预紧力对超声换能系统振动特性影响规律研究
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摘要
半导体器件制造是国家各支柱产业发展的基础,是发展国民经济、信息与安全、民用与军用电子产品等领域的关键。当前,包括单点引线与多点倒装的超声键合构成半导体器件的主要封装形式。换能系统是在超声键合工艺与装备的核心执行机构,其动力学特性直接决定键合质量。全篇论文以提高芯片键合质量为目标,主要讨论了换能系统中PZT压电陶瓷受一维压应力对超声能量传递效率与动力学特性的影响规律等理论与技术问题,并对键合工具与换能杆的连接预紧力对换能系统动力学特性影响进行了分析。本文通过用有限元分析软件ANSYS对换能器进行有限元建模,仿真得到换能系统的振动模态和换能系统谐响应与时间历程的响应曲线,并利用阻抗测试仪、多普勒测速仪验证有限元分析的结果。本文的研究工作主要集中在：
1.论述了当前换能器的发展情况以及其存在的问题,查阅大量文献资料,对压电陶瓷PZT的非线性力电耦合特性进行了描述,压电陶瓷在一维压应力的作用下的本构特征参数变化规律是本文进行有限元分析的基础。
2.利用有限元分析软件ANSYS建立换能系统的有限元模型,研究换能系统的模态与响应动力学特性。在概括压电材料结构有限元方法的理论基础上,利用有限单元法构建[压电陶瓷-过渡段-变幅杆-键合工具-界面]整个系统的动力学仿真模型,研究系统固有振动特性与响应行为,仿真计算获得换能系统的工作主模态。
3.分析后盖板预紧力、劈刀与变幅杆连接预紧力对超声换能器振动模态的影响规律。
4.分析劈刀与变幅杆连接预紧力对换能系统谐响应和瞬态响应的影响规律。
5.介绍了换能器的阻抗测试方法,并采用阻抗分析仪扫频测试换能器谐振频率验证仿真结果。利用非接触式激光多普勒测振仪实验获得换能器变幅杆末端的振动位移和振动速度。
以上研究内容、方法与结论,对理解、分析与设计芯片键合换能系统具有积极作用。
IC Packaging is the development foundation of all main industries, and is the key factor for developing other domains such as economy, safe guard and electronic products in our China. Nowadays, ultrasonic bonding, which including wire bonding and thermosonic flip chip bonding, are the main packaging processes for manufacturing semiconductor products. The transducer system is the key working actuator in bonder, and its characteristics of ultrasonic energy propagation and vibration in bonder, and its characteristics of ultrasonic energy propagation and vibration influence the bonding quality. The whole work is aimed for improving the bonding quality, in which the ultrasonic energy propagation in the system, the dynamic characteristics effected by pre-stress are discussed. This article through managing ANSYS simulation obtain the vibration mode of transducer system, and analyze the effect of transducer when the pre-tighten force is considered or not, and validate the result through finite element analysis with Impedance equipment. The study of this paper mainly bases on:
1. The currently development and problem of the ultrasonic transducer. is dissertated in this paper, the nonlinear piezoelectric ceramic PZT-electrical coupling characteristics under compressive stress are described, the conformation changes of characteristic parameters in one-dimensional piezoelectric ceramics is the basis of the finite element analysis。
2. The theoretic model of ultrasonic energy propagation of transducer system is established based on equivalent method. The impedance/admittance model includes all parameters such as materials, size, frequency and load. Based on the model, the frequency and impedance of transducer system are calculated numerically, and the result are verified by experiments.
3. The affection of pre-stress for the transducer back slab and mounting style is analyzed. The model analysis effected by the pre-stress between bonding tool and ultrasonic horn is constructed.
4. Finite Element Harmonic analysis and Transient analysis are researched by changing the pre-stress between bonding tool and ultrasonic horn.
5. Impedance test of transducer system is introduced in this paper, and the analysis result with Impedance equipment testing transducer system is validated. The ultrasonic energy of different directions for transducer system are attained by laser Doppler vibrometer.
All above research contexts, methods and conclusions will help to understand, analyze and design the ultrasonic transducer in IC bonding.
