阵列波导光栅及可调色散补偿器研究
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摘要
本论文根据波导阵列光栅（Arrayed Waveguide Grating，简称AWG）近年来具有往低成本、无热封装、以及基于AWG的可调色散补偿器（Tunable Optical DispersionCompensator，TODC）的方向发展的趋势，着重进行了如下几个方面的研究，并取得了如下创新性的成果：
进行了低成本曲线型切割AWG有热稳定封装技术研究。通过理论分析与实验的方法研究了AWG芯片受加热片、受封装盒线膨胀系数与AWG芯片或带装光纤之间的不同导致的热应力。本论文提出了一种通过在加热片与曲线AWG芯片接触面之间使用导热硅脂、在AWG芯片周围用硅橡胶将其贴到加热片上的方法减小加热片对AWG芯片的应力，并通过在加热片下贴一块高硼硅玻璃片将AWG上的带状光纤固定到该玻璃片上的方案极大低降低了封装盒对AWG芯片的应力，同时又保证了AWG芯片不受通过带状光纤传递过来的来自封装盒外的外力的影响。实验表明环境温度在-20~65℃范围内变化时使用本方案封装的AWG热应力引起的中心波长变化典型值为5pm。
进行了新型无热AWG研究。本论文提出一种新型无热AWG方案：在两条线膨胀系数较大的材料上贴两片平整的基片A与B，将曲线切割的AWG芯片沿着输入平板波导且垂直于光传输方向切断为A、B两个部分并分别贴在这些基片上，利用补偿杆的热胀冷缩导致的AWG芯片各个部分之间的相对运动来实现无热AWG。本方案的特点是使用的补偿杆本身比较稳定，不易产生弹性形变，封装的无热AWG不易受外力的影响，而且可以在封装过程中通过在曲线型AWG芯片上施加外力改变AWG芯片的中心波长，用以补偿贴AWG芯片以及其它操作中使用的夹具应力、胶的应力的释放引起的AWG中心波长的漂移并精确调整波长。实验结果表明，可以在-5～70℃环境温度范围内实现波长温度系数为-0.79pm/℃的无热AWG。
进行了新型小尺寸AWG芯片设计研究。本论文提出了一种新型的小尺寸低折射率差硅基二氧化硅AWG芯片的设计方案，该方案通过将输出波导与AWG输出平板连接的部分制作成高折射率差的空气槽波导，从而缩减AWG芯片尺寸。该方案优点是除输出波导与AWG输出平板波导连接的部分制作成高折射率差的空气槽波导外，其余各处的波导均为低折射率差波导，这就保留了低折射率差波导与普通单模光纤之间的低耦合损耗的特性，以及阵列波导低相位误差的特性。设计结果表明可以在一个6英寸的硅片上加工并切出49个40通道100GHz间隔的AWG芯片——是常规曲线切割AWG的2倍左右。
本论文提出了一种新型的单片集成的基于AWG的TODC的设计方案：将AWG中输出波导与输出平板波导连接的部分制作成高折射率差的空气槽波导以获得相邻输出波导光谱中心波长差很小的AWG，并将AWG输出波导分成若干组，每组中各个输出波导均利用热光效应改变该波导中的光信号的相位，实现多通道同时或独立可调TODC功能。模拟结果显示多通道独立可调TODC可以实现-402～402ps/nm的色散补偿能力，设计的多通道同时可调TODC可以实现-783～783ps/nm的色散补偿能力。同时提出了一种超低群时延抖动的级联TODC方案，模拟结果表示在色散补偿范围为-776～776ps/nm内时，级联的TODC的群时延抖动的峰-谷值小于0.9ps。
Dense wavelength division multiplexer (DWDM) based on arrayed waveguide grating(AWG) is widely used in the backbone, metropolitan, and access networks, for itsadvantages of small channel spacing, easy integration with other optical components,compact size, high reliability, high yield, and low cost. In the recent years, most effortswere paid in the AWGs with low cost and athermal packaging technologies. Further more,more and more attentions were paid in the multiple channel tunable optical dispersioncompensator (TODC) based on AWG with the development of40Gbps systemts. For thesereasons, we did some researches and made the following innovations:
In this thesis, we experimentally studied the thermal stresses in curve diced AWG chipintroduced by the differences between the linear expansion coefficient of AWG and those ofthe heater and the packaging box, and we introduced a new low thermal stress AWGpackaging. In this packaging, the AWG chip was bonded to the heater by heater conductivesilicon greese and silicon rubber, so the stress was very small which was caused by thethermal expansion coefficient difference between the AWG chip and the heater. Aborosilicate glass plate was bonded to the ceramic heater, and the ribbon fibbers werebonded to it with silicon rubber. For the linear expansion coefficient difference between theborosilicate glass plate and ribbon fiber is very samll, the thermal stress of ribbon fibber orAWG chip is very small. Further more, this new pakaging can assure that the AWG in thepackaging case will not be influenced by the forces outside of the case. Experimentalresults showed the typical center wavelength variation introduced by the thermal stress forthermally stabled AWG modules manufactured with this technique was smaller than5pm,when the ambient temperature varied from-20℃to65℃.
