热电制冷的半导体泵浦532nm激光器控温性能优化研究
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摘要
半导体泵浦532nm激光器已经越来越广泛地应用于材料加工、医疗和军事等领域,其工作的稳定性和可靠性在系统应用中起着关键作用。但是半导体泵浦532nm激光器的性能受温度的影响很大,因此其热问题一直是人们关注的焦点之一。特别是近年来,半导体泵浦532nm激光器的发展趋势向小型化,高功率的方向发展,其对传热特性与温度控制技术提出了新的要求。
本文首先简单回顾了半导体泵浦532nm激光器的发展和应用,介绍了半导体泵浦532nm激光器的温度特性,阐述了温控对于半导体泵浦532nm激光器的重要性和目前半导体激光器的主要温控手段。介绍了目前半导体泵浦532nm激光器的市场状况,回顾了有限元方法在半导体激光器传热特性研究中的应用情况。
其次,叙述了热电制冷的原理以及热电制冷在设计中具体应用,建立了热电制冷的半导体泵浦532nm激光器控温部分的数学模型,然后在半导体泵浦532nm激光器控温部分的设计中,通过引入有限元分析(FEM)的方法,使用ANSYS有限元分析软件,通过稳态热模拟和瞬态热模拟对控温部分结构进行热分析,并且在数学模型的指导下对结构进行了优化和热分析。研究结果表明:在同样的制冷量输入下,优化后控温部分的稳态控温能力提高了8%左右,瞬态的作用时间提高了33%,较初始结构有明显改善。
最后,根据优化后的结构制作了实验装置,并且对实验装置的控温能力进行了测试。通过对比实验测试数据和ANSYS热模拟的数据,确认相互之间的误差约在10%左右;结果表明,有限元分析的应用在改善热电制冷的半导体泵浦532nm激光器控温部分性能有明显的效果,有助于缩短产品的开发周期、提高产品性能、降低研发成本、提高客户满意度。
532nm DPSS Laser with thermoelectric cooler is widely used in material process, medical treatment and military affairs etc. In order to ensure the stability and reliability of 532nm DPSS Laser, it is very important to set and maintain a stable temperature. So the problem about heat is always the focus of attention.
In the paper, the development and application of DPSS laser were introduced simply at the beginning. It is described that temperature control for 532nm DPSS Laser is important. The market condition of 532nm DPSS Laser is introduced. Then it analyzes temperature characteristics of 532nm DPSS Laser and temperature control techniques of 532nm DPSS Laser are compared at present.
Next, the principle of thermoelectric cooler was explained and the appliance to use the thermoelectric cooler was introduced. In the 532nm DPSS Laser, the mathematical model of part of temperature control is established. Then, the design process of 532nm DPSS Laser with thermoelectric cooler applies finite element analysis (FEM) method for optimization temperature controlling performance. Using ANSYS, kind of finite element analysis software, did thermal analysis of the temperature controlling structure by steady-state thermal simulation and transient thermal simulation and optimize the structure on the basis of analytic result. The results show that the cooling capacity in the same input, steady-state temperature controlling capacity of the optimized temperature controlling structure arise approximate 8% and action time of transient temperature controlling capacity reduce 33%, a significant improvement over the initial structure.
Finally, an experimental device on basis of optimized structure was made and temperature controlling capacity of it has been tested. By comparing the experimental data and ANSYS thermal simulation data, the error is less than 10% each other. The result show that finite element analysis to improve the temperature controlling performance of 532nm DPSS Laser with thermoelectric cooler has a significant effect, towards shortening product development cycles, improve performance, reduce development costs, improve customer satisfaction has importance.
本文首先简单回顾了半导体泵浦532nm激光器的发展和应用,介绍了半导体泵浦532nm激光器的温度特性,阐述了温控对于半导体泵浦532nm激光器的重要性和目前半导体激光器的主要温控手段。介绍了目前半导体泵浦532nm激光器的市场状况,回顾了有限元方法在半导体激光器传热特性研究中的应用情况。
其次,叙述了热电制冷的原理以及热电制冷在设计中具体应用,建立了热电制冷的半导体泵浦532nm激光器控温部分的数学模型,然后在半导体泵浦532nm激光器控温部分的设计中,通过引入有限元分析(FEM)的方法,使用ANSYS有限元分析软件,通过稳态热模拟和瞬态热模拟对控温部分结构进行热分析,并且在数学模型的指导下对结构进行了优化和热分析。研究结果表明:在同样的制冷量输入下,优化后控温部分的稳态控温能力提高了8%左右,瞬态的作用时间提高了33%,较初始结构有明显改善。
最后,根据优化后的结构制作了实验装置,并且对实验装置的控温能力进行了测试。通过对比实验测试数据和ANSYS热模拟的数据,确认相互之间的误差约在10%左右;结果表明,有限元分析的应用在改善热电制冷的半导体泵浦532nm激光器控温部分性能有明显的效果,有助于缩短产品的开发周期、提高产品性能、降低研发成本、提高客户满意度。
532nm DPSS Laser with thermoelectric cooler is widely used in material process, medical treatment and military affairs etc. In order to ensure the stability and reliability of 532nm DPSS Laser, it is very important to set and maintain a stable temperature. So the problem about heat is always the focus of attention.