1.论述了当前换能器的发展情况以及其存在的问题,查阅大量文献资料,对压电陶瓷PZT的非线性力电耦合特性进行了描述,压电陶瓷在一维压应力的作用下的本构特征参数变化规律是本文进行有限元分析的基础。
2.利用有限元分析软件ANSYS建立换能系统的有限元模型,研究换能系统的模态与响应动力学特性。在概括压电材料结构有限元方法的理论基础上,利用有限单元法构建[压电陶瓷-过渡段-变幅杆-键合工具-界面]整个系统的动力学仿真模型,研究系统固有振动特性与响应行为,仿真计算获得换能系统的工作主模态。
3.分析后盖板预紧力、劈刀与变幅杆连接预紧力对超声换能器振动模态的影响规律。
4.分析劈刀与变幅杆连接预紧力对换能系统谐响应和瞬态响应的影响规律。
5.介绍了换能器的阻抗测试方法,并采用阻抗分析仪扫频测试换能器谐振频率验证仿真结果。利用非接触式激光多普勒测振仪实验获得换能器变幅杆末端的振动位移和振动速度。
以上研究内容、方法与结论,对理解、分析与设计芯片键合换能系统具有积极作用。
IC Packaging is the development foundation of all main industries, and is the key factor for developing other domains such as economy, safe guard and electronic products in our China. Nowadays, ultrasonic bonding, which including wire bonding and thermosonic flip chip bonding, are the main packaging processes for manufacturing semiconductor products. The transducer system is the key working actuator in bonder, and its characteristics of ultrasonic energy propagation and vibration in bonder, and its characteristics of ultrasonic energy propagation and vibration influence the bonding quality. The whole work is aimed for improving the bonding quality, in which the ultrasonic energy propagation in the system, the dynamic characteristics effected by pre-stress are discussed. This article through managing ANSYS simulation obtain the vibration mode of transducer system, and analyze the effect of transducer when the pre-tighten force is considered or not, and validate the result through finite element analysis with Impedance equipment. The study of this paper mainly bases on:
1. The currently development and problem of the ultrasonic transducer. is dissertated in this paper, the nonlinear piezoelectric ceramic PZT-electrical coupling characteristics under compressive stress are described, the conformation changes of characteristic parameters in one-dimensional piezoelectric ceramics is the basis of the finite element analysis。
2. The theoretic model of ultrasonic energy propagation of transducer system is established based on equivalent method. The impedance/admittance model includes all parameters such as materials, size, frequency and load. Based on the model, the frequency and impedance of transducer system are calculated numerically, and the result are verified by experiments.
3. The affection of pre-stress for the transducer back slab and mounting style is analyzed. The model analysis effected by the pre-stress between bonding tool and ultrasonic horn is constructed.
4. Finite Element Harmonic analysis and Transient analysis are researched by changing the pre-stress between bonding tool and ultrasonic horn.
5. Impedance test of transducer system is introduced in this paper, and the analysis result with Impedance equipment testing transducer system is validated. The ultrasonic energy of different directions for transducer system are attained by laser Doppler vibrometer.
All above research contexts, methods and conclusions will help to understand, analyze and design the ultrasonic transducer in IC bonding.
