学出版社,2003
    [36]藏绪运,赵刚.高压测试中冲击性电磁骚扰的时域分析.上海交通大学高电压实验设备开发中心
    [37]石磊,邱爱慈,周国振.微秒级强脉冲磁场的产生和测量.高压电器,2001(2):24-25
    [38]修士新,王季梅.关于高电压等级真空灭弧室研究与开发.高电压技术,2003(12):7-9
    [39]Stevn C Glidden.High Voltage,High Current,High di/dt Solid State Switch.IEEE Transactions on Magnetics.VOL.19.NO.6,January 2002:p 1043-p1046
    [40]Yoshiteru Shimizu,Hiroshi Kozaka.An Overvoltage Self-protected Thrisitor with a Structure to Predict Breakover Voltage.IEEE Transactions On Electron Devices.VOL.43.NO.6.June 1996:p1000-p1006
    [41]刘金亮、钟辉煌、贺军涛.测量ns级脉冲大电流的同轴分流器.高压电器,1997年第3期
    [42]林云志等.雷电流自动监测系统[J].电工电能新技术,1998,17(1):36-38
    [43]Wey J,Peter H.Measurements at the ISL-EML1 Railgun facility
    [44]Kato Jun,Tominaga Tetsuya,Kuwabara Nobuo.Improved frequency characteristics of large Rogowski coil using lighning surges observation,310-313
    [45]卢其庆,张安康.半导体器件可靠性与失效分析.南京:江苏科学技术出版社,1981
    [46]Grove W R.Physics technology of semiconductor devices.John Wiley and Sans.In.1967
    [47]Hower P L.Avalanche injection and second breakdown in transistors.IEEE Trans.On Electron Devices,Vol.ED- 17.NO.4.PP.320-335(1970)
    [48]Lin H C,Hlavacek A R and White B H.Transient Operation of Transistor with Inductive Load.IEEE Trans.On Electron Devices,VOL.ED-7.NO.3.PP.174-179(1980)
    [49]徐爱斌,郑延圭.半导体器件参数退化失效分析.电子产品可靠性与环境实验,1996(4):38-42
    [50]profumo F,Tenconi A,Facelli S,and Passerini B.Instantaneous Juncion Temperature of high-power diodes(thristors)during current transients.IEEE Trans.Poewer electronics,1999.14(2):292-299
    [51]张奕轩,孔学东,功率晶体管结温测量与器件筛选条件拟定.可靠性物理与失效分析技术,2007,6(25):11-14
    [52]陆建东.热电偶的测温原理及误差分析.宁夏电力,2007增刊(2):76-79
    [53]马志凌,郑学仁.半导体器件的温度测量.科学技术与工程,2007,7(8):1695-1698
    [54]成红英,刘超英.差动光隔离放大器的研制和应用.内蒙古大学学报,2002,33(5):572-575
    [55]董健年,桂应春,李军,张军.电磁弹射系统的脉冲功率源设计.高电压技术,2007,12,33(12):105-107
    [56]董健年,桂应春,李军.电热化学炮移动式脉冲功率源.弹道学报,2005,17(2):84-88
    [57]董健年,张军,桂应春.轨道炮脉冲电流源续流硅堆设计及实验现象分析.弹道学报,2007,19(4):71-74
    [58]Garbarino P L.New Method of Monitoring Junction Temperature.IEEE Trans.Instrum.Meas,1971,IM-20:99-104
    [59]Howard L Skolnik.Design considerations for linear optically coupled isolation amplifiers.IEEE Journal of Solid-Satate Circuits,VOL.SC-17 1982:1095-1100
    [60]Chang D I.A pluse forming network and test fixture for screening ecectrothermal chemical candidate propellants.IEEE Transactions on Magnetics,2003,29(1):919-922
    [61]Spahn E,Wenning G.High voltage thyristor switch for EML applications 7~(th)Int.Symposium on Electromagnetic Launch Technology,April94,San-Diego
    [62]Gu-yot C C H.The Pulse Shape Requirement of an ETC Gun.IEEE Transactions On Magnetics,Vol.31,No.1,Jan.1995,P56-60
    [63]Ramboz John D.Machinable Rogoski Coil,Design and Calibration.IEEE RAMTech Enginerring,Inc.1995
    [64]Ghijselen Jozef,bossche Alex Van den.EMC Combined di/dt Current Probe.Sint-Pietersnieuwstraat 41 B-9000 Ghent,BELGIUM
    [65]Sadedin D R.Geometry of a Pulse Transformer for Electromagnetic Launching.IEEE Transactions on Magnetics,1984(2)
    [66]Ying Wang,Shukang Cheng,Ping Zheng.Widely Developing Electric Launch Technology in China.IEEE Transactions on Magnetics,2003(1):39-41
    [67]Chadee Persad.A Review of U.S.Patents in Electromagnetic Launch Technology.IEEE Transactions on Magnetics,2001(2):493-49
    [68]Harry D Fair.Electromagnetic Launch Science and Technology in the United States Enters a New Era.IEEE Transactions on Magnetics,2005(1):158-164
    [69]Claeys W,Dihaire S.Optical instrumentation for the themal characterization of electionic devices www.electronics cooling.com,2002
    [70]Altet J,Granby.S.Advanced techniques for IC surface temperature measurements Electrinics Cooling,2002
    [71]Hall D C,Goldberg L.Technique for lateral temperature profiling in optoelectronic devices using a photoluminescence microprobe Applied Physics letters,61(4):384-386
    [72]Kin Q,Stark B.A novel high resolution,non-contact channel temperature measurement technique.Proceedings 36~(th)Annual IEEE Reliability Physics Symposium,IEEE,USA.1998 102-112
    [73]Ju Y S,Goodson K E.Thermal mapping of interconnects subjected to brief electrical stresses.IEEE Elecctron Device Letters,1997 18(11):512-514[73]
    [74]Ju Y S,Goodson K E.Short-timescale themal mapping of interconnects Proceedings 35th Annual Reliability Physics Symposium,1997:320-324
    [75]董健年,李鸿志,栗保明.大功率二极管脉冲功率源中的过渡过程.弹道学报,2001,13(1):41-45
    [76]宋伟.大功率可控硅器件及串并联技术在脉冲功率源中的应用.南京理工大学.硕士学位论文.2005.6
    [77]郭俊.晶闸管开关脉冲电源的技术关键探讨.电力电子技术,1993(2):58-60
    [78]天津师范学院物理系.高压硅堆技术.北京:国防工业出版社,1977
    [79]施敏.半导体元件物理与工艺.北京:科学出版社,1992
    [80]颜延刚,鲁广斌。提高晶闸管器件对di/dt的耐受能力的途径.信息技术,2002(9):67-68
    [81]张光华译.功率半导体原件工作原理和制造工艺.北京:机械工业出版社,1982
    [82]高光渤,李学信.半导体器件可靠性物理.北京:科学教育出版社,1987

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