In the paper, the development and application of DPSS laser were introduced simply at the beginning. It is described that temperature control for 532nm DPSS Laser is important. The market condition of 532nm DPSS Laser is introduced. Then it analyzes temperature characteristics of 532nm DPSS Laser and temperature control techniques of 532nm DPSS Laser are compared at present.
Next, the principle of thermoelectric cooler was explained and the appliance to use the thermoelectric cooler was introduced. In the 532nm DPSS Laser, the mathematical model of part of temperature control is established. Then, the design process of 532nm DPSS Laser with thermoelectric cooler applies finite element analysis (FEM) method for optimization temperature controlling performance. Using ANSYS, kind of finite element analysis software, did thermal analysis of the temperature controlling structure by steady-state thermal simulation and transient thermal simulation and optimize the structure on the basis of analytic result. The results show that the cooling capacity in the same input, steady-state temperature controlling capacity of the optimized temperature controlling structure arise approximate 8% and action time of transient temperature controlling capacity reduce 33%, a significant improvement over the initial structure.
Finally, an experimental device on basis of optimized structure was made and temperature controlling capacity of it has been tested. By comparing the experimental data and ANSYS thermal simulation data, the error is less than 10% each other. The result show that finite element analysis to improve the temperature controlling performance of 532nm DPSS Laser with thermoelectric cooler has a significant effect, towards shortening product development cycles, improve performance, reduce development costs, improve customer satisfaction has importance.
引文
1.李维晖.新光源半导体激光器.当代科学仪器, 2001(3):58-60
2.黄德修,刘雪峰.半导体激光器及其应用.国防工业出版社,1999:102~107
3.王路威.半导体激光器的发展及应用.成都大学学报.2003,22(3):34～38
4. Yohei Enya, Yusuke Yoshizumi, Takashi Kyono, Katsushi Akita, Masaki Ueno, Masahiro Adachi, Takamichi Sumitomo, Shinji Tokuyama, Takatoshi Ikegami, Koji Katayama, and Takao Nakamura. 531nm Green Lasing of InGaN Based Laser Diodes on Semi-Polar {2021} Free-Standing GaN Substrates Applied Physics Express 2 Japan, 2009, 082101:1~3
5. Dirk Mittnacht,Albert Linder,Hans-Jochen Foth. Medical Application of a High Power Diode Laser. Proceeding of SPIE on Progress in Biomedical Optics and lmaging,Munich,Germany,2005:14~15
6. Chen Jie Wei,Z.Jerry,C.James. Diode Laser Bonding of Planar MEMS,MOEMS,and Microfluidic Devices. Proceeding of Materials Research Society Spring Meeting,San Francisco,United States,2005:309～314
7. A. Hohl一AbiChedid,A. Rice,LIJ,et al. High Power and High Efficiency Single Mode AIGalnAs/InP 14xx Laser with High Temperature Operation. Topical Meeting on Optical Amplifiers and Their Applications,Vancouver,Canada,2002:185～187
8.单成玉.温度对半导体激光器性能参数的影响.吉林师范大学学报:自然科学版,2003,11(4):95.97.