引文
[1]毕克允.中国半导体封装业的发展.[J],中国集成电路,2006,3(2)：21-23
[2]本田辰夫.封装技术及其[2]苏世民.高密度、高性能IC封装的现状未来发展趋势及今后的对策[J],半导体技术,1994,8,(4)：62-66
[3]制造设备的发展方向[J],电子工业专用设备,1994,4,(23)：24-28
[4]何田.先进封装技术的发展趋势[J],电子工业专用设备,2005,5,(124)：5-8
[5]Dehaine, G.; Kurzweil, K.; Lewandowski, P. Crossing the 200 wire barrier in VLSI bonding Proceedings of the 1984 International Symposi u m on Microelectronics,17-19 Sept.1984, Dallas, TX, USA, p 353-7
[6]Vath III, Charles J.; Murali, S.; Srikanth, N. Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding
[7]Abhijit Dasgupta, Michael Pecht and Ji Wu失效机理与损伤模型
[8]Tsujino, Jiromaru, Hasegawa, Koichi. Ultrasonic wire bonding using high frequency 330,600 kHz and complex vibration 190 kHz welding systems [J], Ultrasonics,1996,6(34):223-228
[9]Murali, Sarangapani; Srikanth, Narasimalu; Vath, Charles J. Effect of wire diameter on the thermosonic bond reliability [J], Microelectronics Reliability,2006,2 (46):467-475
[10]Lau, Kin-tak, Tam, Wai-yin, Meng Xiang-long, Zhou Li-min. Morphological study on twisted NiTi wires for smart composite systems [J], Materials Letters,2002,11 (57):364-368
[11]Shze, J. Hu, Lim, Richard K. S., G., Y. Sow. Gold wire weakening in the thermosonic bonding of the first bond [J], Microelectronics and Reliability, 1996,4(36):549
[12]Liang, Z. N.; Kuper, F. G.; Chen, M. S. A concept to relate wire bonding parameters to bondability and ball bond reliability [J], 1998,6(38):1287-1291
[13]M. S. W. Tam, N.C. Cheung. A high speed, high precision linear drive system for manufacturing automation, Proc. Of IEEE Applied Power Electronics Conferences and Exposition-APEC,2001 Vol.1:440-444
[14]贾松良.微电子封装业和微电子封装设备[J],电子工业专用设备,2003,3(102)
[15]http://www. ednchina. com/ec/AtcShow. asp?AID=6712.电子中国
[16]王福亮,韩雷,钟掘.超声功率对粗铝丝超声引线键合强度的影响[J],中国机械工程,2005,10(16)：919-923
[17]隆志力,吴运新,韩雷.以有效值计算的热声键合PZT换能器阻抗分析[J],应用声学,2005,7(24)：216-220
[18]隆志力,韩雷,吴运新,钟掘.热超声键合过程的温度因素影响规律研究[J],焊接学报,2005,2(68)：23-38
[19]Guang Ming'an, Han Lei, Li Hanxiong, Studies of Electrical Characteristics of Wire Bonder Transducer by Clamp Condition and On/Off of Bonding Tool[J]. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'06),209-213
[20]现代微电子封装技术[M].武汉：华中科技大学出版社,2005.50-75
[21]Luck C F, Chan Y C, Huang K C. Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies[J].Microeletronics reliability.2002,34 (12):381-389
[22]L. K. Cheah, Y. M. Tan, J. Wei and C. K. Wong. Gold to gold thermosonic flip-chip bonding. The International Conference & Exhibition on High Density Interconnect and Systems Packaging[C], USA,2001.
[23]Jakubowski, M., Ultrasonic horn design:translating an art into sound design principles[J]. Electromechanical Design,1992,16(4):p 30-36
[24]Changsoo Jang, Geun Sik Ahn, Yung Joon Kim, et al. Finite element contact analysis on a horn-holder assembly for wire bonding. [J]. IEEE Transactions on Electronics Packaging Manufacturing.2003, v 26, n 1, p 46-53
[25]Chang Zensheu, Sherrit. Stewart, Bao, et al. Design and analysis of ultrasonic horn for USDC. Proceedings of SPIE-The International Society for Optical Engineering, v 5388, Smart Structures and Materials 2004-Industrial and Commercial Applications of Smart Structures Technologies,2004, p 320-326
[261 贺西平,胡时岳.复合超声纵振型换能杆的简化设计[J].兰州大学学报,2002,38(5)：24-26
[27]Schaufele AB, Hardtl KH. Ferroelastic properties of lead zirconate titanate ceramics. J AmCeram Soc,1996,79:2637-2640
[28]李长清,方岱宁.铁电陶瓷PZT的实验本构研究.力学学报,Z000} 32(I)：34-41.
[29]Chen W, Lynch CS. A micro-electro-mechanical model for polarization switching of ferroelectric materials. Acta Materialia,1998,46(15): 5303-5311
[30]Chen W, Lynch CS. Multiaxial constitutive behavior of ferroelectric materials. J. of EngMaterials and Tech.,2001,123(2):169-175
[31]Hwang SC,polarization Lynch CS, McMeeking RM. Feiroelectric/ferroelastic interactions and a switching model. Acta MetaU Mater,1995,43:2073-2084
[32]贺岩松.铁电材料非线性力电耦合关系研究.[博士论文].重庆大学,2003《 ANSYS10.0机械设计高级应用实例(第2版)》王庆五、胡仁喜等编著
[33]鲍芳,李科,胡荣.超声波换能器特征参量电测法的研究[J].江汉石油学院学报,2000,44(6)：89-92
[34]鲍善惠.压电换能器的动态匹配[J].应用声学,1998,24(2)：16-20
[35]贺西平.一端带有圆柱杆的复合纵振超声变幅杆的简明设计理沦.声学技术,1994,13(2)：85-88.