We introduced a new athermalized AWG packaging. In this athermal AWG, two plaes Aand B with the same thermal expansion coefficient as AWG chip were adhered to thealuminium alloy compensation bars with large thermal expansion coefficient, and two parts(A and B)of AWG chip were adhered to the plate A and B, repectively. The part A and B ofAWG chip were fabricated by cutting a curve-shape AWG chip from the center of its inputslab waveguide. For the thermal expansion coefficient of compensation bar is larger than thatof AWG chip, the position between the AWG part A and B varies with the variation of theambient temperature, so the AWG center wavelength variation caused by the variation of the ambient temperature can be reduced. For this new athermal AWG have no any flexibility, itcan not be influenced by the outside force. And for the curve-shape AWG center wavelengthcan be adjusted by the radial stress, the center wavelength of this athermal AWG can beadjusted during packaging process, which can be used to compensate the center wavelengthvariation introduced by the mechanical and thermal stress. The experiment results showedthe coefficient of center wavelength varying with the ambient temperature was as small as-0.79pm/℃, when the ambient temperature varied from-5℃to70℃
A novel compact AWG based on low refractive index contrast silica-on-silicontechnology is proposed. In this AWG, only the segments connected with slab waveguides inthe input and output waveguides are air trench (AT) waveguides. By using these ATsegments, the distance between the adjacent output waveguides connected with the outputslab is decreaced greatly, so the size of AWG chip is decreased dramatically. The segmentscoupling to fibers in the input or output waveguides and the arrayed waveguides are allfabricated with low refractive index contrast waveguides, for the purpose to obtain lowcoupling loss with fibers and good performances as traditional SOS AWGs. The designresuts show that the size of an AWG designed consisting of40channels on100GHz ITUgrid is very small, and forty-nine pieces of square AWG dies can be cut from a six inchsilicon wafer.
This thesis proposes an integrated tunable optical dispersion compensator whichconsists of an AWG with air trench output waveguides and waveguide-type phasemodulators based on thermo-optic effect. The air trenches are formed on both sides of eachoutput waveguide to minimize the size of AWG. One TODC design for compensatingchromatic dispersion (CD) channel by channel with a tunable range from-402ps/nm to402ps/nm and another TODC design for compensating chromatic dispersions of multiplechannels simultaneously with a tunable range from-783ps/nm to783ps/nm are introduced.Finally, a TODC consisting of two cascaded TODCs is analyzed, which peak-to-peak groupdelay ripple is as low as0.9ps, when its CD can be tuned from-776ps/nm to776ps/nm.
进行了低成本曲线型切割AWG有热稳定封装技术研究。通过理论分析与实验的方法研究了AWG芯片受加热片、受封装盒线膨胀系数与AWG芯片或带装光纤之间的不同导致的热应力。本论文提出了一种通过在加热片与曲线AWG芯片接触面之间使用导热硅脂、在AWG芯片周围用硅橡胶将其贴到加热片上的方法减小加热片对AWG芯片的应力，并通过在加热片下贴一块高硼硅玻璃片将AWG上的带状光纤固定到该玻璃片上的方案极大低降低了封装盒对AWG芯片的应力，同时又保证了AWG芯片不受通过带状光纤传递过来的来自封装盒外的外力的影响。实验表明环境温度在-20~65℃范围内变化时使用本方案封装的AWG热应力引起的中心波长变化典型值为5pm。
进行了新型无热AWG研究。本论文提出一种新型无热AWG方案：在两条线膨胀系数较大的材料上贴两片平整的基片A与B，将曲线切割的AWG芯片沿着输入平板波导且垂直于光传输方向切断为A、B两个部分并分别贴在这些基片上，利用补偿杆的热胀冷缩导致的AWG芯片各个部分之间的相对运动来实现无热AWG。本方案的特点是使用的补偿杆本身比较稳定，不易产生弹性形变，封装的无热AWG不易受外力的影响，而且可以在封装过程中通过在曲线型AWG芯片上施加外力改变AWG芯片的中心波长，用以补偿贴AWG芯片以及其它操作中使用的夹具应力、胶的应力的释放引起的AWG中心波长的漂移并精确调整波长。实验结果表明，可以在-5～70℃环境温度范围内实现波长温度系数为-0.79pm/℃的无热AWG。
进行了新型小尺寸AWG芯片设计研究。本论文提出了一种新型的小尺寸低折射率差硅基二氧化硅AWG芯片的设计方案，该方案通过将输出波导与AWG输出平板连接的部分制作成高折射率差的空气槽波导，从而缩减AWG芯片尺寸。该方案优点是除输出波导与AWG输出平板波导连接的部分制作成高折射率差的空气槽波导外，其余各处的波导均为低折射率差波导，这就保留了低折射率差波导与普通单模光纤之间的低耦合损耗的特性，以及阵列波导低相位误差的特性。设计结果表明可以在一个6英寸的硅片上加工并切出49个40通道100GHz间隔的AWG芯片——是常规曲线切割AWG的2倍左右。
本论文提出了一种新型的单片集成的基于AWG的TODC的设计方案：将AWG中输出波导与输出平板波导连接的部分制作成高折射率差的空气槽波导以获得相邻输出波导光谱中心波长差很小的AWG，并将AWG输出波导分成若干组，每组中各个输出波导均利用热光效应改变该波导中的光信号的相位，实现多通道同时或独立可调TODC功能。模拟结果显示多通道独立可调TODC可以实现-402～402ps/nm的色散补偿能力，设计的多通道同时可调TODC可以实现-783～783ps/nm的色散补偿能力。同时提出了一种超低群时延抖动的级联TODC方案，模拟结果表示在色散补偿范围为-776～776ps/nm内时，级联的TODC的群时延抖动的峰-谷值小于0.9ps。
Dense wavelength division multiplexer (DWDM) based on arrayed waveguide grating(AWG) is widely used in the backbone, metropolitan, and access networks, for itsadvantages of small channel spacing, easy integration with other optical components,compact size, high reliability, high yield, and low cost. In the recent years, most effortswere paid in the AWGs with low cost and athermal packaging technologies. Further more,more and more attentions were paid in the multiple channel tunable optical dispersioncompensator (TODC) based on AWG with the development of40Gbps systemts. For thesereasons, we did some researches and made the following innovations:
In this thesis, we experimentally studied the thermal stresses in curve diced AWG chipintroduced by the differences between the linear expansion coefficient of AWG and those ofthe heater and the packaging box, and we introduced a new low thermal stress AWGpackaging. In this packaging, the AWG chip was bonded to the heater by heater conductivesilicon greese and silicon rubber, so the stress was very small which was caused by thethermal expansion coefficient difference between the AWG chip and the heater. Aborosilicate glass plate was bonded to the ceramic heater, and the ribbon fibbers werebonded to it with silicon rubber. For the linear expansion coefficient difference between theborosilicate glass plate and ribbon fiber is very samll, the thermal stress of ribbon fibber orAWG chip is very small. Further more, this new pakaging can assure that the AWG in thepackaging case will not be influenced by the forces outside of the case. Experimentalresults showed the typical center wavelength variation introduced by the thermal stress forthermally stabled AWG modules manufactured with this technique was smaller than5pm,when the ambient temperature varied from-20℃to65℃.
We introduced a new athermalized AWG packaging. In this athermal AWG, two plaes Aand B with the same thermal expansion coefficient as AWG chip were adhered to thealuminium alloy compensation bars with large thermal expansion coefficient, and two parts(A and B)of AWG chip were adhered to the plate A and B, repectively. The part A and B ofAWG chip were fabricated by cutting a curve-shape AWG chip from the center of its inputslab waveguide. For the thermal expansion coefficient of compensation bar is larger than thatof AWG chip, the position between the AWG part A and B varies with the variation of theambient temperature, so the AWG center wavelength variation caused by the variation of the ambient temperature can be reduced. For this new athermal AWG have no any flexibility, itcan not be influenced by the outside force. And for the curve-shape AWG center wavelengthcan be adjusted by the radial stress, the center wavelength of this athermal AWG can beadjusted during packaging process, which can be used to compensate the center wavelengthvariation introduced by the mechanical and thermal stress. The experiment results showedthe coefficient of center wavelength varying with the ambient temperature was as small as-0.79pm/℃, when the ambient temperature varied from-5℃to70℃
A novel compact AWG based on low refractive index contrast silica-on-silicontechnology is proposed. In this AWG, only the segments connected with slab waveguides inthe input and output waveguides are air trench (AT) waveguides. By using these ATsegments, the distance between the adjacent output waveguides connected with the outputslab is decreaced greatly, so the size of AWG chip is decreased dramatically. The segmentscoupling to fibers in the input or output waveguides and the arrayed waveguides are allfabricated with low refractive index contrast waveguides, for the purpose to obtain lowcoupling loss with fibers and good performances as traditional SOS AWGs. The designresuts show that the size of an AWG designed consisting of40channels on100GHz ITUgrid is very small, and forty-nine pieces of square AWG dies can be cut from a six inchsilicon wafer.
This thesis proposes an integrated tunable optical dispersion compensator whichconsists of an AWG with air trench output waveguides and waveguide-type phasemodulators based on thermo-optic effect. The air trenches are formed on both sides of eachoutput waveguide to minimize the size of AWG. One TODC design for compensatingchromatic dispersion (CD) channel by channel with a tunable range from-402ps/nm to402ps/nm and another TODC design for compensating chromatic dispersions of multiplechannels simultaneously with a tunable range from-783ps/nm to783ps/nm are introduced.Finally, a TODC consisting of two cascaded TODCs is analyzed, which peak-to-peak groupdelay ripple is as low as0.9ps, when its CD can be tuned from-776ps/nm to776ps/nm.
引文
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