9.沈德元王长青邵宗书蒋民华.晶体温度对LD泵浦Nd:YVO/KTP腔内倍频激光器输出的影响[J].中国激光,1996,23,(5):385～388
10.罗清海,汤广发,王静伟.小型和微型热电制冷的应用与前景.制冷与空调. 2005,26(101):16一203
11.徐德胜.半导体制冷与应用技术[M].上海:上海交通大学出版社,1992.7~17
12.姬鹏先,时阳,罗晓玉.热电制冷器特性分析.制冷与空调.2005,5(l):82~85
13.陈玉忠.微型热电制冷散热器工作状态特性分析.华东船舶工业学院学报(自然科学版).2002,16(1):62~68
14.李军,陈林根.热电热泵换热面积最优分配.制冷. 2004,23(4):1～5
15.王宏杰,杜家练,陈金灿.半导体制冷系统性能特性优化.制冷. 1996,18(4):54～5
16. Salinas, M.A. 3-D thermoelectric cooler analysis. Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE, San Jose, CA, USA,2000: 10~18
17. Kandasamy, S. Kalantar-zadeh, K. Rosengarten, G. Wlodarski, W. Modelling of a Thin Film Thermoelectric Micro Peltier Module. Proceeding of the IEEE TENCON Conference, ChangMai, Thailand, 2004:310~313
18. P.G.Lau. Temperature and Time Dependent Finite- element Model of a Thermoelectric Couple. Proceeding of the 15th IEEE International Conference on Thermoelectrics,Pasadena,USA,1996:227~233
19.卢希红,李茂德.半导体制冷器温度场的数值分析.2001,17(l):18~21
20.李茂德,殷亮,乐伟等.半导体制冷系统电极非稳态温度场的数值分析.同济大学学报(自然科学版). 2004,32(6):767~770
21.鲁鹏程崔碧峰李建军廉鹏郭伟玲邹德恕沈光地.隧道再生大功率半导体激光器瞬态热特性研究[J].中国激光,2004,31,(5):518～522
22. Y. J. He Y. G. Zhang K. J. Nan et al. Thermal Analysis of Ridge Waveguide InAsP/InGaAsP MQW Lasers by using Finite-element Method [J]. Proceeding of SPIE on Semiconductor Lasers and Applications,Shanghai. China , 2002:199~203
23.武斌李毅胡双双蒋群杰王海方.非制冷980nm半导体激光器封装设计与热特性分析[J]中国激光,2009,36,(4):799~803
24.王智群;尧舜;崔碧峰;王智勇;沈光地.高光束质量大功率半导体激光阵列的热特性[J].中国激光,2010,37,(10):2498~2501
25.李兵斌过振宋小鹿蔡德芳文建国王石语.端面抽运固体激光器中抽运端面的直接散热[J].中国激光,2009,36,(1):59～65
26. Hee Jin Lee Joon Shik Yoon and Charn-Jung Kim. Numerical Analysis on the Cooling of a Laser Diode Package with a Thermoelectric Cooler [J]. Heat Transfer—Asian Research, 30 (5), 2001
27. Marko Labudovic Jin Li. Modeling of TE Cooling of Pump Lasers [J]. IEEE Transaction on Components and Packaging Technologies. 2004, 27(4): 720~730
28. LingXie, D.pinjala, K.Sudharsanam, etc. Optimization of Thermal Management Techniques for Low Cost Optoelectronic Packages. Proceeding of the 4th Electronics Packaging Technology Conference,Singapore,2002:375~379
29.胡韩莹朱冬生.热电制冷技术的研究进展与评述.制冷学报,2008, 05: 1~7
30. Walter Koechner Solid-State Laser Engineering [M]. Springer Science+Business Media, Inc. , 2006.139~145
31.杨强生浦保荣.高等传热学.上海:上海交通大学出版社,2001.10~12
32.杨世铭陶文铨.传热学(第四版)[M].北京:高等教育出版社,2006. 336~338; 555~556
33.王勖成.有限元法基本原理和数值方法.北京:清华大学出版社,1997
34. Saeed Moaveni.有限元分析-ANSYS理论与应用.北京:电子工业出版社,2003
35.练章华.现代CAE技术与应用教程.北京:石油工业出版社,2004
2.黄德修,刘雪峰.半导体激光器及其应用.国防工业出版社,1999:102~107
3.王路威.半导体激光器的发展及应用.成都大学学报.2003,22(3):34～38
4. Yohei Enya, Yusuke Yoshizumi, Takashi Kyono, Katsushi Akita, Masaki Ueno, Masahiro Adachi, Takamichi Sumitomo, Shinji Tokuyama, Takatoshi Ikegami, Koji Katayama, and Takao Nakamura. 531nm Green Lasing of InGaN Based Laser Diodes on Semi-Polar {2021} Free-Standing GaN Substrates Applied Physics Express 2 Japan, 2009, 082101:1~3
5. Dirk Mittnacht,Albert Linder,Hans-Jochen Foth. Medical Application of a High Power Diode Laser. Proceeding of SPIE on Progress in Biomedical Optics and lmaging,Munich,Germany,2005:14~15
6. Chen Jie Wei,Z.Jerry,C.James. Diode Laser Bonding of Planar MEMS,MOEMS,and Microfluidic Devices. Proceeding of Materials Research Society Spring Meeting,San Francisco,United States,2005:309～314
7. A. Hohl一AbiChedid,A. Rice,LIJ,et al. High Power and High Efficiency Single Mode AIGalnAs/InP 14xx Laser with High Temperature Operation. Topical Meeting on Optical Amplifiers and Their Applications,Vancouver,Canada,2002:185～187
8.单成玉.温度对半导体激光器性能参数的影响.吉林师范大学学报:自然科学版,2003,11(4):95.97.