[36]孙世虎.多参数对换能系统振动特性的影响.[硕士论文].中南大学,2008
[37]阻抗分析仪产品说明书.上海欧其德电子有限公司,2004
[38]左全生.压电换能器的导纳分析及其应用[J].常州工学院学报,2000,47(2)：37-42
[39]孙渝生.激光多普勒测量技术及其应用[M].上海：上海科学技术文献出版社,1995
[40]桑波.激光多普勒测振技术理论、信号处理及应用研究[D].[博士论文].西安交通大学,2003
[41]Polytec公司激光多普勒测速仪用户手册[M].2003
[42]蔡晨光,樊尚春.基于Polytec激光测速仪的微振动测试分析系统[J].测控技术,2004,23(4)：5-7
[43]黄长艺,严普强.机械工程测试技术基础[M].北京：机械工业出版社,2001
[44]王伯雄.测试技术基础[M].北京：清华大学出版社,2003
[45](日)酒井英昭编著；白玉林译.信号处理[M].北京：科学出版社,2001,
[46](英)贝兹著；张志明等译.信号处理、调制与噪声[M].北京：人民邮电出版社,1985
[2]本田辰夫.封装技术及其[2]苏世民.高密度、高性能IC封装的现状未来发展趋势及今后的对策[J],半导体技术,1994,8,(4)：62-66
[3]制造设备的发展方向[J],电子工业专用设备,1994,4,(23)：24-28
[4]何田.先进封装技术的发展趋势[J],电子工业专用设备,2005,5,(124)：5-8
[5]Dehaine, G.; Kurzweil, K.; Lewandowski, P. Crossing the 200 wire barrier in VLSI bonding Proceedings of the 1984 International Symposi u m on Microelectronics,17-19 Sept.1984, Dallas, TX, USA, p 353-7
[6]Vath III, Charles J.; Murali, S.; Srikanth, N. Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding
[7]Abhijit Dasgupta, Michael Pecht and Ji Wu失效机理与损伤模型
[8]Tsujino, Jiromaru, Hasegawa, Koichi. Ultrasonic wire bonding using high frequency 330,600 kHz and complex vibration 190 kHz welding systems [J], Ultrasonics,1996,6(34):223-228
[9]Murali, Sarangapani; Srikanth, Narasimalu; Vath, Charles J. Effect of wire diameter on the thermosonic bond reliability [J], Microelectronics Reliability,2006,2 (46):467-475
[10]Lau, Kin-tak, Tam, Wai-yin, Meng Xiang-long, Zhou Li-min. Morphological study on twisted NiTi wires for smart composite systems [J], Materials Letters,2002,11 (57):364-368
[11]Shze, J. Hu, Lim, Richard K. S., G., Y. Sow. Gold wire weakening in the thermosonic bonding of the first bond [J], Microelectronics and Reliability, 1996,4(36):549
[12]Liang, Z. N.; Kuper, F. G.; Chen, M. S. A concept to relate wire bonding parameters to bondability and ball bond reliability [J], 1998,6(38):1287-1291
[13]M. S. W. Tam, N.C. Cheung. A high speed, high precision linear drive system for manufacturing automation, Proc. Of IEEE Applied Power Electronics Conferences and Exposition-APEC,2001 Vol.1:440-444
[14]贾松良.微电子封装业和微电子封装设备[J],电子工业专用设备,2003,3(102)
[15]http://www. ednchina. com/ec/AtcShow. asp?AID=6712.电子中国
[16]王福亮,韩雷,钟掘.超声功率对粗铝丝超声引线键合强度的影响[J],中国机械工程,2005,10(16)：919-923
[17]隆志力,吴运新,韩雷.以有效值计算的热声键合PZT换能器阻抗分析[J],应用声学,2005,7(24)：216-220
[18]隆志力,韩雷,吴运新,钟掘.热超声键合过程的温度因素影响规律研究[J],焊接学报,2005,2(68)：23-38
[19]Guang Ming'an, Han Lei, Li Hanxiong, Studies of Electrical Characteristics of Wire Bonder Transducer by Clamp Condition and On/Off of Bonding Tool[J]. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'06),209-213
[20]现代微电子封装技术[M].武汉：华中科技大学出版社,2005.50-75
[21]Luck C F, Chan Y C, Huang K C. Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies[J].Microeletronics reliability.2002,34 (12):381-389
[22]L. K. Cheah, Y. M. Tan, J. Wei and C. K. Wong. Gold to gold thermosonic flip-chip bonding. The International Conference & Exhibition on High Density Interconnect and Systems Packaging[C], USA,2001.
[23]Jakubowski, M., Ultrasonic horn design:translating an art into sound design principles[J]. Electromechanical Design,1992,16(4):p 30-36
[24]Changsoo Jang, Geun Sik Ahn, Yung Joon Kim, et al. Finite element contact analysis on a horn-holder assembly for wire bonding. [J]. IEEE Transactions on Electronics Packaging Manufacturing.2003, v 26, n 1, p 46-53
[25]Chang Zensheu, Sherrit. Stewart, Bao, et al. Design and analysis of ultrasonic horn for USDC. Proceedings of SPIE-The International Society for Optical Engineering, v 5388, Smart Structures and Materials 2004-Industrial and Commercial Applications of Smart Structures Technologies,2004, p 320-326
[261 贺西平,胡时岳.复合超声纵振型换能杆的简化设计[J].兰州大学学报,2002,38(5)：24-26
[27]Schaufele AB, Hardtl KH. Ferroelastic properties of lead zirconate titanate ceramics. J AmCeram Soc,1996,79:2637-2640
[28]李长清,方岱宁.铁电陶瓷PZT的实验本构研究.力学学报,Z000} 32(I)：34-41.
[29]Chen W, Lynch CS. A micro-electro-mechanical model for polarization switching of ferroelectric materials. Acta Materialia,1998,46(15): 5303-5311
[30]Chen W, Lynch CS. Multiaxial constitutive behavior of ferroelectric materials. J. of EngMaterials and Tech.,2001,123(2):169-175
[31]Hwang SC,polarization Lynch CS, McMeeking RM. Feiroelectric/ferroelastic interactions and a switching model. Acta MetaU Mater,1995,43:2073-2084
[32]贺岩松.铁电材料非线性力电耦合关系研究.[博士论文].重庆大学,2003《 ANSYS10.0机械设计高级应用实例(第2版)》王庆五、胡仁喜等编著
[33]鲍芳,李科,胡荣.超声波换能器特征参量电测法的研究[J].江汉石油学院学报,2000,44(6)：89-92
[34]鲍善惠.压电换能器的动态匹配[J].应用声学,1998,24(2)：16-20
[35]贺西平.一端带有圆柱杆的复合纵振超声变幅杆的简明设计理沦.声学技术,1994,13(2)：85-88.
[36]孙世虎.多参数对换能系统振动特性的影响.[硕士论文].中南大学,2008
[37]阻抗分析仪产品说明书.上海欧其德电子有限公司,2004
[38]左全生.压电换能器的导纳分析及其应用[J].常州工学院学报,2000,47(2)：37-42
[39]孙渝生.激光多普勒测量技术及其应用[M].上海：上海科学技术文献出版社,1995
[40]桑波.激光多普勒测振技术理论、信号处理及应用研究[D].[博士论文].西安交通大学,2003
[41]Polytec公司激光多普勒测速仪用户手册[M].2003
[42]蔡晨光,樊尚春.基于Polytec激光测速仪的微振动测试分析系统[J].测控技术,2004,23(4)：5-7
[43]黄长艺,严普强.机械工程测试技术基础[M].北京：机械工业出版社,2001
[44]王伯雄.测试技术基础[M].北京：清华大学出版社,2003
[45](日)酒井英昭编著；白玉林译.信号处理[M].北京：科学出版社,2001,
[46](英)贝兹著；张志明等译.信号处理、调制与噪声[M].北京：人民邮电出版社,1985