9.沈德元王长青邵宗书蒋民华.晶体温度对LD泵浦Nd:YVO/KTP腔内倍频激光器输出的影响[J].中国激光,1996,23,(5):385～388
10.罗清海,汤广发,王静伟.小型和微型热电制冷的应用与前景.制冷与空调. 2005,26(101):16一203
11.徐德胜.半导体制冷与应用技术[M].上海:上海交通大学出版社,1992.7~17
12.姬鹏先,时阳,罗晓玉.热电制冷器特性分析.制冷与空调.2005,5(l):82~85
13.陈玉忠.微型热电制冷散热器工作状态特性分析.华东船舶工业学院学报(自然科学版).2002,16(1):62~68
14.李军,陈林根.热电热泵换热面积最优分配.制冷. 2004,23(4):1～5
15.王宏杰,杜家练,陈金灿.半导体制冷系统性能特性优化.制冷. 1996,18(4):54～5
16. Salinas, M.A. 3-D thermoelectric cooler analysis. Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE, San Jose, CA, USA,2000: 10~18
17. Kandasamy, S. Kalantar-zadeh, K. Rosengarten, G. Wlodarski, W. Modelling of a Thin Film Thermoelectric Micro Peltier Module. Proceeding of the IEEE TENCON Conference, ChangMai, Thailand, 2004:310~313
18. P.G.Lau. Temperature and Time Dependent Finite- element Model of a Thermoelectric Couple. Proceeding of the 15th IEEE International Conference on Thermoelectrics,Pasadena,USA,1996:227~233
19.卢希红,李茂德.半导体制冷器温度场的数值分析.2001,17(l):18~21
20.李茂德,殷亮,乐伟等.半导体制冷系统电极非稳态温度场的数值分析.同济大学学报(自然科学版). 2004,32(6):767~770
21.鲁鹏程崔碧峰李建军廉鹏郭伟玲邹德恕沈光地.隧道再生大功率半导体激光器瞬态热特性研究[J].中国激光,2004,31,(5):518～522
22. Y. J. He Y. G. Zhang K. J. Nan et al. Thermal Analysis of Ridge Waveguide InAsP/InGaAsP MQW Lasers by using Finite-element Method [J]. Proceeding of SPIE on Semiconductor Lasers and Applications,Shanghai. China , 2002:199~203
23.武斌李毅胡双双蒋群杰王海方.非制冷980nm半导体激光器封装设计与热特性分析[J]中国激光,2009,36,(4):799~803
24.王智群;尧舜;崔碧峰;王智勇;沈光地.高光束质量大功率半导体激光阵列的热特性[J].中国激光,2010,37,(10):2498~2501
25.李兵斌过振宋小鹿蔡德芳文建国王石语.端面抽运固体激光器中抽运端面的直接散热[J].中国激光,2009,36,(1):59～65
26. Hee Jin Lee Joon Shik Yoon and Charn-Jung Kim. Numerical Analysis on the Cooling of a Laser Diode Package with a Thermoelectric Cooler [J]. Heat Transfer—Asian Research, 30 (5), 2001
27. Marko Labudovic Jin Li. Modeling of TE Cooling of Pump Lasers [J]. IEEE Transaction on Components and Packaging Technologies. 2004, 27(4): 720~730
28. LingXie, D.pinjala, K.Sudharsanam, etc. Optimization of Thermal Management Techniques for Low Cost Optoelectronic Packages. Proceeding of the 4th Electronics Packaging Technology Conference,Singapore,2002:375~379
29.胡韩莹朱冬生.热电制冷技术的研究进展与评述.制冷学报,2008, 05: 1~7
30. Walter Koechner Solid-State Laser Engineering [M]. Springer Science+Business Media, Inc. , 2006.139~145
31.杨强生浦保荣.高等传热学.上海:上海交通大学出版社,2001.10~12
32.杨世铭陶文铨.传热学(第四版)[M].北京:高等教育出版社,2006. 336~338; 555~556
33.王勖成.有限元法基本原理和数值方法.北京:清华大学出版社,1997
34. Saeed Moaveni.有限元分析-ANSYS理论与应用.北京:电子工业出版社,2003
35.练章华.现代CAE技术与应用教程.北京:石油工业出版社,2004